KR101255692B1 - 톱날을 모니터링하고 컨디셔닝하기 위한 장치 및 방법 - Google Patents
톱날을 모니터링하고 컨디셔닝하기 위한 장치 및 방법 Download PDFInfo
- Publication number
- KR101255692B1 KR101255692B1 KR1020067021830A KR20067021830A KR101255692B1 KR 101255692 B1 KR101255692 B1 KR 101255692B1 KR 1020067021830 A KR1020067021830 A KR 1020067021830A KR 20067021830 A KR20067021830 A KR 20067021830A KR 101255692 B1 KR101255692 B1 KR 101255692B1
- Authority
- KR
- South Korea
- Prior art keywords
- saw blade
- sensor
- dispenser
- carrier
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sawing (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
Description
Claims (14)
- -원형 절단 변부를 가지는 회전식 톱날,-원형 절단 변부를 감지하기 위한 하나 이상의 센서, 및-상기 회전식 톱날의 냉각 및 세척용 매체(medium)의 디스펜서를 포함하고, 캐리어 상에 장착된 전자 부품을 분리하기 위한(separating) 장치에 있어서,상기 센서와 디스펜서는 조인트 캐리지 상에 조립되고, 상기 조인트 캐리지는 톱날에 대하여 가이드를 따라 이동 가능한 것을 특징으로 하는 장치.
- 제 1 항에 있어서, 가이드는 톱날에 대해 평행하게 형성되는 것을 특징으로 하는 장치.
- 제 2 항에 있어서, 톱날은 수직하게 배열되고, 가이드는 수직선에 대해 45°로 형성되는 것을 특징으로 하는 장치.
- 제 1항 내지 제 3 항 중 어느 한 항에 있어서, 센서는 톱날의 직경을 측정하는 것을 특징으로 하는 장치.
- 제 1항 내지 제 3 항 중 어느 한 항에 있어서, 센서는 원형 절단 변부에서의 중단 상태(interruption)를 감지하는 것을 특징으로 하는 장치.
- 제 1항 내지 제 3 항 중 어느 한 항에 있어서, 센서는 위치 표시기(position indicator)와 상호 협력하는 개별적인 광학 디텍터에 의해 형성되는 것을 특징으로 하는 장치.
- 제 1항 내지 제 3 항 중 어느 한 항에 있어서, 디스펜서는 원형 절단 변부로 향하게 하는 스프레이 헤드를 포함하는 것을 특징으로 하는 장치.
- 제 1항 내지 제 3 항 중 어느 한 항에 있어서, 디스펜서는 톱날의 상측부 상에 매체를 분사하는 스프레이 헤드를 포함하는 것을 특징으로 하는 장치.
- 제 8 항에 있어서, 디스펜서는 톱날의 상측부 상에 매체를 분사하고, 톱날의 한 측부에 위치된 2개의 다중 스프레이 헤드를 포함하는 것을 특징으로 하는 장치.
- 제 1항 내지 제 3 항 중 어느 한 항에 있어서, 장치는 개별적으로 조절 가능한 구동 샤프트에 장착되고 서로 평행하게 배열된 2개 이상의 회전식 톱날이 제공되는 것을 특징으로 하는 장치.
- 제 1항 내지 제 3 항 중 어느 한 항에 있어서, 센서는 데이터-처리 유닛에 연결되고, 데이터-처리 유닛은 구동 수단을 조절하며, 조인트 캐리지는 센서를 이용하여 감지된 측정값에 의존하여 가이드를 따라 이동될 수 있는 것을 특징으로 하는 장치.
- 분리를 위한 전자 부품을 포함하는 캐리어와 회전 톱날을 서로 이동시킴으로써 캐리어 상에 장착된 전자 부품을 분리시키기 위한 방법에 있어서,원형 톱날의 변부가 센서 수단에 의해 감지되고, 그 감지에 기초하여, 톱날에 대해 위치할 톱날의 냉각 및 세척용 매체의 디스펜싱 수단과 센서 수단이 공동 변위(joint displacement)에 의해 톱날에 대해 위치하게 되는 것을 특징으로 하는 방법.
- 제 12 항에 있어서, 캐리어는 2개의 회전 톱날에 의해 동시에 처리되고, 2개의 톱날의 센서 수단과 디스펜싱 수단(dispensing means)은 서로 독립적으로 이동 가능한 것을 특징으로 하는 방법.
- 제 12 항 또는 제 13 항에 있어서, 센서 수단과 디스펜싱 수단은 조인트 가이드를 따라 이동 가능한 것을 특징으로 하는 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NLNL1026080 | 2004-04-29 | ||
NL1026080A NL1026080C2 (nl) | 2004-04-29 | 2004-04-29 | Inrichting en werkwijze voor het conditioneren en monitoren van een zaagblad. |
PCT/NL2005/000318 WO2005105354A1 (en) | 2004-04-29 | 2005-04-28 | Device and method for conditioning and monitoring of a saw blade |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070015175A KR20070015175A (ko) | 2007-02-01 |
KR101255692B1 true KR101255692B1 (ko) | 2013-04-17 |
Family
ID=34967353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067021830A Expired - Lifetime KR101255692B1 (ko) | 2004-04-29 | 2005-04-28 | 톱날을 모니터링하고 컨디셔닝하기 위한 장치 및 방법 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP2007534511A (ko) |
KR (1) | KR101255692B1 (ko) |
CN (1) | CN1956814B (ko) |
MY (1) | MY159395A (ko) |
NL (1) | NL1026080C2 (ko) |
TW (1) | TWI346596B (ko) |
WO (1) | WO2005105354A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI548500B (zh) * | 2014-02-10 | 2016-09-11 | The cutting knife position sensing means |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0550362A (ja) * | 1991-08-21 | 1993-03-02 | Tokyo Seimitsu Co Ltd | ブレード位置検出装置 |
JPH05104327A (ja) * | 1991-10-11 | 1993-04-27 | Amada Co Ltd | 鋸盤における切粉除去装置 |
JP2002217135A (ja) * | 2001-01-19 | 2002-08-02 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69205786T2 (de) * | 1991-08-21 | 1996-03-28 | Tokyo Seimitsu Co Ltd | Blattpositiondetektionsvorrichtung. |
CN1055649C (zh) * | 1994-10-31 | 2000-08-23 | 株式会社阿马达 | 用于锯机的除锯屑装置 |
JP2955936B2 (ja) * | 1998-03-06 | 1999-10-04 | 株式会社東京精密 | ダイシング装置 |
DE19905751A1 (de) * | 1999-02-11 | 2000-08-31 | Wacker Siltronic Halbleitermat | Innenlochsäge und Verfahren zum Justieren einer Düse und eines Sensors einer Innenlochsäge relativ zu einem Sägeblatt der Innenlochsäge |
JP4590058B2 (ja) * | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP2002343745A (ja) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2002343746A (ja) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | インターロック付ダイシング装置 |
-
2004
- 2004-04-29 NL NL1026080A patent/NL1026080C2/nl not_active IP Right Cessation
-
2005
- 2005-04-28 JP JP2007510639A patent/JP2007534511A/ja active Pending
- 2005-04-28 CN CN2005800134128A patent/CN1956814B/zh not_active Expired - Lifetime
- 2005-04-28 KR KR1020067021830A patent/KR101255692B1/ko not_active Expired - Lifetime
- 2005-04-28 WO PCT/NL2005/000318 patent/WO2005105354A1/en active Application Filing
- 2005-04-29 MY MYPI20051922A patent/MY159395A/en unknown
- 2005-04-29 TW TW094113840A patent/TWI346596B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0550362A (ja) * | 1991-08-21 | 1993-03-02 | Tokyo Seimitsu Co Ltd | ブレード位置検出装置 |
JPH05104327A (ja) * | 1991-10-11 | 1993-04-27 | Amada Co Ltd | 鋸盤における切粉除去装置 |
JP2002217135A (ja) * | 2001-01-19 | 2002-08-02 | Disco Abrasive Syst Ltd | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070015175A (ko) | 2007-02-01 |
CN1956814B (zh) | 2011-09-07 |
MY159395A (en) | 2016-12-30 |
WO2005105354A1 (en) | 2005-11-10 |
TW200603938A (en) | 2006-02-01 |
JP2007534511A (ja) | 2007-11-29 |
NL1026080C2 (nl) | 2005-11-01 |
TWI346596B (en) | 2011-08-11 |
CN1956814A (zh) | 2007-05-02 |
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