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KR101162543B1 - Method of manufacturing stacking type polishing and cutting tool - Google Patents

Method of manufacturing stacking type polishing and cutting tool Download PDF

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KR101162543B1
KR101162543B1 KR1020110043945A KR20110043945A KR101162543B1 KR 101162543 B1 KR101162543 B1 KR 101162543B1 KR 1020110043945 A KR1020110043945 A KR 1020110043945A KR 20110043945 A KR20110043945 A KR 20110043945A KR 101162543 B1 KR101162543 B1 KR 101162543B1
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polishing
abrasive
abrasive grains
manufacturing
layers
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조희철
윤영세
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윤영세
조희철
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P5/00Setting gems or the like on metal parts, e.g. diamonds on tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

본 발명은 연마 및 절삭 공구의 제조방법에 관한 것으로, 보다 상세하게는 다수의 단층을 여러층으로 적층함으로써 복수 층의 연마층을 갖는 연마 및 절삭 공구의 제조방법에 관한 것이다.
본 발명에 따른 연마 및 절삭 공구 제조방법은 메쉬망 형태의 금속 베이스 상에 연마지립을 규칙 또는 불규칙하게 배열하는 연마지립 배치 단계; 상기 베이스 상에 배치된 상기 연마지립을 융착하여 연마층을 제조하는 연마층 제조 단계; 상기 연마층을 복수 층으로 적층하며, 각각의 상기 연마층 사이에 가압 성형된 판재 형태의 금속 분말 성형체를 배치하는 적층 단계; 및 적층된 상기 연마층을 가압 소결하여 연마부를 제조하는 연마부 제조 단계;를 포함하여 구성된다.
The present invention relates to a method of manufacturing a polishing and cutting tool, and more particularly, to a method of manufacturing a polishing and cutting tool having a plurality of layers of polishing layers by laminating a plurality of single layers in multiple layers.
Polishing and cutting tool manufacturing method according to the present invention comprises the abrasive grain arrangement step of arranging abrasive grains on a metal base in the form of a mesh net or irregularly; An abrasive layer manufacturing step of manufacturing an abrasive layer by fusing the abrasive grains disposed on the base; A laminating step of laminating the abrasive layer in a plurality of layers and disposing a metal powder compact in the form of a press-formed plate between each of the abrasive layers; And a polishing unit manufacturing step of manufacturing the polishing unit by pressure sintering the stacked polishing layers.

Description

적층식 연마 및 절삭 공구 제조방법{METHOD OF MANUFACTURING STACKING TYPE POLISHING AND CUTTING TOOL}METHODS OF MANUFACTURING STACKING TYPE POLISHING AND CUTTING TOOL}

본 발명은 연마 및 절삭 공구 제조방법에 관한 것으로, 보다 상세하게는 단층의 연마층을 여러층 적층함으로써 복수 층의 연마층을 갖는 연마 및 절삭 공구 제조방법에 관한 것이다.
The present invention relates to a polishing and cutting tool manufacturing method, and more particularly, to a polishing and cutting tool manufacturing method having a plurality of polishing layers by stacking a single layer of a polishing layer.

일반적으로 다이아몬드 전착, 융착, 및 세그먼트 타입 공구의 경우 직접 피삭재의 가공(연마, 절단)에 관여하는 다이아몬드 지립의 수명 연장과 연마, 절삭 성능의 향상에 관해 많은 노력과 연구가 진행되어져 왔다.In general, in the case of diamond electrodeposition, fusion, and segment type tools, much effort and research has been conducted on the extension of the life of the abrasive grains involved in the processing (grinding, cutting), grinding, and improvement of cutting performance.

전착공구의 경우 도 1에 도시된 바와 같이 샹크(10) 위에 니켈(Ni) 도금층(30)을 형성하여 연마지립(20)을 기계적으로 구속하여 피삭재 가공 중 연마지립이 이탈되지 않도록 하는 방식으로 제조되고, 융착공구의 경우 도 2에 도시된 바와 같이 샹크(10)에 본딩재(40)와 연마지립을 도포한 후 본딩재(40)의 융점 이상으로 가열하여 본딩재(40)와 연마지립(20) 간 화학적 결합을 생성시켜 피삭재 가공 중 연마지립의 이탈을 방지하는 방식으로 제조된다.In the case of the electrodeposition tool, as shown in FIG. 1, a nickel (Ni) plating layer 30 is formed on the shank 10 to mechanically restrain the abrasive grains 20 so as to prevent the abrasive grains from leaving during processing of the workpiece. In the case of a fusion tool, as shown in FIG. 2, the bonding material 40 and the abrasive grains are applied to the shank 10, and then the bonding material 40 and the abrasive grains are heated by heating above the melting point of the bonding material 40. 20) It is produced in such a way as to produce chemical bonds between the particles to prevent the removal of abrasive grains during workpiece processing.

또한, 세그먼트 타입 공구의 경우, 도 3에 도시된 바와 같이 연마지립(20)과 여러가지 금속분말을 균일하게 혼합하여 가열 가압, 소결함으로써 기계적 및 금속간 결합을 생성시켜 피삭재 가공 중 연마지립의 이탈을 방지하는 단층의 세그먼트 팁(50)을 샹크(10)에 용접하는 방식으로 제조된다.In addition, in the case of the segment type tool, as shown in FIG. 3, the abrasive grains 20 and various metal powders are uniformly mixed and heated, pressurized, and sintered to generate mechanical and intermetallic bonds, thereby eliminating the abrasive grains during machining. It is manufactured by welding a single-layered segment tip 50 to the shank 10.

그러나, 이와 같은 일반적인 전착 또는 융착에 의한 단층의 연마지립을 갖는 연마공구의 경우 피삭재의 가공에 직접 관여하는 1층의 연마지립이 가공 중 파손, 이탈 등의 원인으로 소실되는 경우 연마공구 자체가 수명을 다하여 사용하지 못하게 된다는 문제가 있다. 또한, 세그먼트 타입의 단층의 세그먼트 공구는 공구의 수명이 절삭 및 연마의 조건에 따라 일정하지 않으며, 절삭이 균일하게 되지 못하는 문제점이 있다.
However, in the case of an abrasive tool having a single layer of abrasive grains by such general electrodeposition or fusion, the abrasive tool itself has a lifespan when one layer of abrasive grains directly involved in the processing of the workpiece is lost due to breakage or separation during processing. There is a problem that can not be used to. In addition, the segment type single layer segment tool has a problem that the tool life is not constant according to the conditions of cutting and polishing, and the cutting is not uniform.

본 발명은 상술한 문제점을 해결하기 위해 안출된 것으로, 본 발명의 목적은 단층의 연마지립 층을 여러층 적층하여 복수 층의 연마지립 층을 형성되게 함으로써, 최외각층의 연마지립이 파손, 이탈된 경우 그 하부층에 위치하는 연마지립이 그 역할을 대신할 수 있도록 하여 연마 및 절삭 공구의 수명을 연장시키는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to stack a plurality of abrasive grain layers of a single layer to form a plurality of abrasive grain layers, whereby the abrasive grains of the outermost layer are broken and dislodged. In this case, the abrasive grains located in the lower layer may be substituted for the role thereof, thereby extending the life of the polishing and cutting tools.

또한, 본 발명은 연마공구의 절삭, 연마 성능 등 가공 효율을 향상시키는 것을 또 다른 목적으로 한다.
Another object of the present invention is to improve processing efficiency, such as cutting and polishing performance of an abrasive tool.

본 발명은 메쉬망 형태의 금속 베이스 상에 연마지립을 규칙 또는 불규칙하게 배열하는 연마지립 배치 단계; 상기 베이스 상에 배치된 상기 연마지립을 융착하여 연마층을 제조하는 연마층 제조 단계; 상기 연마층을 복수 층으로 적층하며, 각각의 상기 연마층 사이에 가압 성형된 판재 형태의 금속 분말 성형체를 배치하는 적층 단계; 및 적층된 상기 연마층을 가압 소결하여 연마부를 제조하는 연마부 제조 단계;를 포함하는 것을 특징으로 하는 적층식 연마 및 절삭 공구 제조방법을 제공한다.
여기서, 상기 연마지립의 규칙 또는 불규칙 배열은 단위 연마지립들이 각 각 이격되어 규칙 또는 불규칙 배열되거나, 일정 개수가 모인 복수 개의 연마지립 단들이 각 각 이격되어 규칙 또는 불규칙 배열될 수 있다.
그리고, 상기 연마지립은 다이아몬드 지립, 텅스텐 카바이드 지립, 알루미나 지립, 실리콘 카바이드 지립, CBN(Cubic Boron Nitride) 지립, 및 실리콘 나이트라이드 지립 중 적어도 하나를 포함할 수 있다.
The present invention provides a method for arranging abrasive grains, wherein the abrasive grains are regularly or irregularly arranged on a metal base in the form of a mesh network; An abrasive layer manufacturing step of manufacturing an abrasive layer by fusing the abrasive grains disposed on the base; A laminating step of laminating the abrasive layer in a plurality of layers and disposing a metal powder compact in the form of a press-formed plate between each of the abrasive layers; And a polishing unit manufacturing step of manufacturing the polishing unit by pressurizing and sintering the stacked polishing layers.
Here, the ruled or irregular arrangement of the abrasive grains may be a regular or irregular arrangement of the unit abrasive grains are spaced apart from each other, or a plurality of abrasive abrasive grains of a certain number may be arranged in a regular or irregular arrangement.
The abrasive grains may include at least one of diamond abrasive grains, tungsten carbide abrasive grains, alumina abrasive grains, silicon carbide abrasive grains, cubic boron nitride (CBN) abrasive grains, and silicon nitride abrasive grains.

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본 발명에 의하면, 연마층이 복수 층으로 구성됨으로써, 피삭재의 연마 또는 절삭 등의 가공 중 최외곽 층의 연마지립이 소실되더라고 그 하부층에 있는 연마지립에 의해 가공이 가능하여 연마 및 절삭 공구의 수명을 연장하는 효과가 있다. According to the present invention, since the abrasive layer is composed of a plurality of layers, the abrasive grains in the outermost layer are lost during the processing such as grinding or cutting of the workpiece, and can be processed by the abrasive grains in the lower layer. It has the effect of extending the life.

또한, 연마지립이 단층인 경우 연마지립이 소실되면 가공능력이 저하되어 가공 효율이 떨어지는 것과 달리 본 발명에 따른 복수 층의 연마지립을 갖는 연마공구는 연마지립이 소실되더라도 그 하부층의 연마지립에 의해 피삭재의 가공이 수행되어 연마, 절삭 등 가공 효율을 향상시킬 수 있다.
In addition, in the case where the abrasive grain is a single layer, when the abrasive grains are lost, the processing ability is lowered and the processing efficiency is lowered. Machining of the workpiece may be performed to improve processing efficiency such as polishing and cutting.

도 1은 전착법에 의해 지립을 샹크에 부착시키는 개략도.
도 2는 융착법에 의해 지립을 샹크에 부착시키는 개략도.
도 3은 소결법에 의해 세그먼트 팁을 샹크에 부착시키는 개략도.
도 4은 본 발명의 일 실시예에 따른 적층식 연마 및 절삭 공구를 도시한 개략도.
도 5는 연마지립의 규칙적인 패턴화를 개략적으로 나타낸 개략도.
도 6은 본 발명의 일 실시예에 따른 복수 층의 연마층을 갖는 연마부가 수직방향의 샹크에 결합된 것을 나타내는 개략도.
도 7은 본 발명의 일 실시예에 따른 적층식 연마 및 절삭 공구의 제조방법을 개략적으로 나타낸 흐름도.
1 is a schematic diagram of attaching abrasive grains to a shank by electrodeposition;
2 is a schematic diagram of attaching an abrasive grain to a shank by fusion welding;
3 is a schematic diagram of attaching a segment tip to a shank by a sintering method;
4 is a schematic diagram illustrating a laminated polishing and cutting tool in accordance with an embodiment of the present invention.
5 is a schematic diagram schematically showing regular patterning of abrasive grains.
6 is a schematic view showing that a polishing unit having a plurality of polishing layers according to an embodiment of the present invention is coupled to a shank in a vertical direction.
7 is a flow chart schematically showing a method of manufacturing a laminated polishing and cutting tool according to an embodiment of the present invention.

이하, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시예에 대하여 첨부한 도면을 참고로 하여 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 명세서 전체를 통하여 유사한 부분에 대해서는 동일한 도면 부호를 붙였다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Like parts are designated by like reference numerals throughout the specification.

그러면, 본 발명에 따른 연마 및 절삭 공구의 제조방법에 대하여 도면을 참조하여 설명하기로 한다.Next, a method of manufacturing the polishing and cutting tool according to the present invention will be described with reference to the drawings.

도 4는 본 발명의 일 실시예에 따른 복수 층의 연마층을 갖는 적층식 연마 및 절삭 공구를 도시한 개략도이다.4 is a schematic diagram illustrating a laminated polishing and cutting tool having a plurality of abrasive layers in accordance with one embodiment of the present invention.

도 4를 참조하면 본 발명에 따른 적층식 연마 및 절삭 공구는 베이스 상에 연마지립이 규칙 또는 불규칙 배열되어 전착, 융착 또는 수지 접합 중 어느 하나의 방법으로 부착된 연마층이 복수 층으로 적층되고 각각의 연마층이 본딩재에 의해 결합된 연마부 및, 연마부가 부착된 샹크를 포함하여 구성될 수 있다.Referring to FIG. 4, in the stacked polishing and cutting tool according to the present invention, abrasive grains are regularly or irregularly arranged on a base, and an abrasive layer attached by any one of electrodeposition, fusion, or resin bonding is laminated in a plurality of layers, respectively. The polishing layer may comprise a polishing portion bonded by a bonding material and a shank to which the polishing portion is attached.

이와 같이 베이스(110) 상에 연마지립(120)이 부착된 연마층이 복수 층으로 적층되어 구성됨으로써, 연마공구에 의한 피삭재의 연마 또는 절삭 등의 가공 중 최외곽 층의 연마지립이 소실 되더라도 그 하부 층의 연마지립에 의해 가공을 계속 수행할 수 있으므로 단층의 연마지립이 부착된 연마공구에 비해 오래 사용할 수 있고, 연마, 절삭 등의 가공 효율도 향상시킬 수 있다.As such, the abrasive layer having the abrasive grains 120 attached to the base 110 is laminated in a plurality of layers, so that even when the abrasive grains of the outermost layer are lost during the grinding or cutting of the workpiece by the abrasive tool, Processing can be continued by the abrasive grains of the lower layer, so that it can be used longer than the abrasive tool with a single abrasive grain, and the processing efficiency such as polishing and cutting can be improved.

베이스(110)는 그 상면에 연마지립(120)이 부착될 수 있도록 하는 기재 역할을 수행하는 것으로, 금속 메쉬망으로 이루어질 수 있다.The base 110 serves as a substrate for attaching the abrasive grain 120 to the upper surface thereof, and may be formed of a metal mesh network.

연마지립(120)은 피삭재의 가공에 직접 관여하는 연마입자로서 다이아몬드 지립, 텅스텐 카바이드 지립, 알루미나 지립, 실리콘 카바이드 지립, CBN(Cubic Boron Nitride) 지립, 및 실리콘 나이트라이드 지립 등 다양한 연마지립이 사용될 수 있다.The abrasive grains 120 are abrasive grains that are directly involved in the processing of the workpiece, and various abrasive grains such as diamond abrasives, tungsten carbide abrasives, alumina abrasive grains, silicon carbide abrasive grains, CBN (Cubic Boron Nitride) abrasive grains, and silicon nitride abrasive grains can be used. have.

연마층은 페이스트 형태의 결합재(130)를 통해 융착되어 이루어질 수 있다.The polishing layer may be fused through the binder 130 in the form of a paste.

이때 베이스에 부착되는 연마지립들은 규칙 또는 불규칙하게 배열될 수 있고, 이와 같은 규칙 또는 불규칙 배열은 단위 연마지립들이 각 각 이격되어 규칙 또는 불규칙 배열되거나, 일정 개수가 모인 복수 개의 연마지립 단들이 각 각 이격되어 규칙 또는 불규칙 배열됨으로써 형성된다.At this time, the abrasive grains attached to the base may be arranged in a regular or irregular manner, such a rule or irregular arrangement is a unit or abrasive grains are arranged in a regular or irregularly spaced apart, or a plurality of abrasive abrasive grains of a certain number each It is formed by spaced apart regular or irregular arrangement.

도 5는 연마지립의 규칙적인 패턴화를 개략적으로 나타낸 개략도이다.5 is a schematic diagram schematically showing regular patterning of abrasive grains.

본 발명에서 베이스(110) 상에 부착된 연마지립(120)은 규칙 또는 불규칙적인 패턴 형태로 배열될 수 있다. 즉, 도 4에 도시된 바와 같이 베이스(110) 상에 마스킹(150) 등의 수단을 이용하여 연마지립이 규칙 혹은 불규칙적인 연속 또는 불연속 패턴을 갖도록 한 후 전착, 융착, 수지 접합 등의 방법으로 베이스에 연마지립을 부착하여 연마층을 형성할 수 있다.In the present invention, the abrasive grains 120 attached to the base 110 may be arranged in a regular or irregular pattern form. That is, as illustrated in FIG. 4, the abrasive grains have a regular or irregular continuous or discontinuous pattern by means of a masking 150 or the like on the base 110, and then by electrodeposition, fusion, and resin bonding. The abrasive grains may be attached to the base to form an abrasive layer.

이에 의해, 세그먼트 타입의 연마공구가 다이아몬드가 무질서하게 배열되어 세그먼트마다 연마 및 절삭 성능의 편차를 갖는 것과 달리 본 발명에 따른 연마 및 절삭 공구는 균일한 연마 및 절삭 성능을 가지면서 또한 가공 효율을 향상 시킬 수 있다.As a result, unlike the segment type abrasive tool, the diamonds are arranged randomly so that the grinding and cutting performance of each segment is different, the grinding and cutting tool according to the present invention has uniform polishing and cutting performance and also improves the processing efficiency. You can.

또한, 이 마스킹 등의 방법에 의한 패턴화를 통해 베이스(110) 상에 부착되는 연마지립(120)을 일정한 개수의 연마지립이 일정한 간격을 갖도록 배열되게 배치 함으로써, 연마공구의 연마 및 절삭 가공 효율을 최대화 시킬 수 있을 것이다.In addition, by arranging the abrasive grains 120 to be attached on the base 110 through patterning by masking or the like, such that a predetermined number of abrasive grains are arranged at regular intervals, thereby improving the polishing and cutting efficiency of the abrasive tool. Will be able to maximize.

연마부(100)는 베이스(110) 상에 연마지립(120)이 부착된 연마층이 복수 층으로 적층되고 결합되어 구성된다. 즉 베이스 상에 연마지립이 전착된 전착 연마층이 복수 층으로 적층되거나, 베이스 상에 연마지립이 융착된 융착 연마층이 복수 층으로 적층되거나, 베이스 상에 연마지립이 수지 접합된 수지 접합 연마층이 복수 층으로 적층되어 구성될 수 있다. The polishing unit 100 is configured by stacking and bonding a plurality of polishing layers having abrasive grains 120 attached on the base 110 in a plurality of layers. That is, the electrodeposited abrasive layer in which abrasive grains are electrodeposited on the base is laminated in plural layers, the fused abrasive layer in which abrasive grains are fused on the base is laminated in plural layers, or the resin bonded abrasive layer in which abrasive grains are resin bonded on the base. It can be laminated | stacked in multiple layers.

그리고, 연마층 적층시 각 연마층의 연마지립간 위치를 교차 또는 동일하게 함으로써 연마공구의 연마 및 절삭 효율을 높일 수 있을 것이다.In addition, the polishing and cutting efficiency of the polishing tool may be increased by crossing or making the positions between the abrasive grains of each polishing layer at the time of laminating the polishing layer.

삭제delete

각 연마층간의 상호 결합은 적층된 연마층 사이에 판재형태의 가압 성형된 금속분말 성형체(미도시)를 삽입한 후 가압 소결함으로써 결합될 수도 있다.The mutual bonding between the polishing layers may be combined by pressing and sintering a press-formed metal powder compact (not shown) in the form of a plate between the stacked polishing layers.

삭제delete

이와 같이 각 연마층이 견고히 결합됨으로써 연마 가공시 연마층에 작용되는 힘에 의해 각 연마층이 분리되지 않을 것이다. As such, each abrasive layer is firmly bonded so that each abrasive layer will not be separated by a force acting on the abrasive layer during polishing.

본 발명의 연마층은 연마 및 절삭 공구의 사용용도에 따른 여러가지 형상을 갖는 샹크와 결합이 용이하도록 그 형상을 가공하여 적층?결합한 후 샹크와 결합될 수 있고, 도 5은 본 발명에 따른 복수 층의 연마층을 갖는 연마부가 수직된 샹크(210)에 결합되어 사용되는 것을 나타내는 개략도이다.The abrasive layer of the present invention can be combined with the shank after laminating and combining the shape by processing the shape to facilitate bonding with the shank having various shapes according to the use of the polishing and cutting tools, Figure 5 is a plurality of layers according to the present invention It is a schematic diagram showing that a polishing portion having a polishing layer of is used in conjunction with a vertical shank 210.

또한, 본 발명의 일 실시예에 따른 연마 및 절삭 공구 제조방법은 메쉬망 형태의 금속 베이스 상에 연마지립을 규칙 또는 불규칙하게 배열하는 연마지립 배치 단계, 베이스 상에 배치된 연마지립을 융착하여 연마층을 제조하는 연마층 제조 단계, 연마층을 복수 층으로 적층하며, 각각의 연마층 사이에 가압 성형된 판재 형태의 금속 분말 성형체를 배치하는 적층 단계, 및 적층된 연마층을 가압 소결하여 연마부를 제조하는 연마부 제조 단계를 포함하는 포함하여 제조될 수 있다.In addition, the polishing and cutting tool manufacturing method according to an embodiment of the present invention is a polishing abrasive grain arrangement step of arranging abrasive grains on a metal base in the form of a mesh net or irregularly, fusion polishing abrasive grains disposed on the base A polishing layer manufacturing step of manufacturing a layer, a laminating step of laminating the polishing layer in a plurality of layers, and placing a metal powder molded body in the form of a press-formed plate between each polishing layer, and pressure-sintering of the laminated polishing layer It may be prepared including a manufacturing step of manufacturing a polishing portion.

도 7은 본 발명의 일 실시예에 따른 복수 층의 연마층을 갖는 연마 및 절삭 공구의 제조방법을 개략적으로 나타낸 흐름도이다.7 is a flow chart schematically illustrating a method of manufacturing a polishing and cutting tool having a plurality of polishing layers according to an embodiment of the present invention.

도 7을 참조하면, 복수개의 베이스 상면에 연마지립을 융착하는 방법에 의하여 안착시킨다.Referring to Figure 7, it is seated by a method of fusion bonding abrasive grains on the plurality of base upper surface.

이에 의해 제조된 복수개의 베이스를 샹크의 형상에 적합하도록 절단한 후, 각 베이스를 적층하고 결합한다. 이때 적층된 각 베이스 간 결합은 적층된 베이스 사이에 판재형태의 가압 성형된 금속분말 성형체를 삽입한 후 가압 소결함으로써 이루어 질 것이다.The plurality of bases thus produced are cut to fit the shape of the shank, and then the bases are laminated and joined. In this case, the bonding between the stacked bases may be performed by inserting a press-formed metal powder molded body in the form of a plate between the stacked bases and then pressure sintering the molded body.

이후, 이 적층되어 결합된 베이스를 샹크에 부착함으로써 복수층의 연마층의 연마지석을 갖는 연마 및 절삭 공구를 제조할 수 있다.Subsequently, by attaching the laminated and bonded base to the shank, it is possible to manufacture a polishing and cutting tool having abrasive grinds of a plurality of abrasive layers.

이상에서 본 발명의 바람직한 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, Of the right.

10 : 샹크 20 : 연마지립
30 : 니켈 도금층 40 : 본딩재
50 : 세그먼트 팁 100 : 연마부
110 : 베이스 120 : 연마지립
130 : 결합재 140 : 마스킹
150 : 충진재 200 : 샹크
210 : 수직방향 샹크
10: shank 20: abrasive grain
30 nickel plated layer 40 bonding material
50: segment tip 100: abrasive
110: base 120: abrasive grain
130: binder 140: masking
150: filler 200: shank
210: vertical shank

Claims (5)

메쉬망 형태의 금속 베이스 상에 연마지립을 규칙 또는 불규칙하게 배열하는 연마지립 배치 단계;
상기 베이스 상에 배치된 상기 연마지립을 융착하여 연마층을 제조하는 연마층 제조 단계;
상기 연마층을 복수 층으로 적층하되, 각각의 상기 연마층 사이에 가압 성형된 판재 형태의 금속 분말 성형체를 배치하는 적층 단계; 및
적층된 상기 연마층을 가압 소결하여 연마부를 제조하는 연마부 제조 단계;를 포함하고,
상기 연마지립은 다이아몬드 지립 또는 CBN(Cubic Boron Nitride) 지립인 것을 특징으로 하는 적층식 연마 및 절삭 공구 제조방법.
An abrasive grain arrangement step of regularly or irregularly arranging abrasive grains on a metal base in the form of a mesh network;
An abrasive layer manufacturing step of manufacturing an abrasive layer by fusing the abrasive grains disposed on the base;
Laminating the polishing layer in a plurality of layers, and disposing a metal powder compact in the form of a plate material press-molded between each polishing layer; And
And a polishing unit manufacturing step of manufacturing the polishing unit by pressure sintering the stacked polishing layers.
The abrasive grains are diamond abrasive grains or CBN (Cubic Boron Nitride) abrasive grains, characterized in that the grinding and cutting tool manufacturing method.
삭제delete 삭제delete 제1항에 있어서,
상기 연마지립의 규칙 또는 불규칙 배열은, 단위 연마지립들이 각각 이격되어 규칙 또는 불규칙 배열되거나, 일정 개수가 모인 복수 개의 연마지립 단들이 각각 이격되어 규칙 또는 불규칙 배열되는 것을 특징으로 하는 적층식 연마 및 절삭 공구 제조방법.
The method of claim 1,
The ruled or irregular arrangement of the abrasive grains is a lamination polishing and cutting, characterized in that the unit abrasive grains are spaced apart or arranged in a regular or irregular, or a plurality of abrasive abrasive grains of a certain number are arranged in a regular or irregular spaced apart Tool manufacturing method.
삭제delete
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491897B1 (en) * 2013-02-19 2015-02-12 인하대학교 산학협력단 Abrasive tool
WO2019139826A1 (en) * 2018-01-10 2019-07-18 General Electric Company Mineral grinding articles having silicon carbide
KR20200046447A (en) * 2018-10-24 2020-05-07 김태수 Cutting tip and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002018732A (en) * 2000-07-11 2002-01-22 Yasunaga Corp Lapping paper
JP2006527663A (en) * 2004-04-21 2006-12-07 エーワ ダイアモンド インダストリアル カンパニイリミテッド CUTTING TIP, CUTTING TIP MANUFACTURING METHOD, AND CUTTING TOOL

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002018732A (en) * 2000-07-11 2002-01-22 Yasunaga Corp Lapping paper
JP2006527663A (en) * 2004-04-21 2006-12-07 エーワ ダイアモンド インダストリアル カンパニイリミテッド CUTTING TIP, CUTTING TIP MANUFACTURING METHOD, AND CUTTING TOOL

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491897B1 (en) * 2013-02-19 2015-02-12 인하대학교 산학협력단 Abrasive tool
WO2019139826A1 (en) * 2018-01-10 2019-07-18 General Electric Company Mineral grinding articles having silicon carbide
KR20200046447A (en) * 2018-10-24 2020-05-07 김태수 Cutting tip and manufacturing method thereof
KR102229917B1 (en) * 2018-10-24 2021-03-22 김태수 Cutting tip and manufacturing method thereof

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