KR101085727B1 - Embedded printed circuit board and method of manufacturing the same - Google Patents

Abstract

PURPOSE: An embedded printed circuit board and a method of manufacturing the same are provided to reduce resistance and easily form a cavity by using an exposure and development applying a photosensitivity build-up layer. CONSTITUTION: In an embedded printed circuit board and a method of manufacturing the same, an insulating layer(10a) forms a cavity. A chip(30) mounts in the cavity. A circuit layer(40) is formed in the insulating layer. The insulating layer is comprised of a photosensitive composition including a light-sensitivity monomer and a photoinitiator.

Description

Embedded Printed Circuit Board and Method of Manufacturing the Same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embedded printed circuit board and a method of manufacturing the same, and more particularly, to an embedded printed circuit board and a method of manufacturing the same.

With the development of the electronic industry, the trend of increasing the functionality and miniaturization of electronic components is increasingly required. In particular, the trend of the market is based on a form that makes it easy to carry like a mobile communication terminal such as a cellular phone and a PDA. As a result of the trend toward thinner and more efforts to provide more functions in a limited area, the development of component embedded boards is drawing attention in relation to next-generation multifunctional / small package technology.

Looking at the conventional chip embedding (Chip Embedding) process, to form a cavity (Cavity) to fix the chip (Taping) was applied.

Herein, the cavity was used by a method such as a mechanical drill, a punch, a laser drill, and the like.

As described above, in general, a single device embedding method embeds a chip through a process of forming a cavity for embedding a chip and a taping process at a bottom of a substrate on which a cavity is formed to fix the chip.

However, the method using mechanical drills, punches, laser drills, and the like does not form a cavity to exactly match the chip size due to the limitation of the mechanical resistance (Tolerance). Occurs.

Accordingly, the present invention has been made to solve the problems that may occur in a conventional embedded printed circuit board, an embedded printed circuit board is formed in the insulation layer consisting of a photosensitive film and the cavity for chip embedded in the exposure and development process and Its purpose is to provide a process for its preparation.

Embedded printed circuit board according to an embodiment of the present invention for achieving the above object, the insulating layer formed cavity; A chip mounted in the cavity; And a circuit layer formed on the insulating layer, wherein the insulating layer may be formed of a photosensitive composition including a photosensitive monomer and a photoinitiator.

In addition, the cavity may be formed through an exposure and development process.

In addition, the insulating layer may include a resin composition comprising a composite epoxy resin containing a naphthalene-based epoxy resin and a rubber-modified epoxy resin, a curing agent, a curing accelerator, and an inorganic filler.

The hardener may be a compound of any one or more of the group consisting of phenol noble, bisphenol noble, and mixtures thereof.

In addition, the curing accelerator is an imidazole compound, any one of the group consisting of 2-methyl imidazole, 1- (2-cyanoethyl) -2-alkyl imidazole, 2-phenyl imidazole and mixtures thereof The above compound may be sufficient.

On the other hand, the inorganic filler may be any one or more inorganic materials of the group consisting of graphite, carbon black, silica, and gray.

In addition, the photosensitive monomer may include an acrylate (Acrylate) resin.

In addition, the embedded printed circuit board manufacturing method according to an embodiment of the present invention for achieving the above object comprises the steps of providing an insulating layer comprising a photosensitive composition; Forming a cavity in the insulating layer by an exposure and development process; Placing the chip in the cavity; And forming a plating layer on the insulating layer on which the chip is disposed and forming a pattern by etching the plating layer.

In this case, the insulating layer may have any one of an RCC, a build up film, and a CCL.

In addition, the insulating layer may be formed of a photosensitive composition including a photosensitive monomer and a photoinitiator.

In addition, the insulating layer may include a resin composition including a composite epoxy resin including a naphthalene-based epoxy resin and a rubber-modified epoxy resin, a curing agent, a curing accelerator, and an inorganic filler.

In addition, the curing agent may be a compound of any one or more of the group consisting of phenol noblock, bisphenol noblock, and mixtures thereof.

In addition, the curing accelerator is an imidazole compound, any one of the group consisting of 2-methyl imidazole, 1- (2-cyanoethyl) -2-alkyl imidazole, 2-phenyl imidazole and mixtures thereof The above compound may be sufficient.

In addition, the inorganic filler may be at least one inorganic material selected from the group consisting of graphite, carbon black, silica, and gray.

The photosensitive monomer may include an acrylate resin.

The embedded printed circuit board and the method of manufacturing the same of the present invention can be expected to reduce the resistance and easily form the cavity by using the exposure and shape processes to which the photosensitive build-up layer is applied.

In addition, the present invention has the advantage that the degree of freedom of design of the embedded printed circuit board can be secured compared to the prior art, since only the insulating layer selectively forms a cavity when manufacturing the embedded printed circuit board.

In addition, the present invention has an advantage of reducing the cost including the material cost and the process cost because no separate adhesive member is required during the chip embedding process.

1 to 5 are cross-sectional views showing a first embodiment of an embedded printed circuit board according to the present invention;
6 to 11 are cross-sectional views showing a second embodiment of an embedded printed circuit board according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of an embedded printed circuit board. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 to 5 are cross-sectional views showing a first embodiment of an embedded printed circuit board according to the present invention.

1 to 5, the embedded printed circuit board of the present invention includes an insulating layer 10a having a cavity 20, a cavity 20, a chip 30 mounted on the cavity, and an insulating layer. It may include a circuit layer 40 formed on.

In more detail, the insulating layer 10a may be formed of a photosensitive composition, and may be stacked on a copper foil layer 10b to form a resin coated copper (RCC) 10. Here, the insulating layer 10a may be formed of a photosensitive composition including a photosensitive monomer and a photoinitiator. This may be advantageous by adding a photosensitive monomer and a photoinitiator to an existing thermosetting insulating material composition to enable UV curing, thereby minimizing the deterioration of physical properties of the existing thermosetting insulating material. .

Meanwhile, the insulating layer may include a resin composition including a composite epoxy resin, a curing agent, a curing accelerator, and an inorganic filler including a naphthalene-based epoxy resin and a rubber-modified epoxy resin.

Here, the composite epoxy resin may include a naphthalene-based epoxy resin having an average epoxy resin equivalent of 100 to 300 and a rubber-modified epoxy resin having an average epoxy resin equivalent of 100 to 500. In addition, it may be possible to mix 50 to 70 parts by weight of naphthalene-based epoxy resin, 1 to 30 parts by weight of the rubber-modified epoxy resin with respect to 100 parts by weight of the composite epoxy resin.

The curing agent may be a compound of any one or more of the group consisting of phenol noble, bisphenol noble, and mixtures thereof. The curing accelerator is an imidazole compound, and may be any one or more compounds of the group consisting of 2-methyl imidazole, 1- (2-cyanoethyl) -2-alkyl imidazole, 2-phenyl imidazole, and mixtures thereof. have. At this time, the curing accelerator is preferably mixed to 0.1 to 1 parts by weight based on 100 parts by weight of the composite epoxy resin.

On the other hand, the photosensitive monomer should have a double bond and -COOH group at the same time in the chemical structure, it is preferable to include an acrylate (Acrylate) resin. Herein, the photosensitive monomer may be included in the amount of 1 to 10 wt% in the photosensitive monomer.

In addition, the inorganic filler may be an inorganic material of any one or more of the group consisting of graphite, carbon black, silica, and gray. Herein, the inorganic filler is preferably mixed in an amount of 10 to 60 parts by weight based on 100 parts by weight of the composite epoxy resin, surface-treated with a silane coupling agent, and includes spherical fillers of different sizes, but is not limited thereto.

The composition prepared as described above may be cast in a film form by casting 50 ~ 120 ㎛ on a PET substrate through a film casting (Film Casting) process.

As shown in FIG. 2, the cavity 20 may be formed in the insulating layer 10a through an exposure and development process.

To explain this in more detail, the prepared film may be laminated at the top of an electrode (Electrod) for 1 minute by applying a pressure of 0.7 ° C to 7.5 kgf at 80 ° C., followed by drying at a predetermined temperature and time. Here, the drying proceeds to a degree of drying such that the barrier material layer does not adhere to the working film during contact exposure, and when the drying process is completed, exposure is performed at an integrated amount of 150 mj to 1000 mj using a contact exposure machine. It is preferable to proceed.

In addition, after performing the exposure, the thermal curing is partially performed through a pre-cure process. Finally 1 wt% Na ₂ C0 ₃ After developing the first development by passing the developer at a rate of 1 m / min, the ultrasonic cleaning was performed using an organic solvent capable of melting the epoxy (for example, 2-methoxy ethanol) for a predetermined time. To complete. When the development is completed, the cavity 20 may be formed by post-curing at about 190 degrees.

The pattern forming method of the photosensitive film is UV curing, exposure, and development, and the resistance is smaller than that of the mechanical processing method, and the cavity may be formed similarly to the chip size. Therefore, chip placing is advantageous, and there may be an advantage that an adhesive member is not required separately in a later process.

Thereafter, as shown in FIGS. 3 to 5, the chip 30 is disposed in the cavity 20, and electrically connected by performing Build Up Film Curing and Cu Plating. The circuit 40 may be formed through copper pattering.

Here, the chip 30 may be an active device, a passive device or an IC.

The shape of the insulating layer disclosed in the present invention is any one of the resin-coated copper clad laminate (RCC), the build-up film (Copper Clad Lamination, CCL) form in which copper foil is laminated only on one surface of the insulating material Can be.

Hereinafter, for the convenience of description, detailed descriptions of technologies overlapping with those disclosed in FIGS. 1 to 5 will be omitted.

6 to 11 are cross-sectional views showing a second embodiment of an embedded printed circuit board according to the present invention and are for explaining an example applied to a multilayer printed circuit board.

As shown, the embedded printed circuit board may include a core layer 100, an insulation layer 200, a cavity 300, a chip 400, and a circuit layer 500 in the form of a copper clad laminate (CCL). .

In more detail, the insulating layer 200 formed of the photosensitive build-up film is stacked on the upper and lower portions of the core layer 100, and the exposure and development are performed on the insulating layer 200 to connect the cavity 300 and the connecting via ( Via). Here, since the photosensitive build-up film is the same as the manufacturing method disclosed in FIGS. 1 to 5, detailed description thereof will be omitted.

Subsequently, after the chip 400 is disposed in the cavity 300, the electrode layer may be formed by performing build-up film curing and copper plating, and patterning may be performed to form the electrode pattern 500.

Hereinafter, a method of manufacturing an embedded printed circuit board according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 5.

1 to 5 are cross-sectional views sequentially illustrating a method of manufacturing an embedded printed circuit board according to an exemplary embodiment of the present invention.

First, as shown in FIG. 1, the insulating layer 10a containing the photosensitive composition is provided.

Here, the insulating layer 10a may be formed of a photosensitive composition including a photosensitive monomer and a photoinitiator. In this case, the insulating layer may include a resin composition including a composite epoxy resin, a curing agent, a curing accelerator, and an inorganic filler including a naphthalene-based epoxy resin and a rubber-modified epoxy resin.

Subsequently, as shown in FIG. 2, the cavity 20 may be formed by performing an exposure and development process on the insulating layer 10a.

To explain this in more detail, the prepared film may be laminated at the top of an electrode (Electrod) for 1 minute by applying a pressure of 0.7 ° C to 7.5 kgf at 80 ° C., followed by drying at a predetermined temperature and time. Here, the drying proceeds to a degree of drying such that the barrier material layer does not adhere to the working film during contact exposure, and when the drying process is completed, exposure is performed at an integrated amount of 150 mj to 1000 mj using a contact exposure machine. It is preferable to proceed.

In addition, after performing the exposure, the thermal curing is partially performed through a pre-cure process. Finally 1 wt% Na ₂ C0 ₃ After developing the first development by passing the developer at a rate of 1 m / min, the ultrasonic cleaning was performed using an organic solvent capable of melting the epoxy (for example, 2-methoxy ethanol) for a predetermined time. To complete. When the development is completed, the cavity 20 may be formed by post-curing at about 190 degrees.

Thereafter, as shown in FIG. 3, the chip 30 may be disposed in the cavity 20. Here, the chip 30 may be an active device, a passive device or an IC.

Next, as shown in FIGS. 4 and 5, a plating layer may be formed on the insulating layer 10a on which the chip 30 is disposed, and the plating layer may be etched to form a pattern.

Here, the plating layer may be a generally known method. For example, after formation of the through hole, known desmear treatment, plasma treatment, or the like can be performed, and electroless copper plating and electrocopper plating can be performed. Thereafter, an external circuit can be formed on the surface, and finally, a noble metal plating resistor can be formed to prevent oxidation, and nickel plating and gold plating can be performed. The plating layer may be electrically connected to the electrodes of the electric device.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

10: RCC 10a, 200: insulation layer
10b: copper foil layer 20, 300: cavity
30, 400: chip 40: circuit layer
100 core layer 500 electrode pattern

Claims (16)

An insulation layer in which a cavity is formed;
A chip mounted in the cavity; And
A circuit layer formed on the insulating layer;
Including;
The insulating layer is an embedded printed circuit board formed of a photosensitive composition comprising a photosensitive monomer and a photoinitiator.
The method of claim 1,
The cavity is,
Embedded printed circuit board formed through the exposure and development process.
The method of claim 1,
The insulating layer,
An embedded printed circuit board comprising a resin composition comprising a composite epoxy resin including a naphthalene epoxy resin and a rubber modified epoxy resin, a curing agent, a curing accelerator, and an inorganic filler.
The method of claim 3, wherein
The curing agent,
An embedded printed circuit board, which is a compound of any one or more of the group consisting of phenol noblock, bisphenol noblock, and mixtures thereof.
The method of claim 3, wherein
The curing accelerator,
Embedded printed circuit board which is an imidazole compound and is at least one compound of the group consisting of 2-methyl imidazole, 1- (2-cyanoethyl) -2-alkyl imidazole, 2-phenyl imidazole, and mixtures thereof .
The method of claim 3, wherein
The inorganic filler,
Embedded printed circuit board which is an inorganic material of at least one of the group consisting of graphite, carbon black, silica and gray.
The method of claim 1,
The photosensitive monomer,
Embedded printed circuit board containing an acrylate resin.
Forming an insulating layer comprising the photosensitive composition;
Forming a cavity on the insulating layer by exposing and developing the photosensitive resist;
Placing the chip in the cavity; And
Forming a plating layer on the insulating layer on which the chips are disposed, and etching the plating layer to form a pattern;
Embedded printed circuit board manufacturing method comprising a.
The method of claim 8,
The form of the insulating layer,
Embedded printed circuit board manufacturing method in any one of RCC, Build Up Film and CCL form.
The method of claim 8,
The insulating layer is an embedded printed circuit board manufacturing method formed of a photosensitive composition comprising a photosensitive monomer and a photoinitiator.
The method of claim 10,
The insulating layer,
A method of manufacturing an embedded printed circuit board comprising a resin composition comprising a composite epoxy resin including a naphthalene epoxy resin and a rubber modified epoxy resin, a curing agent, a curing accelerator, and an inorganic filler.
The method of claim 11,
The curing agent,
A method of manufacturing an embedded printed circuit board, which is a compound of any one or more of the group consisting of phenol noble, bisphenol noblock, and mixtures thereof.
The method of claim 11,
The curing accelerator,
Embedded printed circuit board which is an imidazole compound and is at least one compound of the group consisting of 2-methyl imidazole, 1- (2-cyanoethyl) -2-alkyl imidazole, 2-phenyl imidazole, and mixtures thereof Manufacturing method.
The method of claim 11,
The inorganic filler,
An embedded printed circuit board manufacturing method of any one or more inorganic materials selected from the group consisting of graphite, carbon black, silica, and gray.
The method of claim 10,
The photosensitive monomer,
Embedded printed circuit board manufacturing method comprising an acrylate (Acrylate) resin.
Forming an insulating layer comprising the photosensitive composition;
Forming a mask pattern on the insulating layer, and forming a cavity by exposing and developing the insulating layer on which the mask pattern is formed;
Placing the chip in the cavity; And
Forming a plating layer on the insulating layer on which the chips are disposed, and etching the plating layer to form a pattern;
Embedded printed circuit board manufacturing method comprising a.

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