JP5566922B2 - Fixed abrasive wire and method for manufacturing the same - Google Patents

Description

  The present invention relates to a fixed abrasive wire used for slicing a crystalline material such as a solar cell, semiconductor silicon, a magnetic material, sapphire, and SiC, and a method for manufacturing the same.

  Conventionally, as a method for slicing solar cells and silicon for semiconductors, the most commonly used is the free abrasive grain method that mixes abrasive grains with the grinding fluid and supplies the slurry in a slurry form. There are problems such as a low processing speed, a large processing groove on the slurry supply side, and a large variation in wafer thickness. Then, as a wire saw with high cutting accuracy, for example, Patent Documents 1 to 3 propose a fixed abrasive wire for silicon slicing in which superabrasive grains such as diamond and CBN are fixed by electrodeposition or resin bonding. .

JP-A-9-150314 JP-A-11-245154 JP-A-11-320379

  The above-mentioned fixed abrasive wire fixed with superabrasive grains such as diamond and CBN can provide high cutting accuracy, but the superabrasive grains are very hard to wear, so the superabrasive grains are too densely attached around the wire. On the contrary, since there is a problem that the sharpness is deteriorated, conventionally, the wire is fixed only in an area of about 20% to 30% of the surface area of the wire. As shown in FIG. Between the upper diamond abrasive grains 22, only the binder 23 is exposed and flat.

  Therefore, in the conventional fixed abrasive wire 20 to which the conventional diamond abrasive grains are fixed, the grinding liquid is difficult to be held on the surface of the fixed abrasive wire 20, and when the slicing process is performed using the fixed abrasive wire 20, There is a problem that the supply is not sufficiently performed and the life of the fixed abrasive wire 20 is shortened.

  Therefore, in the present invention, in a fixed abrasive wire in which superabrasive grains such as diamond and CBN are fixed, an object of the present invention is to obtain a long-life fixed abrasive wire capable of sufficiently taking in a grinding liquid during slicing. And

  The fixed abrasive wire of the present invention is a fixed abrasive wire in which abrasive grains are fixed on a wire core via a binder, and the abrasive grains are superabrasive having a cross-sectional aspect ratio of 1.2 to 1.6. These are grains and general abrasive grains, which are fixed by protruding from the short side of the cross section to the surface of the binder. In the fixed abrasive wire of the present invention, the long side of the cross section is the protruding height direction of the super abrasive grains and the general abrasive grains, and the protruding height of the super abrasive grains and the general abrasive grains is large. In this fixed abrasive wire, general abrasive grains are arranged between the superabrasive grains with the respective protruding heights increased, and it is possible to take in the grinding liquid between the superabrasive grains and the general abrasive grains. Since the gap is formed, the grinding liquid is held on the surface of the fixed abrasive wire during slicing.

In the present invention, the superabrasive grains are abrasive grains having high hardness (Knoop hardness of 4000 or more) such as diamond (Knoop hardness of 7000 to 8000) and CBN (Knoop hardness of 4700). On the other hand, the general abrasive grains have low hardness (knoop hardness 1250) such as alumina-based abrasive grains (alundum), silicon carbide-based abrasive grains (carborundum) and boron carbide-based abrasive grains excluding these super abrasive grains. ~ 2500) abrasive grains. As alumina-based abrasive grains, A, GA, KA, WA, PA, SA, 6A, VA, and the like can be used. C, GC, or the like can be used as the silicon carbide-based abrasive. B ₄ C or the like can be used as the boron carbide-based abrasive.

  In the fixed abrasive wire of the present invention, it is desirable that 50% or more of the fixed abrasive grains are superabrasive grains. Thereby, while taking advantage of the high cutting accuracy of the superabrasive grains, the grinding liquid is efficiently taken into the gap formed between the superabrasive grains and the general abrasive grains, and the circulation of the grinding liquid is improved. A reduction in sharpness is prevented. In addition, when there are more ratios of a general abrasive than this range, since more will be cut by a general abrasive rather than a superabrasive, cutting accuracy will fall.

  Moreover, it is desirable that both the superabrasive grains and the general abrasive grains are fixed to 20% to 95%, more preferably 40% to 60%, of the surface area of the binder on the wire core. By fixing the abrasive grains to 20% to 95% of the surface area of the binder in both the superabrasive grains and the general abrasive grains, a sufficient gap as a path for the grinding liquid is secured on the surface of the binder, thereby circulating the grinding liquid. Therefore, the sharpness is prevented from being lowered. In particular, if it is fixed at 40% to 60%, the flow of the grinding fluid and the discharge of the chips are optimal, so that it is even better.

  Moreover, it is desirable that the general abrasive is 10% to 110% with respect to the particle size of the superabrasive grain. General abrasive grains are mainly used to form a gap for holding the grinding fluid between them and the super abrasive grains. Although it is good, since the hardness is lower than that of the superabrasive grains, there is little influence on the cutting accuracy as long as it is up to 110% of the superabrasive grain size. On the other hand, if the grain size of the general abrasive grains is less than 10% with respect to the grain size of the superabrasive grains, there is a possibility that the grinding fluid cannot be held between the superabrasive grains.

  The method for producing a fixed abrasive wire according to the present invention is a method for producing a fixed abrasive wire in which abrasive grains are fixed on a wire core wire via a binder, the binder being applied on the wire core wire, It includes projecting superabrasive grains having an aspect ratio of 1.2 to 1.6 and general abrasive grains from the short side of the cross section to the surface of the binder in a powder state.

  According to the method for producing a fixed abrasive wire of the present invention, diamond abrasive grains that fly by, for example, flying superabrasive grains having a cross-sectional aspect ratio of 1.2 to 1.6 and powders of general abrasive grains, and General abrasive grains are fixed to the surface of the binder with the short side of the cross section facing the surface of the binder, pierced from the short side of the cross section to the surface of the binder. As a result, the long side of the cross section is in the protruding height direction of the superabrasive grains and general abrasive grains, so that a fixed abrasive wire having a large protruding height of the superabrasive grains and general abrasive grains is obtained.

  In this fixed abrasive wire, general abrasive grains are arranged between the diamond abrasive grains with the respective protruding heights increased, and it is possible to take in the grinding liquid between the diamond abrasive grains and the general abrasive grains. Since the gap is formed, the grinding liquid is held on the surface of the fixed abrasive wire during slicing.

  When the aspect ratio is less than 1.2, the direction of the abrasive grains is difficult to change due to flight, and the directions of the abrasive grains are difficult to align. On the other hand, when the aspect ratio is more than 1.6, the abrasive grains are likely to be broken, and the life of the fixed abrasive wire may be shortened.

  Moreover, in the fixed abrasive wire manufactured by this method, since only the superabrasive grains and the general abrasive grains pierced on the surface of the binder are fixed, the abrasive grains do not overlap to form a plurality of layers. A fixed abrasive wire in which only one layer is fixed around the wire core wire is obtained. Also, in this fixed abrasive wire, superabrasive grains and general abrasive grains protrude from the short side of the cross section to the surface of the binder, so that a larger number of super abrasive grains than the case of protruding from the long side. A fixed abrasive wire in which abrasive grains and general abrasive grains are arranged around the wire core wire can be realized.

  Here, it is desirable that the diamond abrasive grains and the general abrasive grains fly by an electrostatic coating method. The diamond abrasive grains and the general abrasive grains that are negatively charged by the electrostatic coating method are caused to fly, whereby the diamond abrasive grains and the general abrasive grains are strongly attracted toward the binder on the wire core wire by electrostatic force. During this time, the diamond abrasive grains and the general abrasive grains pierce the binder surface from the short side of the cross section with the short side of the cross section facing the surface of the binder.

  Of the superabrasive grains and the general abrasive grains, at least the conductive superabrasive grains and the general abrasive grains are desirably coated with a non-conductive substance. Since conductive superabrasive grains and general abrasive grains are unstablely charged, by using those coated with a non-conductive substance, it becomes stable and negatively charged. It will be strongly drawn toward the binder on the line.

  In addition, superabrasive grains and general abrasive grains can fly in a mixed state and pierce the surface of the binder. After superabrasive grains fly and pierce the binder surface, It is also possible to fly the grains and pierce the surface of the binder.

  Moreover, it is desirable that the superabrasive grains and the general abrasive grains fly from a plurality of different directions with respect to the wire core to positions separated from each other. By making the wire core wire fly from a plurality of different directions, superabrasive grains and general abrasive grains can be projected evenly around the wire core line. In addition, by flying to positions away from each other, it is possible to prevent air interference to fly abrasive grains from each other's nozzles, and the direction of the abrasive grains from the short side of the cross section to the surface of the binder It can be aligned in the direction of protruding.

  According to the fixed abrasive wire in which superabrasive grains having a cross-sectional aspect ratio of 1.2 to 1.6 and general abrasive grains are fixed by protruding from the short side of the cross section to the surface of the binder, each protruding height The general abrasive grains are arranged between the superabrasive grains having a larger diameter, and a gap capable of taking in the grinding liquid is formed between the superabrasive grains and the general abrasive grains. When slicing is performed, high cutting accuracy of the superabrasive grains is obtained, and the grinding fluid is held on the surface of the fixed abrasive wire, so that the grinding fluid is sufficiently supplied to the grinding surface, The life of the fixed abrasive wire can be extended.

It is a longitudinal cross-sectional view of the fixed abrasive wire in embodiment of this invention. It is a cross-sectional view of the fixed abrasive wire in the embodiment of the present invention. It is the schematic which shows the spraying process of the superabrasive grain and general abrasive grain by an electrostatic coating method. A fixed abrasive wire in which the volume ratio of superabrasive grains and general abrasive grains is changed using superabrasive grains and general abrasive grains having cross-sectional aspect ratios of 1, 1.2, 1.4, 1.6, and 1.8 It is a figure which shows the graph which compared the dispersion | variation in the thickness in a wafer when a slice processing test was done by. The graph which compares the thickness variation in the wafer sliced by the fixed abrasive wire which changed the volume ratio of the superabrasive grain and the general abrasive grain using the superabrasive grain and the general abrasive grain whose cross-sectional aspect ratio is 1.4 FIG. It is a figure which shows the graph which compared the diameter before and behind use of the fixed abrasive wire which changed the volume ratio of a superabrasive grain and a general abrasive grain using the superabrasive grain and the general abrasive grain whose cross-sectional aspect ratio is 1.4. . It is a longitudinal cross-sectional view of the conventional fixed abrasive wire.

  FIG. 1 is a longitudinal sectional view of a fixed abrasive wire according to an embodiment of the present invention, and FIG. 2 is a transverse sectional view. As shown in FIGS. 1 and 2, in the fixed abrasive wire 1 according to the embodiment of the present invention, superabrasive grains 4 and general abrasive grains 5 are fixed on a wire core wire 2 via a binder (fixing material) 3. It is a thing. The wire core wire 2 is a wire such as a piano wire, a high tensile wire, or a high tensile strength non-metallic fiber wire (fiber), and has a wire diameter of φ10 μm to φ300 μm. In addition, although the cross-sectional shape of the wire core wire 2 is circular, it can also be made into a polygon.

The binder 3 is a U V curing resins of the adhesive. If a photo-curing resin such as UV curing resin is used, a drying step is not required, and a fixed abrasive wire can be obtained efficiently. With the coating of the wire core 2 above binder 3, by methods such as blow-out with or dipping. As the superabrasive grain 4, diamond or CBN is used. As the general abrasive 5, alumina-based abrasive (alundum), silicon carbide-based abrasive (carborundum), boron carbide-based abrasive, or the like is used.

  Superabrasive grains 4 and general abrasive grains 5 are those having an average grain diameter of 2 to 40 μm and a cross-sectional aspect ratio of 1.2 to 1.6. However, the grain size of the general abrasive grain 5 is 10% to 110% with respect to the grain size of the superabrasive grain 4. Here, the aspect ratio of the cross section is constituted by the longest side (long side a) and the shortest side (short side b) among the sides constituting the rectangular parallelepiped with the minimum volume surrounding the super abrasive grains 4 and the general abrasive grains 5. It is the ratio (long side a / short side b) of the long side a and the short side b of the cross section.

  When the superabrasive grains 4 and the general abrasive grains 5 having an aspect ratio of 1.2 to 1.6 in the cross section are blown toward the wire core wire 2 in a powder state by an electrostatic coating method or the like, The abrasive grains 4 and the general abrasive grains 5 are the surfaces of the binder 3 that have a smaller area of which the resistance is reduced, among the six faces constituting the rectangular parallelepiped with the minimum volume surrounding the super abrasive grains 4 and the general abrasive grains 5, respectively. To turn to. That is, the superabrasive grains 4 and the general abrasive grains 5 are arranged so that the short side b side of the cross section is directed to the surface of the binder 3 and the long side a side is aligned in the normal direction of the wire core wire 2 during each flight. It pierces the surface of the binder 3 from the short side b side of the cross section.

  The superabrasive grains 4 and the general abrasive grains 5 can be preliminarily mixed and pierced on the surface of the binder 3, or the superabrasive grains 4 can be pierced and pierced on the surface of the binder 3. Then, the general abrasive grains 5 can be caused to fly and pierce the surface of the binder 3. In any case, 50% or more of the fixed abrasive grains are superabrasive grains 4.

  And in this embodiment, the superabrasive grain 4 and the general abrasive grain 5 are made to fly by the electrostatic force by flying the superabrasive grain 4 and the general abrasive grain 5 negatively charged by the electrostatic coating method. It is strongly drawn toward the upper binder 3. The superabrasive grains 4 and the general abrasive grains 5 are pierced into the surface of the binder 3 from the short side b side of the cross section with the short side b side of the cross section facing the surface of the binder 3 during this period. Thereby, the superabrasive grain 4 and the general abrasive grain 5 can be arrange | positioned on the binder 3 so that the long side a side may become a protrusion height direction.

  Since the superabrasive grains 4 are conductive, charging becomes unstable, and therefore it is desirable to use those coated beforehand with a non-conductive substance. In addition, when using conductive abrasive grains, it is desirable to use those previously coated with a non-conductive substance for the same reason.

  FIG. 3 is a schematic view showing a spraying process of superabrasive grains 4 and general abrasive grains 5 by an electrostatic coating method. As shown in FIG. 3, in the step of spraying the superabrasive grains 4 and the general abrasive grains 5, the nozzles 10a and 10b of the electrostatic coating apparatus are disposed above and below the wire core wire 2 after the binder 3 (not shown) is applied. Are arranged at positions separated from each other, and the superabrasive grains 4 and the general abrasive grains 5 are caused to fly from different directions with respect to the moving wire core wire 2. In the illustrated example, the nozzles 10a and 10b fly the superabrasive grains 4 and the general abrasive grains 5 from positions different from each other by 180 ° with respect to the wire core wire 2 to positions separated from each other.

  Thus, the superabrasive grains 4 and the general abrasive grains 5 can be projected evenly around the wire core line 2 by flying the superabrasive grains 4 and the general abrasive grains 5 from different directions with respect to the wire core line 2. . In addition, since they fly to positions that are separated from each other, it is possible to prevent interference of air for causing the superabrasive grains 4 and the general abrasive grains 5 to fly from the nozzles 10a and 10b. The direction of the grains 5 can be aligned in the direction of protruding from the short side b side of the cross section to the surface of the binder 3.

  It is also possible to increase the number of nozzles so that the superabrasive grains 4 and the general abrasive grains 5 fly from different directions with respect to the wire core 2. Also in this case, in order to prevent the interference of the air of the nozzles of the respective nozzles, they are caused to fly away from the respective nozzles. In addition, the nozzles 10a and 10b can be arranged in the left-right direction with respect to the wire core wire 2, or can be arranged in an oblique direction. In addition, the superabrasive grains 4 and the general abrasive grains 5 can be ejected from the nozzles 10a and 10b while being mixed in advance, and can also be ejected separately from the nozzles 10a and 10b. By causing the superabrasive grains 4 and the general abrasive grains 5 to fly separately, the spraying pressure on the surface of the binder 3 can be controlled separately, and the respective embedding amounts can be easily controlled. .

Then, the superabrasive grains 4 and the general abrasive grains 5 are fixed to the binder 3 by heat curing or UV curing. Thereby, the fixed abrasive wire 1 with a large protruding height of the superabrasive grains 4 and the general abrasive grains 5 in which the long side a side of the superabrasive grains 4 and the general abrasive grains 5 protrudes is obtained. Further, in the fixed abrasive wire 1, the surfaces of the protruding superabrasive grains 4 and general abrasive grains 5 are not covered with an adhesive such as a binder 3. When the superabrasive grains 4 and the general abrasive grains 5 are arranged on the binder 3, the protrusion height h of the superabrasive grains 4 and the general abrasive grains 5 on the binder 3 is set to the superabrasive grains 4 and the general abrasive grains. It is set to be 40% to 80% of the height h ₀ of the grain 5. Further, the superabrasive grains 4 and the general abrasive grains 5 are arranged at 20 to 95% of the surface area of the binder 3 on the wire core wire 2.

  In the fixed abrasive wire 1 obtained in this way, as described above, the general abrasive 5 is arranged between the superabrasive grains 4 whose protrusion heights are increased, and the superabrasive grains 4 and the general abrasive grains 5 are arranged. Since the gap 6 capable of taking in the grinding liquid is formed between them, the grinding liquid is held on the surface of the fixed abrasive wire 1 when slicing. Therefore, when slicing is performed using the fixed abrasive wire 1, high cutting accuracy of the superabrasive grains 4 is obtained, and the grinding liquid is held on the surface of the fixed abrasive wire 1, so The supply of the grinding fluid is sufficiently performed, and the life of the fixed abrasive wire 1 can be extended.

  Moreover, in the fixed abrasive wire 1 manufactured by this method, since only the powder of the superabrasive grains 4 and the general abrasive grains 5 pierced on the surface of the binder 3 is fixed to the binder 3, conventional superabrasive grains are used. The superabrasive grains 4 and the general abrasive grains 5 do not overlap to form a plurality of layers unlike the electrodeposited ones, and only one layer is fixed around the wire core wire 2. Therefore, the number per unit length of the fixed abrasive wire 1 of the superabrasive grains 4 and the general abrasive grains 5 that come into contact with the processed surface increases.

  Further, since the powder of superabrasive grains 4 and general abrasive grains 5 is stabbed into the surface of the binder 3 from the short side b side of the cross section, the fixed abrasive wire 1 is stabbed from the long side a side. More superabrasive grains 4 and general abrasive grains 5 are arranged around the wire core wire 2 than in the case of the above. Accordingly, the time until the superabrasive grains 4 and the general abrasive grains 5 are worn is long, and the long-life fixed abrasive wire 1 is obtained.

  Further, the fixed abrasive wire 1 according to the present embodiment includes the superabrasive grains 4 while making use of the high cutting accuracy of the superabrasive grains 4 because 50% or more of the fixed abrasive grains are the superabrasive grains 4. The grinding liquid is efficiently taken into the gap 6 formed between the general abrasive grains 5. Thereby, the circulation of the grinding fluid is improved and the sharpness is prevented from being lowered.

  Moreover, in the fixed abrasive wire 1 in this embodiment, the superabrasive grains 4 and the general abrasive grains 5 are those in which abrasive grains are fixed to 20% to 95% of the surface area of the binder 3 on the wire core wire 2. Therefore, a sufficient gap 6 serving as a passage for the grinding fluid is secured on the surface of the binder 3, the circulation of the grinding fluid is good, and the sharpness is prevented from being lowered.

The fixed abrasive wire according to the present invention was subjected to a slicing test under the test conditions shown in Table 1.

  FIG. 4 shows a fixing method using superabrasive grains and general abrasive grains having cross-sectional aspect ratios of 1, 1.2, 1.4, 1.6, and 1.8, and changing the volume ratio of superabrasive grains and general abrasive grains. The result of having measured the dispersion | variation in the thickness in a wafer when performing a slice process test with an abrasive wire is shown. FIGS. 4A to 4C are superabrasive grains obtained by coating diamond (DIA) coated with nickel (Ni) with a resin as a non-conductive substance, and GC (green silicon carbide) abrasives as general abrasive grains. This is a fixed abrasive wire in which grains are fixed by protruding from the short side of the cross section to the surface of the binder.

  FIGS. 4D to 4F show superabrasive grains in which diamond is coated with a resin as a nonconductive substance and GC abrasive grains as general abrasive grains protruding from the short side of the cross section to the surface of the binder. It is a fixed abrasive wire fixed by (G) to (i) show a nickel-coated diamond superabrasive grain (without resin coating) and a GC abrasive grain as a general abrasive grain protruding from the short side of the cross section to the surface of the binder. A fixed abrasive wire fixed. FIGS. 6 (j) to (l) show fixed abrasive wires in which nickel-coated diamond superabrasive grains and GC abrasive grains as general abrasive grains are fixed by a conventional method (no abrasive grain directionality). It is.

  As shown in FIGS. 4 (a), (b), (d), (e), (g), and (h), the wafer has a cross-sectional aspect ratio of 1.2, 1.4, and 1.6. Although the thickness variation was small, the wafer thickness variation was large when the aspect ratio was 1 which was less than 1.2 and 1.8 which was more than 1.6. This is because when the aspect ratio is less than 1.2, the direction of the abrasive grains is difficult to change due to flight, and the directions of the abrasive grains are uneven. On the other hand, when the aspect ratio is more than 1.6, it is considered that the variation in wafer thickness is increased because the abrasive grains are easily broken.

  On the other hand, as shown in (c), (f), and (i) of FIG. 4, when the ratio of general abrasive grains is larger than superabrasive grains (superabrasive grains are less than 50%), the wafer thickness The variation became large. Further, as shown in (j) to (k) of FIG. 4, in the fixed abrasive wire having no grain directionality, the directions of the abrasive grains are not uniform, and therefore (a) and (b) of FIG. 4. , (D), (e), (g), and (h), the results showed a large variation in wafer thickness as a whole.

  Also, in FIG. 5, the thickness variation in the wafer sliced with a fixed abrasive wire using a superabrasive grain having a cross-sectional aspect ratio of 1.4 and a general abrasive grain and changing the volume ratio of the superabrasive grain and the general abrasive grain. A graph comparing (μm) is shown in FIG. 6, and a graph comparing the diameters (μm) of the respective fixed abrasive wires before and after use is shown.

  5 and 6, each graph is shown in order from left to right: (1) superabrasive grains in which nickel-coated diamond is coated with a resin as a non-conductive substance, and GC abrasive grains as general abrasive grains. Fixed abrasive wire that is fixed by protruding from the short side of the cross section to the surface of the binder, (2) superabrasive grains in which diamond is coated with a resin as a non-conductive substance, and GC abrasive grains as general abrasive grains A fixed abrasive wire that protrudes from the short side of the cross section to the surface of the binder and is fixed, (3) a nickel-coated diamond superabrasive (without resin coating), and a GC abrasive as a general abrasive A fixed abrasive wire that protrudes from the short side of the cross section to the surface of the binder and is fixed, (4) nickel-coated diamond superabrasive grains, and general abrasive grains A fixed abrasive wire fixed (no abrasive directional) by C abrasive grains and a conventional method.

  As shown in (a) to (d) of FIG. 5, fixing is performed by protruding superabrasive grains having a cross-sectional aspect ratio of 1.4 and general abrasive grains to protrude from the short side of the cross section to the surface of the binder. Abrasive wire has less than half the thickness variation in the wafer, regardless of the volume ratio of superabrasive and general abrasive, compared to a fixed abrasive wire with no grain directionality. Was found to be possible. On the other hand, as shown in (e) and (f) of the figure, when the ratio of the general abrasive grains is larger than the super abrasive grains (the super abrasive grains are less than 50%), the variation in the wafer thickness becomes large. It was.

  Moreover, as shown in FIGS. 6B, 6C, and 6D, the volume ratio of superabrasive grains to general abrasive grains is 9-7: 1, 6-4: 1, 3-1: It was confirmed that the fixed abrasive wire of No. 1 had a long service life because the decrease in the product diameter before and after use was small compared to the fixed abrasive wire of only superabrasive grains in FIG. In particular, in the fixed abrasive wire having a volume ratio of 6 to 4: 1 between the superabrasive grains and the general abrasive grains shown in FIG. On the other hand, as shown in FIGS. 5E and 5F, when the ratio of general abrasive grains is larger than superabrasive grains (superabrasive grains are less than 50%), the product system decreases before and after use. The width was the maximum.

  As described above, the fixed abrasive wire of the present invention in which superabrasive grains having a cross-sectional aspect ratio of 1.2 to 1.6 and general abrasive grains are fixed by protruding from the short side of the cross section to the surface of the binder. According to this, high cutting accuracy of the superabrasive grains can be obtained and the grinding fluid is held on the surface of the fixed abrasive wire, so that the grinding fluid can be sufficiently supplied to the grinding surface. It was confirmed that the life of the wire could be extended.

  The fixed abrasive wire of the present invention is useful for slicing of crystalline materials such as solar cells, semiconductor silicon, magnetic materials, sapphire, and SiC.

DESCRIPTION OF SYMBOLS 1 Fixed abrasive wire 2 Wire core wire 3 Binder 4 Super abrasive 5 General abrasive 6 Gap

Claims (6)

A fixed abrasive wire in which abrasive grains are fixed on a wire core via a binder which is a photocurable resin ,
The abrasive grains are super abrasive grains and general abrasive grains having a cross-sectional aspect ratio of 1.2 to 1.6, and are fixed by protruding from the short side of the cross section to the surface of the binder. Abrasive wire.   2. The fixed abrasive wire according to claim 1, wherein at least conductive superabrasive grains and general abrasive grains of the superabrasive grains and general abrasive grains are coated with a nonconductive substance.   The fixed abrasive wire according to claim 1 or 2, wherein 50% or more of the abrasive grains are the superabrasive grains.   The fixed abrasive wire according to claim 3, wherein both the superabrasive grains and the general abrasive grains are fixed to 20% to 95% of the surface area of the binder on the wire core wire.   The fixed abrasive wire according to any one of claims 1 to 4, wherein a particle diameter of the general abrasive is 10% to 110% with respect to a particle diameter of the superabrasive. A method for producing a fixed abrasive wire in which abrasive grains are fixed on a wire core via a binder that is a photocurable resin ,
That with coating the binder onto the wire core,
Production of fixed abrasive wire including projecting superabrasive grains having a cross-sectional aspect ratio of 1.2 to 1.6 and general abrasive grains from the short side of the cross section to the surface of the binder in a powder state Method.

Images