JP2024113255A - Cooling structure and semiconductor device using same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a cooling structure and a semiconductor device using the same which improves the effect of cooling a heating element while suppressing energy consumption required for blowing air by reducing pressure loss of a heat dissipation fin.

SOLUTION: A cooling structure includes a base having a heating element thermally connected to one side and a plurality of heat dissipation fins on the other side, and a wind tunnel having a first wind tunnel for allowing gas to flow from the outside into the heat dissipation fins, and a second wind tunnel connected to the first wind tunnel via the heat dissipation fins and discharging gas that has passed through the heat dissipation fins to the outside, the first wind tunnel has an inlet that takes in gas and a first wind tunnel outlet that discharges gas to the heat dissipation fins, the first wind tunnel outlet abuts against the end of the heat dissipation fin on the opposite side to the base over its entire circumference, the second wind tunnel has a collection portion that collects gas radially discharged from the heat dissipation fins in a direction parallel to the other side of the base, an outlet that discharges the gas to the outside, and an outlet portion that directs the gas from the collection portion to the outlet, the outlet portion extends in a specific direction away from the inlet.

SELECTED DRAWING: Figure 17

COPYRIGHT: (C)2024,JPO&INPIT

Description

This application relates to a cooling structure and a semiconductor device using the same.

In a device having a heat generating element to be cooled, a cooling structure such as a heat sink is provided to promote heat dissipation from the heat generating element. The cooling structure is provided to suppress deterioration of the device's functionality caused by heat generated by the heat generating element. A typical heat sink has a structure in which multiple heat dissipation fins are arranged parallel to each other at predetermined intervals. By blowing air into the gaps between the multiple heat dissipation fins, the heat from the heat generating element can be efficiently dissipated from the heat dissipation fins.

To improve heat dissipation performance, it is sufficient to arrange the heat dissipation fins at a high density. However, when the heat dissipation fins are arranged in parallel at a high density, the flow resistance in the direction of gas flow increases, and the pressure loss of the gas increases. When the pressure loss of the gas increases, the energy consumption required for blowing air increases. A structure to solve this problem has been disclosed (for example, see Patent Document 1). Patent Document 1 discloses a cooling structure that includes a heat sink base, a plurality of fans installed facing the surface of the heat sink base, and a plurality of fins erected on the surface of the heat sink base so as to extend while curving from the positions facing the plurality of fans on the surface of the heat sink base, and a heat sink structure in which gas flows from the center of the fins toward the outside.

Patent No. 3591391

In the above-mentioned Patent Document 1, air is blown from the center of the fins and guided radially outward from the fins, shortening the length of the path of the gas passing between the fins and reducing the pressure loss of the gas. Because the pressure loss of the gas is reduced, it is possible to obtain the effect of reducing the consumption of energy required for blowing air. However, in the disclosed cooling structure, the gas inlet and outlet for the fins are close to each other, so the gas that has passed through the fins and been heated is taken in again through the gas inlet, which reduces the cooling effect of the heat-generating body.

Therefore, the present application aims to provide a cooling structure that reduces the pressure loss of the heat dissipation fins, suppresses the energy consumption required for blowing air, and improves the cooling effect of the heat generating body, as well as a semiconductor device using the same.

The cooling structure disclosed in the present application comprises a base having a heat generating element thermally connected to one side and a plurality of heat dissipation fins on the other side, a first wind tunnel for allowing gas to flow from the outside into the heat dissipation fins, and a second wind tunnel that communicates with the first wind tunnel via the heat dissipation fins and discharges gas that has passed through the heat dissipation fins to the outside, the first wind tunnel has an inlet for taking in gas and a first wind tunnel outlet for discharging gas to the heat dissipation fins, the first wind tunnel outlet abutting the end of the heat dissipation fin on the opposite side to the base over the entire circumference, the second wind tunnel has a collection section for collecting gas discharged radially from the heat dissipation fins in a direction parallel to the other side of the base, an outlet for discharging gas to the outside, and an outlet section for guiding gas from the collection section to the outlet, the outlet section extending in a specific direction away from the inlet.

The semiconductor device disclosed in this application is equipped with the cooling structure disclosed in this application and a heating element having a semiconductor element.

According to the cooling structure disclosed in the present application, a base is provided with a heat generating element thermally connected to one side and a plurality of heat dissipation fins on the other side, a first wind tunnel for allowing gas to flow from the outside into the heat dissipation fins, and a second wind tunnel that is connected to the first wind tunnel via the heat dissipation fins and discharges gas that has passed through the heat dissipation fins to the outside, the first wind tunnel having an inlet for taking in gas and a first wind tunnel outlet for discharging gas to the heat dissipation fins, and the first wind tunnel outlet is provided on the side opposite the base of the heat dissipation fins around the entire circumference. The second air tunnel abuts against the end, and has a collection section that collects the gas discharged radially from the heat dissipation fin in a direction parallel to the other surface of the base, an exhaust port that discharges the gas to the outside, and an outlet section that guides the gas from the collection section to the exhaust port. Since the outlet section extends in a specific direction away from the inlet, the gas is discharged radially in a direction parallel to the other surface of the base, shortening the path length of the gas that experiences fluid resistance, suppressing an increase in gas pressure loss, and reducing the energy consumption required for blowing air. In addition, re-intake of high-temperature gas that has passed through the heat dissipation fin from the inlet port is suppressed, improving the cooling effect of the heat-generating body.

The semiconductor device disclosed in the present application is equipped with the cooling structure disclosed in the present application and a heat generating body having a semiconductor element, so that it is possible to obtain a semiconductor device that achieves a high cooling effect for the heat generating body while suppressing the energy consumption required for blowing air for cooling.

1 is a perspective view of a semiconductor device according to a first embodiment; FIG. 1 is a plan view of a semiconductor device according to a first embodiment; 3 is a perspective cross-sectional view of the semiconductor device taken along the line AA in FIG. 2. 3 is a cross-sectional view of the semiconductor device taken along the line AA in FIG. 2. 3 is a cross-sectional view of the semiconductor device taken along the line BB in FIG. 2. 1 is a perspective view showing a main part of a cooling structure of a semiconductor device according to a first embodiment; 13 is a perspective view showing a main part of a cooling structure of another semiconductor device according to the first embodiment; FIG. 3 is a perspective cross-sectional view of another semiconductor device taken along the line AA of FIG. 2. FIG. 11 is an exploded perspective view of a semiconductor device according to a second embodiment. FIG. 11 is an exploded perspective cross-sectional view of a semiconductor device according to a second embodiment. FIG. 11 is a perspective view showing a main part of a cooling structure of a semiconductor device according to a third embodiment. FIG. 11 is a perspective cross-sectional view of a semiconductor device according to a third embodiment. FIG. 11 is a cross-sectional view of a semiconductor device according to a third embodiment. 14 is a cross-sectional view of the cooling structure of the semiconductor device taken along the CC cross section in FIG. 13. 15 is a cross-sectional view of the cooling structure of the semiconductor device taken along the line DD in FIG. 14. FIG. 13 is a perspective view of a semiconductor device according to a fourth embodiment. FIG. 13 is a perspective cross-sectional view of a semiconductor device according to a fourth embodiment. FIG. 13 is a perspective view of a semiconductor device according to a fourth embodiment. FIG. 13 is a perspective cross-sectional view of a semiconductor device according to a fourth embodiment. FIG. 13 is a perspective view of a semiconductor device according to a fifth embodiment. FIG. 13 is a perspective cross-sectional view of a semiconductor device according to a fifth embodiment. FIG. 13 is a perspective view of a semiconductor device according to a fifth embodiment. FIG. 13 is an exploded perspective view of a semiconductor device according to a fifth embodiment. 13 is a plan view of a main part of a cooling structure of a semiconductor device according to a sixth embodiment. FIG.

The power conversion device according to the embodiment of the present application will be described below with reference to the drawings. Note that the same or equivalent members and parts in each drawing will be denoted by the same reference numerals.

Embodiment 1.
Fig. 1 is a perspective view of a semiconductor device 100 according to the first embodiment, Fig. 2 is a plan view of the semiconductor device 100, in which the heat dissipation fins 3 are omitted, Fig. 3 is a perspective cross-sectional view of the semiconductor device 100 cut at the A-A cross section position in Fig. 2, Fig. 4 is a cross-sectional view of the semiconductor device 100 cut at the A-A cross section position in Fig. 2, Fig. 5 is a cross-sectional view of the semiconductor device 100 cut at the B-B cross section position in Fig. 2, Fig. 6 is a perspective view showing a main part of a cooling structure 101 of the semiconductor device 100, in which the base 2 is seen from the side of the heat dissipation fin installation surface 2b, and Fig. 7 is a perspective view showing a main part of a cooling structure 101 of another semiconductor device 100 according to the first embodiment, in which the base 2 is seen from the side of the heat dissipation fin installation surface 2b. The semiconductor device 100 is, for example, a device that converts an input current from DC to AC, AC to DC, or an input voltage to a different voltage using a semiconductor element. In this embodiment, a semiconductor device 100 will be described as an application example of the cooling structure 101 disclosed in the present application, but the application example of the cooling structure 101 is not limited to semiconductor devices. The cooling structure 101 can also be applied to a capacitor module or the like that is a heat generating body that does not have a semiconductor element.

<Semiconductor device 100>
The semiconductor device 100 includes a cooling structure 101 and a heat generating body 1, as shown in Fig. 1. The heat generating body 1 includes a semiconductor element 1a, as shown in Fig. 3. The cooling structure 101 includes a base 2 and an air tunnel 6. In the figure, the extension direction of a portion of a second air tunnel 6b, which will be described later, is the X direction, and directions perpendicular to the X direction and perpendicular to each other are the Y direction and the Z direction. Fig. 4 shows an XZ cross section, and Fig. 5 shows a YZ cross section. The heat generating body 1 including the semiconductor element 1a is, for example, a power module. Although Fig. 3 shows only one semiconductor element 1a, the number of semiconductor elements 1a is not limited to one. When the heating element 1 is a power module, the power module is formed by molding a semiconductor element 1a, such as a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), a diode, etc., with a resin together with an electrical insulating layer, a thermal diffusion layer, etc. The power module, which is the heating element 1, is cooled by a cooling structure 101. The cooling suppresses the deterioration of the function of the power module caused by heat generation.

<Cooling structure 101>
The configuration of the cooling structure 101 will be described. As shown in FIG. 4, the base 2 has a heat generating body 1 thermally connected to one surface thereof and a plurality of heat dissipation fins 3 on the other surface thereof. One surface of the base 2 is a heat generating body mounting surface 2a, and the other surface of the base 2 opposite to the one surface is a heat dissipation fin installation surface 2b. The base 2 is made of a metal such as aluminum in a plate shape. The heat dissipation fins 3 may be integrally formed on the heat dissipation fin installation surface 2b of the base 2. The heat dissipation fins 3 may be provided separately from the base 2 and thermally connected to the heat dissipation fin installation surface 2b via an intermediary such as heat dissipation grease.

The wind tunnel 6 has a first wind tunnel 6a that allows gas to flow from the outside into the heat dissipation fin 3, and a second wind tunnel 6b that communicates with the first wind tunnel 6a via the heat dissipation fin 3 and discharges the gas that has passed through the heat dissipation fin 3 to the outside. The first wind tunnel 6a has an inlet 13 that takes in gas, and a first wind tunnel outlet 5 that discharges gas to the heat dissipation fin 3. The first wind tunnel outlet 5 abuts against the end of the heat dissipation fin 3 opposite the base 2 side over the entire circumference. The part of the heat dissipation fin 3 that abuts against the first wind tunnel outlet 5 is the abutment end 3a. Since the first wind tunnel outlet 5 abuts against the heat dissipation fin 3, the gas that flows in from the inlet 13 can be reliably flowed into the heat dissipation fin 3. The second air channel 6b has a collection section 11 that collects gas discharged radially from the heat dissipation fins 3 in a direction parallel to the other surface of the base 2, an exhaust port 7 that discharges the gas to the outside, and an outlet section 10 that guides the gas from the collection section 11 to the exhaust port 7. The outlet section 10 extends in a specific direction away from the inlet 13. In this embodiment, the specific direction is the X direction.

The gas passed through the air tunnel 6 is, for example, air. The gas is not limited to air, and may be other gases such as argon. The gas passes through the inlet 13, flows into the heat dissipation fins 3 from the first air tunnel outlet 5, then changes direction parallel to and radially from the heat dissipation fin installation surface 2b of the base 2, passes through the heat dissipation fins 3, and is guided in a specific direction by the outlet section 10 of the second air tunnel 6b so as not to be re-taken from the inlet 13, and is discharged from the outlet 7. The cooling structure 101 is a structure that can effectively cool the heat generating body 1 by passing the gas through the heat dissipation fins 3 and not being re-taken from the inlet 13.

The energy required for the gas to move inside the wind tunnel 6 can be obtained by creating a state in which the pressure on the inlet 13 side is higher than the pressure on the outlet 7 side. In this embodiment, the state in which the pressure on the inlet 13 side is higher is created by providing the blower fan 4, which is the air blowing means, on the inlet 13 side. The method of creating a state in which the pressure on the inlet 13 side is higher is not limited to this. It is also possible to provide a suction fan or the like on the outlet 7 side to lower the pressure on the outlet 7 side.

In this embodiment, an example in which one exhaust port 7 and one lead-out portion 10 are provided is shown, but the number of exhaust ports 7 and lead-out portions 10 is not limited to one. There may be two or more exhaust ports 7 and lead-out portions 10. An example in which two exhaust ports 7 and two lead-out portions 10 are provided is shown in FIG. 8. FIG. 8 is a perspective cross-sectional view of another semiconductor device 100 cut at the A-A cross-sectional position in FIG. 2. Two exhaust ports 7 and two lead-out portions 10 are provided, and the two lead-out portions 10a and 10b extend in opposite directions from the collection portion 11, and the two exhaust ports 7a and 7b open in opposite directions. In FIG. 8, the exhaust port 7a opens in the X direction, and the exhaust port 7b opens in the -X direction. With this configuration, the pressure on the exhaust port 7 side can be further reduced than the pressure on the inlet 13 side. Since the pressure on the exhaust port 7 side is further reduced, the energy consumption for blowing air can be further reduced.

<Heat dissipation fin 3>
6 and 7 show examples of the arrangement of the plurality of heat dissipation fins 3. In this embodiment, the plurality of heat dissipation fins 3 are a plurality of plate-shaped fins extending radially from the center to the outer periphery when viewed in a direction perpendicular to the heat dissipation fin installation surface 2b. By configuring in this manner, gas can be efficiently discharged radially in a direction parallel to the heat dissipation fin installation surface 2b of the base 2 toward the collection unit 11. The shape of the plurality of heat dissipation fins 3 may be flat as shown in FIG. 6. The shape of the plurality of heat dissipation fins 3 may also be curved as shown in FIG. 7. For example, when there is a swirling flow in the flow of gas sent out from the blowing means, it is desirable to make the heat dissipation fins curved along the swirling direction of the gas as shown in FIG. By curving the heat dissipation fins 3 along the swirling direction of the gas, the pressure loss of the gas can be reduced. When the plurality of heat dissipation fins 3 are arranged radially as shown in FIG. 6 or FIG. 7, a fin-free portion 8 is generated in the center of the heat dissipation fin installation surface 2b. The non-fin portions 8 are formed so that the plurality of heat dissipating fins 3 are not in contact with each other. In the non-fin portions 8, the heat dissipating fin mounting surface 2b is exposed.

The effect of heat dissipation from the heat generating body 1 by the heat dissipation fins 3 is higher as the surface area of the heat dissipation fins 3 is larger, so the heat dissipation effect can be increased by shortening the distance between adjacent heat dissipation fins 3 and arranging the heat dissipation fins 3 closely. On the other hand, when the heat dissipation fins 3 are arranged closely, the cross-sectional area through which the gas passes between adjacent heat dissipation fins becomes smaller, and the flow rate of the gas increases. When the flow rate of the gas increases, the pressure loss of the gas increases, and the energy consumption for blowing air increases. In this embodiment, the gas flows radially from the center of the heat dissipation fins 3 to the outer periphery, so the flow rate of the gas flowing between the heat dissipation fins 3 is smaller and the length of the path through which the gas passes between the heat dissipation fins 3 is shorter than when the gas flows linearly from one end to the other end of multiple heat dissipation fins arranged in parallel. Therefore, even when the heat dissipation fins 3 are arranged closely, the increase in the flow rate of the gas can be suppressed, and the path length subjected to fluid resistance is shortened, which suppresses the increase in the pressure loss of the gas and reduces the energy consumption for blowing air.

<Derivation section 10>
The effect of providing the outlet portion 10, which is a main part of the present application, will be described. In order to enhance the cooling effect of the heat generating body 1, it is necessary to lower the temperature of the gas flowing into the inlet 13 as much as possible. Therefore, it is important not to re-take the gas that has absorbed heat from the heat generating body 1 and become hot at the inlet 13. In this embodiment, as shown in FIG. 4, the outlet portion 10 extends in the X direction, which is a specific direction away from the inlet 13. The gas flowing in from the inlet 13 absorbs heat from the heat dissipation fins 3 and becomes hot when passing through the heat dissipation fins 3, and is guided to the exhaust port 7 provided at a position away from the inlet 13 and discharged to the outside without leaking to the outside due to the airtight air tunnel 6. Therefore, the high-temperature gas discharged from the exhaust port 7 is unlikely to re-flow into the inlet 13. Since the high-temperature gas is unlikely to re-flow from the inlet 13, the cooling effect of the heat generating body 1 can be enhanced.

The opening direction of the inlet 13 and the extension direction of the outlet 10 have an angle difference of 90 degrees or more. In this embodiment, as shown in FIG. 4, the opening direction of the inlet 13 is the Z direction, and the extension direction of the outlet 10 is the X direction, so there is an angle difference of 90 degrees between the opening direction of the inlet 13 and the extension direction of the outlet 10. The cooling structure 101 is not limited to a configuration in which the opening direction of the inlet 13 and the extension direction of the outlet 10 have an angle difference of 90 degrees or more, but by having an angle difference of 90 degrees or more between the opening direction of the inlet 13 and the extension direction of the outlet 10, it is possible to further suppress re-intake of high-temperature gas discharged from the exhaust port 7 through the inlet 13.

The extension length of the outlet section 10 is longer than the extension length of the first wind tunnel 6a. In this embodiment, as shown in FIG. 4, the extension length of the outlet section 10 extending in the X direction is longer than the extension length of the first wind tunnel 6a extending in the Z direction. The cooling structure 101 is not limited to a configuration in which the extension length of the outlet section 10 is longer than the extension length of the first wind tunnel 6a, but by making the extension length of the outlet section 10 longer than the extension length of the first wind tunnel 6a, the exhaust port 7 can be reliably moved away from the inlet 13, and the re-intake of high-temperature gas discharged from the exhaust port 7 through the inlet 13 can be further suppressed.

In this embodiment, an example is shown in which a first air tunnel 6a extending in the Z direction, which is a direction perpendicular to the heat dissipation fin installation surface 2b, and an outlet portion 10 extending in the X direction perpendicular to the Z direction are provided, but the configuration of the air tunnel 6 is not limited to this. By changing the shape of the air tunnel 6, the position of the exhaust port 7 can be changed to a desired position. For example, if another device is installed around the cooling structure 101 and the allowable temperature of that device is low, the position of the exhaust port 7 can be changed to prevent the high-temperature gas from hitting the device with the low allowable temperature.

By configuring the semiconductor device 100 by applying the cooling structure 101 shown in this embodiment to a heat generating body 1 such as an inverter having a semiconductor element, it is possible to obtain a semiconductor device 100 that achieves a high cooling effect for the heat generating body 1 while suppressing the energy consumption required for blowing air for cooling. Since a high cooling effect for the heat generating body 1 is obtained, it is possible to suppress a decrease in the function of the semiconductor device 100 caused by heat generation of the heat generating body 1. In addition, a high cooling effect for the heat generating body 1 can be obtained by the compact cooling structure 101. By applying such a semiconductor device 100 to an electric vehicle such as an electric car, it is possible to achieve improved power consumption performance and compact size.

As described above, the cooling structure 101 according to the first embodiment includes a base 2 having a heat generating element 1 thermally connected to the heat generating element mounting surface 2a and a plurality of heat dissipation fins 3 on the heat dissipation fin installation surface 2b, and a wind tunnel 6 having a first wind tunnel 6a for flowing gas from the outside into the heat dissipation fins 3 and a second wind tunnel 6b that communicates with the first wind tunnel 6a via the heat dissipation fins 3 and discharges gas that has passed through the heat dissipation fins 3 to the outside, the first wind tunnel 6a having an inlet 13 for taking in gas and a first wind tunnel outlet 5 for discharging gas to the heat dissipation fins 3, and the first wind tunnel outlet 5 is connected to the base 2 of the heat dissipation fins 3 around the entire circumference. The second air tunnel 6b has a collection section 11 that collects gas discharged radially from the heat dissipation fin 3 in a direction parallel to the heat dissipation fin installation surface 2b of the base 2, an exhaust port 7 that discharges the gas to the outside, and an outlet section 10 that guides the gas from the collection section 11 to the exhaust port 7. Since the outlet section 10 extends in a specific direction away from the inlet 13, the gas is discharged radially in a direction parallel to the heat dissipation fin installation surface 2b of the base 2, so the path length of the gas that receives fluid resistance is shortened, the increase in pressure loss of the gas is suppressed, and energy consumption for blowing air can be suppressed. In addition, the re-intake of high-temperature gas that has passed through the heat dissipation fin 3 from the inlet 13 is suppressed, so the cooling effect of the heat generating body 1 can be improved. In addition, since the first air tunnel exhaust port 5 abuts the heat dissipation fin 3, the gas that flows in from the inlet 13 can be reliably flowed into the heat dissipation fin 3.

When the opening direction of the inlet 13 and the extension direction of the outlet 10 have an angle difference of 90 degrees or more, the re-intake of high-temperature gas discharged from the outlet 7 through the inlet 13 can be further suppressed. In addition, when the extension length of the outlet 10 is longer than the extension length of the first air tunnel 6a, the outlet 7 can be reliably moved away from the inlet 13, so that the re-intake of high-temperature gas discharged from the outlet 7 through the inlet 13 can be further suppressed.

When two exhaust ports 7 and two lead-out sections 10 are provided, the two lead-out sections 10a, 10b extend from the collection section 11 in opposite directions, and the two exhaust ports 7a, 7b open in opposite directions, the pressure on the exhaust port 7 side can be further reduced than the pressure on the inlet 13 side. Because the pressure on the exhaust port 7 side is further reduced, the energy consumption for blowing air can be further reduced.

When the multiple heat dissipation fins 3 are multiple plate-shaped fins extending radially from the center to the outer periphery when viewed in a direction perpendicular to the heat dissipation fin installation surface 2b, gas can be efficiently discharged radially in a direction parallel to the heat dissipation fin installation surface 2b of the base 2 toward the collection section 11. In addition, when the semiconductor device 100 includes the cooling structure 101 disclosed in the present application and a heat generating body 1 having a semiconductor element 1a, it is possible to obtain a semiconductor device 100 that achieves a high cooling effect for the heat generating body 1 while suppressing the energy consumption required for blowing air for cooling.

Embodiment 2.
A semiconductor device 100 according to the second embodiment will be described. Fig. 9 is an exploded perspective view of the semiconductor device 100 according to the second embodiment, and Fig. 10 is an exploded perspective cross-sectional view of the semiconductor device 100 shown in Fig. 9. The state before disassembly in Fig. 9 is equivalent to the semiconductor device 100 shown in Fig. 1 of the first embodiment. The cross-sectional position in Fig. 10 is equivalent to the A-A cross-sectional position shown in Fig. 2. In the cooling structure 101 of the semiconductor device 100 according to the second embodiment, the air channel 6 has a first air channel member 21 and a second air channel member 22.

As shown in FIG. 9, the wind tunnel 6 has a first wind tunnel member 21 and a second wind tunnel member 22. The first wind tunnel member 21 and the second wind tunnel member 22 are combined to form the wind tunnel 6. The first wind tunnel member 21 has a plate-shaped lid portion 21a and a recess 21b formed in the lid portion 21a. The opening of the recess 21b is the inlet 13, and the first wind tunnel exhaust port 5 is formed in the bottom wall 21c of the recess 21b. The recess 21b portion is the first wind tunnel 6a. The second wind tunnel member 22 has a plate-shaped foundation wall 22a and a peripheral wall 22b that surrounds the periphery of the foundation wall 22a except for the portion that becomes the exhaust port 7 and has a tip connected to the outer peripheral end of the lid portion 21a. The foundation wall 22a has an opening 22c in which the heat dissipation fin 3 is provided at a position opposite the recess 21b. The space surrounded by the first wind tunnel member 21 and the second wind tunnel member 22 is the second wind tunnel 6b.

As shown in FIG. 4 of the first embodiment, the vertical height of the heat dissipation fin installation surface 2b in the collection section 11 around the heat dissipation fin 3 is lower than the vertical height of the heat dissipation fin installation surface 2b in the outlet section 10. Therefore, as shown in FIG. 9, the bottom wall 21c on which the first wind tunnel outlet 5 is provided is not on the same plane as the lid portion 21a of the first wind tunnel member 21.

The first wind tunnel exhaust port 5 is provided as a through hole in the bottom wall 21c of the recess 21b. As shown in FIG. 4, the surface of the bottom wall 21c on which the first wind tunnel exhaust port 5 is provided, facing the heat dissipation fin 3, is in contact with the abutting end 3a of the heat dissipation fin 3 so that the gas that has flowed into the heat dissipation fin 3 does not flow back into the first wind tunnel 6a upstream of the first wind tunnel exhaust port 5. On the other hand, in the second wind tunnel 6b, which is the area downstream of the heat dissipation fin 3 in the wind tunnel 6, the fluid resistance is reduced by increasing the cross-sectional area of the part through which the gas passes as much as possible. When the fluid resistance of the gas is reduced, the energy consumption required for blowing air can be reduced.

By making the vertical height of the heat dissipation fin installation surface 2b in the collection section 11 around the heat dissipation fin 3 lower than the vertical height of the heat dissipation fin installation surface 2b in the lead-out section 10, in other words, in the configuration shown in this embodiment, the first wind tunnel exhaust port 5 is provided, and the bottom wall 21c in contact with the abutting end portion 3a of the heat dissipation fin 3 and the lid portion 21a of the first wind tunnel member 21 are not on the same plane, so that the cross-sectional area of the portion through which the gas passes in the second wind tunnel 6b, which is the area downstream of the heat dissipation fin 3, can be expanded on the exhaust port 7 side. Since the cross-sectional area of the portion through which the gas passes in the second wind tunnel 6b is expanded on the exhaust port 7 side, the fluid resistance of the gas in the second wind tunnel 6b can be reduced. Since the fluid resistance of the gas is reduced, the energy consumption required for blowing air can be suppressed.

When manufacturing the shape of the wind tunnel 6 shown in FIG. 4 of the first embodiment as a finished product, the first wind tunnel outlet 5 is not on the same plane as the lid portion 21a and is an undercut, so it is necessary to use a manufacturing method with low productivity such as a 3D printer. In this embodiment, as described above, the wind tunnel 6 has the first wind tunnel member 21 and the second wind tunnel member 22, and the wind tunnel 6 is formed by combining the first wind tunnel member 21 and the second wind tunnel member 22. Each of the first wind tunnel member 21 and the second wind tunnel member 22 can be manufactured by a manufacturing method with high productivity such as resin molding, die casting molding, and sheet metal molding. By forming the wind tunnel 6 with the first wind tunnel member 21 and the second wind tunnel member 22, the productivity of the cooling structure 101 can be improved.

As described above, in the cooling structure 101 according to embodiment 2, the vertical height of the heat dissipation fin mounting surface 2b in the portion of the collection section 11 around the heat dissipation fin 3 is lower than the vertical height of the heat dissipation fin mounting surface 2b in the outlet section 10, so that in the second wind tunnel 6b, which is the region downstream of the heat dissipation fin 3, the cross-sectional area of the portion through which the gas passes can be expanded on the side of the exhaust port 7. Since the cross-sectional area of the portion through which the gas passes in the second wind tunnel 6b expands on the side of the exhaust port 7, the fluid resistance of the gas in the second wind tunnel 6b can be reduced. Since the fluid resistance of the gas is reduced, the energy consumption required for blowing air can be suppressed.

The wind tunnel 6 has a first wind tunnel member 21 and a second wind tunnel member 22, the first wind tunnel member 21 has a plate-shaped lid portion 21a and a recess 21b formed in the lid portion 21a, the opening of the recess 21b is the inlet 13, the first wind tunnel exhaust outlet 5 is formed in the bottom wall of the recess 21b, the second wind tunnel member 22 has a plate-shaped foundation wall 22a and a peripheral wall 22b that surrounds the periphery of the foundation wall 22a except for the portion that becomes the exhaust outlet 7 and has a tip connected to the outer peripheral end of the lid portion 21a. When the base wall 22a has an opening 22c where the heat dissipation fins 3 are provided at a position opposite the recess 21b, and the space surrounded by the first wind tunnel member 21 and the second wind tunnel member 22 is the second wind tunnel 6b, each of the first wind tunnel member 21 and the second wind tunnel member 22 can be manufactured by a highly productive manufacturing method such as resin molding, die casting molding, or sheet metal molding, thereby improving the productivity of the cooling structure 101.

Embodiment 3.
A semiconductor device 100 according to the third embodiment will be described. FIG. 11 is a perspective view showing a main part of a cooling structure 101 of a semiconductor device 100 according to the third embodiment, in which the base 2 is seen from the side of the heat dissipation fin installation surface 2b. FIG. 12 is a perspective cross-sectional view of the semiconductor device 100, in which the cross-sectional position is equivalent to the A-A cross-sectional position shown in FIG. 2. FIG. 13 is a cross-sectional view of the semiconductor device 100, in which the cross-sectional position is equivalent to the A-A cross-sectional position shown in FIG. 2. FIG. 14 is a cross-sectional view of the cooling structure 101 of the semiconductor device 100 cut at the C-C cross-sectional position in FIG. 13. FIG. 15 is a cross-sectional view of the cooling structure 101 of the semiconductor device 100 cut at the D-D cross-sectional position in FIG. 14. The cooling structure 101 of the semiconductor device 100 according to the third embodiment has a pin fin 9 as the heat dissipation fin 3. The collecting portion 11 has an inner collecting portion 12a and an outer collecting portion 12b surrounding the inner collecting portion 12a.

<Pinfin 9>
The heat dissipating fins 3 are a plurality of columnar fins erected on the heat dissipating fin installation surface 2b of the base 2. The columnar fins are pin fins 9 as shown in FIG. 11. The pin fins 9 are uniformly arranged on the heat dissipating fin installation surface 2b. In this embodiment, since the pin fins 9 are used as the heat dissipating fins 3, the fin non-arrangement portion 8 that occurs when the plate-shaped heat dissipating fins 3 are arranged radially does not occur, and the heat dissipating fins 3 can be arranged in the central region of the heat dissipating fin installation surface 2b where the fin non-arrangement portion 8 occurs. The heat dissipating fins 3 are not arranged in the fin non-arrangement portion 8, the heat dissipating fin installation surface 2b is exposed, and the fin non-arrangement portion 8 is an area where the cooling effect of the heat generating body 1 is reduced.

In this embodiment, the multiple heat dissipation fins 3 are multiple pin fins 9 erected on the heat dissipation fin installation surface 2b of the base 2, so that multiple heat dissipation fins 3 can be arranged in the central area of the heat dissipation fin installation surface 2b, which was previously the non-fin arrangement area 8, thereby improving the cooling effect of the heat generating body 1. Even if pin fins 9 are used as the heat dissipation fins 3, the gas can pass through the inlet 13, flow into the heat dissipation fins 3 from the first wind tunnel outlet 5, and then change direction parallel to and radially from the heat dissipation fin installation surface 2b of the base 2 to pass through the heat dissipation fins 3.

<Collection Unit 11>
In this embodiment, the collecting section 11 has an inner collecting section 12a surrounding the periphery of the heat dissipating fin 3 and an outer collecting section 12b surrounding the inner collecting section 12a, as shown in FIG. 15. The vertical height of the heat dissipating fin installation surface 2b in the outer collecting section 12b is higher than the vertical height of the heat dissipating fin installation surface 2b in the inner collecting section 12a. In this embodiment, all parts of the collecting section 11 surrounding the periphery of the heat dissipating fin 3 have the inner collecting section 12a and the outer collecting section 12b, but this is not limited thereto. It is preferable that the inner collecting section 12a and the outer collecting section 12b are provided at least in the part of the collecting section 11 provided in the Y direction different from the specific X direction (the part indicated by diagonal lines in FIG. 14). The reason for this and the effect of providing the inner collecting section 12a and the outer collecting section 12b will be described below.

In FIG. 14, the arrows indicate the direction of flow of the gas after passing through the heat dissipation fins 3. In the outlet section 10 and the part of the collection section 11 adjacent to the outlet section 10, the gas flows in one direction (specific direction X) toward the exhaust port 7. In the part of the collection section 11 not adjacent to the outlet section 10, the gas changes direction and flows toward the outlet section 10, passes through the outlet section 10, and is exhausted from the exhaust port 7. When the gas changes direction and flows, pressure loss occurs, and the pressure loss increases as the flow speed of the gas when changing direction increases. The greater the pressure loss of the gas, the more energy is consumed to blow the air. Therefore, reducing the pressure loss by reducing the flow speed of the gas in the collection section 11 not adjacent to the outlet section 10 where the gas changes direction is effective in reducing the energy consumption required for blowing the air.

In this embodiment, the vertical height of the heat dissipation fin installation surface 2b in the outer collection section 12b is higher than the vertical height of the heat dissipation fin installation surface 2b in the inner collection section 12a, so the cross-sectional area through which gas flows is larger in the outer collection section 12b than in the inner collection section 12a. By having the outer collection section 12b in addition to the inner collection section 12a, the collection section 11 can reduce the flow rate of gas in the collection section 11. Since the flow rate of gas in the collection section 11 having the outer collection section 12b is reduced, the pressure loss of gas in the collection section 11 having the outer collection section 12b can be reduced. Since the pressure loss of gas in the collection section 11 having the outer collection section 12b is reduced, the energy consumption for blowing air can be reduced.

The portion of the collection section 11 shown with diagonal lines in FIG. 14 is where the gas changes direction after passing through the heat dissipation fins 3, so it is desirable to provide an outer collection section 12b. In addition, the portion of the collection section 11 shown with diagonal lines in FIG. 14 also passes through gas that has flowed into the collection section 11 on the left side of FIG. 14, so it is desirable to provide an outer collection section 12b to expand the area through which the gas passes.

As described above, in the cooling structure 101 according to embodiment 3, the multiple heat dissipation fins 3 are multiple columnar fins erected on the heat dissipation fin installation surface 2b of the base 2, so that the multiple heat dissipation fins 3 can also be arranged in the central area of the heat dissipation fin installation surface 2b, which was previously the non-fin arrangement portion 8, thereby improving the cooling effect of the heat generating body 1.

When the collection section 11 has an inner collection section 12a that surrounds the periphery of the heat dissipation fin 3 and an outer collection section 12b that surrounds the inner collection section 12a, and the vertical height of the heat dissipation fin installation surface 2b in the outer collection section 12b is higher than the vertical height of the heat dissipation fin installation surface 2b in the inner collection section 12a, the flow rate of the gas in the collection section 11 decreases, so that the pressure loss of the gas in the collection section 11 with the outer collection section 12b can be reduced. Since the pressure loss of the gas in the collection section 11 with the outer collection section 12b is reduced, the energy consumption for blowing air can be reduced.

Embodiment 4.
A semiconductor device 100 according to the fourth embodiment will be described. Fig. 16 is a perspective view of the semiconductor device 100 according to the fourth embodiment, Fig. 17 is a perspective cross-sectional view of the semiconductor device 100, the cross-sectional position of which is equivalent to the cross-sectional position A-A shown in Fig. 2, Fig. 18 is a perspective view of the semiconductor device 100, the semiconductor device 100 shown in Fig. 16 with a blower means added, Fig. 19 is a perspective cross-sectional view of the semiconductor device 100 shown in Fig. 18, the cross-sectional position of which is equivalent to the cross-sectional position A-A shown in Fig. 2. In Figs. 16 and 17, the direction of gas flow is indicated by arrows. The cooling structure 101 of the semiconductor device 100 according to the fourth embodiment is configured such that the inlet 13 is disposed at a position different from that of the first embodiment.

When viewed in a direction perpendicular to the heat dissipation fin installation surface 2b of the base 2, the inlet 13 is disposed at a position that does not overlap with the heat dissipation fin 3 and is spaced apart from the heat dissipation fin 3. In this embodiment, as shown in FIG. 17, the connection portion 15 that connects the inlet 13 and the first wind tunnel exhaust port 5 and the outlet portion 10 extend in opposite directions, and the inlet 13 and the exhaust port 7 open in opposite directions. Note that in this embodiment, an example in which pin fins 9 are provided as the heat dissipation fins 3 has been shown, but the heat dissipation fins 3 are not limited to pin fins 9.

By arranging the inlet 13 at a position away from the heat dissipation fins 3 so as not to overlap with them, the inlet 13 can be arranged at a sufficient distance from the exhaust port 7 even if there are constraints on the layout of the air tunnel 6, such as other equipment being arranged at a position that overlaps with the heat dissipation fins 3 when viewed in a direction perpendicular to the heat dissipation fin installation surface 2b. Because the inlet 13 can be arranged at a sufficient distance from the exhaust port 7, the effect of suppressing the re-intake of hot air at the inlet 13 can be obtained without being affected by the layout arrangement.

When the connection portion 15 connecting the inlet 13 and the first wind tunnel exhaust outlet 5 and the outlet portion 10 extend in opposite directions, and the inlet 13 and the exhaust outlet 7 open in opposite directions, the inlet 13 and the exhaust outlet 7 are positioned farthest apart in the cooling structure 101, and the gas inflow and outflow directions are opposite, so that the re-intake of high-temperature gas that has passed through the heat dissipation fins 3 from the inlet 13 is further suppressed, thereby further improving the cooling effect of the heat generating body 1.

In this embodiment, as shown in FIG. 19, a high pressure state on the inlet 13 side is created by providing a blower fan 4, which is a blowing means, on the inlet 13 side. The blower means is not limited to the blower fan 4, and may be configured to send high-pressure air from the outside to the inlet 13. The configuration for creating a high pressure state on the inlet 13 side is not limited to this, and may be configured to open the inlet 13 side to the atmosphere and provide a suction fan or the like on the outlet 7 side to lower the pressure on the outlet 7 side.

Embodiment 5.
A semiconductor device 100 according to a fifth embodiment will be described. Fig. 20 is a perspective view of the semiconductor device 100 according to the fifth embodiment, Fig. 21 is a perspective cross-sectional view of the semiconductor device 100, the cross-sectional position of which is equivalent to the A-A cross-sectional position shown in Fig. 2, Fig. 22 is a perspective view of the semiconductor device 100, the semiconductor device 100 shown in Fig. 20 seen from the -Z direction, and Fig. 23 is an exploded perspective view of the semiconductor device 100 shown in Fig. 22. The cooling structure 101 of the semiconductor device 100 according to the fifth embodiment has a configuration in which the base 2 is fixed to the air channel 6.

The base 2 is fixed to the portion of the wind tunnel 6 where the second wind tunnel 6b is formed. The portion of the wind tunnel 6 where the second wind tunnel 6b is formed is the holding member 14. The holding member 14 is a part of the wind tunnel 6 and has the function of holding the base 2. The holding member 14 is made of a metal such as aluminum. In this embodiment, as shown in FIG. 21, the wind tunnel 6 is formed by fixing the wind tunnel member 14a to the holding member 14. In this embodiment, the holding member 14 has a plurality of mounting portions for mounting the semiconductor device 100 to another member. The mounting portions are through holes 16. The semiconductor device 100 is attached to another member by bolts or the like using the through holes 16.

The heating element 1 is mounted on the base 2, and the heat dissipation fins 3 are mounted on the base 2 or are integrally molded therewith. Therefore, the position of the base 2 needs to be fixed relative to the air tunnel 6. It is also possible to fix the positions of the base 2 and the air tunnel 6 by fixing them separately to other members such as a housing or frame. However, when the arrangement is fixed in this way, there is an issue that the number of parts of the semiconductor device 100 increases.

In this embodiment, the base 2 is fixed to the holding member 14 as shown in Figs. 22 and 23. In these figures, the base 2 is fixed to the fixing points 18 of the holding member 14 by bolts 17. When the holding member 14 is formed of metal by die casting or casting, a screw hole is provided as the fixing point 18 in the main body of the holding member 14. When the holding member 14 is formed of resin, a metal insert member with a screw hole is provided as the fixing point 18 in the main body of the holding member 14 made of resin. The fixing of the base 2 to the holding member 14 is not limited to the fixing using the bolts 17, and other methods such as FSW (Friction Stir Welding) may be used.

By fixing the base 2 to the portion of the wind tunnel 6 where the second wind tunnel 6b is formed in this manner, the position of the base 2 relative to the wind tunnel 6 can be determined without using other members such as a housing or frame, and therefore an increase in the number of parts of the semiconductor device 100 can be suppressed. Since an increase in the number of parts of the semiconductor device 100 is suppressed, the weight of the semiconductor device 100 can be reduced, and the cost of the semiconductor device 100 can be reduced.

Embodiment 6.
A semiconductor device 100 according to the sixth embodiment will be described. Fig. 24 is a plan view of a main part of a cooling structure 101 of the semiconductor device 100 according to the sixth embodiment, and shows the first air tunnel 6a in which the heat dissipation fins 3 and the first air tunnel exhaust port 5 are formed, viewed in a direction perpendicular to the heat dissipation fin installation surface 2b. The cooling structure 101 of the semiconductor device 100 according to the sixth embodiment has a structure in which the area in which the heat dissipation fins 3 are arranged is defined.

The heat dissipation fins 3 are provided on both the inside and outside of the first wind tunnel exhaust port 5 when viewed in a direction perpendicular to the heat dissipation fin installation surface 2b of the base 2. Therefore, the area of the region surrounded by the outline 5a of the first wind tunnel exhaust port 5 is smaller than the area surrounded by the outline 3b of the heat dissipation fins 3.

The first wind tunnel outlet 5 is a portion that sends gas to the heat dissipation fin 3. By providing the heat dissipation fin 3 on both the inside and outside of the first wind tunnel outlet 5 in this way, all of the gas that passes through the first wind tunnel outlet 5 can be reliably supplied to all parts of the heat dissipation fin 3. In addition, the surrounding portion of the first wind tunnel outlet 5 is in contact with the end of the heat dissipation fin 3 over the entire circumference, and the heat dissipation fin 3 is provided on both the inside and outside of the first wind tunnel outlet 5, so that the gas that once flows into the heat dissipation fin 3 does not leak out from the area of the heat dissipation fin 3 to the outside, but passes through the heat dissipation fin 3 and flows out from the outlet 7 to the outside. In this way, the entire amount of gas supplied to the heat dissipation fin 3 can be utilized for heat dissipation of the heat generating body 1, thereby improving the efficiency of cooling the heat generating body 1.

Although the present application describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to application to a particular embodiment, but may be applied to the embodiments alone or in various combinations.
Therefore, countless modifications not illustrated are conceivable within the scope of the technology disclosed in the present specification, including, for example, modifying, adding, or omitting at least one component, and further, extracting at least one component and combining it with a component of another embodiment.

Various aspects of the present disclosure are summarized below as appendices.
(Appendix 1)
a base having a heating element thermally connected to one surface thereof and a plurality of heat dissipation fins on the other surface thereof;
a first wind tunnel for allowing gas to flow from the outside into the heat dissipation fins, and a second wind tunnel communicating with the first wind tunnel via the heat dissipation fins and discharging the gas that has passed through the heat dissipation fins to the outside;
The first wind tunnel has an inlet for taking in gas and a first wind tunnel outlet for discharging the gas to the heat dissipation fin, and the first wind tunnel outlet abuts against an end of the heat dissipation fin opposite to the base over an entire circumference thereof,
the second air tunnel has a collection section that collects gas radially discharged from the heat dissipation fin in a direction parallel to the other surface of the base, an exhaust port that exhausts the gas to the outside, and a lead-out section that guides the gas from the collection section to the exhaust port,
A cooling structure in which the outlet portion extends in a particular direction away from the inlet.
(Appendix 2)
2. The cooling structure according to claim 1, wherein an angle between an opening direction of the inlet and an extension direction of the outlet portion is 90 degrees or more.
(Appendix 3)
3. The cooling structure according to claim 1, wherein an extension length of the outlet portion is longer than an extension length of the first wind tunnel.
(Appendix 4)
The outlet and the outlet portion are provided in pairs,
The cooling structure according to any one of claims 1 to 3, wherein the two outlet sections extend in opposite directions from the collection section, and the two exhaust ports open in opposite directions from each other.
(Appendix 5)
5. The cooling structure according to claim 1, wherein the vertical height of the other surface in the collection section around the heat dissipation fin is lower than the vertical height of the other surface in the outlet section.
(Appendix 6)
The wind tunnel has a first wind tunnel member and a second wind tunnel member,
The first wind tunnel member has a plate-shaped lid portion and a recess formed in the lid portion, an opening of the recess is the inlet, and a first wind tunnel exhaust port is formed in a bottom wall of the recess,
the second air channel member has a plate-shaped foundation wall and a peripheral wall that surrounds the periphery of the foundation wall except for a portion that becomes the exhaust port and has a tip end connected to an outer peripheral end of the lid portion, the foundation wall has an opening in which the heat dissipation fin is provided at a position facing the recess,
6. The cooling structure according to claim 1, wherein a space surrounded by the first wind tunnel member and the second wind tunnel member is the second wind tunnel.
(Appendix 7)
7. The cooling structure according to claim 1, wherein the plurality of heat dissipation fins are a plurality of plate-shaped fins extending radially from a center to an outer periphery when viewed in a direction perpendicular to the other surface.
(Appendix 8)
7. The cooling structure according to claim 1, wherein the plurality of heat dissipation fins are a plurality of columnar fins provided upright on the other surface of the base.
(Appendix 9)
The collecting section includes an inner collecting section that surrounds the periphery of the heat dissipating fin and an outer collecting section that surrounds the inner collecting section,
9. The cooling structure according to any one of claims 1 to 8, wherein a vertical height of the other surface of the outer collection section is greater than a vertical height of the other surface of the inner collection section.
(Appendix 10)
A cooling structure described in any one of appendix 1 to 5, wherein the inlet is positioned at a position that does not overlap with the heat dissipation fins and is spaced apart from the heat dissipation fins when viewed in a direction perpendicular to the other surface of the base.
(Appendix 11)
The connection portion connecting the inlet and the first wind tunnel outlet and the outlet portion extend in opposite directions to each other,
11. The cooling structure according to claim 10, wherein the inlet and the outlet open in opposite directions to each other.
(Appendix 12)
12. The cooling structure according to any one of claims 1 to 11, wherein the base is fixed to a portion of the wind tunnel in which the second wind tunnel is formed.
(Appendix 13)
13. The cooling structure according to any one of claims 1 to 12, wherein the heat dissipation fins are provided on both the inside and outside of the first wind tunnel exhaust port when viewed in a direction perpendicular to the other surface of the base.
(Appendix 14)
14. A semiconductor device comprising: the cooling structure according to claim 1; and a heat generating body having a semiconductor element.

1 Heating element, 1a Semiconductor element, 2 Base, 2a Heating element mounting surface, 2b Heat dissipation fin installation surface, 3 Heat dissipation fin, 3a Contact end, 3b Outline, 4 Blower fan, 5 First wind tunnel exhaust port, 5a Outline, 6 Wind tunnel, 6a First wind tunnel, 6b Second wind tunnel, 7, 7a, 7b Exhaust port, 8 Fin-free portion, 9 Pin fin, 10, 10a, 10b Lead-out portion, 11 Collection portion, 12a Inner collection portion, 12b Outer collection portion, 13 Inlet, 14 Holding member, 14a Wind tunnel member, 15 Connection portion, 16 Through hole, 17 Bolt, 18 Fixing portion, 21 First wind tunnel member, 21a Lid portion, 21b Recess, 21c Bottom wall, 22 Second wind tunnel member, 22a Foundation wall, 22b Peripheral wall, 22c opening, 100 semiconductor device, 101 cooling structure

Claims (14)

a base having a heating element thermally connected to one surface thereof and a plurality of heat dissipation fins on the other surface thereof;
a first wind tunnel for allowing gas to flow from the outside into the heat dissipation fins, and a second wind tunnel communicating with the first wind tunnel via the heat dissipation fins and discharging the gas that has passed through the heat dissipation fins to the outside;
The first wind tunnel has an inlet for taking in gas and a first wind tunnel outlet for discharging the gas to the heat dissipation fin, and the first wind tunnel outlet abuts against an end of the heat dissipation fin opposite to the base over an entire circumference thereof,
the second air tunnel has a collection section that collects gas radially discharged from the heat dissipation fin in a direction parallel to the other surface of the base, an exhaust port that exhausts the gas to the outside, and a lead-out section that guides the gas from the collection section to the exhaust port,
A cooling structure in which the outlet portion extends in a particular direction away from the inlet. The cooling structure according to claim 1, wherein the angle between the inlet opening direction and the outlet extension direction is 90 degrees or more. The cooling structure according to claim 1, wherein the extension length of the outlet portion is longer than the extension length of the first wind tunnel. The outlet and the outlet portion are provided in pairs,
The cooling structure according to claim 1 , wherein the two outlet portions extend in opposite directions from the collection portion, and the two exhaust ports open in opposite directions. The cooling structure according to claim 1, wherein the vertical height of the other surface in the portion of the collection section surrounding the heat dissipation fin is lower than the vertical height of the other surface in the outlet section. The wind tunnel has a first wind tunnel member and a second wind tunnel member,
The first wind tunnel member has a plate-shaped lid portion and a recess formed in the lid portion, an opening of the recess is the inlet, and a first wind tunnel exhaust port is formed in a bottom wall of the recess,
the second air channel member has a plate-shaped foundation wall and a peripheral wall that surrounds the periphery of the foundation wall except for a portion that becomes the exhaust port and has a tip end connected to an outer peripheral end of the lid portion, the foundation wall has an opening in which the heat dissipation fin is provided at a position facing the recess,
The cooling structure according to claim 1 , wherein a space surrounded by the first wind tunnel member and the second wind tunnel member is defined as the second wind tunnel. The cooling structure according to claim 1, wherein the plurality of heat dissipation fins are plate-shaped fins extending radially from the center to the outer periphery when viewed in a direction perpendicular to the other surface. The cooling structure according to claim 1, wherein the plurality of heat dissipation fins are a plurality of columnar fins erected on the other surface of the base. The collecting section includes an inner collecting section that surrounds the periphery of the heat dissipating fin and an outer collecting section that surrounds the inner collecting section,
The cooling structure according to claim 1 , wherein a vertical height of the other surface of the outer collection section is greater than a vertical height of the other surface of the inner collection section. The cooling structure according to claim 1, wherein the inlet is disposed at a position that does not overlap with the heat dissipation fins and is spaced apart from the heat dissipation fins when viewed in a direction perpendicular to the other surface of the base. The connection portion connecting the inlet and the first wind tunnel exhaust port and the outlet portion extend in opposite directions to each other,
The cooling structure according to claim 10 , wherein the inlet and the outlet open in opposite directions to each other. The cooling structure according to claim 1, wherein the base is fixed to the portion of the wind tunnel in which the second wind tunnel is formed. The cooling structure according to claim 1, wherein the heat dissipation fins are provided on both the inside and outside of the first wind tunnel outlet when viewed in a direction perpendicular to the other surface of the base. A semiconductor device comprising the cooling structure according to any one of claims 1 to 13 and a heating element having a semiconductor element.

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