JP5727362B2 - 化学気相蒸着反応器内にガスを流通させるためのシステムおよび方法 - Google Patents
化学気相蒸着反応器内にガスを流通させるためのシステムおよび方法 Download PDFInfo
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- 238000005229 chemical vapour deposition Methods 0.000 title claims description 31
- 238000000034 method Methods 0.000 title claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 84
- 239000000463 material Substances 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 19
- 229920005591 polysilicon Polymers 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 3
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- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 7
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- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 3
- 239000005052 trichlorosilane Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
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- 239000000376 reactant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- BUMGIEFFCMBQDG-UHFFFAOYSA-N dichlorosilicon Chemical compound Cl[Si]Cl BUMGIEFFCMBQDG-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B28/00—Production of homogeneous polycrystalline material with defined structure
- C30B28/12—Production of homogeneous polycrystalline material with defined structure directly from the gas state
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Chemical Vapour Deposition (AREA)
Description
本出願は、2008年3月26日に出願された係属中の米国仮出願第61/039,758号の利益を主張し、当該仮出願の開示はその全体が本明細書中に引用により明示的に援用される。
主題発明は、反応器内での化学気相蒸着による、ポリシリコンなどの材料の製造用のシステムおよび方法に向けられる。より特定的には、主題発明は、シリコン製の直立管(standpipe)を使用する化学気相蒸着反応器内の流れパターンを改善するために、ガスを流通させるシステムおよび方法に関する。
化学気相蒸着(CVD)は、通常反応室内で起こる、気相からの固体材料の蒸着に関する反応をいう。CVDは、たとえばポリシリコン、二酸化シリコン、窒化シリコンなどの、高純度で高性能の固体材料を製造するために使用され得る。半導体産業および太陽光発電産業において、薄膜およびバルク半導体材料を製造するために、CVDが使用されることが多い。たとえば、加熱された表面が、一種類以上のガスに曝されることがある。ガスが反応室内に送られると、その気体は加熱された表面に接触する。一旦これが起きると、その後ガスの反応または分解が起こり、固相を形成する。この固相は基板表面上に蒸着し、所望の材料を製造する。このプロセスにとって重大なことは、これらの反応が起きる速度および製品の品質に影響する、ガス流れパターンである。
主題発明は、化学気相蒸着反応器内にガスを流通させるための、特に、CVD反応器内のガス流れを改善するための、システムおよび方法に関する。そのため、主題発明は、CVD反応室内の反応効率を増加するため、固体蒸着物の生産量を増加するため、製品品質を向上するため、および、全体の運転コストを低減するために、使用されてもよい。主題発明によってまた含まれることは、CVD反応器内の直立管に蒸着したシリコンが付加的なポリシリコン製品として使用され得ることである。
主題発明の好ましい実施の形態は、添付の図面を参照して、以下に述べられる。図面において、同様の参照番号は、同一または類似の要素を表す。
本明細書中に引用された全ての特許、公開された特許出願、およびその他の参考文献の全体の内容は、その全体が本明細書中に明示的に引用により援用される。
Claims (19)
- 反応室であって、前記反応室内部に固定された底板と、前記底板に操作可能に連結された筐体と、を少なくとも含む、反応室と、
前記底板に取り付けられた少なくとも一つのフィラメントと、
前記少なくとも一つのフィラメントに電流を供給するための電力源と、
前記反応室に操作可能に連結され、ガスが前記反応室を通過して流れるようにする、ガス源と、
前記ガス源に操作可能に連結された入口端と、前記反応室内において露出する、前記ガスの流れを前記反応室に注入するためと前記反応室内でポリシリコンの蒸着物を受けるための出口端とを含むパイプ本体を有する直立管とを備え、前記直立管はシリコンで形成され、前記出口端は前記パイプ本体に構造を付加しない前記パイプ本体の終端であり、前記出口端は、前記電力源に接続された前記少なくとも一つのフィラメントの下端部よりも上方の高さに位置する、反応器システム。 - 前記電流は、前記底板内の電気的フィードスルーを介して前記フィラメントに直接供給される、請求項1に記載の反応器システム。
- 前記反応室は、前記反応室の内部を観察するための観察口をさらに備える、請求項1に記載の反応器システム。
- 前記反応室内に収容される少なくとも一つの付加的な直立管をさらに備える、請求項1に記載の反応器システム。
- 前記直立管は、ノズル連結器をさらに備え、前記ノズル連結器は前記ガス源との連結のためのものであり、前記ノズル連結器は、前記パイプ本体を前記底板に取り外し可能に取り付けるように構成される、請求項1に記載の反応器システム。
- 前記パイプ本体の径は、少なくとも所望のガス流量に基づいて選択される、請求項5に
記載の反応器システム。 - 前記ノズル連結器は、前記ガス源に対し前記直立管を封止するためのガスケットをさらに備える、請求項5に記載の反応器システム。
- 前記反応器システムは、化学気相蒸着反応器システムである、請求項1に記載の反応器システム。
- 前記反応器システムに操作可能に連結された流体入口と流体出口とを少なくとも有する冷却システムをさらに備える、請求項1に記載の反応器システム。
- 反応器内に材料を蒸着させる方法であって、
反応室であって、前記反応室内部に固定された底板と、前記底板に操作可能に連結された筐体と、を少なくとも含む、反応室を設けるステップと、
前記底板に少なくとも一つのフィラメントを取り付けるステップと、
前記フィラメントの端部に電流を供給するための電力源を前記反応室に連結するステップと、
ガスが前記反応室を通過して流れるようにするガス源を前記反応室に連結するステップと、
前記反応室の内部に前記ガスの流れを流通させかつ前記反応室内でポリシリコンの蒸着物を受けるための直立管を前記ガス源に連結するステップとを備え、前記直立管は、前記ガス源に操作可能に連結された入口端と、前記反応室内において露出する、前記ガスの流れを前記反応室に注入するための出口端とを含むパイプ本体を有し、前記直立管はシリコンで形成され、前記出口端は前記パイプ本体に構造を付加しない前記パイプ本体の終端であり、前記出口端は、前記電力源に接続された前記少なくとも一つのフィラメントの下端部よりも上方の高さに位置し、前記方法はさらに、
前記反応器を作動させ前記反応室内の前記少なくとも一つのフィラメント上に材料を蒸着させるステップを備える、方法。 - 前記フィラメント上に蒸着した材料はポリシリコンである、請求項10に記載の方法。
- 前記反応器は、化学気相蒸着反応器である、請求項10に記載の方法。
- 前記底板内の電気的フィードスルーを介して前記フィラメントに前記電流を直接供給するステップをさらに備える、請求項10に記載の方法。
- 前記反応室は、前記反応室の内部を観察するための観察口をさらに備える、請求項10に記載の方法。
- 反応室であって、
前記反応室内部に固定された底板と、
端部を有し、前記底板に取り付けられた少なくとも一つのフィラメントと、を少なくとも備え、前記反応室は前記少なくとも一つのフィラメント上に材料を蒸着させるための電流源およびガス源に操作可能に連結され、さらに、
前記ガス源に操作可能に取り付けられた入口端と、前記反応室内において露出する、前記反応室の内部にガスの流れを流通させるためと前記反応室内でポリシリコンの蒸着物を受けるための出口端とを含むパイプ本体を有する直立管を備え、前記直立管はシリコンで形成され、前記出口端は前記パイプ本体に構造を付加しない前記パイプ本体の終端であり、前記出口端は、前記底板に取り付けられた前記少なくとも一つのフィラメントの下端部よりも上方の高さに位置する、反応室。 - 前記電流源によって前記フィラメントに電流が供給される、請求項15に記載の反応室。
- 前記底板内の電気的フィードスルーを介して前記フィラメントに前記電流が直接供給される、請求項16に記載の反応室。
- 前記反応室に操作可能に連結された、ガスが前記反応室を通過して流れるようにするための、ガス入口とガス出口とを少なくともさらに備える、請求項15に記載の反応室。
- 前記反応室の内部を観察するための観察口をさらに備える、請求項15に記載の反応室。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US3975808P | 2008-03-26 | 2008-03-26 | |
US61/039,758 | 2008-03-26 | ||
PCT/US2009/038393 WO2009120862A2 (en) | 2008-03-26 | 2009-03-26 | Systems and methods for distributing gas in a chemical vapor deposition reactor |
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JP2011515590A JP2011515590A (ja) | 2011-05-19 |
JP5727362B2 true JP5727362B2 (ja) | 2015-06-03 |
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US (1) | US8961689B2 (ja) |
EP (1) | EP2271788A2 (ja) |
JP (1) | JP5727362B2 (ja) |
KR (1) | KR101623458B1 (ja) |
CN (2) | CN102027156A (ja) |
MY (1) | MY156940A (ja) |
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WO2009120862A2 (en) * | 2008-03-26 | 2009-10-01 | Gt Solar, Inc. | Systems and methods for distributing gas in a chemical vapor deposition reactor |
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US9315895B2 (en) * | 2010-05-10 | 2016-04-19 | Mitsubishi Materials Corporation | Apparatus for producing polycrystalline silicon |
KR101146864B1 (ko) | 2011-10-27 | 2012-05-16 | 웅진폴리실리콘주식회사 | 폴리실리콘 제조용 반응기 |
DE102013206236A1 (de) * | 2013-04-09 | 2014-10-09 | Wacker Chemie Ag | Gasverteiler für Siemens-Reaktor |
RU2582077C2 (ru) * | 2014-09-04 | 2016-04-20 | Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) | Устройство для нанесения функциональных слоёв тонкоплёночных солнечных элементов на подложку путём осаждения в плазме низкочастотного индукционного разряда трансформаторного типа низкого давления |
KR101895526B1 (ko) * | 2015-08-28 | 2018-09-05 | 한화케미칼 주식회사 | 폴리실리콘 제조 장치 |
FR3044024B1 (fr) * | 2015-11-19 | 2017-12-22 | Herakles | Dispositif pour le revetement d'un ou plusieurs fils par un procede de depot en phase vapeur |
FR3044023B1 (fr) * | 2015-11-19 | 2017-12-22 | Herakles | Dispositif pour le revetement d'un ou plusieurs fils par un procede de depot en phase vapeur |
AT518081B1 (de) * | 2015-12-22 | 2017-07-15 | Sico Tech Gmbh | Injektor aus Silizium für die Halbleiterindustrie |
CN112342529B (zh) * | 2020-09-24 | 2022-12-06 | 杭州盾源聚芯半导体科技有限公司 | 一种具有连接头的喷射管 |
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JP2011515590A (ja) | 2011-05-19 |
WO2009120862A3 (en) | 2010-01-28 |
WO2009120862A2 (en) | 2009-10-01 |
CN104357807A (zh) | 2015-02-18 |
TWI494458B (zh) | 2015-08-01 |
TW201002853A (en) | 2010-01-16 |
CN102027156A (zh) | 2011-04-20 |
KR20100126569A (ko) | 2010-12-01 |
CN104357807B (zh) | 2019-06-28 |
KR101623458B1 (ko) | 2016-05-23 |
US20110129621A1 (en) | 2011-06-02 |
RU2010143559A (ru) | 2012-05-10 |
EP2271788A2 (en) | 2011-01-12 |
RU2499081C2 (ru) | 2013-11-20 |
MY156940A (en) | 2016-04-15 |
US8961689B2 (en) | 2015-02-24 |
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