KR101419636B1 - Heat sink, and method for producing same - Google Patents

Abstract

A heat sink provided with a heat dissipating fin on a base portion includes: a) a first base plate having an outer surface and an inner surface and capable of mounting a heat generating component on an outer surface thereof; b) A second base plate having an inner surface and capable of mounting a heat generating component on its outer surface; and c) a second base plate disposed perpendicularly to each of the first base plate and the second base plate, fixing them along the bonding line, A base portion having a first region and a second region which are arranged in a direction of a joining line and including a first base plate and a second base plate; And a parallel pin disposed in the second region so as to be parallel to the first base plate from the inner surface of the third base plate.

Description

[0001] HEAT SINK AND METHOD FOR PRODUCING THE SAME [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink and a manufacturing method thereof, and more particularly to a heat sink for cooling a plurality of heat generating components and a manufacturing method thereof.

In a conventional heat sink, when a plurality of heat generating components are provided, heat generating components are mounted on two base plates arranged in parallel, the side surfaces of the two base plates are thermally connected to each other with different connecting members, And a pin is provided on the plate to cool the heat generating component (for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2008-270651

In the conventional heat sink, the side surface of the base plate on which the heat generating component is mounted is thermally connected to the connecting member to perform heat transfer between the two base plates. In this way, since the two base plates are connected to only one place, there is a problem in that if the difference in calorific value between the two heat generating parts is large, sufficient heat transfer can not be performed, and cooling of the heat generating parts with a large calorific value becomes insufficient.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a heat sink capable of efficiently cooling each heat generating component regardless of a difference in calorific value of the heat generating component in a heat sink for cooling a plurality of heat generating components.

The present invention is a heat sink provided with a heat dissipating fin in a base portion,

a) a first base plate having an outer surface and an inner surface and capable of mounting a heat generating component on an outer surface thereof; b) a second base plate having an outer surface and an inner surface and disposed so as to be parallel to the first base plate, C) a third base plate vertically disposed on each of the first base plate and the second base plate, fixing the first base plate and the second base plate along the fixing line and having an outer surface and an inner surface, A base portion having a region and a second region,

A connection pin which is connected to the inner surface of each of the first base plate and the second base plate and arranged so as to be parallel to the third base plate,

And a parallel pin disposed in the second region from the inner surface of the third base plate so as to be parallel to the first base plate.

The present invention also provides a method of manufacturing a heat sink,

a) a first base plate having an outer surface and an inner surface and capable of mounting a heat generating component on an outer surface thereof; b) a second base plate having an outer surface and an inner surface and disposed so as to be parallel to the first base plate, C) a third base plate vertically disposed on each of the first base plate and the second base plate and fixing them along the joining line, the third base plate having an outer surface and an inner surface, A base portion having a first region and a second region,

A connection pin which is connected to the inner surface of each of the first base plate and the second base plate and arranged so as to be parallel to the third base plate,

Preparing a mold corresponding to a heat sink including a parallel pin arranged so as to be parallel to the first base plate from the inner surface of the third base plate in the second area,

Injecting a molten thermally conductive material into the mold,

A step of cooling and solidifying the thermally conductive material to form a heat sink,

And a step of removing the heat sink from the mold,

The mold is composed of two partial molds separated by a plane perpendicular to the joining line between the first region and the second region of the base portion and the two partial molds are moved and separated in the joining line direction to take out the heat sink from the mold Wherein the heat sink is manufactured by a method of manufacturing a heat sink.

In the heat sink according to the present invention, the cooling efficiency of the heat generating component provided on the heat sink can be improved.

Further, in the method of manufacturing a heat sink according to the present invention, the manufacturing process of the heat sink can be reduced, and the manufacturing cost can be reduced.

1 is a perspective view of a heat sink according to Embodiment 1 of the present invention,
2 is a plan view of a heat sink according to Embodiment 1 of the present invention,
3 is a plan view of a heat sink according to Embodiment 2 of the present invention,
4 is a plan view of a heat sink according to Embodiment 3 of the present invention,
5 is a plan view of a heat sink according to Embodiment 4 of the present invention,
6 is a plan view of a heat sink according to Embodiment 5 of the present invention,
7 is a plan view of a heat sink according to Embodiment 6 of the present invention,
8 is a perspective view of a heat sink according to Embodiment 7 of the present invention,
9 is a perspective view of a heat sink according to Embodiment 8 of the present invention,
10 is a plan view of an electronic apparatus according to Embodiment 9 of the present invention,
11 is a perspective view of a heat sink according to Embodiment 10 of the present invention,
12A is a plan view of a heat sink according to Embodiment 10 of the present invention,
12B is a plan view of a heat sink according to Embodiment 10 of the present invention,
12C is a plan view of a heat sink according to Embodiment 10 of the present invention,
12D is a plan view of a heat sink according to Embodiment 10 of the present invention,
12E is a plan view of a heat sink according to Embodiment 10 of the present invention,
12F is a plan view of a heat sink according to Embodiment 10 of the present invention.

(Embodiment 1)

1 is a perspective view of a heat sink according to a first embodiment of the present invention, the whole of which is denoted by 1; Fig. 2 is a plan view of the heat sink 1. Fig. 2 (a) is a view taken along the Z-axis direction of Fig. 1 (from above) Respectively.

As shown in Fig. 1, the heat sink 1 has a base portion 2 made of, for example, aluminum. The base portion 2 includes a first base plate 3a and a second base plate 3b disposed so as to face each other so as to be parallel to each other and a second base plate 3b connected between the first base plate 3a and the second base plate 3b And a third base plate 3c connecting the first base plate 3a and the third base plate 3c along a line (for example, a line in the Z-axis direction to which the first base plate 3a and the third base plate 3c are connected). The three base plates 3a, 3b and 3c are connected so as to form a U-shape when viewed in the Z-axis direction in Fig.

The first base plate 3a and the second base plate 3b opposed to each other are connected to the inside of the base portion 2 (first region) so as to be parallel to the third base plate 3c ) Connecting pins 5 are provided. The third base plate 3c of the base portion 2 (second region) is provided with a first base plate 3b which is parallel to the first base plate 3a and the second base plate 3b, (In the YZ plane) parallel pins 6 are provided. The connection pin 5 and the parallel pin 6 are made of, for example, aluminum.

1 and 2, three connecting pins 5 and two parallel pins 6 are used. However, one or two or more connecting pins 5 may be used. 1 and 2, the connection pin 5 may be provided above and the parallel pin 6 may be provided below.

The heat generating components 4a and 4b such as power transistors are connected to the outside of the first base plate 3a and the second base plate 3b of the base portion 2 via the thermally conductive material 7, Respectively. As the thermally conductive material 7, for example, thermal grease or a thermal sheet is used. When viewed in the X-axis direction, the heat generating components 4a and 4b are preferably arranged such that at least a part thereof overlaps with the connection pin 5. [

1 and 2, one heat-generating component 4a and one heat-generating component 4b are provided on the first base plate 3a and the second base plate 3b, respectively. However, the heat-generating components 4a and 4b may be provided on only one surface, .

In this heat sink 1, the heat generated in the heat generating components 4a and 4b is transferred from the base portion 2 to the connecting pin 5 or the parallel pin 6. The surrounding air is warmed by the transmitted heat around the connecting pin 5 and the parallel pin 6 and the cooling air 8 directed upward from the lower side as shown in Fig. 2 due to the density difference of the air Occurs. The base portion 2, the connecting pin 5 and the parallel pin 6 are air-cooled by the cooling wind 8 to cool the heat generating components 4a and 4b.

Since the heat sink 1 is provided with the parallel pin 6 above the connecting pin 5, it is possible to improve the heat radiation characteristic by the leading edge effect at the entrance portion (the lower portion of the parallel pin 6) of the parallel pin 6 .

Conventionally, in order to obtain the leading edge effect, a heat sink in which straight pins are offset and arranged in parallel at regular intervals has been used. However, in the offset portion, the air inflow width of the fin inlet becomes narrow, There is a problem that the flow resistance is increased because the high-speed portion collides with the lower surface of the rear end pin.

In contrast to this, in the heat sink 1 according to the first embodiment, since the connecting pin 5 and the parallel pin 6 are arranged so that the normal line is orthogonal to the connecting pin 5, The inlet of air to the inlet of the air inlet is widened. Further, the air flowing out of the front end pin (connecting pin 5) collides with the lower end of the rear end pin (parallel pin 6) as well as the high speed portion, so that the flow resistance can be reduced. As a result, the ventilation amount can be increased and the cooling efficiency can be increased more than in the prior art.

Further, in a structure in which two heat sinks are simply opposed to each other and one end is connected as in the conventional case (for example, Patent Document 1), when a difference in calorific value between a plurality of mounted heat generating components is large, The generated heat needs to move the heat to the base plate and the pin on the opposite side through the connecting plate, there is a problem that the heat transfer path is long and the cooling efficiency is low.

On the other hand, in the heat sink 1 according to the first embodiment, between the opposing first base plate 3a and the second base plate 3b on which the heat generating components 4a and 4b are mounted, And is also thermally connected by the connection pin 5 in addition to the heat sink 3c, and the heat transfer path is shorter than in the conventional structure. Therefore, when the difference in calorific value between the two heat generating components 4a and 4b is large, the heat is automatically balanced in the third base plate 3c and the connecting pin 5, and the heat radiation characteristic can be improved.

For example, when the amount of heat generated by the heat generating component 4a mounted on the first base plate 3a is large, the third base plate 3c and the connection pin 5 contribute to heat radiation of the heat generating component 4a And the area contributing to the heat radiation of the heat generating component 4b becomes smaller, so that the temperature can be balanced and the temperature rise of the heat generating component 4a can be reduced.

Further, the box-shaped straight heat sink in which the connecting pins 5 produced by extrusion of aluminum are arranged on the entire surface from the upper part to the lower part of the base can be further processed such as punching for attaching parts, , There is a problem that the manufacturing process becomes complicated. In addition, when the same box-shaped heat sink is manufactured by aluminum die casting, burrs are formed at the central portion of the fin because the frame is pulled out from the up and down directions, which makes it difficult to remove the burrs. Further, since there is a draft angle of the die in the die casting method, there is a problem that the longer the fin is in the ventilation direction, the narrower the opening of the fin exit, the higher the pressure loss and the lower the air volume.

On the other hand, the heat sink 1 according to the first embodiment can be manufactured by a die casting method in which a mold is pulled out in two directions, so that holes for mounting components can be provided at the same time, It becomes. More specifically, for example, in the case of manufacturing the heat sink 1 of Fig. 1, between the lower portion (first region) provided with the connection pin 5 and the upper portion (second region) provided with the parallel pin 6 Casting is performed using the divided mold. In the casting step, holes for component mounting are formed at the same time. After the casting, the heat sink 1 can be taken out by extracting the two molds in the upper direction and the lower direction (connection line direction: Z-axis direction), respectively. The molds in the upper portion (second region) are extracted in all directions (direction perpendicular to the connection line: Y-axis direction), and the molds in the lower region (first region) It is also good to draw.

Since the three base plates 3a, 3b and 3c are formed integrally with each other by the die casting method, the height of the two base plates 3a and 3b . Further, when the upper part (first area) and the lower part (second area) are made into separate parts and then polymerized, the number of manufacturing steps increases and parts for connection become necessary. Thereby making it possible to reduce the cost. In addition, since there is a space between the connecting pin 5 and the parallel pin 6, it is possible to easily remove even if a burr occurs in the manufacturing process of the die casting. When the front surface of the heat sink 1 is used as the connection pin 5 in the die casting method, the outlet becomes narrower due to the draft angle of the frame. However, by providing two types of pins, the connection pin 5 and the parallel pin 6 The opening of the fin outlet does not become too narrow and the ventilation characteristic does not deteriorate.

(Embodiment 2)

Fig. 3 is a plan view of the heat sink 11 according to the second embodiment of the present invention. Fig. 3 (a) is a plan view in the Z-axis direction In the Y-axis direction, respectively. 3, the same reference numerals as in Figs. 1 and 2 denote the same or corresponding parts.

3, the heat sink 11 according to the second embodiment has the connecting pin 5, the connecting pin 5, the parallel pin 6, the connecting pin 5, The heat radiating fins are provided in this order. That is, the heat sink 1 of the first embodiment has a structure in which the connection pin 5 is further provided.

In such a heat sink 21, when the number of heat generating components 4a and 4b mounted on the base portion 2 is large, as shown in FIG. 3 (b), the heat generating components 4a and 4b The connection pins 5 are provided in the vicinity of the first base plate 3a and the second base plate 3b to connect the first base plate 3a and the second base plate 3b and the cracks are generated even when the difference in calorific value of the heat generating components 4a, So that the heat radiation characteristic can be improved. It is preferable that at least a part of the heat generating components 4a and 4b overlap the connection pin 5 when viewed in the X axis direction.

3, the connection pin 5, the parallel pin 6 and the connection pin 5 are sequentially arranged in three stages (the base portion 2 is a first region, a second region, (The base portion 2 is constituted by the second region, the first region, the second region, and the third region) in this order from the lower side to the parallel pin 6, the connection pin 5 and the parallel pin 6 Two regions may be used. Further, the present invention is not limited to the third stage, and the connecting pin 5 and the parallel pin 6 may alternatively be provided in four or more stages. The present invention is not limited to the case where the connection pins 5 and the parallel pins 6 are alternately arranged but the connection pins 5 are continuously arranged with intervals and the parallel pins 6 are arranged continuously Configuration.

(Embodiment 3)

Fig. 4 is a plan view of the heat sink 21 according to the third embodiment of the present invention. Fig. 4 (a) is a sectional view taken along the Z- In the Y-axis direction, respectively. 4, the same reference numerals as in Figs. 1 and 2 denote the same or corresponding portions.

4, the heat sink 21 according to the third embodiment is different from the heat sink 1 according to the first embodiment in that the heat conductive material 7 is provided outside the third base plate 3c, So that the heat generating component 4c is mounted.

As described in the first embodiment, the third base plate 3c can be formed with the first base plate 3a and the second base plate 3b by using the die casting method, So that the third base plate 3c also has a good heat radiation property. Therefore, the heat generating component 4c can be mounted on the third base plate 3c.

The heat generating parts may be arranged so as to be aligned with the height (position in the Z axis direction), but the heat generating parts 3a, 3b and 3c may be arranged to have different heights as shown in Fig. By arranging the heat generating elements 3a, 3b and 3c at different heights, the path of heat generated by the heat generating components 3a, 3b, 3c to the heat dissipating surface of the fin is shortened, so that the cooling efficiency can be improved and the heat radiation characteristic can be improved. For example, in Embodiment 1 (Fig. 2), the heat generating components 4a and 4b are mounted at the same height in the vicinity of the upper portion of the connecting pin 5, but in this case, the heat generating components 4a and 4b The heat is transported by heat conduction to the lower portion of the connecting pin 5 via the first or second base plates 3a, 3b. On the other hand, in the third embodiment (FIG. 4), the position of the heat generating component 4b is the same as that of the first embodiment, but since the heat generating component 4a is disposed below the heat generating component 4b, The lower portion of the fin 5 mainly dissipates heat from the heat generating component 4a while the upper portion of the connection pin 5 mainly dissipates heat from the heat generating component 4b. Therefore, the heat can be transmitted to the heat radiating surface of the connecting pin by a shorter path, and the heat radiation efficiency can be further improved.

(Fourth Embodiment)

Fig. 5 is a plan view of the heat sink 31 according to the fourth embodiment of the present invention. Fig. 5 (a) shows the Z axis direction In the Y-axis direction, respectively. 5, the same reference numerals as in Figs. 1 and 2 denote the same or corresponding portions.

The heat sink 31 according to the fourth embodiment is different from the heat sink 11 according to the second embodiment in that the heat generating part 4c is formed on the outside of the third base plate 3c via the thermally conductive material 7, As shown in FIG.

When the heat generating components 4a and 4b are provided on the first and second base plates 3a and 3b, the connection between the first base plate 3a and the connection pin 5 of the second base plate 3b, It is preferable to mount the heat generating components 4a and 4b in the vicinity thereof. When the heat generating component 4c is provided on the third base plate 3c, it is preferable to mount the heat generating component 4c in the vicinity of the connection portion between the third base plate 3c and the parallel pin 6. As a result, heat generated from the heat generating components 4a, 4b, 4c can be efficiently transferred to the connecting pin 5 and the parallel pin 6, and heat radiation characteristics can be improved.

5, the heat dissipation fin is configured in three stages in order from the lower side of the connection pin 5, the parallel pin 6 and the connection pin 5 in the same manner as in the second embodiment, ), The connecting pin 5, and the parallel pin 6 in that order. Further, the present invention is not limited to the third stage, and the connecting pin 5 and the parallel pin 6 may alternatively be provided in four or more stages. The connection pins 5 and the parallel pins 6 are not limited to the alternate arrangement, but the connection pins 5 may be continuously arranged with a gap therebetween. Further, Configuration.

(Embodiment 5)

Fig. 6 is a plan view of the heat sink 41 according to Embodiment 5 of the present invention. Fig. 6 (a) shows the Z axis direction in Fig. 1, (From above), respectively. 6, the same reference numerals as in Figs. 1 and 2 denote the same or corresponding portions.

The heat sink 41 according to the fifth embodiment is structured such that the cooling fan 9 is provided near the upper exit of the heat sink 1 according to the first embodiment. By moving the upward air using the cooling fan 9 as described above, the cooling wind 8 flows from the lower opening of the heat sink 1, and the connecting pin 5 and the parallel pin 6 are air-cooled The heat generating components 4a and 4b are cooled. Particularly, by forcibly circulating the cooling wind 8 using the cooling fan 9, the cooling efficiency of the heat generating parts 4a and 4b can be improved as compared with the case where the air is heated to generate the cooling wind 8 .

Since the connection pins 5 and the parallel pins 6 are provided so that their normal lines are orthogonal to each other, a leading edge effect with a small flow resistance is obtained even in the presence of the cooling fan 9 as in the first embodiment , It is possible to improve the heat radiation characteristics.

6, the cooling fan 9 is provided at the upper part so as to flow the air upward. However, in order to blow air into the heat sink 41 from the upper side with the cooling fan 9 in the reverse direction, Air may be flown. The cooling fan 9 may be provided on the lower side of the heat sink 41. [

Although the cooling fan 9 is provided in the two-stage heat sink of the connecting pin 5 and the parallel pin 6 in Fig. 6, as shown in Fig. 3 or Fig. 5, The cooling fan 9 may be provided in the heat sink having four or more pins.

Further, the operation speed of the cooling fan 9 can be adjusted in accordance with the amount of heat generated from the exothermic parts. When the amount of heat generation is small, the cooling fan 9 may be stopped and used as natural air cooling.

(Embodiment 6)

Fig. 7 is a plan view of the heat sink 51 according to the sixth embodiment of the present invention. Fig. 7 (a) is a plan view of the heat sink 51 in the Z- In the Y-axis direction, respectively. 7, the same reference numerals as in Figs. 1 and 2 denote the same or corresponding portions.

The heat sink 51 according to the sixth embodiment differs from the heat sink 51 according to the fourth embodiment in that the side surface of the heat sink (FIG. 5) provided with the parallel pin 6 (the second area) The cooling fan 9 is provided on the side surface of the casing. In such a structure, the cooling fan 9 flows air toward the inside of the heat sink 1, so that the cooling wind 8 flows from the parallel pin 6 toward the third base plate 3c, As shown in Fig. 7 (b), the cooling wind 8 divided into upper and lower portions flows between the connecting pins 5 and is exhausted from the upper and lower openings. In this process, the heat generating components 4a and 4b are cooled . Particularly, since the cooling wind 8 is divided almost evenly in both the upper and lower directions, the heat generating parts 4a and 4b arranged above and below can be cooled almost evenly.

Particularly when the heat generation amount of the heat generating component 4c is larger than the other heat generating components 4a and 4b, the third base plate 3c The heat radiation characteristic can be improved by mounting the heat generating component 4c in the vicinity of the same height as the mounting position of the cooling fan 9 (the position facing the cooling fan 9).

7, even when the cooling fan 9 is stopped and used by disposing the cooling fan 9 on the side opposite to the third base plate 3c, The flow resistance of the natural air cooling does not occur, so that it is possible to cool more efficiently.

7, the cooling fan 9 is provided so as to draw air into the inside of the heat sink 51. In contrast to this, the cooling fan 9 is provided so as to discharge the air from the inside of the heat sink 51 It is also good.

(Seventh Embodiment)

8 is a perspective view of a heat sink 61 according to Embodiment 7 of the present invention. 8, the same reference numerals as in Figs. 1 and 2 denote the same or equivalent portions.

The heat sink 61 according to the seventh embodiment has the fourth base plate 3d so as to connect the tips of the first base plate 3a and the second base plate 3b of the heat sink (Fig. 2) ) Are provided. In such a structure, when the heat sink 61 is mounted on the wall surface, the fourth base plate 3d is mounted on the wall surface to increase the contact area, thereby reducing the contact thermal resistance and improving the heat radiation characteristics. 8, both ends of the fourth base plate 3d are extended from the first base plate 3a and the second base plate 3b, so that mounting on the wall surface with screws or the like is facilitated. A heat generating component may be provided on the outer surface of the fourth base plate 3d.

It is also possible to transfer heat from the fourth base plate 3d to the tip end portion of the parallel pin 6 by connecting the fourth base plate 3d and the front end portion of the parallel pin 6, ) Can be improved. In Fig. 8, the fourth base plate 3d is provided with a hole at the portion of the parallel pin 6, but a box-shaped heat sink 61 may be used without holes.

(Embodiment 8)

9 is a perspective view of a heat sink 71 according to Embodiment 8 of the present invention. 9, the same reference numerals as in Figs. 1 and 2 denote the same or corresponding parts.

The heat sink 71 according to the eighth embodiment is similar to the heat sink 71 according to the first embodiment except that the connection between the first base plate 3a and the second base plate 3b of the heat sink Plate 16 is provided. A fixing plate 17 is provided at the ends of the first base plate 3a and the second base plate 3b and can be mounted on the wall surface with screws or the like. A heat generating component 4d is mounted so as to be in close contact with the connecting plate 16 and the connecting pin 5 immediately in front of the connecting plate 16.

In this structure, since the first base plate 3a and the second base plate 3b are connected to the distal end portions of the parallel pins 6 by the connecting plate 16, the first base plate 3a, 2 heat from the base plate 3b to the tip end portion of the parallel pin 6 can be made possible, and the heat dissipation characteristic in the parallel pin 6 can be improved. When the fixing plate 17 is mounted on the wall surface with the heat generating component 4d provided thereon, air flows from the lower air inlet 18 and is exhausted from the air outlet 19, And it becomes possible to efficiently cool down. Further, since the front end portion of the parallel pin 6 is also open, it is also possible to cool the heat generating component 4d by the air flowing out between the connecting pins 5.

The heat sink 71 as shown in Fig. 9 can be manufactured by the die cast method by using four partial dies. More specifically, for example, in the case of manufacturing the heat sink 71 shown in Fig. 9, casting is performed by using the molds in the + Y direction, -Y direction, + Z direction, and -Z direction. In the casting step, holes for component mounting are formed at the same time. After casting, the heat sink 71 can be taken out by extracting the four molds in the + Y direction, -Y direction, + Z direction, and -Z direction, respectively. At this time, a hole for attaching the component in the X direction may be provided by using five or more partial dies.

(Embodiment 9)

10 is a plan sectional view of the electronic device 10 using the heat sink 1 (in the + Z-axis direction in FIG. 1) according to Embodiment 9 of the present invention. 2 denote the same or equivalent parts.

In the ninth embodiment, a plurality of electronic apparatuses 10 are fixed to the side surface of the mounting plate 13. [ The mounting plate 13 corresponds to, for example, the inner wall of the control panel. Each electronic apparatus 10 has, for example, a heat sink 1 shown in Embodiment Mode 1 and a housing 15 arranged so as to cover the heat sink 1. The front end portions of the first base plate 3a and the second base plate 3b of the heat sink 1 are bent in an L shape and fixed to the mounting plate 13 with screws 12. [

The heat sink 1 according to the present invention has the base portion 2 having a U-shaped structure integrally formed by, for example, a die casting method and having high rigidity, Can be fixed to the mounting plate (13).

Since the heat sink 1 is thermally connected to the mounting plate 13, the heat generated by the heat generating components 4a and 4b also moves to the mounting plate 13 and is radiated from the mounting plate 13 into the air , Heat radiation characteristics are improved.

In Fig. 10, the case where the heat sink 1 according to the first embodiment is applied to the electronic apparatus 10 has been described. However, the heat sink according to the second to eighth embodiments may be used. Although the tip portions of the first base plate 3a and the second base plate 3b are L-shaped, they may be T-shaped, for example. The contact area between the base portion 2 and the mounting plate 13 is increased by the T-shaped configuration, and the contact thermal resistance is lowered, thereby further improving the heat dissipation characteristics.

(Embodiment 10)

11 is a perspective view of a heat sink according to Embodiment 10 of the present invention, the whole of which is denoted by 81. In Fig. 12A is a plan view of the heat sink 81, FIG. 12A is a view showing the YZ plane of FIG. 11 in the + X axis direction (AA section, BB section) 12C shows the XZ plane of FIG. 11 in the -Z axis direction, FIG. 12E shows the XZ plane of FIG. 11 in the XZ plane of FIG. 12B shows the case of viewing the X-axis in the + Y-axis direction (see FIG. 12B).

As shown in Fig. 11, the heat sink 81 has, for example, a base portion 2 made of aluminum. The base portion 2 includes a first base plate 3a and a second base plate 3b disposed to face each other so as to be parallel to each other, a third base plate 3c connecting the two base plates, And a plate 3d.

The first base plate 3a and the second base plate 3b opposed to each other are connected to the inside of the base portion 2 (first region) so as to be parallel to the third base plate 3c ) Connecting pins 5 are provided. The third base plate 3c of the base portion 2 (second region) is provided with a first base plate 3b that is parallel to the first base plate 3a and the second base plate 3b, (In the YZ plane) parallel pins 6 are provided. The connection pin 5 and the parallel pin 6 are made of, for example, aluminum.

The first base plate 3a and the second base plate 3b are provided with a substrate positioning boss 20 and a screw hole 21 for fixing the substrate. A fan positioning boss 22, a fan fixing screw hole 23, a fan cover claw fixing hole 24, and a wiring passage 28 are provided on the upper portion of the base portion 2.

A fixing plate 17 is provided at the tip of the first base plate 3a and a hole 25 for fixing the heat sink is provided on the fixing plate 17. [ Further, on the outer sides of the first base plate 3a, the second base plate 3b and the fourth base plate 3d, the heat generating component is screwed to the screw hole 26 for mounting the heat generating component. A resin cover fixing hole 27 is provided in the fourth base plate 3d and a resin cover fixing claw 32 is provided in the first base plate 3a and the second base plate 3b.

In this heat sink 81, heat generated in the heat generating component is transferred from the base portion 2 to the connection pin 5 or the parallel pin 6. The surrounding air is warmed by the transmitted heat around the connecting pin 5 and the parallel pin 6 and the cooling air flowing from the lower side toward the upper side flows in from the connecting pin inlet 33 due to the density difference of the air. The base portion 2 and the connection pin 5 are air-cooled by the cooling wind and the cooling wind flowing out from the connection pin outlet 29 flows into the parallel pin inlet 30, The parallel pin 6 is air-cooled and the exothermic component is cooled in the outflow process from the parallel pin outlet 31. [

Since the heat sink 81 is provided with the parallel pin 6 above the connection pin 5, the heat radiation characteristic can be improved by the leading edge effect at the parallel pin inlet 30 (lower part of the parallel pin 6) have.

In the heat sink 81, the connection pin 5 and the parallel pin 6 are disposed so that their normal lines are perpendicular to each other. Therefore, the inflow width of the air from the connection pin outlet 29 to the parallel pin inlet 30 Widening. In addition, not only the high speed portion but also the low speed portion collides against the lower surface of the rear end pin (parallel pin 6), so that the flow resistance can be reduced.

Further, in a structure in which two heat sinks are simply opposed to each other and one end is connected as in the conventional case (for example, Patent Document 1), when a difference in calorific value between a plurality of mounted heat generating components is large, The generated heat needs to move the heat to the base plate and the pin on the opposite side through the connecting plate, there is a problem that the heat transfer path is long and the cooling efficiency is low.

In contrast to this, in the heat sink 81 according to the tenth embodiment, the first base plate 3a, the second base plate 3b, and the fourth base plate 3d on which the heat generating components are mounted are directly connected In addition, the connection pin 5 is thermally connected to the third base plate 3c in addition to the third base plate 3c. Therefore, when the difference in calorific value of each heat generating component is large, the heat is automatically balanced by thermal diffusion, and the heat radiation characteristic can be improved.

The third base plate 3c and the connecting pin 5 have an area contributing to the heat dissipation of the heat generating component 4a when the heat generation amount of the heat generating component mounted on the first base plate 3a is large The area contributing to the heat radiation of the heat generating component mounted on the second base plate 3b becomes small so that the temperature is balanced and the temperature rise of the heat generating component mounted on the first base plate 3a can be reduced .

Since the heat sink 81 is provided with the heat sink fixing hole 25, the fixing plate 17 can be closely attached to the inner wall of the control panel or the like. At this time, since the heat of the heat generating component can be transferred to the mounting plate and the heat can be dissipated, the heat dissipation characteristic can be improved. Since the ventilation inlet 18 and the ventilation outlet 19 are formed between the mounting plate and the fourth base plate d, the heat radiation characteristics of the heat generating component mounted on the fourth base plate 3d can be improved. Since the front end portion of the parallel pin 6 of the fourth base plate 3d is open, the heat-generating component mounted on the fourth base plate 3d is cooled by the cooling wind flowing out from the connection pin outlet 29 Work becomes possible.

Since the substrate positioning boss 20 and the screw holes for fixing the substrate are provided in the heat sink 81, positioning and fixing of the substrate can be performed easily when assembling the product using the heat sink 81, Since the fan positioning boss 22 and the screw fixing hole 23 for fixing the fan are also provided, the mounting of the fan can be performed easily, and the manufacturing cost can be reduced.

The heat sink 81 is provided with the fan cover claw fixing hole 24, the resin cover claw fixing hole 27 and the resin cover fixing claw 32. Therefore, The cover can be mounted by one-touch operation, and the screw fixing position can be reduced, so that the manufacturing cost can be reduced.

Further, a wiring passage 28 is provided on the upper portion of the heat sink 81, and it is possible to pass the wiring of the fan or the heating element mounted on the outside to the inside of the housing.

The heat sink 81 according to the tenth embodiment can be manufactured by a die cast method in which four or more partial molds are drawn out, and constituent elements can be simultaneously provided in multiple directions, thereby making the manufacturing process easy. Since the four base plates 3a, 3b, 3c and 4d are formed integrally with each other by the die casting method, the height of the two base plates 3a and 3b I can not see. It is also possible to provide a space between the connecting pin 5 and the parallel pin 6 by interposing the partial mold which is drawn out from the -Y direction in Fig. 11 in the + Z direction and the -Z direction So that it is possible to easily eliminate the occurrence of burrs in the die cast manufacturing process.

1: Heatsink 2: Base portion
3a: first base plate 3b: second base plate
3c: third base plate 3d: fourth base plate
4a, 4b, 4c, 4d: Heat generating component 5: Connection pin
6: parallel pin 7: thermally conductive material
8: cooling wind 9: cooling fan
10: Electronic component 12: Screw
13: mounting plate 15: housing
16: connecting plate 17: fixed plate
18: ventilation inlet 19: ventilation outlet
20: substrate positioning boss 21: substrate fixing screw hole
22: Fan positioning boss 23: Screw hole for fixing the fan
24: hole for fixing the fan cover claw 25: hole for fixing the heat sink
26: Screw hole for mounting the heat generating element 27: Hole for fixing the resin cover claw
28: wiring passage 29: connection pin outlet
30: Parallel pin inlet 31: Parallel pin outlet
32: Cloak for fixing the resin cover 32, 33: Connection pin inlet.

Claims (18)

In a heat sink provided with a heat dissipating pin in a base portion,
a) a first base plate having an outer surface and an inner surface and capable of mounting a heat generating component on an outer surface thereof; b) a second base plate having an outer surface and an inner surface and disposed so as to be parallel to the first base plate, C) a third base plate disposed vertically with respect to each of the first base plate and the second base plate and fixing the first base plate and the second base plate along the joining line and having an outer surface and an inner surface, A base portion having a first region and a second region aligned in a bonding line direction,
A connection pin which is connected to the inner surface of each of the first base plate and the second base plate and arranged so as to be parallel to the third base plate,
And a parallel pin disposed in the second area so as to be parallel to the first base plate from the inner surface of the third base plate
Heatsink. The method according to claim 1,
When seen in the direction of the line of joining, the connecting pin and the parallel pin intersect vertically
Heatsink. The method according to claim 1,
When viewed in the direction of the joining line, the base portion has a U-shaped shape
Heatsink. delete The method according to claim 1,
And the connection pin and the parallel pin are not in contact with each other.
Heatsink. The method according to claim 1,
And a fourth base plate parallel to the third base plate at the tip end portions of the first base plate and the second base plate.
Heatsink. delete The method according to claim 1,
And a connecting plate connecting the front end portions of the first base plate and the second base plate and the front end portions of the parallel pins.
Heatsink. The method according to claim 1,
The base portion has two second regions provided so as to interpose the first region or two first regions provided so as to interpose the second region
Heatsink. The method according to claim 1,
The base portion has two second regions provided so as to interpose the first region and two first regions provided so as to interpose the second region
Heatsink. The method according to any one of claims 1 to 3, 5, 6, and 8 to 10,
Characterized in that a fan is provided at an end of the base portion in the direction of the joining line
Heatsink. The method according to any one of claims 1 to 3, 5, 6, and 8 to 10,
Characterized in that a fan is provided at an end of the base portion in a direction perpendicular to the joining line so as to face the third base plate with a parallel pin interposed therebetween
Heatsink. A method of manufacturing a heat sink,
a) a first base plate having an outer surface and an inner surface and capable of mounting a heat generating component on an outer surface thereof; b) a second base plate having an outer surface and an inner surface and disposed so as to be parallel to the first base plate, C) a third base plate disposed vertically with respect to each of the first base plate and the second base plate and fixing the first base plate and the second base plate along the joining line and having an outer surface and an inner surface, A base portion having a first region and a second region arranged in a bonding line direction,
A connection pin which is connected to the inner surface of each of the first base plate and the second base plate and arranged so as to be parallel to the third base plate,
Preparing a mold corresponding to a heat sink including a parallel pin arranged so as to be parallel to the first base plate from the inner surface of the third base plate in the second area,
A step of injecting a molten thermally conductive material into the mold,
A step of cooling and solidifying the thermally conductive material to form a heat sink,
And a step of removing the heat sink from the mold,
The mold is composed of two partial molds separated by a plane perpendicular to the bonding line between a first region and a second region of the base portion and the partial molds of the first region are moved in the direction of the line of joining, The heat sink is taken out from the mold by separating the heat sink by moving it in a direction perpendicular to the joining line,
A method of manufacturing a heat sink. A method of manufacturing a heat sink,
a) a first base plate having an outer surface and an inner surface and capable of mounting a heat generating component on an outer surface thereof; b) a second base plate having an outer surface and an inner surface and disposed so as to be parallel to the first base plate, C) a third base plate disposed vertically with respect to each of the first base plate and the second base plate and fixing the first base plate and the second base plate along the joining line and having an outer surface and an inner surface, A base portion having a first region and a second region arranged in a bonding line direction,
A connection pin which is connected to the inner surface of each of the first base plate and the second base plate and arranged so as to be parallel to the third base plate,
Preparing a mold corresponding to a heat sink including a parallel pin arranged so as to be parallel to the first base plate from the inner surface of the third base plate in the second area,
A step of injecting a molten thermally conductive material into the mold,
A step of cooling and solidifying the thermally conductive material to form a heat sink,
And a step of removing the heat sink from the mold,
The mold is composed of two partial molds separated by a plane perpendicular to the joining line between the first region and the second region of the base portion and the two partial molds are moved and separated in the joining line direction to take out the heat sink from the mold Characterized in that
A method of manufacturing a heat sink. 14. The method of claim 13,
The mold is composed of at least two partial molds in the direction of the joining line and at least four partial molds in total of two or more partial molds in the direction perpendicular to the joining line and each mold is separated and moved in the direction of the joining line and the joining line , And the heat sink is taken out from the mold
A method of manufacturing a heat sink. 16. The method of claim 15,
Characterized in that the joining line for forming the parallel pin and the partial mold in the vertical direction are interposed in the partial mold in the joining line direction
A method of manufacturing a heat sink. 17. The method according to any one of claims 13 to 16,
The method for manufacturing the heat sink is characterized in that a die casting method is used
A method of manufacturing a heat sink. The method according to any one of claims 1 to 3, 5, 6, and 8,
A substrate positioning boss provided on the first base plate and the second base plate and a screw hole for fixing the substrate,
A fan positioning boss provided on an upper portion of the base portion, a screw hole for fixing the fan, a hole for fixing the fan cover claw,
A fixing plate provided at the tip of the first base plate,
A heat sink fixing hole provided in the fixing plate,
A screw hole for mounting a heat generating component provided on the first base plate, the second base plate and the fourth base plate,
A resin cover fixing hole provided in the fourth base plate,
And a resin cover fixing claw provided on the first base plate and the second base plate.
Heatsink.

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