KR101280986B1 - Camera module and method of producing the same - Google Patents

Abstract

The present invention provides a substrate on which an image sensor is mounted, a housing formed on the substrate to cover the image sensor, a plurality of lenses accommodated therein, an actuator mounted on an upper portion of the housing, and moving at least one lens, And a connecting member including a pair of connecting terminals connecting the electrode pads formed on the substrate and the electrode pads formed on the actuator, and a fixing part partially covering the connecting terminals.

Description

Camera module and its manufacturing method {CAMERA MODULE AND METHOD OF PRODUCING THE SAME}

The present invention relates to a camera module.

Generally The compact camera module is compact and is applied to portable mobile communication devices such as camera phones, PDAs and smart phones and various IT devices.

Such a camera module is manufactured with an image sensor such as a CCD or a CMOS as a main component, and is manufactured to be able to adjust focus to adjust an image size.

At this time, the camera module includes a plurality of lenses, and the optical focal length is adjusted by moving each lens to change its relative distance.

Recently, researches for implementing auto focus using various types of actuators in addition to the existing voice coil motor (VCM) have been actively conducted.

The actuator is electrically connected to the electrode terminal of the substrate by a flexible printed circuit board (FPCB).

However, when soldering the electrode pad of the actuator and the electrode pad of the substrate with the flexible printed circuit board, respectively, there is a problem of low electrical reliability during external impact, and there is a problem of low productivity because soldering is performed manually.

The present invention provides a camera module that is easy to electrically connect an actuator to a substrate and has excellent electrical reliability.

In another aspect, the present invention provides a camera module manufacturing method excellent in productivity by surface-mounting the connecting member on the substrate (SMT).

According to an aspect of the present invention, a camera module includes: a substrate on which an image sensor is mounted; A housing formed on the substrate to cover the image sensor and to accommodate a plurality of lenses; An actuator mounted on an upper portion of the housing and moving at least one lens; And a connection member including a pair of connection terminals connecting the electrode pad formed on the substrate and the electrode pad formed on the actuator, and a fixing part partially covering the pair of connection terminals, wherein the connection terminal includes the substrate. A first connection part that is bent and electrically connected to the electrode pad formed at the second electrode; a second connection part that is bent and electrically connected to the electrode pad formed on the actuator; and a connection part which connects the first connection part and the second connection part. It includes.

In the camera module according to an aspect of the present invention, the end of the connection terminal is bent and connected to correspond to the electrode pad of the substrate.
According to another aspect of the present invention, a camera module includes a substrate on which an image sensor is mounted; A housing formed on the substrate to cover the image sensor and to accommodate a plurality of lenses; An actuator mounted on an upper portion of the housing and moving at least one lens; And a connection member including a pair of connection terminals connecting the electrode pad formed on the substrate and the electrode pad formed on the actuator, wherein the connection terminal is bent and electrically connected to the electrode pad formed on the substrate. And a first connection part, a second connection part electrically connected to an electrode pad formed on the actuator, and a connection part connecting the first connection part and the second connection part.

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According to an aspect of the present invention, there is provided a method of manufacturing a camera module, comprising: connecting a connector including a connection terminal and a fixing part covering a portion of the connection terminal to a substrate, and then mounting one end of the connection member to an electrode pad of the substrate; A first step, a second step of mounting a housing and an actuator on the substrate, and a third step of electrically bending the connection member upward to electrically connect the other end of the connection member to the electrode pad of the actuator.

According to the present invention, the camera module has excellent electrical reliability against external shock, and has an advantage of increasing yield.

In addition, the soldering operation is performed only on the electrode pad of the actuator, thereby reducing productivity and improving productivity.

1 is a process chart sequentially showing a manufacturing process of a camera module according to an embodiment of the present invention,
2 is a plan view showing a state in which a connection member is mounted on a substrate according to an embodiment of the present invention,
3 is a perspective view of a connecting member according to an embodiment of the present invention,
4 is a modification of FIG. 3,
5 is a side view showing a state in which a connection member is mounted on a substrate according to an embodiment of the present invention;
6 is a perspective view of a camera module according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail.

It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Also, the drawings in the present application should be understood as being enlarged or reduced for convenience of description.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

1 is a process diagram sequentially showing a manufacturing process of a camera module according to an embodiment of the present invention, Figure 2 is a plan view showing a state in which a connection member is mounted on a substrate according to an embodiment of the present invention.

In a method of manufacturing a camera module according to an embodiment of the present invention, after the connecting member 50 is positioned on the substrate 10, a first step of mounting one end of the connecting member 50 to an electrode pad of the substrate 10 is performed. And a second step of mounting the housing 20 and the actuator 40 on the substrate 10, and upwardly bending the connection member 50 to connect the other end of the connection member 50 to the actuator 40. And a third step of electrically connecting the electrode pads.

The first step is to mount the connecting member 50 on the substrate 10, to mount a component such as an image sensor 70 on the substrate 10, the electrode pad (not shown) of the substrate 10 ) One end of the connecting member 50 in a horizontal position.

Thereafter, one end of the connection member 50 is surface mounted on the electrode pad using a surface mounter (not shown). In this case, all commonly used surface mount technologies are applicable.

Therefore, the connection with the board during the conventional manual soldering is replaced by surface mount (SMT) has the effect of reducing the manufacturing time.

In this case, when the connecting member 50 is too light, there is a problem in that the connecting member 50 that is exactly aligned before the initial mounting is mismounted when the surface is mounted. Thus, the connecting member 50 is a conventional flexible circuit board. It may be prepared to have a weight of about 2 to 7 times higher than (FPCB).

As a specific implementation method, the connecting member 50 may be manufactured by mixing a plating solution with copper and lead. In this case, the weight is increased by the addition of lead, and there is an advantage in that the electrical connection is more excellent.

In this case, as shown in FIG. 2, when the ground 11 is processed at the edge of the substrate 10, the connection member 50 is electrically connected to the ground 11 by the surface mounting Q to generate a short. there is a problem.

In addition, even if the connection member 50 is not electrically connected to the ground 11, if the lead component of the connection member 50 is in contact with the ground 11 surface when contacted during surface mounting, the connection member ( It is important to control 50 so that it is electrically connected only to the electrode pads of the substrate 10.

Referring to FIG. 3, the connection member 50 according to the embodiment of the present invention includes a pair of connection terminals and a fixing portion 54 which partially covers the center of the connection terminal.

The connection terminal includes a first connection portion 51 electrically connected to an electrode pad of the substrate 10, a second connection portion 56 electrically connected to an electrode pad of the actuator 40, and the first connection portion. And a connecting portion 53 connecting the 51 and the second connecting portion 56.

The connection terminal is manufactured by mixing copper and lead by a mold injection method, and the fixing part 54 is made of a plastic material to fix the connection terminal to a central area.

A bent portion 52 may be further formed between the first connecting portion 51 and the connecting portion 53, and the bent portion 52 may be formed in a hook shape 52a as shown in FIG. 4.

Therefore, referring to FIG. 5, when the connection member 50 is horizontally seated on the substrate 10, the first connection portion 51 is brought into horizontal contact with the electrode pad formed on the substrate 10. It becomes possible.

At this time, when the first connecting portion 51 is formed at the same height as the bottom of the fixing portion 54, the first connecting portion when the fixing portion 54 is placed on the substrate 10 as shown in FIG. The 51 may also be stably mounted on the electrode pad of the substrate 10.

Since the connection part 53 is higher than the horizontal height of the connection part 51 by the bent part 52 and is spaced apart from the substrate 10 during surface mounting, there is no fear of contact with the ground 11 of the substrate 10.

In addition, when the bent portion 52 is formed in a hook shape, the front surface serves as a kind of blocking film, thereby preventing the risk of surface mounting to the rear of the bent portion 52.

Referring back to FIG. 1, the second step is mounting the housing 20 and the actuator 40 on the substrate 10. However, the second step may be selectively performed with the first step. For example, the housing 20, the actuator 40, and the like are first mounted on the substrate 10, and then the connection member 50 and the electrode pad may be surface mounted.

The housing 20 covers the image sensor 70 and any configuration may be applied as long as the housing accommodates a plurality of lenses. For example, the holder may cover the image sensor 70 and a lens barrel into which a plurality of lenses are inserted, and the holder and the lens barrel may be integrally formed.

Since the process of mounting the housing 20 and the actuator 40 is similar to a general camera module manufacturing process, a further detailed description thereof will be omitted and each feature will be described later.

The third step is a step of bending the connecting member 50 upward to electrically connect the other end of the connecting member 50 to the electrode pad of the actuator 40. 2, the connecting portion 56 is electrically connected to the electrode pad 41 of the actuator 40.

Since the second connector 56 is bent to correspond to the electrode pad of the actuator 40, the second connector 56 is easily electrically connected by soldering or the like.

In this case, although the second connecting portion 56 of the connecting member 50 is illustrated as being connected to the lower portion of the electrode pad 41 of the actuator 40, the present invention is not limited thereto. Or it is also possible to be electrically connected to the side.

According to the camera module manufacturing method of the present invention, the surface mounting technology is applicable, there is an advantage that the electrical reliability, yield and productivity are increased.

6 is a perspective view of a camera module according to an embodiment of the present invention.

The camera module according to the embodiment of the present invention includes a substrate 10 on which the image sensor 70 is mounted, a housing formed on the substrate 10 to cover the image sensor 70, and accommodate a plurality of lenses. 20, an actuator 40 mounted on the housing 20 and moving at least one or more lenses 61, electrode pads formed on the substrate 10, and electrode pads formed on the actuator 40. It includes a connecting member 50 for connecting.

The substrate 10 may be a general printed circuit board 10 can be used, and an electrical wiring (not shown) is formed on the upper surface so that the electrode pad and the image sensor 70 can be mounted. The electrode pad may be formed on one side of the substrate 10 to be electrically connected to the actuator 40.

The image sensor 70 converts an optical signal into an electrical signal, and may include a pixel region (not shown) including a plurality of pixels and a plurality of electrodes (not shown) that are input / output terminals of the pixel region. have. In this case, each of the plurality of electrodes is electrically connected to the substrate 10 by using wire bonding equipment.

Referring to FIG. 6, a cut-out portion 20a may be formed at a portion of the housing 21 so that the electrode pad of the substrate 10 may be exposed to the outside. When the housing 20 includes the holder 21 and the lens barrel 22, the holder 21 is formed on the substrate 10 to allow light to enter the image sensor 70. The light progress space is formed in the.

Looking at this in more detail, the light traveling space of the holder 21 is a rectangular opening (not shown) to allow light to be incident on the upper part and the image sensor 70 in which the circular opening for accommodating the lens barrel 22 is formed. It may be composed of a lower portion formed.

However, the shape of the holder 21 is not necessarily limited thereto, and any shape may be applied as long as the image sensor 70 is built in the holder 21 and an opening in which the lens barrel 22 is accommodated is formed thereon.

The lens barrel 22 is formed in a cylindrical shape so that one or more lenses 62 to 64 may be formed therein. At this time, the upper surface may be formed in a plate shape so that the actuator 40 is seated.

However, the housing 20 is not necessarily limited thereto and may be formed in a structure in which the holder and the lens barrel are integrated.

The actuator 40 may perform an auto focusing function by finely adjusting the lens 61 by moving the lens 61 up and down using a silicon wafer instead of a conventional voice coil.

The connecting member 50 serves to electrically connect the electrode pad of the substrate 10 and the electrode pad 41 of the actuator 40, and is connected to the substrate 10 and the actuator 40. The connection part of the connection member 50 is bent and mounted to correspond to the electrode pad of the substrate 10 to ensure electrical reliability.

In this case, as described above, the connection part electrically connected to the electrode pad of the substrate 10 may be surface mounted on the substrate 10. At this time, the connection terminal of the connection member 50 is made of a mold injection product mixed with copper and lead bar has the advantage that the electrical reliability by the external impact.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

10: substrate 20: housing
21: holder 40: actuator
50: connecting member 51: first connecting portion
52: bend 53: connection
54: fixed part 56: second connection part
60: lens 70: image sensor
Q: Surface Mount

Claims (17)

A substrate on which an image sensor is mounted;
A housing formed on the substrate to cover the image sensor and to accommodate a plurality of lenses;
An actuator mounted on an upper portion of the housing and moving at least one lens; And
And a connection member including a pair of connection terminals connecting the electrode pads formed on the substrate and the electrode pads formed on the actuator, and a fixing part partially covering the pair of connection terminals.
The connection terminal may include a first connection part that is bent and electrically connected to the electrode pad formed on the substrate, a second connection part that is bent and electrically connected to an electrode pad formed on the actuator, and the first connection part and the first connection part. 2 Camera module including a connection for connecting the connection. delete The camera module of claim 1, wherein the first connection portion of the connection member is surface mounted on an electrode pad of the substrate. The camera module of claim 1, wherein the fixing part is formed at a connection part of the connection terminal to fix the connection terminal and is formed of an insulating material. The camera module of claim 1, wherein the connection terminal is a mixture of copper and lead. The camera module of claim 1, wherein a bent portion is formed between the first connection portion and the connection portion. The camera module of claim 6, wherein the bent portion has a hook shape. The camera module of claim 1, wherein the housing comprises a holder covering the image sensor and a lens barrel accommodated in the holder and into which a plurality of lenses are inserted.
The camera module of claim 1, wherein the housing has a cut-out portion formed at a portion corresponding to an electrode pad formed on the substrate.
A first step of mounting one end of the connection member on an electrode pad of the substrate after placing the connection member including a pair of connection terminals and a fixing part covering the connection terminal on the substrate;
A second step of mounting a housing and an actuator on the substrate; And
And a third step of electrically bending the connecting member upward to electrically connect the other end of the connecting member to the electrode pad of the actuator.
The connection terminal includes a first connection portion electrically connected to an electrode pad formed on the substrate, a second connection portion electrically connected to an electrode pad formed on the actuator, and a connection portion connecting the first connection portion and the second connection portion. Camera module manufacturing method. delete The method of claim 10, wherein in the first step, the first connection part is horizontally positioned on an electrode pad of the substrate and then surface mounted. The method of claim 10, wherein in the first step, a hook-shaped bent portion is formed between the first connection portion and the connection portion such that the connection portion is spaced apart from the substrate. The method of claim 10, wherein in the third step, the connector is bent upward and the second connector is electrically connected to the electrode pad of the actuator. The method of claim 10, wherein the housing includes a holder covering the image sensor and a lens barrel accommodated in the holder and into which a plurality of lenses are inserted. delete A substrate on which an image sensor is mounted;
A housing formed on the substrate to cover the image sensor and to accommodate a plurality of lenses;
An actuator mounted on an upper portion of the housing and moving at least one lens; And
It includes a connection member including a pair of connecting terminals for connecting the electrode pad formed on the substrate and the electrode pad formed on the actuator,
The connection terminal may include a first connection part bent and electrically connected to an electrode pad formed on the substrate, a second connection part electrically connected to an electrode pad formed on the actuator, and the first connection part and the second connection part. Camera module comprising a connecting portion.

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