KR101261600B1 - Loading and unloading apparatus for semiconductor package lead frame magazine. - Google Patents

Abstract

An automatic supply and retrieval apparatus of a semiconductor package lead frame magazine is disclosed.
The invention provides a first magazine supply conveyor for transporting the semiconductor package lead frame loaded in the magazine to the withdrawal position to be withdrawn; First linear transfer means for sequentially drawing and supplying the semiconductor package lead frame from the magazine transferred by the magazine supply conveyor; A first magazine recovery conveyor for recovering a magazine from which the semiconductor package lead frame is drawn out by the first linear transport means; First alignment means for aligning the semiconductor package lead frame transferred by the first linear transfer means; First rotating transport means for attaching the semiconductor package lead frame aligned by the first alignment means to a chain belt for plating; Second rotating conveying means attached to the chain belt for plating by the first rotating conveying means and withdrawing the semiconductor package lead frame from the plating chain belt in order to recover the semiconductor package lead frame after the plating process; Second alignment means for aligning the semiconductor package lead frame drawn out from the belt by the second rotation transfer means; Second linear transfer means for loading the semiconductor package lead frame aligned by the alignment means into a magazine; A second magazine supply conveyor which feeds a magazine in which the semiconductor package lead frame is not loaded into a storage position to recover the semiconductor package lead frame supplied by the second linear transfer means; A second magazine recovery conveyor which is fed by the second magazine supply conveyor and recovers a magazine in which the semiconductor package lead frame is accommodated by the second linear transfer means; By including, the chain belt for plating is continuously driven at high speed while minimizing the operating distance between the transfer mechanism, the installation space is small, and noise is prevented, and it is possible to implement the optimized automation equipment without changing the existing plating line. It is.

Description

Automatic loading and retrieval device for semiconductor package lead frame magazine {Loading and unloading apparatus for semiconductor package lead frame magazine.}

The present invention provides an automatic supply and retrieval of a semiconductor package lead frame magazine capable of automatically extracting and automatically supplying and retrieving a semiconductor package lead frame from a magazine for plating a semiconductor package lead frame loaded in a magazine in a semiconductor package lead frame plating process line. Relates to a device.

The semiconductor package is composed of a semiconductor chip and a semiconductor package lead frame. The semiconductor package lead frame includes a lead that serves to connect the inside and the outside of the semiconductor package and a support that supports the semiconductor chip. frame). In order to improve reliability of the thin plate member, which is a raw material, such a semiconductor package lead frame is subsequently subjected to surface treatment such as alkali electrolytic degreasing and micro etching, and then to form the thin plate member into a predetermined shape by a stamping process or an etching process. do.

The semiconductor package lead frame is completed through a process of forming a plating layer, a downset process of providing a portion on which the semiconductor chip is disposed, a taping process, and a forming process. Arranged and molded by molding resin into a semiconductor package

In manufacturing a semiconductor package using a conductor package lead frame, after completion of the molding process, the outlead exposed to the outside of the molded semiconductor package is exposed to the outside to prevent chemical change (corrosion by oxidation). The surface of the outlead is plated.

In general, the plating line of the semiconductor package lead frame proceeds with a cleaning, pretreatment, plating, post treatment, and drying process. These plating lines require automation facilities because they cannot rely on the need to improve productivity and manual work, but due to the high environmental factors of hazardous chemicals, it is not only difficult to fully automate. They are exposed to harsh environmental conditions where earplugs and masks must be worn.

Until now, the automatic supply and retrieval of semiconductor package lead frame for plating semiconductor package lead frame has to be continuously operated at high speed by the chain belt for plating, and the height between the positions for supplying and fixing the semiconductor package lead frame to the chain chain belt for fixing. Due to the large deviation, the device requires a lot of working space for driving, noise is generated, and above all, because the plating line is installed in various standards and types, for example, the size of the semiconductor package lead frame is 2 The size of the magazine to accommodate and transport the semiconductor package lead frame is different depending on the species, there is a problem that it is difficult to implement an automated system that can be optimized for the existing plating line according to the size of the magazine.

The present invention has developed a high-speed linear motion and rotational movement means that can automatically supply and retrieve the semiconductor package lead frame at high speed in the plating process of the semiconductor package lead frame, so that the chain belt for plating is continuously operated at high speed while operating between the transfer mechanisms. Minimize the distance to minimize installation space, prevent noise, and respond to magazines of various sizes according to the specifications of semiconductor package lead frames. Semiconductor package lead frames can realize optimized automation equipment without changing existing plating lines. It is to provide an automatic supply and recovery device.

Technical features for achieving the object of the present invention is a semiconductor package for attaching a semiconductor lead frame supplied from a magazine in which a plurality of semiconductor package lead frames are stacked in a layer attached to a chain belt for plating on an orbit to move to a plating line A lead frame plating apparatus, comprising: a first magazine supply conveyor for transferring a semiconductor package lead frame loaded in a magazine to a withdrawal position so as to be withdrawn; First linear transport means for sequentially drawing and supplying the semiconductor package lead frame from the magazine transported by the first magazine supply conveyor; A first magazine recovery conveyor for recovering a magazine from which the semiconductor package lead frame is drawn out by the first linear transport means; First alignment means for aligning the semiconductor package lead frame transferred by the first linear transfer means; A first rotation transfer means for attaching the semiconductor package lead frame aligned by the first alignment means to the chain belt for plating; a semiconductor package lead frame attached to the chain belt for plating by the first rotation transfer means and completed a plating process Second rotational conveying means for drawing out the semiconductor package lead frame from the chain belt for plating to recover the metal; Second alignment means for aligning the semiconductor package lead frame drawn out from the belt by the second rotational transfer means; Second linear transfer means for loading the semiconductor package lead frame aligned by the alignment means into a magazine; A second magazine supply conveyor which feeds a magazine in which the semiconductor package lead frame is not loaded into a storage position to recover the semiconductor package lead frame supplied by the second linear transfer means; And a second magazine recovery conveyor which is fed by the second magazine supply conveyor and recovers a magazine in which the semiconductor package lead frame is accommodated by the second linear transfer means.

The magazine is formed in a layered space in which the semiconductor package lead frame is individually accommodated by a plurality of slots formed opposite to the inner surfaces of both vertical surfaces, and is open to insert / extract the semiconductor package lead frame on the front and back surfaces. A space is formed so that a plurality of semiconductor package lead frames are stacked in layers.

The first magazine supply conveyor is provided with a width adjusting means to transfer the semiconductor package lead frame loaded in the magazine to a position for drawing out.

The width adjusting means is installed so that either belt frame is guided and movable in a guide rail installed in a direction perpendicular to the traveling direction of the conveyor, and is installed in a direction parallel to the guide rail, that is, perpendicular to the traveling direction of the conveyor. And the lead screw rotated by the step motor is screwed to be guided to the guide rail as the lead screw rotates to be able to supply a magazine of various specifications.

The first linear transfer means is screwed to a lead screw driven by a step motor on one side of the first magazine supply conveyor, and receives a magazine loaded with a semiconductor package lead frame, and is vertically spaced by the interval of the semiconductor frames arranged in layers. With lift to lift; A push rod installed horizontally to pull out the semiconductor package lead frame loaded in the magazine; A pair of transfer rollers capable of lifting and lowering so that the upper roller is close to and spaced apart from the lower roller, and compresses the semiconductor package lead frame drawn by the push rod to move in the horizontal direction; The semiconductor package from the magazine transported by the magazine supply conveyor, which consists of a pusher which is moved up and down and horizontally by a pneumatic cylinder so as to transport the rear end portion of the semiconductor package lead frame transferred by the transport roller to the first rotational transport means. The lead frame is drawn out sequentially.

The lift is provided with a width adjusting means, the magazine is installed inside the conveyor for supplying the first magazine is accommodated periodically by the interval in which the semiconductor package lead frame is stacked so that the semiconductor package lead frame can be ejected sequentially It moves up, vertically reciprocating between the first magazine feed conveyor and the first magazine discharge conveyor, periodically raising the magazine in the eject stage, and conveying the ejected magazine to the first magazine discharge conveyor It may be configured as a lift, the lower lift that is received in the step of ejecting the magazine from the inside of the first magazine supply conveyor, and the semiconductor package lead frame is clamped to the fully ejected magazine and conveyed to the first magazine recovery conveyor It may consist of an upper lift.

The first magazine recovery conveyor is provided with a width adjusting means such as the magazine supply conveyor to adjust the width of the conveyor together with the magazine supply conveyor, and leads the semiconductor package by an ejector installed on the magazine supply conveyor. The frame ejects the extracted magazine.

The ejector is provided with a position adjusting means, and consists of a pair of fingers for clamping and lifting and horizontally moving the magazine discharged from the semiconductor package lead frame by the actuator seated on the first magazine recovery conveyor.

The first alignment means is advanced and retracted by a pneumatic cylinder installed on a storage table for accommodating the semiconductor package lead frame drawn by the first linear transfer means, and on a moving table which is slidably placed on the guide rail and moved by a screw shaft. It consists of a operative pusher to align the semiconductor package lead frame so that it can be accurately attached to the belt by the first rotational conveying means.

The first rotational conveying means is a pneumatic cylinder rotatably installed in the upper portion of the receiving unit of the alignment means and rotatably installed by a servo motor, and another pneumatic cylinder installed in the piston rod of the pneumatic cylinder to linearly reciprocate And a carrier finger for clamping the semiconductor package lead frame aligned by the alignment means to attach the semiconductor package lead frame transferred by the extraction means to the chain belt for plating.

The second rotary feeder has the same structure as the first rotary feeder, and is provided symmetrically with the first rotary feeder. That is, with a carrier finger that clamps and releases the semiconductor package lead frame after the plating process is completed by a pneumatic cylinder rotatably installed by a servo motor and another pneumatic cylinder mounted on the piston rod of the pneumatic cylinder and linearly reciprocating. The semiconductor package lead frame, which has been configured and completed the plating process, can be recovered from the chain belt for plating.

The second alignment means has the same structure as the first alignment means, and is provided symmetrically with the second alignment means. That is, the pusher which moves forward and backward by the pneumatic cylinder which is installed in the storage stand which accommodates the semiconductor package lead frame isolate | separated by the said 2nd rotation conveyance means, and the slide which is slidably placed in the guide rail and is moved by a screw shaft. It is arranged so that the semiconductor package lead frame can be accurately transferred to the recovery magazine.

The second linear transfer means has the same structure as the first linear transfer means, and is provided symmetrically with the first linear transfer means. That is, the pusher is installed in the piston rod of the pneumatic cylinder so as to push the semiconductor package lead frame placed in the storage rack to load the semiconductor package lead frame aligned by the second alignment means in the magazine; In order to move the semiconductor package lead frame transferred by the pusher close to the magazine, the upper roller may move up and down so as to be spaced apart from the lower roller, thereby compressing the semiconductor package lead frame drawn by the pusher and compressing the horizontal package direction. The horizontal and vertical movement of the semiconductor package lead frame is performed by a pair of transfer rollers and a pneumatic cylinder installed in the horizontal direction and the vertical direction so that the semiconductor package lead frame transferred to the transfer roller reaches the magazine. A pusher for pushing and transporting the rear end portion; In order to receive the semiconductor package lead frame supplied by the pusher, a screw is coupled to a lead screw driven by a step motor on one side of the second magazine supply conveyor to receive a magazine in which the semiconductor package lead frame is not loaded. It consists of lifts that are lifted in the vertical direction by the interval of the layered semiconductor frame to load the semiconductor package lead frame in the magazine.

The second magazine supply conveyor has the same configuration as the first magazine supply conveyor, and is installed symmetrically with the second magazine supply conveyor. That is, the semiconductor package lead frame is provided with a width adjusting means. The magazine is transferred to a position for receiving the semiconductor package lead frame.

The width adjusting means is installed such that the belt frame is guided to the guide rail is installed in a direction perpendicular to the traveling direction of the conveyor, such as the first magazine supply conveyor, so as to be movable, parallel to the guide rail, that is, The lead screw installed at right angles to the direction of travel of the conveyor and rotated by the servo motor is screwed to guide and move to the guide rail as the lead screw rotates, thereby providing magazines of various specifications.

The 2nd magazine collection conveyor has the same structure as the said 1st magazine collection conveyor, and is installed symmetrically with the 1st magazine collection conveyor. That is, a width adjusting means such as the second magazine supply conveyor is provided to adjust the width of the conveyor together with the second magazine supply conveyor, and to the second discharge means installed on the second magazine supply conveyor. As a result, the magazine loaded with the semiconductor package lead frame is discharged.

The second discharge means has a width adjusting means, and is composed of a pair of fingers that clamp, lift and horizontally move the magazine discharged from the semiconductor package lead frame by the actuator to be seated on the second magazine recovery conveyor.

The present invention is to minimize the operating distance between the transfer mechanism while the chain belt for plating continuously running at high speed to reduce the installation space and to prevent noise, and to add an automated equipment optimized for the existing installation line in various standards and types It becomes possible to install.

1 is a plan view of the system of the present invention
2 is a front view of the system of the present invention;
3 is a front view of the first / second automatic supply and recovery device of the present invention;
4 is a side view of the first and second automatic feeding and recovering apparatus of the present invention;
5 is a plan view of a conveyor for supplying a first / second magazine of the present invention;
6 is a side view of a conveyor for supplying a first / second magazine of the present invention;
7 is a plan view of the lower lifter of the present invention;
8 is a front view of the lower lifter of the present invention;
9 is a side view of the lower lifter of the present invention;
10 is a plan view of the upper lifter of the present invention;
11 is a front view of the upper lifter of the present invention;
12 is a side view of the upper lifter of the present invention;
Figure 13 is a plan view of the ejector of the present invention
14 is a front view of the ejector of the present invention
Figure 15 is a side view of the ejector of the present invention
16 is a plan view of the transfer roller mechanism of the present invention.
17 is a front view of the transfer roller mechanism of the present invention.
18 is a side view of the transfer roller mechanism of the present invention.
19 is a plan view of the conveyor for collecting the first and second magazines of the present invention;
20 is a side view of the first / second magazine recovery conveyor of the present invention;
Figure 21 is an enlarged front view of a part of the alignment means of the present invention
Figure 22 is a front view of the alignment means of the present invention
Figure 23 is an overall plan view of the alignment means of the present invention.
24 is an overall front view of the alignment means of the present invention.
Figure 25 is an overall right side view of the alignment means of the present invention.
Figure 26 is a front view of a state in which the alignment means of the present invention is installed
Figure 27 is an overall plan view of the first / second rotational conveying means of the present invention.
28 is a front view of the first / second rotational conveying means of the present invention;
29 is a side view of the first / second rotational conveying means of the present invention
30 is a plan view of the pusher of the present invention;
Figure 31 is a front view of the pusher of the present invention
32 is a side view of the pusher of the present invention

Features and advantages of the invention will be more clearly understood by the embodiments described by the accompanying drawings.

Hereinafter, embodiments of the present invention will be described.

In the following description, the positions and symbols of the sensors installed in each section are omitted.

The apparatus of the present invention is a chain belt system (CVS) and a semiconductor package lead frame (LF) installed in a conventional plating line that performs cleaning, pretreatment, plating, post-treatment and drying processes as shown in FIGS. 1 and 2. Of the chain belt system CVS to recover the semiconductor package lead frame LF which has passed through the plating line and the automatic supply device A installed on the right front side of the chain belt system CVS for supplying to the plating line. It consists of the automatic collection | recovery apparatus B installed in the front left side.

The automatic supply device (A) is transported by the first magazine supply conveyor (1) and the magazine supply conveyor (1) for transferring to the position to take out the semiconductor package lead frame (LF) loaded in the magazine (M). The semiconductor package lead frame LF is drawn out by the first linear transfer means 2 and the first linear transfer means 2 which sequentially draw the semiconductor package lead frame LF from the magazine M and supply it. A first magazine recovery conveyor 3 for recovering the used magazine, a first alignment means 4 for aligning the semiconductor package lead frame LF transferred by the first linear transport means 2, and the first It consists of the 1st rotation conveying means 5 which attaches the semiconductor package lead frame arrange | positioned by the 1st alignment means 4 to the plating chain belt.
The automatic recovery device B has the same configuration as the automatic supply device A and is provided symmetrically with the second rotary feed means 5a, the second alignment means 4a, the second linear feed means 2a, It consists of the 2nd magazine supply conveyor 1a and the 2nd magazine collection conveyor 3a.

First, look at the automatic supply (A).

As shown in FIGS. 5 and 6, the first magazine supply conveyor 1 has a wheel shaft fixed to the front and rear of the belt frames 10, 10a and 10b installed at both sides at the right front side of the chain belt system CVS. The wheels 12, 12a, 12b and 12c are fixed to the wheels 11 and 11a so that the belts 13 and 13a installed on the wheels 12 and 12a and the wheels 12b and 12c are connected to the drive motor 17. Driven by power, the belt frame 10a on which the wheels 12b and 12c and the belt 13a on one side are installed is guided and guided by the guide rails 15 and 15a installed in a direction perpendicular to the traveling direction of the conveyor. It is installed to be slidably movable in the axial direction of the shafts 11 and 11a so that the magazine M can be transferred to the position where the semiconductor leaf frame LF is drawn out.

The belt frame 10a, which is movably installed along the guide rails 15, 15a, is attached to the lead screws 16, 16a, which are bearing-installed on the belt frames 10, 10b between the belt frames 10, 10b on both sides. It is fastened to be able to move in both directions as the lead screw (16, 16a) is rotated to be able to adjust the width between the belt 13, 13a according to the size of the magazine (M).

The pair of lead screws 16 and 16a rotate in the same direction by interlocking with the belts 13b installed on the wheels 12d and 12e fixed to one end exposed to the outside of the belt frame 10.

On the other hand, one end of the wheel shafts 11 and 11a and the lead screws 16 and 16a are mounted on the belt frame 10b fixed to the belt frame 10b, and the driving motor 17 is installed at the front and the step motor 18 at the rear. It is installed.

The drive shaft of the drive motor 17 is connected to the wheel shaft 11 to drive the belts 13 and 13a so as to transfer the magazine M placed on the belts 13 and 13a to the first linear transfer means 2. Let's do it.

The drive shaft of the step motor 18 is connected to the lead screw 16 to drive the belt 13b so that another lead screw 16a is interlocked with the lead screw 16 to adjust the width between the belts 13 and 13a. To provide power.

In the magazine M, a space in which the semiconductor package lead frame LF is individually accommodated is formed in a layered manner by a plurality of slots formed opposite to the inner surfaces of both vertical surfaces, and the semiconductor package lead frame LF is disposed on the front and back surfaces thereof. An open space is formed so that this insertion / ejection can be made in a known configuration in which a plurality of semiconductor package lead frames are stacked in layers.

The first linear conveying means 2 is composed of a vertical conveying means 20 and a horizontal conveying means 25 to remove the semiconductor package lead frame LF from the magazine M conveyed by the magazine supply conveyor 1. It can be withdrawn sequentially and supplied.
The vertical conveying means 20 is composed of a lower lift 200 and an upper lift 220 as shown in FIGS. 7 to 12.

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As shown in FIGS. 7 to 9, the lower lift 200 has a lead screw 203 installed vertically at the center between the vertical guide rails 202 and 202a fixed to the front sides of the vertical frame 201 in the vertical direction. The rear step motor 204 is fixed to the rear surface and is connected to the lead screw 203 and the belt pulley 205.

The lead screw 203 is fastened to the center of the body 207 while the body 207 of the magazine support 206 is fixed to the front of the vertical guide rails 202 and 202a so as to be slidably movable. The magazine pedestal 206 can be moved up and down along the guide rails 202 and 202a by the lead screw 203 which rotates in the correct position by the power of the < RTI ID = 0.0 >

A pair of fingers 208 and 208a are installed side by side on the front surface of the body 207 to which the magazine pedestal 206 is fixed, so that the supplied magazine M can be clamped.

The body 207 is provided with guide rails 209 and 209a and lead screws 210 in the horizontal direction on the front of the body 207 so that the width between the fingers 208 and 208a can be adjusted according to the magazine M size. One finger 208 is fixed to the body 207, the other finger 208a is fastened to the lead screw 210 while being installed to be slidably movable on the guide rails 209 and 209a.

One end of the lead screw 210 is supported by a bearing on the body 207, and the other end is fastened to the finger 208a to be installed on one side of the body 207 to adjust the power of the step motor 213. To run.

The pneumatic cylinder 211 is fixed to the outside of the finger 208a in the horizontal direction, and the pusher 212 is installed at the tip of the piston rod of the pneumatic cylinder 211 penetrating inward of the finger 208a, the magazine (M) It can be intercepted.

10 to 12, the lead screw 223 is vertically installed at the center between the guide rails 222 and 222a fixed in the vertical direction on both front surfaces of the vertical frame 221, as shown in FIGS. A lift step motor 224 is fixed to the rear surface and is connected to the lead screw 223 and the belt pulley 225.

In the front of the vertical guide rails (222, 222a), the vertical portion 227 of the vertical movable table 226 is fixed to the guide rails (222, 222a) to be slidably moved, and at the center protruding to the rear surface of the vertical portion (227) The lead screw 223 is fastened so that the vertical movable table 226 can be moved up and down along the guide rails 222 and 222a by the lead screw 223 rotating in position by the power of the lift step motor 224. .

The lead screw 223 is supported by the bearing on the vertical frame 221, the lower end is fastened to the vertical portion 227 of the vertical movable table 226, the stepping motor for the lift is installed on the back of the vertical frame 221 Drive by the power of (224).

One pneumatic cylinder 228 is fixed to the upper portion of the vertical movable table 226 in the traveling direction of the conveyor, and a pair of guide rails 229 and 229a parallel to the traveling direction of the conveyor are fixed to the bottom surface.

On both sides of the guide rails 229 and 229a, opposing upper horizontal slides 230 and 230a and fingers 232 and 232a may be installed to clamp the supplied magazine M, and the upper horizontal slides 230 and 230a may be clamped. The front end is connected and fixed to the piston rod of the pneumatic cylinder 228 so that when the pneumatic cylinder 228 is driven to reciprocate along the guide rails 229 and 229a to transfer the clamped magazine M.

The pneumatic cylinder 234 is fixed to the outside of the finger 232a in the horizontal direction, the pusher 235 is installed at the tip of the piston rod of the pneumatic cylinder 234 penetrating inward of the finger 232a, the magazine (M) It can be intercepted.

The fingers 232 and 232a may adjust widths that are opposed to each other according to the size of the magazine M by the width adjusting means.

The width adjusting means includes a pair of guide rails 231 and 231a installed at a lower portion of the upper horizontal slides 230 and 230a in a direction crossing the guide rails 229 and 229a, and one end of the lower horizontal slides 233. The lead screw 236 is supported by a bearing and the other end is fastened to the finger, and the width adjustment step motor 237 fixed to the lower horizontal moving table 233a to drive the lead screw 236 is a finger The lower horizontal movable table 233a having the fixed portion 232a sliding along the guide rails 231 and 231a may adjust the width.

The horizontal conveying means 25 is composed of an ejector 250 and a conveying roller mechanism 255 as shown in FIGS. 13 to 18.

As shown in FIGS. 13 to 15, the fixing piece 253 of the extraction pneumatic cylinder 252 is fastened to the upper surface of the supporter 251 by the fastener 254, as shown in FIGS. 13 to 15.

Extraction pneumatic cylinder 252 is installed toward the open space of the magazine (M) which is stepped up by the lower lift 200 or the upper lift 220, the push rod 252a is loaded in the magazine (M) The semiconductor package lead frame LF is extracted from the magazine M, and is transported in a horizontal direction to a position where the transfer roller mechanism 255 can be pinched.

The fixing piece 253 to which the fixing tool 254 is coupled is formed as a long hole to change the fixed position according to the specification of the magazine M, thereby accurately extracting the semiconductor package lead frame LF from the magazine M. Can be.

As shown in FIGS. 16 to 18, the transfer roller mechanism 255 may include a guide 256 for guiding the semiconductor package lead frame LF extracted by the ejector 250, and a semiconductor flowing through the guide 256. And a pair of feed rollers 257 and 257a for compressing and feeding the package lead frame LF, and a drive motor 258 for driving the feed rollers 257 and 257a, and a drive shaft 270 of the feed roller 257. ) Is connected to the drive motor 258 and the belt transmission mechanism (271).

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The feed rollers 257 and 257a of one side are fixed to the roller block 262, and the roller block 262 is guided to the guide rail 261 to be slid and moved, while the lead screw 260 that rotates with the adjuster 259. When the adjustment mechanism 259 is rotated, the width of the semiconductor package lead frame LF is adjusted according to the size of the semiconductor package lead frame LF by being guided to the guide rail 261 together with the roller roller block 262.

The first magazine recovery conveyor 3 has the same configuration as the magazine supply conveyor 1 as shown in FIGS. 19 and 20, and is also provided with a width adjusting means having the same configuration, together with the magazine supply conveyor. It is possible to adjust the width of, by the upper lift 220 for transporting the magazine (M) from which the semiconductor package lead frame (LF) is extracted by the ejector 250 is installed on the upper side of the magazine supply conveyor (1) The stored magazine (M) is discharged.

The first alignment means 4 is moved forward and backward by the pneumatic cylinder 42 in order to align the housing 40 and the semiconductor package lead frame transferred to the storage 40 as shown in FIGS. The pusher 41 pushes and aligns the semiconductor package lead frame LF, which is composed of a pusher 41 and a position adjusting means, which is conveyed by the transfer rollers 257 and 257a, and then by the first rotational transfer means 5. Allow to be transferred to the plating line.

The storage table 40 accommodates the semiconductor package lead frame LF transported by the transfer rollers 257 and 257a to stay in the stopped state.

The pusher 41 is installed on the piston rod of the pneumatic cylinder 42 fixed horizontally, and is installed horizontally toward the storage table 40.

The position adjusting means is provided on the guide rails 44 and 44a fixed to the upper part of the lower fixing member 43 so that the upper fixing member 43a to which the pneumatic cylinder 42 is fixed is movable, and one end thereof is the lower fixing member 43. The other end is rotatably supported by the support end portion 46 having the opening groove 45 formed in the upper fixing base 43a on which the pneumatic cylinder 42 is fixed while being supported by the bearing. It consists of a lead screw 48 and a fastener 49 which is fastened to the support end 46 to fasten the lead screw 48 to fasten the opening groove 45 to secure the lead screw 48, The distance between the transferred semiconductor package lead frame LF and the pusher 41 can be adjusted.

The first rotary feed means 5 is composed of a pneumatic cylinder 50, carrier fingers 51, 51a, position adjusting means of the carrier fingers 51, 51a as shown in Figs.

The pneumatic cylinder 50 is rotatably installed on the receiving table 40 of the first alignment means 4 to be rotated by the servomotor 52.

The carrier fingers 51 and 51a are mounted on the piston rod of the pneumatic cylinder 50 to drive another pneumatic cylinder 59 and 59a, which are linearly reciprocated, to be aligned by the alignment means. ) Is attached to the chain belt (CV) for plating.

Positioning means of the carrier fingers (51, 51a) is a movable table (55) which is slidably installed on the guide rails (54, 54a) fixed to the upper portion of the fixing table (53) fixed to the piston rod of the pneumatic cylinder (50) Carrier fingers 51 and 51a are provided at one end thereof, and one end thereof is supported by the bearing 53 by a bearing, and the other end thereof is composed of a lead screw 56 which is fastened to the movable table 55.

The automatic recovery device B includes a second rotary feed means 5a, a second alignment means 4a, a second linear feed means 2a, a second magazine supply conveyor 1a, and a second magazine recovery conveyor ( 3a).

The second rotational conveying means 5a has the same configuration as that of the first rotational conveying means 5, so that the semiconductor package lead frame, which has completed the plating process, can be recovered from the chain belt for plating.

The second alignment means 4a has the same configuration as that of the first alignment means 4, and the pusher 70 for supplying the semiconductor package lead frame LF of the holder 40 to the transfer rollers 257, 257A. ) Is further provided to align the semiconductor package lead frame after the plating process so as to be accurately transferred to the recovery magazine.

The pusher 70 is fixed to the pneumatic cylinder 71, the pneumatic cylinder 73 is fixed perpendicular to the bracket 72 is fixed to the pneumatic cylinder 71, and the piston rod end of the pneumatic cylinder 73 And a push rod 74 for pushing the semiconductor package lead frame LF to be installed at a position close to the storage table 40.

The second linear transfer means 2a has the same configuration as the first linear transfer means 2, thereby loading the semiconductor package lead frame into a magazine supplied without the semiconductor package lead frame loaded.

The second magazine supply conveyor 1a has the same configuration as the first magazine supply conveyor 1 and transfers the magazine in a state where the semiconductor package lead frame is not loaded to a position for accommodating the semiconductor package lead frame.

The second magazine recovery conveyor 3a has the same configuration as the first magazine recovery conveyor 3 to discharge the magazine loaded with the semiconductor package lead frame.

In the chain belt system CVS applied to the present invention, a plating chain belt CV is installed on a pair of belt pulleys 300 and 300a, and the semiconductor package lead frame LF is separated from the plating chain belt CV. It consists of a clipper (not shown) of known construction that possibly secures.

Looking at the process of the semiconductor package lead frame (LF) is automatically supplied to the plating line and recovered by the present invention configured as described above are as follows.

In the following description, the position and sign of the sensor operated in each section are omitted.

In the apparatus of the present invention, a plurality of magazines M and a semiconductor package lead frame LF are sequentially and simultaneously supplied and recovered. In the following description, one magazine M and a semiconductor package lead frame LF are provided. This conveying state will be described, and the position and sign of the sensor operated in each section are omitted.

The optimum position is selected for the automatic supply device A and the automatic recovery device B using the width adjusting means and the position adjusting means according to the sizes of the magazine M and the semiconductor package lead frame LF.

The automatic supply device A attaches a semiconductor package lead frame LF supplied from a magazine M in which a plurality of semiconductor package lead frames LF are stacked in a layer to a chain belt CV for an infinitely orbital plating. Transfer to the line.

First, the optimum position selection of the first magazine supply conveyor 1 is performed by driving the step motor 18 in the forward and reverse directions so that the lead belts 16 and 16a interlock with each other, and the belt 13a on which the belt 13a is disposed to face each other. The distance between) is adjusted. Thereafter, a plurality of magazines M on which the semiconductor package lead frame LF is loaded is introduced into the first magazine supply conveyor 1, and the driving motor 17 is driven so that the magazines M of the belts 13 and 13a are loaded. When the rear end is reached, the sensor is sensed and the driving motor 17 is stopped.

When the driving motor 17 stops, the lead screw 203 is driven by the power transmitted to the belt pulley 205 by the lift step motor 204 installed on the lower lift 200 of the vertical transfer means 20. As the magazine pedestal 206 is rotated, the magazine pedestal 206 is stepped up by the interval in which the semiconductor package lead frame LF is loaded.

When the magazine pedestal 206 completes the first step, the extraction pneumatic cylinder 252 constituting the ejector 250 moves forward and backward, so that the push rod 252a transfers one semiconductor package lead frame LF to the transport roller ( 257, 257a), the magazine pedestal 206 is subjected to a two-step lift operation.

When the semiconductor package lead frame LF is detected from the magazine M, the transfer rollers 257 and 257a compress the semiconductor package lead frame LF and the power of the driving motor 258 reaches the transfer roller 257a. As a result, the semiconductor package lead frame LF moves horizontally toward the alignment means 4 and the rotation transfer means 5.

At this time, the tip portion of the semiconductor package lead frame LF exiting the transfer rollers 257, 257a does not reach the storage table 40 of the alignment means 4 sufficiently. The pneumatic cylinder lowers, moves linearly, and rises linearly. The pusher moving and returning completely pushes the semiconductor package lead frame LF to the storage table 40.

The optimum positioning of the feed rollers 257, 257a is because the feed rollers 257, 257a of one side fastened to the lead screw 260 interlocked with each other by rotating the adjuster 259 in the forward and reverse directions are guided and moved to the guide rail. Is determined accordingly.

On the other hand, when the lower lift 200 completes the step-up and the semiconductor package lead frame LF is extracted to the magazine (M), the empty magazine (M) by the upper lift 220, the first magazine recovery conveyor ( 3) is transported and discharged. That is, when the lift step motor 224 is driven, the power transmitted to the belt pulley 225 rotates the lead screw 223 so that the vertical portion 227 is guided to the guide rails 222 and 222a to open the magazine M. Fingers 232 and 232a are lowered to a clamping position, and both fingers 232 and 232a pinch the magazine M by the pusher 235 which the pneumatic cylinder 234 drives and moves forward.

When the fingers 232 and 232a pinch the magazine M, the lift step motor 224 is driven in the reverse direction so that the lower end of the magazine M reaches a position higher than the belt of the first magazine collecting conveyor 3. Fingers 232 and 232a are raised until then, and pneumatic cylinder 228 is driven so that the upper horizontal carriers 230 and 230a with fingers 232 and 232a installed are guided to the guide rails 229 and 229a to move horizontally. Reach on the recovery conveyor 3.

Then, the lift step motor 224 is driven in the reverse direction again, and the fingers 232 and 23a are lowered to lower the magazine M on the first magazine recovery conveyor 3 and then return to the original position.

The optimal position setting of the upper lift 220 is determined by the stepper motor 237 for width adjustment and the lower horizontal moving table 233a having one finger 232a fixed along the guide rails 231 and 231a. .

In the above, the semiconductor package lead frame LF that reaches the storage table 40 of the first alignment means 4 through the transfer rollers 257 and 257a moves forward in the horizontal direction by the pneumatic cylinder 42 ( 41) is aligned in a direction traveling in a straight line.

The optimal positioning of the pusher 41 is to release the fastening force of the fastener 49, and the pneumatic cylinder 42 including the pusher 41 by the lead screw 48 that rotates when the adjustment knob 47 is rotated in the forward and reverse directions. This is done by adjusting the position of.

When the semiconductor leaf frame LF is aligned, the pneumatic cylinder 50 is lowered. When the carrier fingers 59 and 59a reach the side ends of the semiconductor package lead frame LF, the pneumatic cylinders 51 and 51a are operated. The carrier fingers 51 and 51a crimp the side ends of the semiconductor package lead frame LF.

When it is detected that the carrier fingers 51 and 51a have clamped the semiconductor package lead frame LF, the servomotor 520 is driven so that the pneumatic cylinder 50 together with the carrier fingers 51 and 51a performs a plating chain belt ( It rotates at an angle of about 90 ° toward the CV), transfers it to the plating chain belt CV of the semiconductor package lead frame LF, and then releases the clamping and returns to the original position.

The optimal positioning of the carrier fingers 51 and 51a is performed by rotating the lead screw 56 so that the carrier 55 is guided and moved to the guide rails 54 and 54a so that the carrier fingers 51 and 51a are moved to the semiconductor package. This is performed by adjusting the distance between the side surface of the lead frame LF.

Plating chain belt (CV) is able to perform the plating in the order determined by receiving the semiconductor package lead frame (LF) in a state of being temporarily stopped by a clipper (not shown) like a known method.

In the above description, the lift operation for extracting the semiconductor package lead frame LF is performed by the step-up operation of the lower lift 200 and the upper lift 220 which discharges the magazine M, but the lower lift ( It is also possible to have the upper lift 220 perform the step-up and discharge operations of the magazine M simultaneously without the 200.

The automatic recovery device B includes a second rotary feed means 5a, a second alignment means 4a, a second linear feed means 2a, a second magazine supply conveyor 1a, and a second magazine recovery conveyor ( 3A) is a magazine in which the semiconductor package lead frame LF is not loaded by detaching the semiconductor package lead frame LF that has passed through the plating line by hanging on the chain belt CV for plating. It is collected in M) and collected.

The said 2nd rotation conveying means 5a, the 2nd alignment means 4a, the 2nd linear conveying means 2a, the 2nd magazine supply conveyor 1a, and the 2nd magazine which comprise such automatic collection | recovery apparatus B The recovery conveyor 3a is the same as that of the automatic supply device A described above, except that the pusher 70 supplies the semiconductor package lead frame LF from the storage table 40 to the transfer rollers 257 and 257a. Is further installed, and the pusher for transferring the semiconductor package lead frame LF from the transfer rollers 257 and 257a to the storage table 40 is omitted.

Conveyor for feeding the first magazine (1)
First linear transport means (2)
First magazine recovery conveyor (3)
First alignment means (4)
First rotary feed means (5)
Second rotary feed means 5a
Second alignment means 4a
Second linear transfer means 2a
Second magazine supply conveyor 1a
2nd magazine collection conveyor 3a

Claims (9)

delete delete Semiconductor from the first magazine supply conveyor 1 which transfers the semiconductor package lead frame LF loaded in the magazine M to the position which draws out, and the magazine M conveyed by the said magazine supply conveyor 1 A first linear conveying means 2 which draws out the package lead frame LF sequentially and supplies the first linear conveying means 2 which collects the magazines from which the semiconductor package lead frame LF is drawn out by the first linear conveying means 2; To the magazine sorting conveyor 3, the first sorting means 4 for aligning the semiconductor package lead frame LF conveyed by the first linear transport means 2, and the first sorting means 4. An automatic feeding device (A) comprising first rotating conveying means (5) for attaching the aligned semiconductor package lead frame to the plating chain belt;
2nd rotation conveyance means 5a, 2nd alignment means 4a, 2nd linear conveyance means 2a, and 2nd magazine supply conveyor which have the same structure as the said automatic feed apparatus A, and are installed symmetrically. 1a), an automatic recovery device (B) serving as a second magazine recovery conveyor (3a), wherein the semiconductor lead frame supplied from the magazine is attached to a chain belt for plating on the track and moved to the plating line for recovery. In the known semiconductor package lead frame plating apparatus,
The first linear transfer means 2 is screwed to a lead screw driven by a step motor, and receives a magazine M supplied with a semiconductor package lead frame loaded thereinto, and is vertically spaced by the interval of the semiconductor package lead frame arranged in layers. With a lift lift; A push rod installed horizontally to operate the pneumatic cylinder so as to pull out the semiconductor package lead frame loaded in the magazine M supplied to the lift; A pair of transfer rollers configured to transfer the semiconductor package lead frame drawn by the push rod in a horizontal traveling direction; Magazine (M) is composed of a pusher that is moved up and down and horizontally by a pneumatic cylinder to transfer the rear end portion of the semiconductor package lead frame transferred by the transfer roller to the first rotational transfer means. And an apparatus for automatically supplying and retrieving a semiconductor package lead frame magazine, which sequentially draws the semiconductor package lead frame from the same.
The method of claim 3, wherein the first and second magazine recovery conveyor is an ejector installed on the upper side of the magazine supply conveyor is composed of a pair of fingers, the finger clamping the magazine (M) from which the semiconductor package lead frame is discharged And a magazine (M) from which the semiconductor package lead frame is extracted by being seated on a conveyor for collecting the first magazine, thereby automatically supplying and collecting the semiconductor package lead frame magazine.
The pusher of claim 3, wherein the first alignment means includes a holder for accommodating the semiconductor package lead frame transferred by the transfer roller, and a pusher for advancing and retracting by the pneumatic cylinder to align the semiconductor package lead frame transferred to the holder. And a pusher to align the semiconductor package lead frame of the housing by pushing the pusher to align the semiconductor package lead frame magazine.
delete delete The method according to claim 3, wherein the lift is provided with a width adjusting means, the semiconductor package lead frame is periodically raised by a stacked interval so that the semiconductor package lead frame can be ejected sequentially by receiving the conveyed magazine (M), Vertically reciprocating between the first magazine feed conveyor and the first magazine discharge conveyor and periodically raising the magazine M in the ejecting stage, and conveying the ejected magazine M to the first magazine recovery conveyor An automatic supply and retrieval apparatus for a semiconductor package lead frame magazine.
The conveyor for recovering a first magazine according to claim 3, wherein the lift comprises a width adjusting means, and the lower lift and the semiconductor package lead frame, which receive the magazine M and rise in the ejecting stage, are clamped to the fully ejected magazine M. And an upper lift for conveying to the semiconductor package lead frame magazine.

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