KR101514514B1 - 적층 세라믹 커패시터 및 그 실장 기판 - Google Patents
적층 세라믹 커패시터 및 그 실장 기판 Download PDFInfo
- Publication number
- KR101514514B1 KR101514514B1 KR1020130044156A KR20130044156A KR101514514B1 KR 101514514 B1 KR101514514 B1 KR 101514514B1 KR 1020130044156 A KR1020130044156 A KR 1020130044156A KR 20130044156 A KR20130044156 A KR 20130044156A KR 101514514 B1 KR101514514 B1 KR 101514514B1
- Authority
- KR
- South Korea
- Prior art keywords
- internal
- electrode
- electrodes
- ceramic body
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 95
- 239000004020 conductor Substances 0.000 claims abstract description 119
- 239000000919 ceramic Substances 0.000 claims abstract description 110
- 239000003990 capacitor Substances 0.000 claims abstract description 90
- 238000000034 method Methods 0.000 claims description 27
- 238000010586 diagram Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130044156A KR101514514B1 (ko) | 2013-04-22 | 2013-04-22 | 적층 세라믹 커패시터 및 그 실장 기판 |
JP2013150227A JP5815607B2 (ja) | 2013-04-22 | 2013-07-19 | 積層セラミックキャパシタ及びその実装基板 |
CN201310342102.7A CN104112594B (zh) | 2013-04-22 | 2013-08-07 | 多层陶瓷电容器和安装多层陶瓷电容器的板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130044156A KR101514514B1 (ko) | 2013-04-22 | 2013-04-22 | 적층 세라믹 커패시터 및 그 실장 기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140126083A KR20140126083A (ko) | 2014-10-30 |
KR101514514B1 true KR101514514B1 (ko) | 2015-04-22 |
Family
ID=51709341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130044156A Expired - Fee Related KR101514514B1 (ko) | 2013-04-22 | 2013-04-22 | 적층 세라믹 커패시터 및 그 실장 기판 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5815607B2 (ja) |
KR (1) | KR101514514B1 (ja) |
CN (1) | CN104112594B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102052768B1 (ko) * | 2014-12-15 | 2019-12-09 | 삼성전기주식회사 | 칩 전자 부품 및 칩 전자 부품의 실장 기판 |
DE102015215942A1 (de) * | 2015-08-20 | 2017-02-23 | Robert Bosch Gmbh | Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul |
KR102450593B1 (ko) | 2016-04-27 | 2022-10-07 | 삼성전기주식회사 | 커패시터 부품 |
KR102437806B1 (ko) * | 2017-07-25 | 2022-08-30 | 삼성전기주식회사 | 복합 전자 부품 및 그 실장 기판 |
CN118866552A (zh) * | 2023-04-26 | 2024-10-29 | 荣耀终端有限公司 | Mlcc电容器及其制作方法、电路板组件及电子设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100809239B1 (ko) * | 2006-12-29 | 2008-03-07 | 삼성전기주식회사 | 적층 커패시터 어레이 |
JP5118237B2 (ja) * | 2007-09-28 | 2013-01-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層型キャパシタ |
JP5152278B2 (ja) * | 2010-08-31 | 2013-02-27 | Tdk株式会社 | 積層電子部品の製造方法及び積層電子部品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3502988B2 (ja) * | 2001-07-16 | 2004-03-02 | Tdk株式会社 | 多端子型の積層セラミック電子部品 |
JP3907599B2 (ja) * | 2003-03-07 | 2007-04-18 | Tdk株式会社 | 積層コンデンサ |
JP4293560B2 (ja) * | 2006-07-12 | 2009-07-08 | Tdk株式会社 | 積層コンデンサアレイ |
US7388738B1 (en) * | 2007-03-28 | 2008-06-17 | Tdk Corporation | Multilayer capacitor |
DE102007020783A1 (de) * | 2007-05-03 | 2008-11-06 | Epcos Ag | Elektrisches Vielschichtbauelement |
JP4525773B2 (ja) * | 2007-05-22 | 2010-08-18 | 株式会社村田製作所 | 積層セラミックコンデンサ |
KR100925623B1 (ko) * | 2007-08-31 | 2009-11-06 | 삼성전기주식회사 | 적층형 칩 커패시터 및 이를 구비한 회로기판 장치 및회로기판 |
KR100916476B1 (ko) * | 2007-11-30 | 2009-09-08 | 삼성전기주식회사 | 적층형 칩 커패시터 및 이를 구비한 회로기판 장치 |
JP5282634B2 (ja) * | 2008-06-25 | 2013-09-04 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
-
2013
- 2013-04-22 KR KR1020130044156A patent/KR101514514B1/ko not_active Expired - Fee Related
- 2013-07-19 JP JP2013150227A patent/JP5815607B2/ja not_active Expired - Fee Related
- 2013-08-07 CN CN201310342102.7A patent/CN104112594B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100809239B1 (ko) * | 2006-12-29 | 2008-03-07 | 삼성전기주식회사 | 적층 커패시터 어레이 |
JP5118237B2 (ja) * | 2007-09-28 | 2013-01-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層型キャパシタ |
JP5152278B2 (ja) * | 2010-08-31 | 2013-02-27 | Tdk株式会社 | 積層電子部品の製造方法及び積層電子部品 |
Also Published As
Publication number | Publication date |
---|---|
KR20140126083A (ko) | 2014-10-30 |
JP2014216638A (ja) | 2014-11-17 |
CN104112594A (zh) | 2014-10-22 |
JP5815607B2 (ja) | 2015-11-17 |
CN104112594B (zh) | 2017-05-03 |
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