KR101020669B1 - Apparatus for picking and placing of semiconductor chip - Google Patents

Abstract

The present invention relates to a pickup and place device of a semiconductor chip.

The semiconductor chip pickup and place apparatus according to the present invention, the wafer seating portion on which the wafer is seated; A pickup unit for picking up the semiconductor chips arranged on the wafer from one side and simultaneously placing the picked up semiconductor chips in a tray on the other side; A tray stacking unit in which the tray on which the semiconductor chip is placed and the empty tray are vertically stacked by the pickup unit; And a tray supply unit supplying the empty tray to the tray stacking unit, and has an advantage of improving a feeding speed of chips into a tray. An operational effect is exerted that the packaging of the completed tray can be easily performed.

Pick-up, place, arm, pick-up tool, motor, wafer, tray

Description

Apparatus for picking and placing of semiconductor chip

The present invention relates to a pick-up and place device for a semiconductor chip, and more particularly, a chip is picked up from a wafer on one side of the arm in a rotary manner and at the same time the chip is placed on the tray on the other side, and the tray is vertically lifted. The present invention relates to a pick-up and place device for a semiconductor chip to be stacked.

In general, it is installed in a process equipment for manufacturing a semiconductor device, for example, a packaging process or a test process to pick-up and pick-down of the semiconductor device As the device responsible for the down, pickup and place devices are mainly used.

The conventional pick-up and place device is linked with the X-Y transfer means for moving the pick-up and place device in the X-axis and Y-axis direction to transfer the semiconductor element. For example, it is installed in a semiconductor package inspection facility to perform semiconductor package transfer between a test tray and a customer tray.

Conventional pick-up and place equipment is a single picker (picker) capable of vacuum adsorption vertically pick the picker as the pitch change corresponding to the pocket pitch of the test tray and the customer tray by the transfer means The pick-up or pick-down operation is performed by the suction and transfer of the semiconductor chip by the operation of the cylinder for driving.

However, such a conventional pick-up and place device has difficulty in transferring a large number of semiconductor devices to a customer tray in a short time since the picker is repeatedly moved only in one direction for semiconductor device transfer.

In order to solve this problem, it is possible to consider a method of increasing the transfer speed by increasing the number of pickers and increasing the number of transfers of the semiconductor element that can be transferred in one operation. In addition, when a plurality of pickers simultaneously transport the semiconductor devices, accurate pick-up and placement of the semiconductor devices are difficult to be performed, resulting in a decrease in productivity.

In addition, such a conventional pick-up and place device is a complex structure in which the components for supporting and driving a plurality of pickers are complicated mutually coupled structure, so a lot of time loss is required when replacement or repair of parts due to aging or failure is required. There is also a problem that occurs.

Therefore, the present invention was devised to solve the above-mentioned disadvantages and problems in the conventional chip supply apparatus, and the pick-up and the place of the chip are simultaneously mounted on both sides of the arm that rotates in a rotary manner, thereby being seated on the tray. SUMMARY OF THE INVENTION An object of the present invention is to provide a pick-up and place device for a semiconductor chip in which the supply speed of the chip is improved.

In addition, another object of the present invention is to pick up and place a semiconductor chip in which a tray in which a plurality of semiconductor chips are seated is stacked in an cassette by an elevator method, so that packaging of the tray where the chip is completed is easily performed. Provided.

The object of the present invention is a wafer seating portion on which a wafer is seated, a pickup portion for picking up the semiconductor chips arranged on the wafer from one side and simultaneously placing the picked up semiconductor chips on a tray from the other side, and the pick-up. And a tray stacking unit in which a semiconductor chip is placed by the unit, and a tray stacking unit in which stacks of empty trays are sequentially stacked, and a tray supply unit for supplying empty trays to the tray stacking unit. .

In addition, one side of the wafer seating portion is provided with a wafer loading portion for supplying a wafer, and a wafer transfer for transferring a diced wafer from a wafer loading portion to a wafer seating portion between the wafer loading portion and the wafer seating portion. Includes more phrases.

Such a pickup and place device for a semiconductor chip according to the present invention includes a tray supplying part including the wafer seating part, the pickup part, and the tray loading part, and further includes a casing having an opening and closing door on the front side thereof.

The pick-up part comprises an arm, a motor mounted to the upper center portion of the arm to drive the arm to rotate, and a pick-up tool coupled to both ends of the arm.

In this case, the motor may be configured as a rotary motor for repeatedly rotating the arm by 180 °.

The pick-up and place device of such a semiconductor chip picks up semiconductor chips individually diced on a wafer supplied to the wafer seating portion through both pick-up tools of arms horizontally mounted on the pick-up portion and is placed on a tray at the same time. As a result of improving the working speed and allowing the trays on which the placing is completed are vertically stacked on the cassette stacking tray in an elevating manner, it is possible to easily package a plurality of trays stacked in the cassette.

As described above, the semiconductor chip pick-up and place device according to the present invention is a pair of pickup tools mounted on the pick-up portion is rotated 180 ° and the pickup and the place is made at the same time, thereby improving the feed rate of the chip to the tray There are advantages that can be achieved, and as a plurality of trays are stacked in an cassette by an elevator method, and semiconductor chips placed in each tray are also stacked by an elevator method, packaging of the trays on which chips are completed can be easily packaged. The effect of action that can be performed is exerted.

Matters relating to the operational effects including the technical configuration for the above object of the pickup and place device of the semiconductor chip according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

First, FIG. 1 is a perspective view of an embodiment of a chip pickup and place device according to the present invention, FIG. 2 is a front view of an embodiment of the chip pickup and place device according to the present invention, and FIG. 4 is a plan view of one embodiment of a place device, and FIG. 4 is a side view of one embodiment of a chip pickup and place device according to the present invention.

As illustrated, the semiconductor chip pick-up and place device 100 according to the embodiment of the present invention includes a casing 110, a wafer seating portion 120 and a wafer seating portion 120 installed inside the casing 110. Pick-up unit 130 for picking up chips C from the wafer W seated on the plate) and placing them on the tray T, and a tray stacking unit in which the trays T on which the plurality of chips C are placed are stacked. 140 and a tray supply unit 150 for supplying an empty tray T.

In this case, one side of the wafer seating part 120 in the casing 110 is provided with a wafer loading part 160 in which a plurality of semiconductor chips C are diced and vertically stacked.

The wafer seating unit 120 is formed in a circular shape, and a ring chamber 121 is provided at an edge portion thereof, and the wafer W supplied from the wafer loading unit 160 is seated inside the ring chamber 121. .

In addition, an ejector (ejector, 122) for separately separating the semiconductor chip (C) on the wafer (W) is installed in the central portion of the wafer seating portion 120 by vacuum compression, the ejector 122 is programmed It is driven up and down in a cam method while being pitch-pitched according to the position information, thereby separating the semiconductor chip C to facilitate pickup.

The pickup unit 130 includes an arm 131 mounted with pickup tools 132 on both sides, and a motor 133 for rotationally driving the arm 131.

Pick-up tools 132 mounted on both sides of the arm 131 are mounted in a one-touch manner to pick up the individual semiconductor chip (C) on the wafer (W) through the suction method using a vacuum.

At this time, the pickup tool 132 is further provided on the pickup tool 132 so that the pickup tool 132 can be individually picked up and sorted (sorting) operation.

The motor 133 for rotationally driving the arm 131 is preferably composed of a rotary motor, and the pick-up is repeatedly rotated by 180 ° by an arm 131 having a pair of pickup tools 132 mounted at both ends thereof. The tool 132 allows pick up and place for the chip C on the wafer W.

That is, the pickup 130 is mounted at both ends of the arm 131 as both ends of the arm 131 are positioned on the upper portion of the wafer seating part 120 and the upper portion of the tray loading part 140. A pair of pick-up tools 132 are picked up and placed on a semiconductor chip C on a wafer W seated on the wafer seating unit 120 and a tray T stacked on the tray stacker 140, respectively. To be possible.

In more detail, in the arm 131 rotated by the driving of the motor 133, pickup tools 132 mounted at both ends are repeatedly positioned on the upper surface of the wafer W and the upper surface of the tray T, respectively. The pick-up tool 132 is individually operated by the pick-up tool drive 135 mounted on both sides of the arm 131.

The pick-up tool 132 of one side of the arm 131 is moved along the ejector 122 transferred for each programmed pitch on the wafer W seated on the wafer seating part 120, thereby picking up the semiconductor chip C. At the same time, the pick-up tool 132 of the other side of the arm 131 is rotated with the chip C picked up so that the place of the chip sorting on the upper surface of the tray T is performed. The pickup and the place of the chip (C) is repeatedly performed through the pick-up tool 132 of both sides to improve the work speed by 20 to 50% compared to the conventional.

Meanwhile, the semiconductor chip C picked up on the wafer W of the wafer seating part 120 is separately placed on the tray T, and the tray T is located at one side of the wafer seating part 120. It is vertically stacked in an elevatoring manner on the tray stacking unit 140 of the cassette type installed.

When the empty tray T is supplied, the tray stacking unit 140 checks the flatness and position of the supplied tray T, determines the start position of the chip place, and then repeatedly rotates the arm 131. The operation of the pick-up tool 132 places a plurality of chips (C) sequentially.

As described above, when the place of the chip C is completed on the tray T, the place-completed tray T is stacked below, and the empty tray T is stacked on the tray T through the tray supply unit 150. In addition, the pickup and the placement of the chip C through the pickup tool 132 are repeated to repeat the stacking process of the tray T.

Here, the tray stacking unit 140 may be a system that can enter only one tray in some cases, in which case a plurality of semiconductor chips (C) in the tray is vertically stacked by an elevator method, if a predetermined chip is stacked The tray can also be removed and packaged.

Of course, when a plurality of trays are entered into the tray stacking unit 140, the stacking process of the trays T on the tray stacking unit 140 is repeated to stack the trays T in a cassette. It is also possible to package the tray (T).

In addition, the tray stacking unit 140 allows a plurality of trays (T) stacked therein to be pushed by a leaf spring (not shown) from the bottom, and the pickup tool (c) is clamped by the peripheral portion. It is desirable to enable accurate pickup and placement by 132).

On the other hand, the tray supply unit 150 for supplying the empty tray (T) to the tray stacking unit 140 is configured in the form of a cassette that is operated in an elevator manner similar to the tray stacking unit 140, a large amount of trays (T) can be stacked vertically.

When the empty tray T to be supplied is transferred to the uppermost portion and supplied to the tray stacking unit 140, the tray supplying unit 150 ascends the empty tray T by one step and then moves to the next tray T. Supply preparation is complete.

At this time, between the tray loading unit 140 and the tray supply unit 150 is installed a tray conveying port 170 which is vertically conveyed by hydraulic or pneumatic, and the tray supply unit 150 through the tray conveying port 170 The empty tray T is picked up by a vacuum to be transported to the upper portion of the tray stacking unit 140.

Briefly looking at the overall operation of the pickup and place device of the present invention having such a technical configuration as follows.

First, the opening / closing door 111 of the casing 110 is opened to load an empty tray into a cassette of the tray supply unit 150, and a wafer W to be loaded into the wafer supply unit 140. Apply power and drive start switch.

The wafer W is transferred onto the wafer seating unit 120 through the wafer transfer hole, and at the same time, the empty tray T is placed on the tray stacking unit 140 through the tray transfer hole 170 on the tray supply unit 150. To be moved.

Next, when the mounting of the wafer (W) is completed, the position of the wafer (W) and the tray (T) by the top vision (not shown) attached to each pickup tool 132 of the pickup unit 130 Pick up and place orientation for calibration and accurate chip transfer.

Next, the arm 131 is repeatedly rotated by 180 ° by the driving of the motor 133 of the pickup unit 130, and simultaneously through the pickup tool 132 mounted on both sides of the arm 131. The pick-up and the place of the chip C are made.

After that, when the place of the semiconductor chip C through the pickup tool 132 is completed, the tray T completed by the tray stacking unit 140 descends by one step, and the tray supply unit 150 is disposed on the upper surface thereof. The empty trays are stacked through the package, and when the finished tray reaches a predetermined amount in the cassette of the tray stacking unit 140, the empty tray is packaged and shipped as a product.

This work process can be repeated continuously to improve the tray packaging speed, including the speed of pick-up and place of semiconductor chips.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is a perspective view of an embodiment of a chip pick up and place device according to the present invention;

2 is a front view of an embodiment of a chip pick up and place device according to the present invention;

3 is a plan view of an embodiment of a chip pick up and place device according to the present invention;

4 is a side view of an embodiment of a chip pick up and place device according to the present invention;

<Explanation of symbols for the main parts of the drawings>

110. Casing 120. Wafer seat

121.Ring Chamber 122.Ejector

130. Pickup section 131. Arm

132. Pickup tool 133. Motor

140. Tray Stack 150. Tray Feed

160. Wafer Loading W. Wafer

C. Semiconductor Chip T. Tray

Claims (11)

A wafer seating part on which a wafer is seated; A pickup unit for picking up the semiconductor chips arranged on the wafer from one side and simultaneously placing the picked up semiconductor chips in a tray on the other side; A tray stacking unit in which the tray on which the semiconductor chip is placed and the empty tray are vertically stacked by the pickup unit; And A tray supply unit supplying the empty tray to the tray stacking unit; Including, The tray stacking unit is configured to push the empty tray by a leaf spring positioned at a lower portion thereof, and when the empty tray is fixed by clamping at a peripheral portion of the semiconductor chip, the plating of the semiconductor chip is completed. Vertically stacked by means of an elevator The pick-up unit includes an arm, a rotary motor mounted to an upper center portion of the arm and repeatedly driving the arm by 180 °, and a pickup tool coupled to both ends of the arm. And place device. The method of claim 1, A wafer transfer part for loading a wafer into a wafer loading part for supplying a wafer to one side of the wafer seating part, and a wafer in which a plurality of semiconductor chips are diced between the wafer loading part and the wafer seating part to be transferred from the wafer loading part to the wafer seating part. Pick-up and place device for a semiconductor chip further comprising a sphere. The method of claim 1, The pick-up and place device is a semiconductor chip pick-up and place device further comprises a casing having a tray feeder including the wafer seating portion, the pickup portion, the tray loading portion, the front and rear doors. The method of claim 2, The wafer seating portion is formed in a circular shape, the ring chamber is provided on the edge portion, the pick-up and place of the semiconductor chip, the wafer supplied from the wafer loading portion is seated on the upper surface of the ring chamber. The method of claim 4, wherein An ejector (ejector) for separately separating the semiconductor chip on the wafer by a vacuum compression is installed in the center portion of the wafer seating portion, the ejector is a semiconductor that is driven up and down in a cam method while pitch-shifted according to the programmed position information Pick up and place device for chips. delete The method of claim 1, And a pickup tool driving mechanism is further provided on an upper portion of the pickup tool to allow the pickup tool to individually perform a pickup operation and a sorting operation. delete delete The method of claim 1, The tray stacking unit and the tray supply unit, the pickup and the place of the semiconductor chip in which a plurality of trays are vertically stacked by an elevator method. The method of claim 10, A device for picking up and placing a semiconductor chip, which is vertically driven by hydraulic pressure or pneumatic pressure between the tray loading part and the tray supply part, and is provided with a tray feed hole for transferring an empty tray by vacuum suction.

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