KR101623458B1 - 화학 증착 반응기의 가스 분배 시스템 및 방법 - Google Patents
화학 증착 반응기의 가스 분배 시스템 및 방법 Download PDFInfo
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- KR101623458B1 KR101623458B1 KR1020107023987A KR20107023987A KR101623458B1 KR 101623458 B1 KR101623458 B1 KR 101623458B1 KR 1020107023987 A KR1020107023987 A KR 1020107023987A KR 20107023987 A KR20107023987 A KR 20107023987A KR 101623458 B1 KR101623458 B1 KR 101623458B1
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- 238000005229 chemical vapour deposition Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 39
- 238000006243 chemical reaction Methods 0.000 claims abstract description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 45
- 239000010703 silicon Substances 0.000 claims abstract description 45
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 19
- 229920005591 polysilicon Polymers 0.000 claims abstract description 19
- 238000000151 deposition Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 abstract description 50
- 239000000463 material Substances 0.000 abstract description 18
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 2
- 239000005052 trichlorosilane Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 238000012769 bulk production Methods 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- IDPLGTYMTKXWJJ-UHFFFAOYSA-N dichlorosilane silane Chemical compound [SiH4].Cl[SiH2]Cl IDPLGTYMTKXWJJ-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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Abstract
Description
도 1은 본 발명의 반응 챔버 시스템의 사시도이다.
도 2는 도 1의 반응 시스템의 내부 사시도이다.
도 3a는 본 발명에 따른 스탠드파이프의 확대 단면도이다.
도 3b는 도 3a의 스탠드파이프의 파이프 본체에 부착된 노즐 커플러의 상세도이다.
도 3c는 도 3b에 도시된 노즐 커플러의 가스켓의 확대도이다.
도 4는 본 발명의 반응 챔버 시스템이 다수의 스탠드파이프들에 합체된 부분 단면도이다.
14...유체 출구 노즐 16...관찰 포트
18...유체 입구 노즐 20...전기 피드쓰루(feedtrhrough)
22...가스 출구 노즐 24...가스 입구 노즐
25...노즐 커플러 28...필라멘트
30...베이스 플레이트 42...스탠드파이프
44...파이프 본체
Claims (23)
- 내부에 고정된 적어도 하나의 베이스 플레이트, 및 상기 베이스 플레이트에 작동 가능하게 연결된 테두리를 구비하는 반응 챔버;
상기 베이스 플레이트에 부착된 적어도 하나의 필라멘트;
상기 적어도 하나의 필라멘트에 전류를 공급하기 위한 전류 공급원;
상기 반응 챔버를 통해 실리콘 가스가 유동하도록 상기 반응 챔버에 작동 가능하게 연결된 가스 공급원; 및
상기 반응 챔버 속으로 실리콘 가스를 주입하기 위해 상기 가스 공급원에 작동 가능하게 연결되고 실리콘으로 제조된 스탠드파이프(standpipe)를 구비하고;
상기 적어도 하나의 필라멘트의 표면과 상기 스탠드파이프의 표면 모두에 실리콘이 증착되는 것을 특징으로 하는 실리콘 반응기 시스템. - 제1항에 있어서,
상기 전류는 상기 베이스 플레이트에 있는 전기 피드쓰루(feedthrough)를 통해 상기 필라멘트에 직접적으로 공급되는 것을 특징으로 하는 실리콘 반응기 시스템. - 제1항에 있어서,
상기 반응 챔버는 상기 반응 챔버의 내부를 관찰할 수 있는 관찰 포트를 더 구비하는 것을 특징으로 하는 실리콘 반응기 시스템. - 삭제
- 제1항에 있어서,
상기 스탠드파이프는 상기 반응 챔버 내부에 복수로 설치되는 것을 특징으로 하는 실리콘 반응기 시스템. - 제1항에 있어서,
상기 적어도 하나의 필라멘트 표면과 상기 스탠드파이프의 표면에 증착되는 실리콘은 폴리실리콘인 것을 특징으로 하는 실리콘 반응기 시스템. - 제1항에 있어서,
상기 스탠드파이프는 노즐 커플러(coupler) 및 파이프 본체를 더 구비하고, 상기 노즐 커플러는 상기 가스 공급원과 연결된 것을 특징으로 하는 실리콘 반응기 시스템. - 제7항에 있어서,
상기 파이프 본체의 직경은 적어도 필요한 실리콘 가스의 유동율에 따라 선택되는 것을 특징으로 하는 실리콘 반응기 시스템. - 제7항에 있어서,
상기 노즐 커플러는 상기 스탠드파이프를 상기 가스 공급원에 밀봉시키기 위한 가스켓을 더 구비하는 것을 특징으로 하는 실리콘 반응기 시스템. - 제1항에 있어서,
상기 실리콘 반응기 시스템은 화학 증착 실리콘 반응기 시스템인 것을 특징으로 하는 실리콘 반응기 시스템. - 제1항에 있어서,
상기 실리콘 반응기 시스템에 작동 가능하게 연결된 입구와 출구를 가진 냉각 시스템을 더 구비하는 것을 특징으로 하는 실리콘 반응기 시스템. - 반응기에서 실리콘을 증착하기 위한 방법에 있어서,
반응 챔버 내부에 고정된 베이스 플레이트 및 베이스 플레이트에 작동 가능하게 연결된 테두리를 구비하는 반응 챔버를 제공하는 단계;
상기 베이스 플레이트에 적어도 하나의 필라멘트를 부착시키는 단계;
상기 필라멘트에 전류를 공급하기 위해 상기 반응 챔버에 전류 공급원을 연결시키는 단계;
상기 반응 챔버를 통해 실리콘 가스를 유동시키기 위해 상기 반응 챔버에 가스 공급원을 연결시키는 단계;
상기 반응 챔버 내부에서 실리콘 가스를 분배시키기 위해 실리콘으로 제조된 스탠드파이프를 상기 가스 공급원에 연결시키는 단계; 및
상기 반응기를 작동시켜서 상기 적어도 하나의 필라멘트의 표면과 상기 스탠드파이프의 표면에 실리콘을 증착시키는 단계를 포함하는 것을 특징으로 하는 실리콘 증착 방법. - 제12항에 있어서,
상기 필라멘트와 상기 스탠드파이프의 표면에 증착되는 실리콘은 폴리실리콘인 것을 특징으로 하는 실리콘 증착 방법. - 제12항에 있어서,
상기 필라멘트는 실리콘으로 제조되는 것을 특징으로 하는 실리콘 증착 방법. - 제12항에 있어서,
상기 반응기는 화학 증착 반응기인 것을 특징으로 하는 실리콘 증착 방법. - 제12항에 있어서,
상기 베이스 플레이트에 있는 전기 피드쓰루를 통해 상기 필라멘트에 상기 전류를 직접 공급하는 단계를 더 포함하는 것을 특징으로 하는 실리콘 증착 방법. - 제12항에 있어서,
상기 반응 챔버는 상기 반응 챔버의 내부를 관찰하기 위한 관찰 포트를 더 구비하는 것을 특징으로 하는 실리콘 증착 방법. - 삭제
- 가스 공급원과 전류 공급원에 작동 가능하게 연결되도록 구성된 실리콘 반응 챔버에 있어서:
상기 반응 챔버 내부에 고정된 베이스 플레이트;
상기 베이스 플레이트 부착된 적어도 하나의 필라멘트; 및
상기 반응 챔버 내부로 실리콘 가스를 분배시키기 위해 상기 가스 공급원에 작동 가능하게 연결되고 실리콘으로 제조된 스탠드파이프를 구비하고,
상기 적어도 하나의 필라멘트의 표면과 상기 스탠드파이프의 표면 모두에 실리콘이 증착될 수 있도록 구성된 것을 특징으로 하는 실리콘 반응 챔버. - 제19항에 있어서,
상기 전류 공급원에 의해 상기 필라멘트에 전류가 공급되는 것을 특징으로 하는 실리콘 반응 챔버. - 제20항에 있어서,
상기 전류는 상기 베이스 플레이트에 있는 전기 피드쓰루를 통해 상기 필라멘트에 직접 공급되는 것을 특징으로 하는 실리콘 반응 챔버. - 제19항에 있어서,
상기 반응 챔버를 통해 실리콘 가스를 유동시키기 위해 상기 반응 챔버에 작동 가능하게 연결된 적어도 입구 및 출구를 더 구비하는 것을 특징으로 하는 실리콘 반응 챔버. - 제19항에 있어서,
상기 반응 챔버의 내부를 관찰하기 위한 관찰 포트를 더 구비하는 것을 특징으로 하는 실리콘 반응 챔버.
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EP (1) | EP2271788A2 (ko) |
JP (1) | JP5727362B2 (ko) |
KR (1) | KR101623458B1 (ko) |
CN (2) | CN104357807B (ko) |
MY (1) | MY156940A (ko) |
RU (1) | RU2499081C2 (ko) |
TW (1) | TWI494458B (ko) |
WO (1) | WO2009120862A2 (ko) |
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TWI494458B (zh) * | 2008-03-26 | 2015-08-01 | Gtat Corp | 在化學氣相沉積反應器中用於配氣之系統和方法 |
JP5627703B2 (ja) | 2009-11-18 | 2014-11-19 | アールイーシー シリコン インコーポレイテッド | 流動床反応器 |
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KR101146864B1 (ko) | 2011-10-27 | 2012-05-16 | 웅진폴리실리콘주식회사 | 폴리실리콘 제조용 반응기 |
DE102013206236A1 (de) * | 2013-04-09 | 2014-10-09 | Wacker Chemie Ag | Gasverteiler für Siemens-Reaktor |
RU2582077C2 (ru) * | 2014-09-04 | 2016-04-20 | Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) | Устройство для нанесения функциональных слоёв тонкоплёночных солнечных элементов на подложку путём осаждения в плазме низкочастотного индукционного разряда трансформаторного типа низкого давления |
KR101895526B1 (ko) * | 2015-08-28 | 2018-09-05 | 한화케미칼 주식회사 | 폴리실리콘 제조 장치 |
FR3044024B1 (fr) * | 2015-11-19 | 2017-12-22 | Herakles | Dispositif pour le revetement d'un ou plusieurs fils par un procede de depot en phase vapeur |
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US20110129621A1 (en) | 2011-06-02 |
CN104357807B (zh) | 2019-06-28 |
JP2011515590A (ja) | 2011-05-19 |
JP5727362B2 (ja) | 2015-06-03 |
CN102027156A (zh) | 2011-04-20 |
CN104357807A (zh) | 2015-02-18 |
KR20100126569A (ko) | 2010-12-01 |
TW201002853A (en) | 2010-01-16 |
MY156940A (en) | 2016-04-15 |
WO2009120862A2 (en) | 2009-10-01 |
RU2499081C2 (ru) | 2013-11-20 |
EP2271788A2 (en) | 2011-01-12 |
RU2010143559A (ru) | 2012-05-10 |
US8961689B2 (en) | 2015-02-24 |
TWI494458B (zh) | 2015-08-01 |
WO2009120862A3 (en) | 2010-01-28 |
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