KR101371173B1 - Test socket - Google Patents

Abstract

The present invention relates to a test socket. More specifically, the test socket includes: a housing which has a through hole extended at a position corresponding to the terminal of a semiconductor device in a vertical direction; a pin member which is inserted into the through hole and of which the upper end protrudes to the outside; an elastic member which is placed between a pad and the pin member, of which the upper side is combined to the pin member, which makes the pin member be elastically biased in a direction away from the pad, and which is inserted into the through hole; a floating member which is placed on the top of the housing, stores a semiconductor device inside, and has an insertion hole at a position corresponding to the terminal of the semiconductor device; and a sheet complex body which includes a plurality of conductive particles arranged in an elastic material in a vertical direction, has a conductive unit at a position corresponding to the terminal of the semiconductor device, and is combined to the floating member. The conductive unit of the sheet complex body is placed inside the insertion hole of the floating member. Below the conductive unit, a pin member is placed to support the conductive unit from the bottom and is electrically connected to the conductive unit.

Description

Test socket

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test socket, in which a pin member electrically connected to a terminal of a semiconductor device during an electrical test process does not occur in a hole of a floating member supporting the semiconductor device. .

In general, a semiconductor device manufactured by a predetermined manufacturing process undergoes reliability tests such as an electrical property test and a function test before shipment.

Specifically, the semiconductor device is electrically connected to an inspection apparatus called a test apparatus, and then a predetermined signal is applied to the semiconductor device to check whether there is a defect. However, the semiconductor device is not in direct contact with the test apparatus, but indirectly contacted by a separate intermediary means called a test socket. The reason is that if the semiconductor device directly contacts the test apparatus, the pad of the test apparatus may be damaged, and if the pad of the test apparatus is damaged, the repair cost is relatively expensive. After that, the semiconductor device is in contact with the test socket so that the test socket is easily replaced when used.

Meanwhile, the semiconductor device may be a ball grid array (BGA), a quad flat package (QFP), a quad flat no-lead semiconductor (QFN), or the like. In the BGA type device, hemispherical solder terminals are arranged in a two-dimensional array on the lower surface side of the square plate. In the QFP type device, L-shaped lead terminals are provided from four corners of the square plate. The test socket according to the prior art in which such a semiconductor device is contacted is configured as follows.

1 is a view illustrating a semiconductor device mounted on a test socket according to the related art, and FIG. 2 is a sectional view taken along line II-II of FIG. 1, wherein the test socket 100 includes a housing 110 and a pogo pin 120. , Consisting of a floating member (130).

The housing 110 is mounted on the test apparatus 150 side, and a plurality of through holes 111 are formed at positions corresponding to the terminals 141 of the semiconductor device 140 in the vertical direction. The through hole 111 is formed with a locking projection 112 projecting inward on the upper and lower sides. The pogo pin 120 has a first pin member 122 and the second pin member 123 is disposed in the upper and lower sides of the cylindrical barrel 121 and the spring (between the pin members 122, 123) Not shown) is arranged to elastically bias each pin member (122, 123) in a direction away from each other. The pogo pin 120 is inserted into the through hole 111, the barrel 121 is caught in the upper and lower locking jaw 112 of the through hole 111 is fixed in the housing 110.

The floating member 130 is disposed above the housing 110 and seats the semiconductor device 140 and at the same time corresponds to the terminal 141 of the semiconductor device 140. Is formed so that the first pin member 121 of the pogo pin 120 is protruded through the insertion hole 131, the first pin member 121 is the insertion hole 131 While protruding therethrough, the terminal 130 may contact the terminal 141 of the semiconductor device 140 seated on the floating member 130. On the other hand, the floating member 130 has a locking portion 132 is formed to align the left and right positions of the semiconductor device 140.

On the other hand, the second pin member 123 is in contact with the pad 151 of the test device 150, the first pin via the spring to the electrical signal flowing from the pad 151 of the test device 150 It passes through the member 122 and flows into the terminal 141 of the semiconductor device 140 to perform a predetermined electrical test. Meanwhile, when the semiconductor device 140 presses the first pin member 122 while the semiconductor device 140 is seated on the floating member 130, the first pin member 122 moves downward in the insertion hole 131. At this time, the spring is compressed to press the second pin member 123 so that the second pin member 123 can be in contact with the pad 151 of the test device 150 to remove the electrical defects do.

The test socket according to the prior art has the following problems.

Recently, a semiconductor device having a narrow-pitch terminal between terminals of a semiconductor device has been developed, and the pogo pins of the test socket have also been miniaturized accordingly. In addition, the diameter of the first pin member of the pogo pin is gradually reduced, and the spacing between the pogo pins is gradually narrowing. Accordingly, the size of the insertion hole of the floating member into which the first pin member is inserted also decreases and becomes more and more fine.

However, as the size of the insertion hole is gradually reduced in this manner, it is not easy for the first pin member to move through the insertion hole. That is, even when the insertion hole is not made precisely, or even when the insertion hole is made precisely, the terminal of the semiconductor device contacts the upper side of the upper side rather than the upper center of the first pin member so that an eccentric load is applied. In this case, there is a problem that the first pin member is caught in the insertion hole. As such, when the first pin member is caught in the insertion hole, the first pin member is not sufficiently lowered, so that the electrical connection is poor, or the first pin member is connected to the floating member due to repeated contact with the semiconductor device. There is a problem of breaking in the insertion hole.

In addition, in order to fix the pogo pin in the state of being inserted into the through hole of the housing to form a pair of locking jaws on the upper and lower end side of the through hole, such a locking jaw to the fine pogo pin as described above The mechanical process is not easy because it must be manufactured to correspond to this, but it is also a problem to increase the production cost as a whole, such a jam step to be provided in two places in the upper and lower ends of the housing.

The present invention has been made to solve the above-mentioned problems, and more particularly, to manufacture a test socket that prevents the pin member from being damaged or excessively expensive to manufacture the housing during the contact with the terminals of the semiconductor device. The purpose.

The test socket of the present invention for solving the above object is a terminal of a semiconductor device in a test socket disposed between the semiconductor device and the test apparatus in order to electrically contact the terminals of the semiconductor device and the pad of the test apparatus. A housing having a through hole extending in a vertical direction at a position corresponding thereto;

A pin member inserted into the through hole and having an upper end projecting outward;

An elastic member disposed between the pad and the pin member, the upper side of which is coupled to the pin member to elastically bias the pin member in a direction away from the pad and is inserted into the through hole;

A floating member disposed on an upper side of the housing, in which the semiconductor device is seated and an insertion hole is formed at a position corresponding to the terminal of the semiconductor device; And

A plurality of conductive particles are arranged in the elastic material in the vertical direction and provided with a conductive portion disposed in a position corresponding to the terminal of the semiconductor device, and comprises a sheet composite bonded to the floating member,

The conductive portion of the sheet composite is disposed in the insertion hole of the floating member, and a pin member is disposed under the conductive portion so as to be electrically connected to the pin member while lowering the conductive portion.

In the test socket, the upper end of the pin member and the lower end of the conductive portion are preferably in contact with each other.

In the test socket,

It is preferable that a conductive medium member is interposed between the pin member and the conductive portion.

In the test socket,

Preferably, the conductive portion is in contact with the terminal of the semiconductor device.

In the test socket,

It is preferable that the upper end of the pin member is disposed outside the insertion hole of the floating member.

In the test socket, the floating member is formed in the form of a rectangular frame having four corners therein, the body portion has a central hole is formed in the center of the size that can be inserted into the semiconductor device;

It is preferable to include a seating portion protruding from the inner surface of the body portion to seat the semiconductor device.

In the test socket,

The semiconductor device is a four-way flat package in which terminals are formed on four sides of the square plate,

The seating portion may be formed to protrude from a corner of the body portion, the contact plate in contact with the lower surface of the rectangular plate, and a locking portion protruding upward from the contact plate and disposed between the rectangular plate and the terminal. .

In the test socket,

Preferably, the contact plate has a triangular cross section.

In the test socket,

In the semiconductor device, a plurality of terminals are formed on a lower surface of the rectangular plate, and the seating portion preferably protrudes so as to contact the lower surface of the edge of the rectangular plate on which the terminal is not formed.

In the test socket, the sheet composite,

A frame having an inner hole formed at a position corresponding to the insertion hole of the floating member and coupled to the floating member;

A sheet member comprising the conductive portion and an insulating portion for insulating and supporting the conductive portion; And

Covering one surface of the frame is coupled to the frame but the sheet member is attached and preferably comprises a film member having a through hole formed in a position corresponding to the conductive portion of the sheet member.

In the test socket,

Preferably, the conductive portion is inserted into the through hole of the film member.

In the test socket,

The lower end of the housing is formed with a locking projection protruding from the inner peripheral surface of the through hole,

Preferably, the lower end of the elastic member is formed with a stepped to engage with the locking step.

In the test socket,

The pin member,

A first pin and a second pin formed integrally with the lower side of the first pin and having an elastic member inserted therein;

The elastic member is a spring in which the wires are wound in a spiral shape, and the elastic members in which the adjacent wires are wound are spaced apart from each other in the up and down direction, and the close parts are in close contact with each other. It is preferable to be in contact with the bottom of the second pin.

In the test socket,

The floating member is installed in the housing to be movable in a predetermined range in the vertical direction, it is preferable that the spring between the floating member and the housing to elastically bias the floating member upward.

The test socket according to the present invention includes a sheet composite attached to the floating member, and the pin member is disposed at the lower end of the sheet composite so that the pin member may be pinched or damaged in the floating member even when the semiconductor device is moved. There is an advantage without worry.

In addition, as the sheet composite is disposed on the upper end of the pin member, there is no fear that the pin member may be separated outward toward the upper side, and thus, a separate locking step may be formed on the upper side of the housing to prevent the pin member from being separated. There is no need to reduce the machining cost and so on.

1 is a view showing a semiconductor device mounted on a test socket according to the prior art
FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.
3 is an exploded perspective view of a test socket according to a preferred embodiment of the present invention;
4 is a perspective view
5 is a plan view illustrating a semiconductor device mounted on the test socket of FIG. 3.
6 is a VI-VI cross-sectional view of FIG.
7 is a cross-sectional view of a test socket according to another embodiment of the present invention.

Hereinafter, a test socket according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 is an exploded perspective view of a test socket according to a preferred embodiment of the present invention, FIG. 4 is a perspective view of FIG. 3, FIG. 5 is a plan view illustrating a semiconductor device mounted in the test socket of FIG. 3, and FIG. 6. Is a VI-VI cross-sectional view of FIG.

The test socket 10 according to the preferred embodiment of the present invention is disposed between the semiconductor device 70 and the test apparatus 80 to connect the terminal 71 of the semiconductor device 70 and the test apparatus 80. The pads 81 are electrically connected to each other, and include a housing 20, a pin member 30, an elastic member 40, a floating member 50, and a sheet composite 60.

The housing 20 generally has a rectangular plate shape, and a plurality of through holes 211 are formed at positions corresponding to the terminals 71 of the semiconductor device 70. Such a housing 20 can be used as long as it is a synthetic material, and any other insulating material can be used as a matter of course. The housing 20 includes a body housing 21 having a groove 212 recessed inwardly at a lower surface thereof and a cover member 22 disposed below the body housing 21 and fitted into the groove 212. Include. In this case, the through holes 211 and 221 are formed in the body housing 21 and the cover member 22 in the same manner. On the other hand, at the lower end side of the through hole 221 of the cover member 22 is formed a locking step 222 protruding from the inner circumferential surface of the through hole 211.

The pin member 30 is inserted into the through hole 211, the top of which protrudes to the outside. Specifically, the first pin 31 and the second pin 32 are formed. The first pin 31 has a diameter corresponding to the through hole 211 and forms an upper side of the pin member 30. A portion of the first pin 31 is disposed inside the through hole 211 and the other upper side thereof exits from the through hole 211 and is exposed to the outside. The upper end of the first pin 31 is disposed outside the insertion hole 53 of the floating member 50.

The second pin 32 has a diameter smaller than that of the first pin 31 and is disposed below the first pin 31. The second pin 32 is a portion to which the elastic member 40 is fitted and coupled to the outer circumference thereof.

The elastic member 40 is disposed between the pad 81 and the pin member 30 and the upper side thereof is coupled to the pin member 30 to move the pin member 30 away from the pad 81. Elastic bias. The elastic member 40 is inserted into the through hole 211 and disposed. The elastic member 40 is preferably to use a coil spring, as long as the elastic compression and restoration is possible, of course. However, it is preferable to use a conductive material.

The elastic member 40, the wire is wound in a spiral, the wound adjacent wires are spaced apart from each other in the vertical direction, the elastic portion 41 which can be compressed when the pin member 30 is pressed by the terminal 71 And the wound wires are in close contact with each other (42). The elastic part 41 constitutes an upper side of the elastic member 40, and the contact part 42 constitutes a lower side of the elastic member 40. At this time, the second pin 32 preferably has a length sufficient to be in contact with only the upper side of the contact portion 42. The reason for this is that as the second pin 32 is in direct contact with the contact part 42, an electrical signal may flow directly through the contact part 42 to the pin member 30. That is, the signal is not transmitted while rotating helically through the elastic portion, but flows linearly while passing through the close contact portion 42 and the pin member 30, thereby shortening the signal transmission path.

The close part 42 has a step 421 formed at a lower end thereof, and the step 421 is engaged with the locking step 222 of the housing 20 described above, such that the close part 42 is a through hole. (211) It can be prevented to escape through the bottom.

The floating member 50 is disposed above the housing 20, and the semiconductor device 70 is seated and an insertion hole 53 is formed at a position corresponding to the terminal 71 of the semiconductor device 70. Will be. The floating member 50 is formed in the form of a square frame having four corners therein, and a body portion 51 in which a central hole 511 having a size into which the semiconductor device 70 can be inserted is formed at the center thereof. And a seating portion 52 protruding from the inner surface of the body portion 51 to seat the semiconductor device 70.

At this time, the mounting portion 52 is the semiconductor device 70 when the semiconductor device 70 is a four-way flat package (QFP) in which the terminals 71 are formed on four surfaces of the square plate 72. It is formed according to the shape of). Specifically, the seating portion 52 protrudes from the corner of the body portion 51, and contacts the bottom surface of the square plate of the semiconductor device 70 with the contact plate 521 and the contact plate 521. Protruding upward, the engaging portion 522 is disposed between the square plate and the terminal 71.

In this case, the contact plate 521 has a triangular cross section, and is formed to be in contact with the square plate 72. On the other hand, the locking portion 522 is to fix the position of the semiconductor device 70, the semiconductor device 70 seated on the contact plate 521 left and right by the locking portion 522 by the locking portion Position shift to is suppressed.

On the other hand, the floating member 50 is moved up and down in a predetermined range in a state coupled to the housing 20, specifically, the floating member 50 is inserted into the housing 20, the housing ( The positional deviation of the bolt 213 fixedly coupled to 20 is caught by the head of the bolt 213. In this state, a spring is interposed between the floating member 50 and the housing 20 to elastically bias the floating member 50 upward. That is, when the floating member 50 is pressed downward by the semiconductor device 70, the resilient force is generated while descending, and when the floating member 50 is released while the semiconductor device 70 is removed, the original position is released. Return to.

The sheet composite body 60 includes a frame 61, a sheet member 62, and a film member 63.

At this time, the frame 61 is formed in the shape of a square plate, the inner hole 611 is formed at a position corresponding to the insertion hole 53 of the floating member 50. The frame 61 is preferably made of a metal material, but may be any material having a rigidity. On the other hand, the frame 61 is fixedly coupled to the floating member 50 by the configuration of the bolt 213 and the like.

The film member 63 is coupled to an upper surface of the frame 61, and is configured to cover the upper surface of the frame 61. The film member 63 is made of a material of a thin synthetic resin sheet, but has elasticity, allowing the sheet member 62 to be lowered while being stretched when the sheet member 62 is pressed by the semiconductor device 70 and the semiconductor. When the device 70 is removed, the sheet member 62 is returned to its original position while being retracted.

The film member 63 has the sheet member 62 attached to an upper surface thereof, and a through hole 631 is formed at a position corresponding to the conductive portion 621 of the sheet member 62. On the other hand, the conductive portion 621 is preferably inserted into the through hole 631 of the film member 63, but is not limited thereto, and of course, may not be inserted into the through hole 631.

The sheet member 62 is disposed as a plurality of conductive parts 621 in which a plurality of conductive particles 621a are vertically aligned in the elastic material 621b. At this time, each conductive portion 621 is disposed to extend in the vertical direction at a position corresponding to the terminal 71 of the semiconductor device 70, the conductive particles 621a is contained in the elastic material 621b. Specifically, the conductive portion 621 has a rod shape extending in the vertical direction, the conductive portion 621 has a form that is arranged side by side in the horizontal direction.

The elastic material 621b constituting the conductive portion 621 is a polymer material, and a heat resistant polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer material-forming material which can be used to obtain such a crosslinked polymer material, and specific examples thereof include silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber and acrylonitrile. Conjugated diene rubbers such as butadiene copolymer rubbers and hydrogenated compounds thereof, block copolymer rubbers such as styrene-butadiene-diene block copolymers, styrene-isoprene block copolymers and hydrogenated compounds thereof, chloroprene rubbers and urethane rubbers , Polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid epoxy rubber, and the like.

Among these, silicone rubber excellent in molding processability and electrical characteristics is preferable. The elastic material 621b is obtained by hardening liquid silicone rubber, and specifically, it is preferable to contain an inorganic filler of colloidal silica. By containing such an inorganic filler, the viscosity of the obtained molding material becomes high, the dispersion | distribution ability of electroconductive particle 621a improves, and the effect of the overall strength of the elastic sheet obtained can be acquired as a whole.

It is preferable that the conductive particles 621a have magnetic properties for vertical alignment. As a specific example of the electroconductive particle 621a which shows such a magnet, the metal particle which shows magnetism, such as iron, nickel, cobalt, the particle | grains of these alloys, the particle | grains containing these metals, or these particles are made into the core particle, and the said core The surface of the core particles is formed by plating a metal having good conductivity such as gold, silver, palladium, rhodium, or inorganic material particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles. Plated with conductive magnetic materials such as nickel and cobalt, or coating both the conductive magnetic material and the metal having good conductivity to the core particles.

In these, it is preferable to use nickel particle as a core particle and to plate the metal with favorable electroconductivity, such as gold and silver, on the surface. Although it does not specifically limit as a means which coat | covers a conductive metal on the surface of a core particle, For example, it can carry out by electroless plating. In addition, the particle diameter of the conductive particles 621a is preferably 1 to 500 µm, particularly preferably 10 to 100 µm.

The insulating portion 622 is disposed between the plurality of conductive portions 621, and may be made of an insulating material, but may be made of the same material as the elastic material 621b, or may be made of other materials.

The sheet member 62 is attached to the upper surface of the film member 63. Specifically, the conductive portion 621 is exposed downward while the conductive portion 621 of the sheet member 62 is inserted into the through hole 631 of the film member 63. The conductive parts 621 are electrically connected to each other with their lower ends in contact with the upper ends of the pin members 30. At this time, the pin member 30 is to support the conductive portion 621. In addition, the upper end of the conductive portion 621 is in contact with the terminal 71 of the semiconductor device 70 seated on the floating member 50.

The test socket 10 according to the preferred embodiment of the present invention operates as follows.

First, the semiconductor device 70 is moved by a predetermined moving means and placed on the test socket 10. Specifically, the semiconductor device 70 is placed on the mounting portion 52 of the floating member 50. At this time, the semiconductor device 70 is placed on both sides of the engaging portion 522 so as to be caught. In this state, the terminal 71 of the semiconductor device 70 comes into contact with the conductive portion 621 of the sheet member 62, respectively. When the semiconductor device 70 is pressed by the pressing means, the semiconductor device 70 is lowered and the terminal 71 presses the sheet member 62. At this time, the conductive portion 621 of the sheet member 62 in contact with the terminal 71 is pressed while the conductive particles 621a therein come into contact with each other to form an electrically energized state. Along with this, the sheet member 62 is pressed to press the pin member 30 disposed below the conductive portion 621, and the pin member 30 presses the elastic member 40 to the lower end of the elastic member 40. The pad 81 of the test apparatus 80 comes into close contact with each other.

At this time, the second pin 32 of the pin member 30 is in contact with the contact portion 42 of the elastic member 40. In this state, when a predetermined electrical signal is applied from the test device 80, the signal passes through the contact part 42 and passes through the second pin 32, the first pin 31, and the conductive part 621. The semiconductor device 70 flows to the terminal 71 of the semiconductor device 70 and thereafter, a predetermined defect inspection is performed.

The test socket according to the present invention has the following advantages.

First, since the terminal of the semiconductor device comes in contact with the conductive portion made of silicone rubber, there is little possibility that the terminal of the device is broken. In addition, even when the conductive part is damaged, only the sheet member needs to be replaced, so the maintenance cost is relatively low.

In addition, the first pin member in contact with the terminal of the semiconductor device in the pogo pin according to the prior art has a pointed shape of the end of the crown to increase the electrical contact performance, but to process such a pointed shape It cost a lot. However, in the present embodiment, since the fine conductive particles are distributed at the lower end of the conductive portion to constitute a plurality of contacts, the upper end of the pin member may be manufactured in a flat form without the pointed probe shape. Can be saved.

In addition, in the test socket according to the related art, while the upper side of the first pin member of the pogo pin is inserted into the insertion hole of the floating member, it is moved, and there is a risk of damage, such as a collision with the inner surface of the insertion hole. In the example, the upper end of the pin member is placed outside the insertion hole, and only the conductive portion of the sheet member is inserted in the insertion hole, thereby preventing such a pin member from being damaged.

In addition, in the prior art, the locking jaw is formed on the upper and lower ends of the through hole to fix the pogo pin in the housing. It is advantageous to form a locking step only on the lower end side of the through hole, thereby reducing the processing cost of the housing.

In addition, since the sheet member is placed on the film member, there is an advantage that the sheet member having excellent contactability can be manufactured without increasing the thickness of the sheet member.

The test socket according to the preferred embodiment of the present invention may be modified as follows.

First, in the above-described embodiment, a case in which a QFP type semiconductor device is used is taken as an example, but the present invention is not limited thereto, and a case in which a BGA type semiconductor device is used is also possible. That is, in the case of a semiconductor device in which a plurality of hemispherical terminals are formed on the bottom surface of the square plate, as shown in FIG. It is formed to protrude from the inner surface of the body portion in contact with the surface.

In addition, in the above-described embodiment, the pin member and the conductive portion are illustrated as being in contact with each other, but the present invention is not limited thereto, and a predetermined conductive intermediate portion such as a separate metal plate or a metallic material is interposed therebetween so that the pin member and the conductive portion are separated from each other. It is, of course, also possible to be in contact with each of the conductive intermediary members.

In addition, in the above-described embodiment, the elastic member is in direct contact with the pad of the test apparatus, but the present invention is not limited thereto, and a separate pin may be installed at the lower end of the elastic member. It is also conceivable that the pin member and the elastic member are inserted into the barrel of the cylinder.

Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention.

10 ... test socket 20 ... housing
21 Body housing 22 Cover member
30 ... pin member 31 ... first pin
32.2nd pin 40 ... elastic member
41.Elastic part 42.
50.Floating member 51 ... Body
52.Seat part 53 ... Insert hole
60 ... Sheet composite 61 ... Frame
62.Sheet member 63 ... Film member
70 ... Device 71 ... Terminal

Claims (14)

A test socket disposed between a semiconductor device and a test device for electrically contacting a terminal of a semiconductor device and a pad of a test device with each other,
A housing having a through hole extending in a vertical direction at a position corresponding to a terminal of the semiconductor device;
A pin member inserted into the through hole and having an upper end projecting outward;
An elastic member disposed between the pad and the pin member, the upper side of which is coupled to the pin member to elastically bias the pin member in a direction away from the pad and is inserted into the through hole;
A floating member disposed on an upper side of the housing, in which the semiconductor device is seated and an insertion hole is formed at a position corresponding to the terminal of the semiconductor device; And
A plurality of conductive particles are arranged in the elastic material in the vertical direction and provided with a conductive portion disposed in a position corresponding to the terminal of the semiconductor device, and comprises a sheet composite bonded to the floating member,
The conductive part of the sheet composite is disposed in the insertion hole of the floating member, and a pin member is disposed below the conductive part, and is electrically connected to the pin member while preventing the conductive part from being lowered.
The floating member is formed in the form of a rectangular frame having four corners therein, the center of which is formed a central hole having a size that can be inserted into the semiconductor device, and is formed to protrude from the inner surface of the body portion And a seating portion for seating the semiconductor device. The method of claim 1,
And a top end of the pin member and a bottom end of the conductive part are in contact with each other. The method of claim 1,
A test socket, characterized in that a conductive intermediate member is interposed between the pin member and the conductive portion. The method of claim 1,
And the conductive portion is in contact with a terminal of the semiconductor device. The method of claim 1,
And the upper end of the pin member is disposed outside the insertion hole of the floating member. delete The method of claim 1,
The semiconductor device is a four-way flat package in which terminals are formed on four sides of the square plate,
The seating portion is formed to protrude from the corner of the body portion, the contact plate which is in contact with the lower surface of the rectangular plate, and protruding upward from the contact plate, characterized in that the engaging portion disposed between the rectangular plate and the terminal To test socket. 8. The method of claim 7,
And the contact plate has a triangular cross section. The method of claim 1,
The semiconductor device is a test socket, characterized in that a plurality of terminals are formed on the lower surface of the rectangular plate, the seating portion protrudes to contact the lower surface of the edge of the rectangular plate in which the terminal is not formed. The method of claim 1,
The sheet composite,
A frame having an inner hole formed at a position corresponding to the insertion hole of the floating member and coupled to the floating member;
A sheet member comprising the conductive portion and an insulating portion for insulating and supporting the conductive portion; And
And a film member coupled to the frame while covering one surface of the frame, wherein the sheet member is attached and a through hole is formed at a position corresponding to the conductive portion of the sheet member. 11. The method of claim 10,
And the conductive portion is inserted into a through hole of the film member. The method of claim 1,
The lower end of the housing is formed with a locking projection protruding from the inner peripheral surface of the through hole,
The lower end of the elastic member is a test socket, characterized in that the stepped with the engaging step is formed. The method of claim 1,
The pin member,
A first pin and a second pin formed integrally with the lower side of the first pin and having an elastic member inserted therein;
The elastic member is a spring in which the wires are spirally wound, and the elastic members are formed of an elastic part in which adjacent wires are wound apart from each other in the up and down direction, and an adhesive part in which the adjacent wires are wound in close contact with each other. And a test socket contacting a lower end of the second pin. The method of claim 1,
The floating member is installed in the housing to move a predetermined range in the vertical direction, the test socket, characterized in that the spring between the floating member and the housing to elastically bias the floating member upward.

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