KR101049000B1 - 점착테이프의 접착방법 및 접착장치 - Google Patents
점착테이프의 접착방법 및 접착장치 Download PDFInfo
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- KR101049000B1 KR101049000B1 KR1020040072546A KR20040072546A KR101049000B1 KR 101049000 B1 KR101049000 B1 KR 101049000B1 KR 1020040072546 A KR1020040072546 A KR 1020040072546A KR 20040072546 A KR20040072546 A KR 20040072546A KR 101049000 B1 KR101049000 B1 KR 101049000B1
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- adhesive tape
- unnecessary
- semiconductor wafer
- tape
- winding
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 143
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract 6
- 238000004804 winding Methods 0.000 claims description 44
- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000011084 recovery Methods 0.000 claims description 9
- 230000001965 increasing effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims 1
- 230000010062 adhesion mechanism Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 78
- 238000003860 storage Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- -1 stainless steel Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0056—Provisional sheathings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S242/00—Winding, tensioning, or guiding
- Y10S242/90—Particular apparatus material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
- Y10T156/1087—Continuous longitudinal slitting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1313—Cutting element simultaneously bonds [e.g., cut seaming]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1343—Cutting indefinite length web after assembly with discrete article
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1378—Cutter actuated by or secured to bonding element
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1734—Means bringing articles into association with web
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1788—Work traversing type and/or means applying work to wall or static structure
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tape Dispensing Devices (AREA)
Abstract
Description
상기 불필요한 점착테이프가 상기 절단된 부분에서 폭방향으로 줄어들지 않도록 권취 회수하는 과정을 포함한다,
위치결정된 상기 물품을 유지하는 물품유지부와,
상기 점착테이프를 이형(離型) 라이너로부터 이형하는 이형기구부와,
Claims (9)
- 반도체 웨이퍼의 표면에 점착테이프를 부착하고, 상기 점착테이프를 상기 반도체 웨이퍼의 외주(外周)테두리를 따라 절단한 후, 불필요한 점착테이프를 회수하는 점착테이프의 접착방법으로서,상기 반도체 웨이퍼의 외주를 따라 오려내진 부분에 회전축의 양단으로부터 중앙을 향하여 팽출(膨出)한 형상의 권취롤러의 가운데 굵은 원통모양의 굵은 축부분을 들어가게 하면서 절단되지 않은 점착테이프 부분이 폭방향으로 줄어들지 않도록 그 권취롤러의 양단측에 의해 잡아 당겨지도록 해서 권취 회수하는 과정을 포함하는 것을 특징으로 하는 점착테이프의 접착방법.
- 제 1항에 있어서,절단된 불필요한 점착테이프의 폭방향으로 텐션을 걸면서 상기 불필요한 점착테이프를 권취하여 회수하는 것을 특징으로 하는 점착테이프의 접착방법.
- 제 1항에 있어서,적어도 1 개 이상의 가운데가 굵은 원통모양의 권취롤러에 의해 상기 불필요한 점착테이프를 권취하고, 절단된 부분에서 폭방향으로 줄어들지 않도록 권취 회수하는 것을 특징으로 하는 점착테이프의 접착방법.
- 반도체 웨이퍼의 표면에 점착테이프를 부착하고, 상기 점착테이프를 상기 반도체 웨이퍼의 외주테두리를 따라 절단한 후, 불필요한 점착테이프를 회수하는 점착테이프의 접착장치로서,반도체 웨이퍼를 수납하는 수납부;상기 수납부로부터 반도체 웨이퍼를 반송하는 반송수단;상기 반송수단에 의해 반송되는 반도체 웨이퍼를 재치하고, 위치결정하는 위치결정 수단;위치결정된 상기 반도체 웨이퍼를 유지하는 반도체 웨이퍼 유지부;상기 반도체 웨이퍼 유지부 위에 재치된 상기 반도체 웨이퍼에 점착테이프를 공급하는 테이프공급부;상기 점착테이프를 이형(離型) 라이너로부터 이형하는 이형기구부;상기 이형기구부에서 이형된 상기 이형 라이너를 권취하는 라이너 권취부;상기 테이프공급부에서 공급되는 점착테이프를 상기 반도체 웨이퍼 표면에 접착하는 접착기구부;상기 반도체 웨이퍼에 접착된 점착테이프를 반도체 웨이퍼의 외주를 따라 오려내는 점착테이프 오려내기 수단;불필요하게 된 점착테이프를 권취하는 불필요 테이프 권취부를 구비하여 이루어지며,상기 불필요 테이프 권취부에, 적어도 1개 이상의 가운데가 굵은 원통모양의 권취롤러가 설치되고, 상기 가운데가 굵은 원통모양의 권취롤러에 의하여 상기 불필요한 점착테이프를 폭방향으로 줄어들지 않도록 권취하는 것을 특징으로 하는 점착테이프의 접착장치.
- 제 4항에 있어서,상기 가운데가 굵은 원통모양의 권취롤러는, 상기 불필요한 점착테이프를 반송 안내하는 가이드롤러인 것을 특징으로 하는 점착테이프의 접착장치.
- 제 4항에 있어서,상기 가운데가 굵은 원통모양의 권취롤러는, 상기 불필요한 점착테이프를 권취 회수하는 회수보빈인 것을 특징으로 하는 점착테이프의 접착장치.
- 제 4항에 있어서,상기 가운데가 굵은 원통모양의 권취롤러는, 회전축의 양단으로부터 회전축 중앙을 향하여 점차 커진 원주측면의 곡률반경이 1000 ∼ 100000mm의 범위인 것을 특징으로 하는 점착테이프의 접착장치.
- 제 4항에 있어서,상기 가운데가 굵은 원통모양의 권취롤러의 축부는, 금속에 의해 형성되는 것을 특징으로 하는 점착테이프의 접착장치.
- 제 4항에 있어서,상기 가운데가 굵은 원통모양의 권취롤러의 축부는, 수지에 의해 형성되는 것을 특징으로 하는 점착테이프의 접착장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2003-00331054 | 2003-09-24 | ||
JP2003331054 | 2003-09-24 |
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Publication Number | Publication Date |
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KR20050030107A KR20050030107A (ko) | 2005-03-29 |
KR101049000B1 true KR101049000B1 (ko) | 2011-07-12 |
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KR1020040072546A KR101049000B1 (ko) | 2003-09-24 | 2004-09-10 | 점착테이프의 접착방법 및 접착장치 |
Country Status (6)
Country | Link |
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US (1) | US7207367B2 (ko) |
KR (1) | KR101049000B1 (ko) |
CN (1) | CN100401480C (ko) |
MY (1) | MY138357A (ko) |
SG (1) | SG110108A1 (ko) |
TW (1) | TWI257666B (ko) |
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JP4592289B2 (ja) * | 2004-01-07 | 2010-12-01 | 日東電工株式会社 | 半導体ウエハの不要物除去方法 |
JP4974626B2 (ja) * | 2006-09-20 | 2012-07-11 | 日東電工株式会社 | 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置 |
JP4836827B2 (ja) * | 2007-02-22 | 2011-12-14 | 日東電工株式会社 | 粘着テープ貼付け装置 |
JP4746003B2 (ja) * | 2007-05-07 | 2011-08-10 | リンテック株式会社 | 移載装置及び移載方法 |
DE102008018173A1 (de) * | 2008-04-03 | 2009-10-08 | Bizerba Gmbh & Co. Kg | Ablagevorrichtung für Lebensmittelscheiben, Lebensmittel-Schneidemaschine, Verfahren zur Ablage von Lebensmittelscheiben und Trennblatt-Endlosband |
JP5417131B2 (ja) * | 2009-11-20 | 2014-02-12 | 日東電工株式会社 | 粘着テープ貼付け装置および粘着テープ貼付け方法 |
CN110253875B (zh) * | 2019-08-09 | 2021-05-28 | 湖南明意湖智能科技股份有限公司 | 一种基于安全防护的玻璃自动贴膜机 |
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JP2002124500A (ja) * | 2000-10-16 | 2002-04-26 | Miyazaki Oki Electric Co Ltd | 半導体ウエハのテープ貼り付け装置およびその貼り付け方法 |
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JPS6443458A (en) * | 1987-08-11 | 1989-02-15 | Nitto Denko Corp | Stick cutter for tacky tape with respect to thin board |
US6641910B1 (en) * | 1999-08-24 | 2003-11-04 | 3M Innovative Properties Company | Stretch releasing adhesive tape with segmented release liner |
US6405957B1 (en) * | 2000-02-15 | 2002-06-18 | Imation Corp. | Data storage tape cartridge and tape path with an idler wrap guide for reduced lateral tape movement |
JP3983053B2 (ja) | 2002-01-17 | 2007-09-26 | 日東電工株式会社 | 保護テープの切断方法およびそれを用いた保護テープ貼付装置 |
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- 2004-07-27 US US10/898,996 patent/US7207367B2/en not_active Expired - Fee Related
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- 2004-08-27 TW TW093125697A patent/TWI257666B/zh not_active IP Right Cessation
- 2004-09-10 KR KR1020040072546A patent/KR101049000B1/ko active IP Right Grant
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JP2002124500A (ja) * | 2000-10-16 | 2002-04-26 | Miyazaki Oki Electric Co Ltd | 半導体ウエハのテープ貼り付け装置およびその貼り付け方法 |
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MY138357A (en) | 2009-05-29 |
US20050061425A1 (en) | 2005-03-24 |
US7207367B2 (en) | 2007-04-24 |
TW200514154A (en) | 2005-04-16 |
TWI257666B (en) | 2006-07-01 |
KR20050030107A (ko) | 2005-03-29 |
SG110108A1 (en) | 2005-04-28 |
CN1601706A (zh) | 2005-03-30 |
CN100401480C (zh) | 2008-07-09 |
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