KR100974535B1 - Film type probe contactor and for manufacturing thereof - Google Patents

Abstract

PURPOSE: A film type probe conductor and a method for manufacturing the same are provided to be capable of testing highly dense-integrated circuits by preventing the generation of deformation due to a contact and external force. CONSTITUTION: A first tin layer(113b) plated-input pad is arranged on the upper side of a first copper layer(113a) of a base film(111) in order to from an input end(113). An output end(115) is connected with the input end through a copper pattern(114). A second tin layer(115b) plated-output pad is arranged on the upper side of the second copper layer(115a) in order to form the output end. A drive integrated-circuit(117) is mounted between the input end and the output end.

Description

FILM TYPE PROBE CONTACTOR AND FOR MANUFACTURING THEREOF

The present invention relates to a film-type probe contactor and a method for manufacturing the same, and more particularly, to a film-type probe contactor and a method for manufacturing the same, by depositing a separate metal terminal on an output terminal of a TCP or COF package. It is about.

The LCD includes a thin film transistor substrate on which a thin film transistor is formed, a color filter substrate on which a color filter layer is formed, and a liquid crystal display panel on which a liquid crystal layer is positioned. Since the liquid crystal display panel is a non-light emitting device, a backlight unit for irradiating light may be disposed on the rear surface of the thin film transistor substrate. Light transmitted from the backlight unit is controlled according to the arrangement of the liquid crystal layer. In addition, in order to drive each pixel of the liquid crystal display panel, a driving circuit and a data driver and a gate driver for receiving a driving signal from the driving circuit and applying a voltage to signal lines such as data lines and gate lines in the display area are provided.

In the manufacturing process of the liquid crystal display panel, various inspections for detecting whether a product is defective at each step are required. Such inspections include array tests, visual inspection (VI), gross tests (G / T), final tests, and the like.

The double visual inspection refers to a test for detecting a defect in a line by applying a test signal through a shorting bar connecting a signal line such as a gate line and a data line after completion of the liquid crystal display panel. Application of the test signal in the visual inspection is via a test signal metal pad connected to the shorting bar. Specifically, the visual inspection test is divided into 1G1D, 1G2D, and 2G2D according to the number of signals input to the gate line and the data line by the shorting bar. In the example of 1G2D, the gate lines all receive the same single signal, and the data lines are divided into two groups to receive two signals. In this case, the data lines are preferably divided evenly and oddly, that is, alternately.

When a single test signal is applied to the signal line, there is a problem that it may not be possible to determine whether a short circuit occurs between adjacent signal lines or adjacent pixel areas. In order to solve this problem, the 2G2D method is configured to enable inversion driving between lines by alternately dividing the odd-numbered signal line gate line and data line and the even-numbered signal line gate line and data line to another shorting bar. In comparison, short defects between adjacent signal lines or adjacent pixels can be distinguished.

However, since the visual inspection through the shorting bar has a different length from the test signal metal pad to the signal line, even if a single signal is applied at the same time, the test signal is distorted due to the difference in the length of the signal line. There is a problem in that failure detection cannot be performed by applying a single signal through the shorting bar.

On the other hand, the gross test is a method for inspecting defects after the shorting bar is removed. The metal pads connected to the gate lines and the data lines formed on the substrate and the connection pins of the probe for the test are respectively connected and the test drive signal is supplied to the probe to provide a liquid crystal. The defect of the signal lines of the display panel or the defect of the pixel is tested. Next, a test image signal is supplied to a liquid crystal display panel which is determined to be good after the gross test, and an image driving test is performed to transfer the TCP including the driving circuit to the liquid crystal display panel which is finally determined to be good. .

As described above, a general probe assembly for inspecting a liquid crystal display panel through a gross test includes an assembly block, a substrate holder fastened to the bottom of the assembly block, a needle holder fastened to the bottom of the substrate holder, and a bottom of the needle holder. A drive IC is attached to the upper surface, and a TCP film on which a pattern is formed, and a probe block attached to the bottom surface of one end of the needle holder.

On the other hand, such a probe block is a configuration that usually arranges a needle or blade-type probe, and bonded the Tape Carrier Package (TCP) / Chip On Film (COF) package attached to the probe and the drive IC.

The TCP / COF package includes an input terminal having a plurality of input terminals arranged on a polyimide film or an anisotropic conductive film, and an output terminal and an output terminal having an output terminal connected to each input terminal in a copper pattern. The drive IC is mounted between the output terminal and the output terminal.

However, such a conventional probe block has a problem in that it is difficult to implement a fine pitch because the assembly time and manufacturing cost are increased because the probes are manually arranged by hand, and the width between the probes must be kept constant.

In addition, the deformation of the probe is easily generated by the pressure when the probe and the LCD contact, there is a problem that the repeatability of the test is lowered due to the deformation.

In addition, since the probe is formed of a needle or blade type, there is a problem that the degree of freedom in arrangement is lowered.

The present invention is to solve the above problems, by forming a probe contactor by stacking a separate metal terminal on the output terminal of the TCP or COF package film-type probe contactor to enable the implementation of a fine pitch probe contactor And to provide a method for the production thereof.

In addition, the present invention by stacking the probe contactor directly to the output terminal of the TCP or COF package to prevent the deformation and position deformation of the probe in the contact and strong external force of the LCD in advance to increase the inspection repeat reliability, probe contactor Another object of the present invention is to provide a film-type probe contactor and a method of manufacturing the same, which have a high degree of freedom in arrangement and enable high density integrated circuit inspection.

Features of the present invention for achieving the above object,

An input terminal on which one side of the base film has a copper (Cu) plated input pad is arranged, and an input end connected to each of the input pads in a copper pattern, and an output pad plated on a copper upper surface. In the method of manufacturing a probe contactor using a TCP package or a COF package composed of an output terminal and a drive IC mounted between the input terminal and the output terminal, at least one layer of the same metal terminal is laminated on the output terminal of the TCP package or COF package. Alternatively, two or more layers of metal terminals of different materials may be stacked to form a probe contactor.

Here, the probe contactor removes some or all of the tin of the output pad of the output terminal of the TCP package or the COF package to expose the copper and then stack the metal terminal on the copper.

Here, the metal terminal is any one of nickel (Ni), nickel-cobalt alloy (Ni-Co), gold (Au), platinum (Pt), and rhodium (Rh).

In addition, when the two or more layers of the metal terminal is laminated, the nickel or nickel-cobalt alloy is laminated on the copper to form a first metal layer, and any one of the gold, platinum, and rhodium is formed on the first metal layer. The second metal layer is formed by stacking the materials.

Here, the tin is removed by an etching method or a polishing method.

Here, the metal terminals are laminated by plating or vapor deposition.

According to another aspect of the present invention,

Probe contactor is formed by stacking one or more layers of the same kind of metal terminals or two or more layers of different metal terminals of the same material to the output terminal of the TCP package or COF package by the method of manufacturing the film type probe. .

According to the film type probe contactor and the manufacturing method thereof of the present invention configured as described above, by forming a probe contactor by stacking a separate metal pattern on the output terminal of the commercialized commercially available TCP or COF package to form a probe contactor of fine pitch Can be implemented, and manufacturing cost and manufacturing time can be reduced.

In addition, according to the present invention by stacking the probe contactor directly to the output terminal of the TCP or COF package by plating method, it is possible to prevent the occurrence of the deformation and positional deformation of the probe contactor in the contact and strong external force of the LCD in advance, thereby repeating inspection reliability. It is possible to increase the accuracy of the probe contactor and to perform high density integrated circuit inspection.

1 is a perspective view showing the configuration of a film type probe contactor according to the present invention;
2 is a process chart for explaining a method for manufacturing a film type probe contactor according to the present invention;
3A to 3C are process explanatory diagrams for explaining a method for manufacturing a film type probe contactor according to the present invention.

Hereinafter, the configuration of the film type probe contactor according to the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intentions or customs of the user, the operator, and the like. Therefore, the definition should be made based on the contents throughout the specification.

1 is a perspective view showing the configuration of a film type probe according to the present invention.

Referring to FIG. 1, the film type probe contactor 100 according to the present invention forms a metal terminal 130, that is, a probe, at an output terminal 115 of a TCP package or a COF package 110 that is mass produced and sold.

The TCP package or the COF package 110 includes a base film 111 and a first tin (Sn) layer 113b plated on an upper surface of the first copper (Cu) layer 113a on one side of the base film 111. An input terminal 113 on which the input pads 113c are arranged, and each input pad 113 and a copper pattern 114 are connected to each other, and a second tin layer 115b is plated on the upper surface of the second copper layer 115a. And an output terminal 115 having an output pad 115c and a drive IC 117 mounted between the input terminal 113 and the output terminal 115.

Here, the base film 111 is formed of a material of a polyimide film or an anisotropic conductive film in a rectangular shape, and holes 111a are formed on both sides of the base film 111 for movement and winding during manufacturing.

Here, the input terminal 113 is formed at one end of one side of the base film 111 in a form that corresponds 1: 1 with the pattern formed on the probe unit (not shown) of the LCD test equipment, and the output terminal 115 is formed on the LCD. It is formed on the other end of one side of the base film 111 in a form corresponding to the pattern formed 1: 1.

On the other hand, the TCP package or COF package 110 is further formed with a dummy pad (not shown) connected to the output terminal 115 for the test, in the present invention, it is preferable to remove the dummy pad in an unnecessary relationship. A pass pattern (not shown) and bumps (not shown) for mounting an electronic component may be formed.

In addition, the probe contactor 100 according to the present invention removes the second tin layer 115b from the output terminal 115 of the TCP package or the COF package 110, and is made of the same material on the second copper layer 115a. One or more layers of metal terminals are stacked or two or more layers of metal terminals of different materials are formed. Preferably, two or more layers of metal terminals 130 of different materials are stacked as shown in the drawing.

Here, the metal terminal 130 is any one of nickel (Ni), nickel-cobalt alloy (Ni-Co), gold (Au), platinum (Pt), and rhodium (Rh).

Here, in the case where two or more metal terminals 130 are stacked, the first metal layer 131 is formed by laminating nickel or nickel-cobalt alloy on the second copper layer 115a to increase hardness. A second metal layer 133 is formed by laminating any one of gold, platinum, and rhodium on the metal layer 131 to prevent oxidation. At this time, the first metal layer 131 is preferably formed with a thickness of 2 ~ 5㎛, when formed with a thickness of less than 2㎛ the hardness is weak, there is a possibility of peeling, if formed with a thickness of more than 5㎛ unit price There is a disadvantage that is raised. In addition, the second metal layer 133 is preferably formed to a thickness of 0.2 ~ 0.5㎛, when formed with a thickness of less than 0.2㎛ can not perform oxidation prevention, when formed with a thickness of more than 0.5㎛ peeling There is a disadvantage that it is easily made.

Here, the second tin layer 115b may be partially or completely removed by an etching method (electrical / chemical) or by a compound polishing method, and the metal terminal 130 may be plated (electrical / chemical) or It is preferable to deposit by a deposition method such as sputtering.

Hereinafter, a method of manufacturing a film type probe contactor according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a process chart for explaining a method for manufacturing a film type probe contactor according to the present invention, and FIGS. 3A to 3D are process explanatory diagrams for explaining a method for manufacturing a film type probe contactor according to the present invention.

As shown in FIG. 3A, an input terminal 113 and an output terminal 115 are formed in the same pattern as the corresponding LCD, and a TCP package or a COF package 110 provided with a drive IC 117 is provided (S100).

In this state, as illustrated in FIG. 3B, the second tin layer 115b of the output terminal 115 of the TCP package or the COF package 110 is removed to expose the second copper layer 115a (S110). In this case, the second tin layer 115b is partially or completely removed by an etching method (electrical / chemical) or a polishing method by a compound.

When the removal of the second tin layer 115b is completed, the nickel or nickel-cobalt alloy is deposited on the exposed second copper layer 115a as shown in FIG. 3C by plating (electrical / chemical) or sputtering. By laminating by the method to form a first metal layer 131 to a thickness of 2 ~ 5㎛ (S120).

As shown in FIG. 3D, one of gold, platinum, and rhodium is deposited on the first metal layer 131 by a deposition method such as plating (electric / chemical) or sputtering to prevent oxidation. The second metal layer 133 is formed to a thickness of ˜0.5 μm (S130).

As those skilled in the art would realize, the described embodiments may be modified in various ways, all without departing from the spirit or scope of the present invention. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the description, but rather includes all modifications, equivalents, and substitutions within the spirit and scope of the invention as defined by the appended claims. Should be.

110: TCP package or COF package
111: base film 113: input end
113a: first copper layer 113b: first tin layer
113c: input pad 114: copper pattern
115: output stage 115a: third copper layer
115b: second tin layer 115c: output pad
117: drive IC 130: metal terminal
131: first metal layer 133: second metal layer

Claims (7)

An input terminal on which one side of the base film has a copper (Cu) plated input pad is arranged, and an input end connected to each of the input pads in a copper pattern, and an output pad plated on a copper upper surface. In the manufacturing method of the probe contactor using a TCP package or a COF package consisting of an output terminal and a drive IC mounted between the input terminal and the output terminal,
At least one layer of a metal material of the same material is laminated on the output terminal of the TCP package or a COF package by a plating method or a deposition method, or two or more layers of metal terminals of a different material are deposited by a plating method or a deposition method, and the tin is partially Or removing all of them to expose the copper, and then stacking the metal terminals on the copper to form a probe contactor. delete The method of claim 1,
The metal terminal,
Nickel (Ni), nickel-cobalt alloy (Ni-Co), gold (Au), platinum (Pt), rhodium (Rh) any one of the manufacturing method of the film type probe contactor. The method of claim 3, wherein
When laminating two or more layers of the metal terminal,
The first metal layer is formed by laminating the nickel or nickel-cobalt alloy on the copper, and the second metal layer is formed by laminating any one of the gold, platinum, and rhodium materials on the first metal layer. The manufacturing method of the film type probe contactor made. The method of claim 1,
The annotation is,
A method of manufacturing a film type probe contactor, which is removed by an etching method or a polishing method. delete The method of manufacturing a film type probe contactor according to claim 1, wherein a probe contactor is formed by stacking at least one layer of a metal terminal of the same material or at least two layers of a metal terminal of a different material at an output terminal of the TCP package or a COF package. Film type probe contactor, characterized in that.

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