KR20110040157A - Organic light emitting display device and manufacturing method thereof - Google Patents

Abstract

PURPOSE: An organic light emitting display device and a manufacturing method thereof are provided to prevent the spread of an adhesive into other area in sealing up a panel by forming a protrusion unit at the corner of a substrate. CONSTITUTION: In an organic light emitting display device and a manufacturing method thereof, a display unit comprises sub pixels in a first substrate(110). A second substrate(140) is combined with the first substrate. A first adhesive member(170) seals hermetically the first substrate and the second substrate. A second adhesive member(180) is arranged in the outside of the first adhesive member. A protrusion(190) is arranged in the outside of the second adhesive member.

Description

Organic Light Emitting Display Device and Manufacturing Method

The present invention relates to an organic light emitting display device and a manufacturing method thereof.

With the development of information technology, the market for a display device, which is a connection medium between a user and information, is growing. Accordingly, flat panel displays (FPDs) such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), and plasma display panels (PDPs) may be used. Usage is increasing.

In the organic light emitting display device belonging to a part of the flat panel display device, the sub pixels arranged in the panel are driven by the scan signal and the data signal supplied to the transistor. The organic light emitting display device uses a deposition method, an etching method, or the like as a method for forming a device such as a transistor in a thin film form on a substrate. In order to protect the elements and the wirings formed on the substrate from the outside, the sealing is combined, and the sealing process is a very important process in manufacturing an organic light emitting display device.

Among the sealing methods used in the sealing process is a method of bonding the substrate and the sealing substrate by printing and firing the frit. In the case of the sealing method using a frit, there is an easy advantage in protecting the device from the outside air, etc., but the adhesive strength is weak and a separate reinforcing process using an adhesive member is required. However, in the conventional sealing method, when the reinforcing process is performed, problems such as smearing or bleeding of the adhesive member to other areas are caused, resulting in defects of the device, and the improvement thereof is required.

The present invention for solving the problems of the above-described background, the organic material that can prevent the problem that the adhesive member formed for the reinforcement purpose in the panel sealing process to bleed or splatter to other areas, protect the device from the outside air and extend the life An electroluminescent display device is provided.

The present invention as a means for solving the above problems, the first substrate; A display unit including subpixels on the first substrate; A second substrate bonded to the first substrate; A first adhesive member positioned between the first substrate and the second substrate to bond and seal the first substrate and the second substrate; A second adhesive member positioned between the first substrate and the second substrate and positioned outside the first adhesive member; And a protrusion disposed between the first substrate and the second substrate and positioned outside the second adhesive member.

At least two protrusions may be positioned in an edge area adjacent to the display unit.

The protruding portion may be in contact with the inner surface of the first substrate or the second substrate.

The protrusion may be formed of any one of materials included in the sub pixels.

The protrusion may be formed of the same material as the bank layer included in the subpixels or the spacer positioned on the bank layer.

The protruding portion may be formed in any one or more of a right angle shape, a sharp angle shape, and a shape shape having an extension line bent from each end.

The first adhesive member and the second adhesive member may be formed of different materials.

In still another aspect, the present invention provides a method for manufacturing a display device including: forming a display unit including sub pixels on a first substrate; Forming a protrusion on the first substrate using any one of materials included in the sub pixels; Forming a first adhesive member between the first substrate and a second substrate spaced apart from the first substrate; Bonding and sealing the first substrate and the second substrate by using the first adhesive member; And forming a second adhesive member on an outer side of the first adhesive member positioned between the first substrate and the second substrate.

The protrusion may be formed by the same process as a bank layer included in the subpixels or a spacer positioned on the bank layer.

The first adhesive member and the second adhesive member may be formed of different materials.

According to the present invention, an organic electric field may be formed in a corner region of a substrate to prevent a problem that an adhesive member, which is formed for reinforcement purposes in a panel sealing process, from spreading or splattering to another region, protects the device from outside air, and extends its life. It is effective to provide a light emitting display device.

Hereinafter, with reference to the accompanying drawings, the specific content for the practice of the present invention will be described.

1 is a plan view of an organic light emitting display device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the region I-II shown in FIG. 1, FIG. 3 is an exemplary cross-sectional view of a subpixel, and FIG. 4 is It is a hierarchical diagram of an organic light emitting layer.

1 to 4, an organic light emitting display device according to an exemplary embodiment of the present invention may include a first substrate 110, a display unit AA, a second substrate 140, a pad unit 150, and a data driver. 160, a scan driver 165, a first adhesive member 170, a second adhesive member 180, and a protrusion 190.

The pad unit 150, the data driver 160, and the scan driver 165 are formed on the first substrate 110. The pad unit 150 transmits various driving signals and power supplied from the outside to the display unit AA, the data driver 160, and the scan driver 165. The data driver 160 generates a data signal in response to various driving signals supplied from the outside and supplies the same through a data line connected to the display unit AA. The scan driver 165 generates a scan signal in response to various driving signals supplied from the outside and supplies the scan signal through a scan wiring connected to the display unit AA.

On the first substrate 110, a display unit AA including sub pixels arranged in a matrix form is formed. The subpixels arranged in the display unit AA are formed in the form of an active matrix using a passive matrix or a thin film transistor. In an embodiment, the subpixels are formed in an active matrix. When the subpixel is formed in an active matrix, it is composed of a transistor (T) 1C (capacitor) structure including a switching transistor S1, a driving transistor T1, a capacitor Cst, and an organic light emitting diode D, or a transistor. And a structure in which a capacitor is further added. Hereinafter, the structure of the subpixel will be described in more detail.

Active layers 113a to 113g are formed on the first substrate 110. The active layers 113a to 113g may include amorphous silicon or polycrystalline silicon obtained by crystallizing the same. The active layers 113a to 113g may include a channel region, a source region, and a drain region, and the source and drain regions may be doped with P-type or N-type impurities. The active layers 113a to 113g serve as active layers 113a, 113b and 113c of the driving transistor T1, active layers 113d, 113e and 113f of the switching transistor S1, and lower electrodes of the capacitor Cst. Layer 113g is included.

The first insulating layer 114 is formed on the active layers 113a to 113g. The first insulating layer 114 may be a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof, but is not limited thereto.

Gate electrodes 115a to 115c are formed on the first insulating layer 114. The gate electrodes 115a to 115c are formed of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed of a single layer or a multi-layer consisting of any one or alloys thereof selected from. The gate electrodes 115a to 115c include a gate electrode 115a of the driving transistor T1, a gate electrode 115b of the switching transistor S1, and a gate electrode 115c serving as an upper electrode of the capacitor Cst.

The second insulating layer 116 is formed on the gate electrodes 115a to 115c. The second insulating layer 116 may be a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof, but is not limited thereto.

Source / drain electrodes 117a to 117d are formed on the second insulating layer 116. The source / drain electrodes 117a to 117d include molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed of a single layer or multiple insects made of any one or an alloy thereof selected from the group consisting of. The source / drain electrodes 117a to 117d include the source / drain electrodes 117a and 117b of the driving transistor T1 and the source / drain electrodes 117c and 117d of the switching transistor S1. The source / drain electrodes 117a and 117b of the driving transistor T1 are connected to the active layers 113a and 113c and the source / drain electrodes 117c and 117d of the switching transistor S1 to the active layers 113d and 113f. do.

The third insulating layer 118 is formed on the source / drain electrodes 117a to 117d. The third insulating layer 118 may be, but is not limited to, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

The fourth insulating layer 119 is formed on the third insulating layer 118. The fourth insulating layer 119 may be a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or multiple layers thereof, but is not limited thereto. The fourth insulating layer 119 may be a planarization layer.

The first electrode 120 connected to the source / drain electrodes 117a and 117b of the driving transistor T1 is formed on the fourth insulating layer 119. The first electrode 120 is selected as an anode or a cathode. When the first electrode 120 is selected as the anode, it may be formed of a transparent material, for example, indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

The bank layer 121 having an opening exposing a part of the first electrode 120 is formed on the first electrode 120. The bank layer 121 may include organic materials such as benzocyclobutene (BCB) -based resin, acrylic resin, or polyimide resin, but is not limited thereto.

On the bank layer 121, spacers 124 that perform various roles, such as maintaining a gap with a shadow mask used during the process of forming the organic emission layer 122 or a gap with the sealing substrate 140, are formed. Can be. The spacer 124 is formed of any one of an organic material, an inorganic material, and an organic / inorganic composite.

The organic emission layer 122 is formed in the opening of the bank layer 121. As illustrated in FIG. 4, the organic emission layer 122 includes a hole injection layer 122a, a hole transport layer 122b, a light emitting layer 122c, an electron transport layer 122d, and an electron injection layer 122e. The hole injection layer 121a may play a role of smoothly injecting holes. CuPc (cupper phthalocyanine), PEDOT (poly (3,4) -ethylenedioxythiophene), PANI (polyaniline), and NPD (N, N-dinaphthyl) -N, N'-diphenyl benzidine) may be composed of any one or more selected from the group consisting of, but is not limited thereto. The hole transport layer 121b serves to facilitate the transport of holes, NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N'-bis- (3-methylphenyl) -N , N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 "-Tris (N-3-methylphenyl-N-phenyl-amino) -triphenylamine) The light emitting layer 121c may include a host and a dopant, and the light emitting layer 121c may include a material emitting red, green, blue, and white light, and may include phosphorescent or fluorescent materials. When the light emitting layer 121c emits red, the light emitting layer 121c may include a host material including CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl), and PIQIr (acac). ) (bis (1-phenylisoquinoline) acetylacetonate iridium), PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) It may be made of a phosphor including a dopant including any one or more selected, and alternatively, may be made of a phosphor including PBD: Eu (DBM) 3 (Phen) or perylene, but is not limited thereto. In the case of emitting green, it may be made of a phosphor including a host material including CBP or mCP and a dopant material including Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium). Alternatively, it may be made of a fluorescent material including Alq3 (tris (8-hydroxyquinolino) aluminum), but is not limited thereto. When the light emitting layer 121c emits blue light, the light emitting layer 121c may include a host material including CBP or mCP, and may be formed of a phosphor including a dopant material including (4,6-F2ppy) 2Irpic. Alternatively, it may be made of a fluorescent material including any one selected from the group consisting of spiro-DPVBi, spiro-6P, distilbenzene (DSB), distriarylene (DSA), PFO-based polymer and PPV-based polymer, but It is not limited. The electron transport layer 121d serves to facilitate the transport of electrons, and may be made of any one or more selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq, and SAlq. However, the present invention is not limited thereto. The electron injection layer 121e serves to facilitate the injection of electrons, and may be Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, LiF, spiro-PBD, BAlq or SAlq, but is not limited thereto. . However, the embodiment of the present invention is not limited to FIG. 4, and at least one of the hole injection layer 121a, the hole transport layer 121b, the electron transport layer 121d, and the electron injection layer 121e may be omitted. Other functional layers may also be included.

The second electrode 123 is formed on the organic emission layer 122. The second electrode 123 may be selected as a cathode or an anode. When the second electrode 123 is selected as the cathode, the second electrode 123 may be formed of aluminum (Al) or aluminum alloy (AlNd), but is not limited thereto.

The sub pixel formed as described above may operate as follows. When the scan signal output from the scan driver 165 is supplied through the scan wiring, the switching transistor S1 is turned on. Next, when the data signal output from the data driver 160 is supplied through the data line, the data signal is stored as a data voltage in the capacitor Cst through the switching transistor S1. Next, when the scan signal is blocked and the switching transistor S1 is turned off, the driving transistor T1 is driven in response to the data voltage stored in the capacitor Cst. The organic light emitting diode D emits light in response to the driving of the driving transistor T1.

Meanwhile, the display portion AA positioned on the first substrate 110 is vulnerable to moisture or oxygen. Therefore, the second substrate 140 bonded to the first substrate 110 is provided. The first substrate 110 and the second substrate 140 are bonded and sealed by the first adhesive member 170 positioned therebetween. In an exemplary embodiment, the first adhesive member 170 is positioned on the third insulating layer 118 formed on the first substrate 110. However, the first adhesive member 170 may be positioned on the surface of the first substrate 110, the first insulating layer 114, or the second insulating layer 116. Undescribed "115n" indicates a gate metal formed in the same manner as the gate electrodes 115a to 115c.

The second adhesive member 180 is formed on the outside of the first adhesive member 170. The first adhesive member 170 and the second adhesive member 180 are formed of different materials. For example, the first adhesive member 170 may be selected as a frit, and the second adhesive member 180 may be selected as a photocurable sealant, but is not limited thereto. In addition, the protrusion 190 is formed on the outside of the second adhesive member 180. The protrusion 190 is formed to be in contact with the inner surface of the first substrate 110 or the second substrate 140. At least two protrusions 190 are positioned in an edge area adjacent to the display portion AA. The protrusion 190 is formed of any one of materials included in the subpixels. For example, the protrusion 190 may be formed of the same material as the bank layer 121 included in the subpixels or the spacer 124 positioned on the bank layer 121, but may be formed on the subpixels according to the height to be formed. The included materials may be used further. The protrusion 190 serves as a dam to prevent a problem such as the second adhesive member 170 spreading or squeezing out to another area. Hereinafter, the role of the protrusion 190 will be described in more detail.

5 is a view for explaining the role of the protrusion according to an embodiment of the present invention, Figures 6 to 9 is a view showing the shape of the protrusion.

1 and 5, the protrusion 190 is formed in the corner region of the first substrate 110. As described above, the protrusion 190 is formed on the insulating film by one of the materials included in the subpixels or is formed on the first substrate 110 as shown. However, the drawing is briefly illustrated as being formed on the first substrate 110.

The first adhesive member 170 selected as the frit is printed on the first substrate 110 (or the second substrate). The first adhesive member 170 bonds and seals the first substrate 110 and the second substrate 140 by a high temperature baking method. Sealing method using a frit as in the embodiment is easy to protect the elements formed on the first substrate 110 from the outside air. However, since the adhesive force is weak in the case of the first adhesive member 170 selected as the frit, a separate reinforcing process using the second adhesive member 180 made of a sealant or the like is performed as in the embodiment of the present invention. The reinforcing process may use a method of disposing the dispenser DP on the side of the panel PNL bonded as shown in FIG. 5 and discharging the second adhesive member 180. In the embodiment, the reinforcing process is performed by rotating the panel PNL while dispensing the dispenser DP and discharging the second adhesive member 180 at a predetermined interval. However, the method of forming the second adhesive member 180 is not limited thereto.

When the reinforcing process is performed in the above manner, the second adhesive member 180 having low viscosity flows through the wall of the frit that is the first adhesive member 170 whenever the panel PNL is rotated. This can cause problems such as crowding and bleeding into other areas. As described above, when the second adhesive member 180 is driven into the corner region, a problem arises in that a process of removing the second adhesive member 180 driven into the corner region before the curing operation is further performed. In addition, when smearing or bleeding to another area, for example, if the bleeding or squeezing out of the direction of the area in which the data driver is located, there is a problem that the process to remove it is considered to be a panel (PNL) failure.

However, the protrusion 190 of the embodiment functions as a dam so that the second adhesive member 180 can stay in the corner region even though the second adhesive member 180 flows on the wall surface of the frit that is the first adhesive member 170. Therefore, in the embodiment, even if the panel PNL is rotated to perform the reinforcing process as described above, the second adhesive member 180 can prevent the problem of smearing or squeezing out of the corner area. It can be solved.

On the other hand, the protrusion 190 has a right angle of the base (a) shape as shown in Figure 6, an acute angle of the base shape as shown in Figure 7 and a base shape of the shape having an extension line bent from each end as shown in Figure 8 (Fig. 8) It can be formed of either. In addition, the protrusion 190 may be formed in a combination of one or more of the shapes shown in FIGS. 6 to 8 as shown in FIG. 9.

Hereinafter, a manufacturing method according to an embodiment of the present invention will be described.

As shown in FIGS. 1 to 5, the display unit AA including the subpixels is formed on the first substrate 110. As described above, the subpixels formed in the display unit AA are formed in the form of an active matrix using a passive matrix or a thin film transistor.

The protrusion 190 may be formed on the first substrate 110 using any one of materials included in the subpixels. The protrusion 190 is formed to be in contact with the inner surface of the first substrate 110 or the second substrate 140. At least two protrusions 190 are positioned in an edge area adjacent to the display portion AA. For example, the protrusion 190 may be formed of the same material as the bank layer 121 included in the subpixels or the spacer 124 positioned on the bank layer 121, but the protrusion 190 may be formed at a height to be formed. Accordingly, the material included in the sub pixels may be further used. The protrusion 190 is formed of any one or more of FIGS. 6 to 9. The protrusion 190 serves as a dam to prevent a problem such as the second adhesive member 170 spreading or squeezing out to another area.

A second substrate 140 facing the first substrate 110 and spaced apart from each other is formed, and a first adhesive member 170 is formed therebetween. The first adhesive member 170 is selected as a frit fired by a high temperature firing method. The first adhesive member 170 selected as the frit is printed on the first substrate 110 (or the second substrate).

A step of bonding and sealing the first substrate 110 and the second substrate 140 by using the first adhesive member 170 is performed. The first adhesive member 170 selected as the frit is fired at a high temperature to bond and seal the first substrate 110 and the second substrate 140.

A step of forming the second adhesive member 180 on the outside of the first adhesive member 170 positioned between the first substrate 110 and the second substrate 140 is performed. The second adhesive member 180 is selected as the photocurable sealant. The second adhesive member 180 selected as the sealant is reinforced by placing the dispenser DP on the side of the panel PNL bonded as shown in FIG. 5 and discharging the second adhesive member 180. In the embodiment, the reinforcing process is an example of rotating the panel PNL while dispensing the dispenser DP and discharging the second adhesive member 180 at a predetermined interval, but the second adhesive member 180 is formed. Is not limited to this.

The protrusion 190 of the embodiment serves as a dam so that the second adhesive member 180 stays in the corner region even though the second adhesive member 180 flows on the wall surface of the frit that is the first adhesive member 170. Therefore, in the embodiment, even if the panel PNL is rotated to perform the reinforcing process as described above, the second adhesive member 180 can prevent the problem of smearing or protruding out of the corner region.

The present invention is an organic electric field that prevents the problem that the adhesive member formed for the purpose of reinforcement in the panel sealing process is smeared or splattered to another area, protects the device from the outside air, and prolongs the life. It is effective to provide a light emitting display device.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the technical configuration of the present invention described above may be modified in other specific forms by those skilled in the art to which the present invention pertains without changing its technical spirit or essential features. It will be appreciated that it may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1 is a plan view of an organic light emitting display device according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of the region I-II shown in FIG. 1. FIG.

3 is a cross-sectional view of a subpixel.

4 is a hierarchical view of an organic light emitting layer.

5 is a view for explaining the role of the protrusion according to an embodiment of the present invention.

6 to 9 are views showing the shape of the protrusions.

<Explanation of symbols on main parts of the drawings>

110: first substrate 114: first insulating film

116: second insulating film 118: third insulating film

121: bank layer 124: spacer

140: second substrate 170: first adhesive member

180: second adhesive member 190: protrusion

Claims (10)

First substrate; A display unit including subpixels on the first substrate; A second substrate bonded to the first substrate; A first adhesive member positioned between the first substrate and the second substrate to bond and seal the first substrate and the second substrate; A second adhesive member positioned between the first substrate and the second substrate and positioned outside the first adhesive member; And And a protrusion disposed between the first substrate and the second substrate and positioned outside the second adhesive member. The method of claim 1, The protrusion, And at least two organic light emitting display devices disposed at corners adjacent to the display unit. The method of claim 1, The protrusion, The organic light emitting display device of claim 1, wherein the organic light emitting display device is not in contact with the inner surface of the first substrate or the second substrate. The method of claim 1, The protrusion, The organic light emitting display device of claim 1, wherein the organic light emitting display device is formed of one of materials included in the sub pixels. The method of claim 1, The protrusion, And a bank layer included in the subpixels or a same material as a spacer disposed on the bank layer. The method of claim 2, The protrusion, An organic light emitting display device, characterized in that it is formed of at least one of a right angle shape (a) shape, an acute angle shape and a base shape having a line extending from each end. The method of claim 1, The first adhesive member and the second adhesive member, An organic light emitting display device, characterized in that formed of different materials. Forming a display unit including subpixels on the first substrate; Forming a protrusion on the first substrate using any one of materials included in the subpixels; Forming a first adhesive member between the first substrate and a second substrate spaced apart from the first substrate; Bonding and sealing the first substrate and the second substrate by using the first adhesive member; And And forming a second adhesive member on an outer side of the first adhesive member positioned between the first substrate and the second substrate. The method of claim 8, The protrusion, And forming a bank layer included in the subpixels or a spacer disposed on the bank layer. The method of claim 8, The first adhesive member and the second adhesive member, A method of manufacturing an organic light emitting display device, characterized in that formed of different materials.

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