KR101214258B1 - Tester for chip type super capacitor - Google Patents

Abstract

PURPOSE: A test apparatus of a super capacitor of a chip type is provided to perform charging and discharging tests for the super capacitor by calculating charge and discharge amounts of the super capacitor in the test process. CONSTITUTION: A probe substrate(60) forms a probe pin. The probe pin is touched with an external contact pad of a super capacitor of chip type received in a tray. A power supply unit(71) supplies power to the probe substrate and charges the power in the super capacitor. A light emitting diode for charging(73) indicates a charging state that the power is supplied to the super capacitor from the power supply unit. A light emitting diode for discharging(75) receives the power from the super capacitor through the probe substrate and discharges the super capacitor and indicates a discharging state. Optical sensors(77,78) detect brightness of light emitted from the light emitting diode for charging and the light emitting diode for discharging. [Reference numerals] (72) Relay; (74) Controller; (76) Timer; (77) First optical sensor; (78) Second optical sensor; (79) Controller

Description

Tester for chip type super capacitor

The present invention relates to a test technique for a chip-type super capacitor, and more particularly, to a test apparatus for a chip-type super capacitor that performs charge / discharge test on a super capacitor by calculating the charge / discharge amount of the super capacitor in a test process. will be.

Electric vehicles such as various portable electronic devices require electric energy storage devices for systems that require a power supply device, or systems for regulating or supplying an overload occurring instantaneously. Such electric energy storage devices include Ni-MH. There are secondary batteries such as batteries, Ni-Cd batteries, lead acid batteries, and lithium secondary batteries, and supercapacitors, aluminum electrolytic capacitors, and ceramic capacitors having high power density and almost unlimited charge / discharge life.

In particular, the supercapacitor includes an electric double layer capacitor (EDLC), a pseudo capacitor, and a hybrid capacitor such as a lithium ion capacitor (LIC).

Here, the electric double layer capacitor is a capacitor using the electrostatic charge generated in the electric double layer formed at the interface of the different phases, and has a faster charge / discharge rate, higher charge / discharge efficiency, and excellent cycle characteristics than a battery whose energy storage mechanism depends on chemical reaction. It is widely used for backup power supply, and the potential as an auxiliary power source for electric vehicles in the future is also infinite.

A pseudo capacitor is a capacitor that converts and stores a chemical reaction into electrical energy by using a redox reaction of an electrode and an electrochemical oxide. The pseudocapacitor can store charge up to near the surface of the electrode material as compared to the double layer formed on the surface of the electrochemical double layer electrode, so that the storage capacity is about five times larger than that of the double layer capacitor. RuOx, IrOx, MnOx and the like are used as the metal oxide electrode materials.

The lithium ion capacitor is a new concept of a secondary battery system that combines the high power and long life characteristics of a conventional electric double layer capacitor with the high energy density of a lithium ion battery. The electric double layer capacitor using the physical adsorption reaction of the electric charge in the electric double layer is limited to various applications due to the low energy density despite the excellent output characteristics and lifetime characteristics. As a means of solving the problems of the electric double layer capacitor, a lithium ion capacitor using a carbon-based material capable of inserting and desorbing lithium ions as a negative electrode active material has been proposed. Thus, the potential of the cathode can be significantly lowered, and the cell voltage can be realized at a high voltage of 3.8 V or more, which is significantly improved compared to the 2.5 V of the conventional electric double layer capacitor, and can express high energy density.

The basic structure of such a supercapacitor is composed of an electrode having a relatively large surface area, an electrolyte, a current collector, and a separator, like a porous electrode, and applying a voltage of several volts across the unit cell electrode to apply ions in the electrolyte. The principle of operation is the electrochemical mechanism that is generated by moving along the electric field and adsorbed on the electrode surface. These cells are sealed in upper and lower cases made of metal, and upper and lower terminals are attached to outer surfaces of the upper and lower cases.

However, in the case of the coin type, the conventional supercapacitor requires gaskets and coating materials for insulation and airtightness of the upper and lower cases, as well as application and crimping processes, thereby requiring assembly and productivity. Not only is it degraded, but it is also costly.

In addition, since the upper and lower terminals have a structure that protrudes to the outside of the upper and lower cases, not only the size of the super capacitor is increased but also takes a lot of mounting space when mounting on the substrate of the electronic device.

And welding and deflection defects frequently occur in the process of attaching the upper and lower terminals.

These problems result in lowering the functionality and usability of the supercapacitor.

In order to solve this problem, a cell is formed by stacking a first electrode, a separator, and a second electrode on a wiring board made of plastic material, and seals the space of the wiring board on which the cell is mounted with a lid to cover the electronic device. A chip type super capacitor capable of surface mounting on a substrate has been proposed.

The chip type supercapacitor is manufactured using a wiring board strip capable of manufacturing a plurality of batches, and separates the individual supercapacitors from the wiring board strip on which the manufacturing process is completed.

In addition, a test process for individual supercapacitors and a classification of good and defective items are required.

It is therefore an object of the present invention to provide a test apparatus for a super capacitor.

Another object of the present invention is to provide a chip type super capacitor test apparatus that can easily check the charge / discharge state in the charge / discharge test process of the super capacitor.

It is still another object of the present invention to provide a chip type supercapacitor test apparatus for testing charge / discharge characteristics of a supercapacitor by measuring a charge / discharge amount in a charge / discharge test process of a supercapacitor.

In order to achieve the above object, the test device of the chip type super capacitor according to the present invention comprises a probe substrate, a power supply, a charging light emitting diode, a discharge light emitting diode, an optical sensor and a control unit. The probe substrate is provided with a probe pin contacting an external connection pad of a chip type super capacitor housed in a tray. The power supply unit supplies power to the probe substrate in which probe pins are in contact with the super capacitor to charge the super capacitor. The charging LED displays a charging state in which power is supplied from the power supply unit to the super capacitor. The discharge LED receives power from the super capacitor through the probe substrate in which the probe pin is in contact with the super capacitor, discharges the super capacitor, and displays a discharge state. The optical sensor detects brightness of light emitted from the rechargeable light emitting diode and the discharge light emitting diode. The controller may be configured to connect the probe substrate and the power supply unit when the super capacitor is in contact with the probe pin of the probe substrate and to charge the super capacitor, and to discharge the super capacitor. And the discharge LED are connected, and the charge / discharge test is performed on the supercapacitor by calculating the charge / discharge amount from the intensity of the brightness received from the optical sensor.

In the testing device of the chip-type super capacitor according to the present invention, the control unit, the charge and discharge amount calculated from the intensity of the brightness received from the optical sensor, the amount of power supplied from the power supply when charging and the super when discharging The amount of charge and discharge of the supercapacitor may be calculated by reflecting the amount of power output from the capacitor.

In the testing device of the chip-type super capacitor according to the present invention, the control unit is connected to the probe substrate and the power supply, a relay for switching the connection between the probe substrate and the discharge light emitting diode, the connection of the relay It may include a controller for switching the state.

In the apparatus for testing a chip type super capacitor according to the present invention, the controller may further include a timer for providing time information for switching the connection state of the relay.

In the test apparatus of the chip type super capacitor according to the present invention, the controller switches the connection state of the relay according to the time information of the timer.

In the test apparatus for a chip type super capacitor according to the present invention, the charging LED is provided between the controller and the power supply unit.

In the test apparatus of the chip type super capacitor according to the present invention, the power supply unit supplies a constant current power to the super capacitor to start charging, and when a predetermined level is reached, the constant voltage power is supplied to the super capacitor. Full capacitor.

According to the present invention, the test apparatus may test the plurality of supercapacitors in a batch by using a tray containing the probe substrate and the plurality of supercapacitors.

In addition, the test apparatus according to the present invention can easily check the charge / discharge state of the supercapacitor by using whether the light emitting diode is turned on, that is, on / off during the charge / discharge test process for the supercapacitor.

In addition, the test apparatus according to the present invention may test the charge / discharge characteristics of the supercapacitor by measuring the charge / discharge amount in the charge / discharge test process of the supercapacitor. That is, the test apparatus may more accurately test the charge / discharge characteristics of the supercapacitor by using the charge / discharge amount calculated from the intensity of brightness received from the optical sensor.

1 is a perspective view showing a chip type super capacitor.
2 is a sectional view taken along the line 2-2 in Fig.
3 is a plan view showing a lower surface of the supercapacitor of FIG.
4 is a plan view illustrating a state in which the super capacitor of FIG. 1 is accommodated in a tray.
FIG. 5 is a cross-sectional view taken along the line 5-5 and shows a state in which a probe pin of a probe substrate is in contact with a super capacitor housed in a tray.
6 is a diagram illustrating a test device for a chip type super capacitor according to an exemplary embodiment of the present invention.

In the following description, only parts necessary for understanding the embodiments of the present invention will be described, and the description of other parts will be omitted so as not to obscure the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is a perspective view showing a chip type super capacitor. FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1. And FIG. 3 is a plan view showing a lower surface of the supercapacitor of FIG.

1 to 3, the chip-type super capacitor 100 includes a wiring board 10, a cell 20, and a lid 40. The supercapacitor 100 has a structure in which a cell 20 is mounted on an upper surface 12 of a wiring board 10 and a region in which the cell 20 is mounted is sealed with a lead 40. In this case, the cell 20 includes a first electrode 21, a separator 23, a second electrode 25, and an electrolyte.

The wiring board 10 is a printed circuit board including an insulating substrate body 11 and a circuit wiring pattern 13 formed on the substrate body 11. [

The substrate body 11 has a top surface 12 and a bottom surface 14 opposite the top surface 12 and can be made of an insulating material. As the material of the substrate body 11, FR4 or a ceramic material can be used. Such a substrate body 11 can be manufactured in the form of a rectangular plate.

The circuit wiring pattern 13 is formed on the lower surface 14 of the substrate body 11 and the electrode mounting area 15 and lead bonding pattern 17 formed on the upper surface 12 of the substrate body 11 And a plurality of external connection pads 18. The electrode mounting region 15 is formed at the central portion of the upper surface 12 of the substrate body 11. [ The lead bonding pattern 17 is formed around the electrode mounting region 15. [ The plurality of external connection pads 18 are formed on the lower surface of the substrate body 11, and the electrode mounting region 15 and the lead bonding pattern 17 are formed by via holes 19 passing through the substrate body 11. And are electrically connected respectively. As the circuit wiring pattern 13, a metal material such as copper having good electrical conductivity may be used, and gold (Au), nickel (Ni), or the like may be plated on the surface.

At this time, the lead bonding pattern 17 is formed in a ring shape surrounding the electrode mounting region 15 and is spaced apart from the electrode mounting region 15 by a predetermined interval. The plurality of external connection pads 18 may be provided in pairs to correspond to the first and second electrodes 21 and 25 of the cell 20. The pair of external connection pads 18a and 18b may be formed on the lower surface 14 of the substrate body 11 in the same size in the form of a rectangular bar. Meanwhile, the pair of external connection pads 18a and 18b may be formed to have different lengths so that an operator can easily distinguish terminals connected to the first and second electrodes 21 and 25 after being manufactured by the supercapacitor 100. Can be.

The cell 20 is mounted in the electrode mounting region 15, and the cell 20 includes a first electrode 21, a separator 23, a second electrode 25, and an electrolyte. The first electrode 21 is bonded to the electrode mounting region 15 via the first bonding member 31 and electrically connected thereto. The separator 23 is stacked on the first electrode 21. The second electrode 25 is stacked on the separator 23. The electrolyte is impregnated into the first and second electrodes 21 and 25. In this case, the first electrode 21 and the second electrode 25 are one of an anode or a cathode and have different polarities. As the first bonding member 31, as the adhesive having electrical conductivity, a carbon paste, a conductive polymer, a silver-epoxy adhesive, or the like may be used, but is not limited thereto. The first bonding member 31 may be provided in the form of a liquid or a sheet. Such a cell 20 may be a cell forming a hybrid capacitor such as an electric double layer capacitor, a pseudo capacitor, and a lithium ion capacitor.

The lead 40 covers the cell 20 mounted on the upper surface 12 of the wiring board 10 to seal the region in which the cell 20 is mounted to the outside. That is, the lead 40 covers the cell 20 mounted on the wiring board 10, and the inner surface of the lead 40 is joined to the second electrode 25 by the second bonding member 33 and electrically connected thereto. The portion is bonded to the lead bonding pattern 17 of the wiring board 10 via the third bonding member 35 and electrically connected thereto. The lead 40 is made of a metal material having good electrical conductivity, and may be composed of a cover portion 41 and a bonding portion 43. The cover part 41 has an internal space 45 into which the cell 20 is inserted, and the second electrode 25 is connected to the second bonding member 33 on the bottom surface 47 of the internal space 45. It is joined together and connected electrically. The joining portion 43 is integrally formed with the edge portion of the lid portion 41 and is electrically connected to the lead joining pattern 17 via the third joining member 35. The joining portion 43 may be formed to be bent outward at an edge portion of the lid portion 41.

Accordingly, the supercapacitor 100 has an external connection pad having the first electrode 21 of the cell 20 formed on the lower surface 14 of the wiring board 10 through the electrode mounting region 15 and the via hole 19. 18) is electrically connected. The second electrode 25 of the cell 20 is an external connection pad 18 formed on the bottom surface 14 of the wiring board 10 through the lead 40, the lead bonding pattern 17, and the via hole 19. Is electrically connected to the

In this case, the second and third bonding members 33 and 35 may be electrically conductive adhesives, and carbon paste, solder paste, conductive polymer, silver-epoxy adhesive, and the like may be used, but the present invention is not limited thereto. In particular, the third bonding member 35 may be formed on the lead bonding pattern 17 of the wiring board 10 by a printing method. The reason why the third bonding member 35 is formed on the lead bonding pattern 17 of the wiring board 10 by the printing method is to standardize the coating amount and the bonding area of the third bonding member 35 to bond the leads 40 to each other. This is to prevent the third bonding member 35 from spreading to the electrode mounting region 15 in the process of joining the lead 40 while maintaining the bonding state more stably. The joining portion 43 of the other lead 40 can be joined to the lead bonding pattern 17 of the wiring board 10 by a welding method using ultrasonic waves or high frequency waves.

As shown in FIGS. 4 and 5, the supercapacitor 100 performs a test using a test apparatus including a probe substrate 60.

In this case, the supercapacitor 100 may be provided in the test apparatus in the form of being accommodated in the storage space 51 of the tray 50. The tray 50 may be provided on the bottom surface of the storage space 51. The opening part 53 which the probe pin 63 of the contact can contact is formed.

The probe substrate 60 includes a probe substrate body 61 and a pair of probe pins 63 formed at positions corresponding to the external connection pads 18 of the super capacitor 100 on the upper surface of the probe substrate body 61, respectively. ). In the present embodiment, since the portion of the probe substrate 60 corresponding to one super capacitor 100 is illustrated, an example in which a pair of probe pins 63 are formed on the probe substrate 60 is disclosed. 60 includes a probe pin 63 corresponding to each of the plurality of supercapacitors 100 stored in the tray 50. Hereinafter, for convenience of description, the probe substrate 60 in which a pair of probe pins 63 are formed to correspond to one super capacitor 100 will be described.

The probe substrate body 61 may be made of FR4 or ceramic material. The probe board body 61 may be made of the same material as the wiring board 10 of the super capacitor 100.

The pair of probe pins 63 are formed at positions corresponding to the pair of external connection pads 18, and probe the center points of the external connection pads 18. That is, the pair of probe pins 63 may be arranged on a line crossing the center of the pair of external connection pads 18 with respect to the lower surface 14 of the rectangular wiring board 10. It can be formed in (61). The probe pin 63 is elastic so as to stably contact the external connection pad 18. The probe pin 63 may be used as long as it is an elastic medium while providing an electrical path such as a pogo pin, various types of springs, a conductive elastomer, and the like.

The plurality of supercapacitors 100 are supplied to the test apparatus while being accommodated in the storage space 51 of the tray 50, and the supercapacitors 100 accommodated in the tray 50 are probe pins of the probe substrate 60. Each of the 63 pieces is contacted and tested.

The test apparatus 200 according to the present embodiment including the probe substrate 60 as described above will be described below with reference to FIG. 6. 6 is a diagram illustrating a test apparatus 200 of a chip type super capacitor 100 according to an exemplary embodiment of the present invention.

The test apparatus 200 according to the present embodiment includes a probe substrate 60, a power supply unit 71, a charging light emitting diode 73, a discharge light emitting diode 75, an optical sensor 77, 78, and a controller 79. The controller 79 may include a relay 72, a controller 74, and a timer 76.

The probe board 60 is formed with the probe pin 63 contacting the external connection pad 18 of the supercapacitor 100. Since the probe substrate 60 has been described with reference to FIGS. 4 and 5, the detailed description thereof will be omitted.

The power supply unit 71 supplies power to the probe substrate 60 in which the probe pin 18 is in contact with the super capacitor 100 to charge the super capacitor 100. At this time, the power supply 71 charges the supercapacitor 100 by supplying a constant current and a constant voltage power during charging. As the power supply 71, a switching mode power supply (SMPS) may be used. That is, the supercapacitor 100 has a structure in which there is no charge voltage, such as shorting the load of the power supply by sucking excessive current, and continuously supplying current even after the charge voltage reaches an appropriate level. If it is not charged, it can not be fully charged. Therefore, when the charging voltage of the super capacitor 100 is insufficient, the power supply unit 71 protects the circuit by the constant current charging, and when the voltage reaches an appropriate level, the full voltage is charged by the constant voltage charging.

The charging light emitting diode 73 displays a charging state in which power is supplied from the power supply unit 71 to the super capacitor 100. In this case, the charging LED 73 may be installed between the probe substrate 60 and the power supply unit 71. A resistor R1 corresponding to the driving voltage of the charging LED 73 is connected on a wire connecting the charging LED 73 and the power supply 71.

The discharge light emitting diode 75 is supplied with power from the super capacitor 100 through the probe substrate 60 in which the probe pin 18 is in contact with the super capacitor 100 to discharge the super capacitor 100 and to discharge the super capacitor 100. Display. A resistor R2 corresponding to the driving operation of the discharge LED 75 is connected on the wiring connecting the discharge LED 75 and the probe substrate 60.

The optical sensors 77 and 78 detect the brightness of the light emitted from the charging LED 73 and the discharge LED 75 and transmit the detected brightness to the controller 79. In this case, the optical sensors 77 and 78 may include a first optical sensor 77 installed adjacent to the charging LED 73 and a second optical sensor 78 installed adjacent to the discharge LED 75. Include.

In addition, the controller 79 is a processor that performs the overall control operation of the test apparatus 200, and controls the charge / discharge test of the super capacitor 100 connected to the probe substrate 60. That is, the control unit 79 may charge the probe substrate 60 and the power supply unit 71 when the super capacitor 100 is charged with the probe pin 63 of the probe substrate 60 in contact with the super capacitor 100. ). The controller 79 connects the probe substrate 60 and the discharge light emitting diode 75 to discharge the supercapacitor 100 to perform a charge / discharge test on the supercapacitor 100. The controller 79 calculates the charge / discharge amount from the intensity of the brightness received from the optical sensors 77 and 78 to perform the charge / discharge test on the super capacitor 100.

The controller 79 may include a relay 72 and a controller 74, and may further include a timer 76. The relay 72 switches the connection between the probe substrate 60 and the power supply 71 and the connection between the probe substrate 60 and the light emitting diode 75 for discharge. The controller 74 switches the connection state of the relay 72 and performs a charge / discharge test of the super capacitor 100.

In this case, the timer 76 provides time information for switching the connection state of the relay 72. The controller 74 switches the connection state of the relay 72 according to the time information of the timer 76, and performs the charge / discharge test of the super capacitor 100.

In addition, the controller 74 controls the amount of charge and discharge calculated from the intensity of the brightness received from the optical sensors 77 and 78, the amount of power supplied from the power supply 71 during charging, and the power output from the super capacitor 100 when discharged. The amount of charge and discharge of the super capacitor 100 may be calculated by reflecting the output amount. For example, when the charge amount is calculated, the charge amount of the supercapacitor 100 may be calculated by giving a weight to one of the charge amount and the power supply amount calculated from the brightness sensor sensed by the first optical sensor 77. In addition, when calculating the discharge amount, the discharge amount of the supercapacitor may be calculated by giving a weight to one of the discharge amount and the power output amount calculated from the intensity of the brightness detected by the second optical sensor 78. In the present embodiment, an example of calculating the charge and discharge amount using the weight is disclosed, but the charge and discharge amount may be calculated by arithmetic average.

Meanwhile, the charging LED 73 is connected between the relay 72 and the power supply 71. In addition, the discharge LED 75 is connected to the probe substrate 60 via a relay 72.

As described above, the test apparatus 200 according to the present exemplary embodiment may test the plurality of supercapacitors 100 in a batch using the probe substrate 60 and the tray 50.

In addition, since the test apparatus 200 according to the present exemplary embodiment includes the charging light emitting diode 73 and the discharging light emitting diode 75, the light emitting diodes 73 and 75 during the charge / discharge test process for the supercapacitor 100. ) Can be easily checked whether or not the on / off state of the supercapacitor 100 is turned on.

In addition, the test apparatus 200 according to the present exemplary embodiment may test the charge / discharge characteristics of the supercapacitor 100 by measuring the charge / discharge amount in the charge / discharge test process of the supercapacitor 100. That is, the test apparatus 200 may test the charge / discharge characteristics of the supercapacitor 100 using the charge / discharge amount calculated from the intensity of the brightness received from the optical sensors 77 and 78. Compared to simply testing the charge / discharge characteristics of the supercapacitor through the power supply amount and the power output amount, the charge / discharge amount calculated from the intensity of the brightness input from the optical sensors 77 and 78 is used to more accurately determine the supercapacitor 100. Charge and discharge characteristics can be tested.

On the other hand, the embodiments disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: wiring board
18: External low speed pad
20: cell
40: lead
50 tray
51: storage space
60: probe substrate
63: probe pin
71: power supply
72: relay
73: light emitting diode for charging
74: controller
75: discharge light emitting diode
76: timer
77 light sensor
79: control unit
100: Super Capacitor
200: test device

Claims (6)

A probe substrate on which probe pins are formed to contact external connection pads of a chip type super capacitor housed in a tray;
A power supply unit configured to charge power to the super capacitor by supplying power to the probe substrate having a probe pin contacted with the super capacitor;
A charging light emitting diode displaying a charging state in which power is supplied from the power supply unit to the super capacitor;
A discharge light emitting diode configured to discharge power of the super capacitor by receiving power from the super capacitor through the probe substrate having a probe pin in contact with the super capacitor, and to display a discharge state;
An optical sensor detecting brightness of light emitted from the rechargeable light emitting diode and the discharge light emitting diode;
When the probe pin of the probe substrate is in contact with the super capacitor, the probe substrate and the power supply unit are connected when power is supplied to the super capacitor, and when the super capacitor is discharged, the probe substrate and the discharge A controller which connects a light emitting diode and calculates a charge / discharge amount from the intensity of brightness received from the optical sensor to perform a charge / discharge test on the supercapacitor;
Test device for a chip-type super capacitor, characterized in that it comprises a. The apparatus of claim 1,
Calculating the charge / discharge amount of the supercapacitor by reflecting the charge / discharge amount calculated from the intensity of the brightness received from the optical sensor, the power supply amount supplied from the power supply unit during charging, and the power output amount output from the supercapacitor during discharge. A chip type super capacitor test device. The apparatus of claim 1,
A relay for switching the connection between the probe substrate and the power supply and the connection between the probe substrate and the light emitting diode for discharge;
A controller for switching the connection state of the relay;
Test device for a chip-type super capacitor, characterized in that it comprises a. The apparatus of claim 3,
And a timer for providing time information for switching the connection state of the relay.
And the controller switches the connection state of the relay according to the time information of the timer. The method of claim 1, wherein the charging light emitting diode
The test device of the chip type super capacitor, characterized in that installed between the control unit and the power supply. The method of claim 1, wherein the power supply unit,
And after charging is started by supplying a constant current power to the supercapacitor, when the predetermined level is reached, supplying a constant voltage power to the supercapacitor to fill the supercapacitor.

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