KR100941672B1 - Test handler and method of transferring devices in test handler - Google Patents

Abstract

The present invention relates to a test handler and a method of transferring a semiconductor device of the test handler, according to the present invention, the semiconductor device of the first loading element by the picking device to be transferred to the second loading element, but not to be carried by the removal hand. By removing the semiconductor element (s) at the position to be moved, the transfer of the semiconductor element is accelerated and the operation rate of the test handler is improved.

Test handler, loading, loading method, transfer, transfer method

Description

TEST HANDLER AND METHOD OF TRANSFERRING DEVICES IN TEST HANDLER}

The present invention relates to a test handler, and more particularly, to a transfer of a semiconductor device of the test handler.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process to be tested by the tester, and classifies the semiconductor devices according to the test results and loads them into a customer tray. It is already published through a number of public documents such as 0553992 (name of the invention: 'test handler').

In general, the produced semiconductor device is supplied to a test handler in a state of being loaded in a customer tray which is a loading element. The semiconductor device supplied to the test handler is loaded into the carrier board in the loading position, tested through the test chamber in the state loaded on the carrier board, moved to the unloading position, and then unloaded into the customer tray at the unloading position. To this end, the test handler uses a loading device for loading the semiconductor devices of the customer tray onto the carrier board, a test chamber provided for testing the semiconductor devices on the carrier board that has been loaded by the loading device, and a test chamber. It is configured to include an unloading device for unloading semiconductor devices on the tested carrier board while going through the customer tray.

Here, the carrier board is a loading element on which a plurality of semiconductor devices can be loaded to support a plurality of semiconductor devices to be tested at one time. The carrier board includes a conventional test tray and a new concept of test proposed in recent years. There is a board. In the following description, a test tray is used as an example for convenience of description.

Meanwhile, when the test tray is positioned in the test chamber during the transfer process of the semiconductor device in the test handler, the semiconductor device is tested by the sockets of the docked test head. The test heads, which are docked in the test chamber and installed to test the semiconductor devices loaded in the test tray located at the test site, have test sockets formed in one-to-one correspondence with the semiconductor devices of the test tray. Each semiconductor device and each test socket are contacted with each other by an operation of a press unit, which is a component of a test handler, to perform an electrical test of the semiconductor device.

In the normal test process, the test handler and the tester make so-called socket-offs by stopping the test for specific sockets by linkage. If the test result of a semiconductor device by a specific socket is continuously failed more than a certain number of times (for example, 3 times), the tester stops the test by the socket and the test handler moves the semiconductor device to the position corresponding to the socket. It will not be transported. That is, the test handler does not load the semiconductor device corresponding to the socket into the test tray. Incidentally, a defective semiconductor device may be continuously transferred to a specific socket and provided. However, due to a malfunction of a specific socket or a poor contact of a specific socket, a test result is more likely to be continuously failed. This is because waste of resources is inevitable.

When a socket of the test head is socketed off, the test handler does not move the semiconductor device to a position corresponding to the socket. That is, the semiconductor device at the position corresponding to the socket is not loaded into the test tray.

A loading method applied to a conventional test handler in response to such a socket off will be described. 1 is a conceptual plan view of a loading apparatus applied to a general conventional test handler (hereinafter, referred to as 'prior art').

The loading device 100 is also referred to as a loader hand 110, a pick and place device for loading or a picking device for loading, having eight configurations each arranged in front and rear rows to hold 16 semiconductor devices at a time. And a loading operation is performed by the loader hand 110. As described above, the semiconductor devices are loaded from the customer tray CT to the test tray TT. And a loading buffer 140 having a first loading portion 140a for temporarily storing a semiconductor element at a position corresponding to the socket-off socket and a second loading portion 140b for aligning the semiconductor elements. .

The loader hand 110 holding 16 semiconductor elements in the customer tray CT moves to the first loading portion 140a of the loading buffer 140 to load the semiconductor elements at positions corresponding to the socket-off sockets. . Subsequently, the loader hand 110 adjusts the distance between the held semiconductor devices and moves to the second loading portion 140b of the loading buffer 140 to lower the semiconductor devices and hold them again, thereby adjusting the distance. Align the positions of the disturbed semiconductor elements. The loader hand 110 holding only semiconductor elements at positions not corresponding to the socket-off sockets moves to the test tray T.T to load the semiconductor devices. If the above process is repeated repeatedly and more than 16 semiconductor elements are present in the first loading part 140a of the loading buffer 140, the loader hand 110 is not a customer buffer CT but a loading buffer ( The semiconductor device is gripped by the first loading portion 140a of the 140 to proceed to the next process.

The loading time of the prior art is time to go through the four processes of holding in the customer tray (C.T), excluding the semiconductor device corresponding to the socket-off socket, alignment of the semiconductor device, loading in the test tray (T.T). However, if there is no semiconductor device corresponding to the socket-off socket, only three steps of holding, loading, and stacking the semiconductor device in the customer tray (C.T) and the test tray (T.T) will be time required for the loading time.

Recently, the problem of cost reduction has become important in the semiconductor device test process, and thus a high speed test handler has been developed. The applicant of the present application implements a test handler for high speed through the unpublished Korean patent application No. 10-2006-7763 (hereinafter referred to as "prior application").

The loading method applied to the test handler of the first application corresponding to the above socket-off will be described. 2 is a conceptual plan view of a loading apparatus applied to a test handler of an earlier application.

The loading device 200 is a picking device having a configuration in which eight pickers are arranged in four columns so that 32 semiconductor devices can be held at a time, and the first loader hand 210 is left to hold 32 semiconductor devices at a time. And a second loader hand 220, which is a picking device having a configuration in which 16 pickers are arranged at the right side (for reference, the first loader hand having 16 pickers and the second loader hand having 24 pickers are applied in the application. And a pair of movable loading tables 230 which reciprocate the loading position located on the side of the customer tray CT and the loading position located on the side of the test tray TT. 210, the loading operation is performed by the second loader hand 220 and a pair of the maneuverable loading table 230, the first loader hand 210 is a maneuverable loading located in the loading position from the customer tray (CT) Peninsula to Table 230 The body devices are transported and loaded, and the second loader hand 220 is transported and loaded into the test tray T.T from the movable loading table 230 positioned at the loading position. And a buffer 240 for temporarily storing a semiconductor device at a position corresponding to the socket-off socket.

The first loader hand 210 holding 32 semiconductor devices in the customer tray C.T moves to the buffer 240 to load the semiconductor devices at positions corresponding to the socket-off sockets. The first loader hand 210 holding only semiconductor elements at positions not corresponding to the socket-off sockets adjusts the space in the front and rear directions of the semiconductor elements and moves to the starting loading table 230 positioned at the loading position. The semiconductor elements are loaded. When the movable loading table 230 is moved forward and positioned at the loading position, the second loader hand 220 grips the semiconductor device. The second loader hand 220 adjusts the distance between the left and right directions of the semiconductor devices and moves to the test tray T.T to load the semiconductor devices. If the first loader hand 210 repeatedly repeats the above process and there are more than 32 semiconductor devices in the buffer 240, the first loader hand 210 grips the semiconductor devices in the buffer 240 instead of the customer tray CT. The transfer to 230 is to be loaded.

The loading process of the prior application is divided into two, the first loader hand 210 is gripped in the customer tray (CT), except for the semiconductor element corresponding to the socket-off socket, the three loading of the loading table 230 located in the loading position After the process, the second loader hand 220 is subjected to two processes of gripping and loading the test tray TT from the maneuverable loading table 230 positioned at the loading position. The loading time depends on the loading time of the first loader hand 210, which takes longer, so that the loading time of the first application is a semiconductor device corresponding to the socket held and socketed off in the customer tray CT of the first loader hand 210. Except, it is time to go through three processes of loading to the movable loading table 230 located at the loading position. However, if there is no semiconductor device corresponding to the socket-off socket, the loading process of the first loader hand 210 is carried out only two processes of loading on the mobile loading table 230 located at the loading position and holding in the customer tray CT. The loading time will also be the time between these two processes.

In a typical case of a semiconductor device test, the socket is about 1 / 32th of the total socket. That is, in the case of the first application, there is an average of one semiconductor device corresponding to the socket-off socket at one time during the loading process of the first loader hand 210 having the number of pickers of 32. As a result, the loading process of the first loader hand 210 to be processed by the two processes is performed by three processes, so that the loading time is approximately 1.5 times longer. According to the above-described prior art, there is an average of one semiconductor device corresponding to the socket-off socket twice in the loading process of the loader hand 110 having the number of 16 pickers. This leads to a long loading time.

In addition to the loading time by the above-described loading device, in order to exclude a specific semiconductor device in the unloading process, there is a case where the transfer is carried out to the loading element which is the target loading element after the transfer to the third loading element. It will take longer.

In addition, even when using a newly proposed test board of the recent concept, the same problem will occur when the sockets on the test board are socketed off.

SUMMARY OF THE INVENTION The present invention aims to facilitate the transfer of semiconductor devices by including a removal hand which removes the semiconductor element (s) from the loading element in a position which should not be transported to solve the above problems.

Test handler according to the present invention for achieving the above object, the loading device for loading the semiconductor board of the customer tray to the carrier board; A test chamber provided for testing the semiconductor devices on the carrier board on which the loading is completed by the loading device; And an unloading device for unloading the semiconductor devices on the carrier board, which have been tested while passing through the test chamber, to the customer tray. The loading apparatus includes at least one movable loading table capable of reciprocating a loading position and a loading position; A first loader hand for transferring and stacking semiconductor elements of a customer tray to the at least one movable loading table located at the loading position; A second loader hand for transferring and stacking semiconductor elements from a carrier board to the carrier board in the at least one movable loading table located at the loading position; And a removal hand for holding and removing the semiconductor device (s) at positions not to be loaded from the at least one startable loading table. Characterized in that it comprises a.

The removal hand is further characterized in that it is located between the loading position and the loading position.

A buffer provided for temporarily storing the semiconductor device (s) removed by the removal hand; It is characterized by another comprising a further.

The semiconductor device (s) in the position that should not be loaded is characterized in that the semiconductor device (s) at a position corresponding to the socket (s) made of the socket-off of the sockets of the tester head.

In addition, the test handler according to the present invention for achieving the above object, a loading device for loading a semiconductor board of the customer tray to the carrier board; A test chamber provided for testing the semiconductor devices on the carrier board on which the loading is completed by the loading device; And an unloading device for unloading the semiconductor devices on the carrier board, which have been tested while passing through the test chamber, to the customer tray. The loading apparatus includes a loader hand for transferring and stacking semiconductor elements of a customer tray to a carrier board; And a removal hand for holding and removing the semiconductor device (s) at positions not to be loaded. Characterized in that it comprises a.

The removal hand is another feature that the position on the horizontal plane is fixed.

The removal hand is another feature of being located between the loading area and the unloading area.

A buffer provided for temporarily storing the semiconductor device (s) removed by the removal hand; It is characterized by another comprising a further.

A first moving device for moving and returning the buffer to a home position and a position below the removal hand spaced apart from the home position on a horizontal plane; It is characterized by another comprising a further.

A second moving device for moving and returning the buffer in a direction perpendicular to a moving direction of the first moving device on a horizontal plane; It is characterized by another comprising a further.

The semiconductor device (s) in the position that should not be loaded is characterized in that the semiconductor device (s) in the position corresponding to the socket (s) made of the socket-off of the sockets of the tester head .

In addition, the semiconductor device transfer method of the test handler according to the present invention for achieving the above object, a transfer for transporting and stacking the semiconductor elements of the first loading element to the movable table located in the first area by the first picking device Stage 1; A removal step of moving the movable table loaded with semiconductor devices from the first area to the second area through the transfer step 1, and removing the semiconductor device (s) at positions not to be transferred by the removal hand; And transfer 2 for transporting and stacking the semiconductor elements of the movable table located in the second area in which the semiconductor element (s) of the positions which should not be transferred in the removing step are removed to the second loading element by a second picking device. step; Characterized in that it comprises a.

In the above transfer method, the semiconductor device (s) in the position which should not be transferred are more specifically the semiconductor element (s) in the position corresponding to the socket (s) in which the socket-off is made. It features.

The removing step may include: a holding step of holding, from the actuated table, the semiconductor element (s) at positions not to be transported by the removal hand; And a loading step of transferring and stacking the semiconductor device (s) held by the removal hand in the holding step into a buffer provided for temporarily storing the semiconductor device. It is another feature to include a.

A re-transfer step of transferring and stacking the semiconductor elements of the buffer to the starting table located in the first area by the first picking device when a predetermined number of semiconductor elements are loaded in the buffer; It is characterized by another comprising a further.

In addition, the semiconductor device transfer method of the test handler according to the present invention for achieving the above object, the semiconductor device of the first loading element by the picking device is transferred to the second loading element, but not carried by the removal hand It is characterized by removing the semiconductor element (s) of the position to be rolled out.

In addition, the semiconductor device transfer method of the test handler according to the present invention for achieving the above object, the semiconductor device (s) of the transfer and stacking the semiconductor device from the first loading element to the second loading element, but should not be transferred Load the buffer, change the loading position of the semiconductor device (s) in the non-transferred position loaded on the buffer, and later change the semiconductor element (s) in the non-transferred position in which the loading position is changed. It is characterized in that the transfer and stacking to the second loading element.

To change the loading position of the semiconductor element (s) in the non-transferred position loaded on the buffer, the buffer is moved below the hand provided to change the loading position, and the buffer is below the hand. Another feature is to change the loading position of the semiconductor element (s) by operating the hand in the moved state.

According to the present invention as described above, the semiconductor device corresponding to the socket-off socket at the transfer time, such as the transfer in the absence of the socket-off socket, by removing the semiconductor device corresponding to the socket-off socket by the removal hand It is effective to remove and transport.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, redundant descriptions will be omitted or compressed for the sake of brevity, and the loading device will be described as an example for convenience of description.

First Embodiment

1. Description of configuration

3 is a conceptual plan view of the loading device of the test handler according to the first embodiment of the present invention (hereinafter abbreviated as 'loading device').

The loading device 300 is, similar to the loading device 200 of the prior application, the first loader hand 310 as a first picking device, the second loader hand 320 as a second picking device and a pair of maneuverable loading. It includes a table 330 and the buffer 340, and further comprises a removal hand 350 therein.

The first loader hand 310 has a configuration in which eight pickers are arranged in four rows so as to hold 32 semiconductor devices at a time. The first loader hand 310 is provided to transfer and stack the semiconductor devices from the customer tray C.T to the movable loading table 330 located at the loading position.

The second loader hand 320 has a configuration in which 16 pickers are arranged in a left row and a right row so as to hold 32 semiconductor devices at a time. The second loader hand 320 transfers and stacks the semiconductor devices from the movable loading table 330 positioned at the loading position to the test tray T.T.

The pair of maneuverable loading tables 330 reciprocate independently of the loading position and the loading position, respectively.

The buffer 340 is provided to temporarily store a semiconductor device at a position corresponding to the socket-off socket.

The removal hand 350 is located between the loading position and the loading position, and a plurality of pickers are provided in one row for transferring and loading the semiconductor element at the position corresponding to the socket-off socket from the startable loading table 330 to the buffer 340. Have a configuration in which they are arranged.

2. Description of loading method

Subsequently, the loading method by the above configuration will be described in detail.

A. Transfer from the customer tray to the movable loading table by the first loader hand

The first loader hand 310 grips eight semiconductor devices, that is, 32 semiconductor devices in four rows in the customer tray C.T. The first loader hand 310 holding the semiconductor device adjusts the space in the front and rear directions of the semiconductor devices (it may be implemented to adjust the space in the left and right directions in this process depending on the implementation) and is located in the loading position. The semiconductor device is loaded into the loading table 330. At this time, the presence or absence of a semiconductor device corresponding to the socket-off socket does not affect the present process. That is, the first loader hand 310 repeats only the process of carrying and loading the 32 semiconductor devices into the movable loading table 330 located at the loading position regardless of the presence or absence of the semiconductor device corresponding to the socket-off socket. .

B. Removing the semiconductor device corresponding to the socket-off socket by the removal hand <removal step>

Through the transfer step 1, the loaded loading table 330 is moved from the loading position to the loading position. At this time, if there is a semiconductor device corresponding to the socket-off socket, the start-up loading table 330 is a semiconductor device corresponding to the socket-off socket under the removal hand 350 located between the loading position and the loading position. Pause the movement so that is located. When the startable loading table 330 stops, the removal hand 350 grips the semiconductor device corresponding to the socket-off socket. Again, the actuation loading table 330 moves and stops so that another semiconductor element corresponding to the socket-off socket can be positioned below the removal hand 350. The removal hand 350 grips the semiconductor device corresponding to the socket-off socket. The removal hand 350 moves to the buffer 340 when the picker holds a predetermined number of semiconductor devices to load the semiconductor devices.

C. Transferring from the loading table to the test tray by the second loader hand

When the movable loading table 330 in which the semiconductor element corresponding to the socket-off socket is removed through the <removing step> is moved forward and positioned in the loading position, the second loader hand 320 places 16 semiconductor elements in two rows. A semiconductor device, that is, 32 semiconductor devices are held. The second loader hand 320 adjusts the space in the left and right directions of the semiconductor devices (it may be implemented to adjust the space in the front and rear directions in this process according to the implementation) and moves to the test tray TT to move the semiconductor devices. Load it.

A-1. Transfer from the buffer by the first loader hand to the starting loading table <retransfer step>

When the first loader hand 310 repeats the <transfer step 1> and there are 32 or more semiconductor devices in the buffer 340, the first loader hand 310 starts by holding the semiconductor devices in the buffer 340 instead of the customer tray CT. Transfer loading to the loading table 330.

The entire loading process as described above is divided into three loading processes for each picking device, that is, a loading process of the first loader hand 310, a loading process of the removal hand 350, and a loading process of the second loader hand 320. It may also be described as.

I. Loading process of the first loader hand

The first loader hand 310 repeats A. < transfer step 1 &quot; of A. during the entire loading process described above. Then, if 32 or more semiconductor devices exist in the buffer 340, the <retransfer step> of A-1. Is performed, and the <transfer step 1> of A. is continuously repeated.

That is, two processes of loading are repeatedly performed from the customer tray CT to the movable loading table 330 positioned at the holding and loading position, and when more than 32 semiconductor devices exist in the buffer 340, the buffer 340 From the gripping, loading position to the maneuverable loading table 330 located in the loading position, and from the customer tray (CT) to repeat the two processes of loading to the maneuvering loading table 330 located in the loading position.

II. Loading process of removal hand

Repeat the <remove step> of B. during the whole loading process.

That is, two processes of loading from the movable loading table 330 located between the loading position and the loading position to the grip and the buffer 340 are continuously repeated.

III. Loading process of the second loader hand

Repeat C. <Step 2 of Transfer> during the entire loading process.

That is, two processes of loading from the maneuverable loading table 330 located at the loading position to the test tray T.T are repeatedly repeated.

According to the present embodiment, each picking device (first loader hand, second loader hand, removal hand) is repeated in two processes. That is, the loading time in the test handler according to the present embodiment is the longest time taken to repeat each of the two processes. Significantly shortened loading time compared to three iterations in a test handler by an earlier filing.

Second Embodiment

1. Description of configuration

4 is a conceptual plan view of a loading apparatus of a test handler according to a second embodiment of the present invention.

The loading device 400 includes a loader hand 410, a loading buffer 440, a removal hand 451/452/453, and the like, substantially similar to the conventional loading device 100.

The loader hand 410 has a configuration in which eight pickers are arranged in front and rear rows so as to hold 16 semiconductor devices at once, and loads the semiconductor devices from the customer tray C.T to the test tray T.T.

The loading buffer 440 has a first loading portion 441 for temporarily storing a semiconductor element at a position corresponding to the socket-off socket and a second loading portion 442 for aligning the semiconductor elements.

The removal hand 451/452/453 grips the semiconductor element at a position corresponding to the socket-off socket and transfers it to the first loading portion 441 of the loading buffer 440. It has a configuration that is arranged. For reference, in Figure 4, three removal hands (451/452/453) are represented to show various positions of the removal hands (451/452/453), but among the three removal hands (451/452/453) It is preferable to have only one.

2. Description of loading method

Subsequently, the loading method by the above configuration will be described in detail.

A. Transfer from customer tray to test tray by loader hand

The loader hand 410 holds the semiconductor device in the customer tray C.T. The loader hand 410 holding the semiconductor device adjusts the distance in the front-back direction and the left-right direction of the semiconductor device and moves to the second loading part 442 of the loading buffer 440. The loader hand 410 lays down the semiconductor devices held in the second loading portion 442 of the loading buffer 440 and grips them again to align the positions of the semiconductor devices that are disturbed due to the gap adjustment. Subsequently, the loader hand 410 moves to the test tray T.T to load the held semiconductor devices. At this time, the presence or absence of a semiconductor device corresponding to the socket-off socket does not affect the present process. That is, the loader hand 410 grips the semiconductor devices regardless of the presence or absence of the semiconductor devices corresponding to the socket-off sockets, aligns them in the second loading portion 442 of the loading buffer 440, and moves them to the test tray TT. Only repeat the loading process.

B. Removal of semiconductor device corresponding to socket-off socket by removal hand

The removal hand 451/452/453 is a socket from the loading element, i.e., the second loading part 442 of the customer tray CT, the loading buffer 440 or the test tray TT regardless of step A. The semiconductor device corresponding to the turned off socket is removed.

B-a. If the removal hand of 451 is provided

The removal hand 451 reciprocates the first loading portion 441 of the customer tray CT and the loading buffer 440, and grips the semiconductor device corresponding to the socket-off socket in the customer tray CT. If more than one semiconductor device is gripped, it moves to the first loading portion 441 of the loading buffer 440 to load the semiconductor devices.

B-b. If a removal hand of 452 is provided

As the removal hand 452 reciprocates between the second loading portion 442 of the loading buffer 440 and the first loading portion 441 of the loading buffer 440, the loader hand 410 receives the loading buffer 440. If the semiconductor device at the position corresponding to the socket-off is left while the semiconductor device is aligned in the second loading part 442 of the second loading part 442, the semiconductor device having the removal hand 452 held is held, and then a predetermined number of semiconductor devices are held. It moves to the first loading portion 441 of the loading buffer 440 to load the semiconductor device.

B-c. If the removal hand with the sign 453 is provided

After the removal hand 453 reciprocates between the test tray TT and the first loading portion 441 of the loading buffer 440, and holds the semiconductor device corresponding to the socket-off socket in the test tray TT, If a predetermined number or more of the semiconductor devices are held, the semiconductor devices are moved to the first loading portion 441 of the loading buffer 440 to load the semiconductor devices.

A-1. Transfer from the first loading part of the loading buffer to the test tray by the loader hand

The loader hand 410 repeats step A. and if more than 16 semiconductor elements are present in the first loading portion 441 of the loading buffer 440, the loading buffer 440 instead of the customer tray CT. The semiconductor device is gripped by the first loading portion 441 of the c) and transferred to the test tray TT.

The overall loading process as described above may be divided into a loading process for two picking devices, that is, a loading process of the loader hand 410 and a loading process of the removal hand 451/452/453.

I. Loader Hand Loading Process

Repeat step A. of the entire loading process described above. Then, if 16 or more semiconductor devices are present in the first loading portion 441 of the loading buffer 440, step A-1 is repeated and step A. is repeated again.

That is, three processes of gripping from the customer tray CT and aligning the semiconductor elements in the second loading unit 442 of the loading buffer 440 and loading into the test tray TT are repeatedly repeated, and then the loading buffer 440. When 16 or more semiconductor elements are present in the first loading portion 441 of the first loading portion 441, the second loading portion 442 of the loading buffer 440 is gripped from the first loading portion 441 of the loading buffer 440. Aligning of semiconductor devices, loading into the test tray (TT), and holding again from the customer tray (CT), the semiconductor device in the second loading portion 442 of the loading buffer 440, loading of the loading into the test tray (TT) Repeat the three steps over and over.

II. Loading process of removal hand

Repeat step B. of the above loading process.

Loading element, that is, loading from the customer tray CT, the second loading portion 442 of the loading buffer 440 or the test tray TT to the first loading portion 441 of the loading buffer 440. Repeat these two steps.

According to the present embodiment, the loader hand 410 repeats three processes, and the removal hand 451/452/453 continues two processes. That is, the loading time in the test handler according to the present embodiment is a time taken to repeat three processes of the loader hand 410. This is a significantly shorter time compared to the loading time of repeating four or three steps in the test handler according to the prior art.

In the present embodiment, the loader hand 410 aligns the semiconductor devices in the second loading part 442 of the loading buffer 440. However, in some cases, the semiconductor device alignment process at the second loading portion of the loading buffer may be omitted. That is, the loader hand grips the semiconductor devices in the customer tray, moves to the test tray and loads them. The removal hand grips the semiconductor device corresponding to the socket off from the customer tray or the test tray, and when a predetermined number of semiconductor devices are gripped, the removal hand moves to the first loading part of the loading buffer and loads the semiconductor device. In this case, each hand is repeated two times. That is, the loading time in the test handler according to the present embodiment is a long time among the time taken to repeat each of the two processes. This is a shorter time compared to the loading time in the test handler according to the prior art.

Third Embodiment

1. Description of configuration

5 is a conceptual plan view of a loading apparatus of a test handler according to a third embodiment of the present invention.

The loading device 500 is similar to the loading device 400 of the second embodiment, such as the loader hand 510, the loading buffer 540, the removal hand 550, the first moving device and the second moving device, and the like. It is configured to include.

The loader hand 510 has an arrangement in which eight pickers are arranged in front and rear rows so as to hold 16 semiconductor devices at a time, and loads the semiconductor devices from the customer tray C.T to the test tray T.T.

The loading buffer 540 has a first loading portion 541 for temporarily storing a semiconductor element at a position corresponding to the socket-off socket and a second loading portion 542 for aligning the semiconductor elements. As referred to in 6, the bottom surface is provided with the LM block 543, and the screw hole 544 is formed in the right rear end.

The removal hand 550 has a configuration in which two pickers for holding a semiconductor element at a position corresponding to the socket-off socket and loading the same into the first loading part 541 of the loading buffer 540 are arranged side by side in the left and right directions. . Of course, depending on the implementation, it may have more pickers. The removal hand 550 is located between the loading area LA and the unloading area UA, and has a fixed position on a horizontal plane. Here, the loading area LA refers to the operating area of the loader hand 510 and the unloading area UA refers to the operating area of the unloader hand.

As shown in the schematic perspective view of FIG. 6, the first moving device is driven by being installed in the LM guide 561, the drive motor 562, and the left and right directions which are installed on the base plate BP. And a screw shaft 563 that rotates with the rotation of the motor 562.

The LM guide 561 engages with the LM block 543 to guide the movement and the return (movement in the left and right directions) of the loading buffer 540 in the right direction.

The drive motor 562 is provided at the right end of the base plate BP and is provided as a drive source for supplying rotational force to the screw shaft 563.

The screw shaft 563 rotates along the forward and reverse rotation of the drive motor 562 and is bolted to the screw hole 544.

Therefore, when the drive motor 562 is operated forward and backward, the screw shaft 563 rotates forward and backward, and in conjunction with this, the loading buffer 540 is guided to the LM guide 651 while the right side of the lower side of the removal hand 550. Direction is returned or is returned between the test tray TT and the customer tray CT in the loading area LA which is the original position.

As shown in FIG. 6, the second moving device includes a pair of LM guides respectively engaged with the LM blocks LM ₁ and LM ₂ provided in the front and rear directions on the left and right bottom surfaces of the base plate BP. 571 and 572, is configured to include the ultimate double cylinder 573 is provided as a drive source for moving the loading buffer 540, and so on for moving the base plate (BP) in the front-rear direction.

The pair of LM guides 571 and 572 are provided to guide the movement of the base plate BP in the front-rear direction.

As shown in the reference figure of FIG. 7, the double cylinder 573 has a holding position of the removal hand 550 fixed on a horizontal plane after the second loading portion 542 of the loading buffer 540. Since it is fixed to the position of the side loading row 542 a , the front loading column 542 b of the second loading part 542 of the loading buffer 540 and the second of the loading buffer 540 The front row stacking row 541 b of the first stacking section 541 of the loading buffer 540 is provided side by side in the left-right stacking row 542b of the stacking section 542. set at the grip position of the removing hand 550, the position, or the grip of the loading yongbeo buffer 540 first mounting portion 541 and then (後) side loading column (541a), removing the hand 550, the position of the position Is prepared to fit. Therefore, the advance length of the piston rod 573a-1 of the first cylinder 573a removes the position of the rear loading column 541a of the first loading portion 541 of the loading buffer 540. It is secured to fit in the holding position of 550, and the advance length of the piston rod 573b-1 of the second cylinder (573b) and the advance length of the piston rod (573a-1) of the first cylinder (573a) The positions of the front stacking rows 541b and 542b of the first loading portion 541 and the second loading portion 542 can be secured to the holding positions of the removal hand 550. Of course, such a double cylinder may be configured as a motor or the like depending on the implementation.

2. Description of loading method

Subsequently, the loading method by the above configuration will be described in detail.

A. Transfer from customer tray to test tray by loader hand

The loader hand 510 grips eight semiconductor devices, that is, sixteen semiconductor devices in two rows in the customer tray C.T. The loader hand 510 holding the semiconductor device adjusts the distance between the left and right directions and the front and rear directions of the semiconductor device and moves to the second loading part 542 of the loading buffer 540 in its original position. The loader hand 510 lays down the semiconductor devices held in the second loading portion 542 of the loading buffer 540 and grips them again to align the positions of the semiconductor devices that are disturbed due to spacing. At this time, the semiconductor element corresponding to the socket-off socket is left in the second loading portion 542. Subsequently, the loader hand 510 moves to the test tray T.T to load the held semiconductor devices. And this process is repeated over and over again.

B. Removal of semiconductor device corresponding to socket-off socket by moving and removing hand for loading buffer

After the loader hand 510 puts down the semiconductor elements held in the second loading portion 542 of the loading buffer 540 and holds them again, the driving motor 562 operates to move the loading buffer 540 to the right. To the holding position of the removal hand 550 in the left and right directions in which the semiconductor element corresponding to the socket-off socket is loaded, and the double cylinder 573 operates to correspond to the socket-off socket. The position in the front-rear direction in which is loaded is adjusted to the grip position of the removal hand 550.

When the positions in the left and right directions and the front and rear directions in which the semiconductor elements corresponding to the socket-off sockets are loaded are aligned with the holding positions of the removal hands 550, the removal hands 550 operate to correspond to the socket-off sockets. A semiconductor device is held.

When the semiconductor device corresponding to the socket turned off by the removal hand 550 is held, the driving motor 562 and the double cylinder 573 operate again in this state to move the loading buffer 540 for loading. The loading position of the first loading portion 541 of the buffer 540 is set to the holding position of the removing hand 550, and in such a state, the removing hand 550 is the first loading portion 541 of the loading buffer 540. The semiconductor device held in the stacking position at ()) is loaded. That is, the removal hand 550 changes the loading position of the semiconductor device loaded in the second loading portion 542 of the loading buffer 540 into the first loading portion 541 of the loading buffer 540. Will be done.

A-1. Transfer from the first loading part of the loading buffer to the test tray by the loader hand

The loader hand 510 repeatedly repeats step A. If more than 16 semiconductor elements are present in the first loading portion 541 of the loading buffer 540, the loading buffer 540 is not the customer tray CT. The semiconductor device is gripped by the first loading part 541 of the c) and transferred to the test tray TT.

The entire loading process as described above may be divided into two loading processes for each picking device, that is, a loading process of the loader hand 510 and a loading process according to a movement operation of the removal hand 550 and the loading buffer 540.

I. Loader Hand Loading Process

Repeat step A. of the entire loading process described above. Then, if 16 or more semiconductor elements are present in the first loading portion 541 of the loading buffer 540, step A-1 is repeated and step A. is repeated again.

That is, alignment of the semiconductor elements in the second loading portion 542 of the buffer 540 for holding and loading from the customer tray CT (the semiconductor elements corresponding to the sockets turned off in the process remain in the second loading portion), After repeating the three processes of loading into the test tray TT, if there are more than 16 semiconductor elements in the first loading portion 541 of the loading buffer 540, the first loading of the loading buffer 540 The second loading portion 542 of the holding buffer 540 for holding and loading from the portion 541 is loaded into the semiconductor device alignment and test tray TT, and then held and loaded from the customer tray CT. In the second loading portion 542 of the semiconductor element alignment, the three processes of loading into the test tray (TT) is repeatedly repeated.

II. Loading process according to movement of removal hand and loading buffer

Repeat step B. of the above loading process.

In addition to the movement of the loading element, that is, the loading buffer 540, the holding and loading buffer 540 of the semiconductor device from the second loading portion 542 of the loading buffer 540 by the removal hand 550. The two processes of loading the semiconductor element held by the first loading portion 541 are repeated repeatedly.

Meanwhile, the time when the loading buffer 540 moves from the original position between the test tray TT and the customer tray CT in the loading area LA to the holding position of the removal hand 550 is returned to the original position again. After the loader hand 510 aligns the position of the semiconductor device held by the second loading part 542 of the loading buffer 540, the semiconductor device held by the test tray TT is loaded, and then the customer tray ( It is shorter or at least equal to the time taken to hold the semiconductor element from the CT and move to the original position of the loading buffer 540. Because the driving motor 562 and the double cylinder 573 can be operated simultaneously and the moving distance of the loading buffer 540 is shorter than the moving distance of the loader hand 510, the loading buffer 540 is removed from the hand ( The time when the second loading portion 542 is set to the holding position of the removing hand 550, the time when the first loading portion 541 is set to the holding position of the removing hand 550, The sum of the time to return to the original position is the time when the loader hand 510 moves upward of the test tray TT, the time of moving upward of the customer tray CT, and the position above the original position of the loading buffer 540. Is less than or equal to the sum of the times.

That is, the loading time in the test handler according to the present embodiment is a time taken to repeat three processes of the loader hand 510. This is a significantly shorter time compared to the loading time of repeating four or three steps in the test handler according to the prior art.

In this embodiment, a first moving device for fixing the position on the horizontal surface of the removal hand 550 and moving the position of the loading buffer 540 in the left and right directions, and a second moving device moving in the front and rear directions. However, according to the implementation, the removal hand may be installed to be movable in the front-rear direction between the loading area and the unloading area, and the loading buffer may be configured to be movable only in the left-right direction, that is, having only the first moving device. . In this case, too, the test handler's loading time is the time taken for the loader hand's three iterations.

In the above embodiments, the loading process is described as an example. However, this could also be applied to the unloading process. The semiconductor devices are transported by a sorter hand (a picking device for classifying the tested semiconductor devices on the test tray by a test class and placing them on a sorting table) or an unloader hand, and a sorting table, etc., rather than a starting loading table, mediates the hands. It may be possible to remove semiconductor devices that should not be transferred by the removal hand. It can also be applied to any transfer process other than loading and unloading process. It would be possible to eliminate semiconductor devices that should not be transferred from any loading elements, including any picking device and a movable table located in any area.

In the above embodiment, only the test handler using the test tray is described. However, this can be applied to any test handler using a test board.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to preferred examples of the present invention, the present invention is limited to the above embodiments. It should not be understood that the scope of the present invention is to be understood by the claims and equivalent concepts described below.

1 is a conceptual plan view of a loading apparatus of a test handler according to the prior art.

2 is a conceptual plan view of a loading apparatus of a test handler according to an earlier application.

3 is a conceptual plan view of the loading apparatus of the test handler according to the first embodiment of the present invention.

4 is a conceptual plan view of a loading apparatus of a test handler according to a second embodiment of the present invention.

5 is a conceptual plan view of a loading apparatus of a test handler according to a third embodiment of the present invention.

6 and 7 are reference diagrams for explaining the loading apparatus of FIG.

<Description of Symbols for Main Parts of Drawings>

300, 400, 500: Loading device

340, 440, 540: loading buffer

350, 451, 452, 453, 550: removal hand

Claims (17)

A loading device for loading semiconductor devices of a customer tray into a carrier board; A test chamber provided for testing the semiconductor devices on the carrier board on which the loading is completed by the loading device; And An unloading device for unloading the semiconductor devices on the carrier board having been tested while passing through the test chamber to a customer tray; Including, The loading device, At least one movable loading table capable of reciprocating a loading position and a loading position; A first loader hand for transferring and stacking semiconductor elements of a customer tray to the at least one movable loading table located at the loading position; A second loader hand for transferring and stacking semiconductor elements from a carrier board to the carrier board in the at least one movable loading table located at the loading position; And A removal hand for grasping and removing the semiconductor device (s) in a position which should not be loaded from the at least one startable loading table; Characterized in that it comprises Test handler. The method of claim 1, The removal hand is characterized in that located between the loading position and the loading position Test handler. The method of claim 1, A buffer provided for temporarily storing the semiconductor device (s) removed by the removal hand; Characterized in that it further comprises Test handler. A loading device for loading semiconductor devices of a customer tray into a carrier board; A test chamber provided for testing the semiconductor devices on the carrier board on which the loading is completed by the loading device; And An unloading device for unloading semiconductor devices on the carrier board, which have been tested while passing through the test chamber, into a customer tray; Including, The loading device, A loader hand for transferring and stacking semiconductor elements of a customer tray to a carrier board; A removal hand for holding and removing the semiconductor element (s) at a position which should not be loaded; And A buffer provided for temporarily storing the semiconductor device (s) removed by the removal hand; Characterized in that it comprises Test handler. The method of claim 4, wherein The removal hand is characterized in that the position on the horizontal plane is fixed Test handler. The method of claim 4, wherein The removal hand is characterized in that located between the loading area and the unloading area Test handler. delete The method of claim 4, wherein A first moving device for moving and returning the buffer to a home position and a position below the removal hand spaced apart from the home position on a horizontal plane ; Characterized in that it further comprises Test handler. The method of claim 8, A second moving device for moving and returning the buffer in a direction perpendicular to a moving direction of the first moving device on a horizontal plane ; Characterized in that it further comprises Test handler. The method according to claim 1 or 4, The semiconductor device (s) in the position that should not be loaded is characterized in that the semiconductor device (s) at a position corresponding to the socket (s) made of the socket-off of the sockets of the tester head Test handler. A conveying first step of conveying and stacking the semiconductor elements of the first loading element by means of a first picking device to a movable table located in the first region; A removal step of moving the movable table loaded with semiconductor devices from the first area to the second area through the transfer step 1, and removing the semiconductor device (s) at positions not to be transferred by the removal hand; And A transfer step 2 of transferring and stacking the semiconductor elements of the movable table located in the second area in which the semiconductor element (s) at a position which should not be transferred in the removing step is removed to the second loading element by a second picking device; ; Including, The removing step, A gripping step of holding the semiconductor element (s) at a position which should not be transferred by the removal hand from the actuated table; And A loading step of transferring and stacking the semiconductor device (s) held by the removal hand in the holding step into a buffer provided for temporarily storing the semiconductor device; Characterized in that it comprises A method of transferring a semiconductor device of a test handler. The method of claim 11, The semiconductor element (s) of the position that should not be transferred is characterized in that the semiconductor element (s) in the position corresponding to the socket (s) made of the socket-off of the sockets of the tester head A method of transferring a semiconductor device of a test handler. delete The method of claim 11, A re-transfer step of transferring and stacking the semiconductor elements of the buffer to the movable table located in the first area by the first picking device when a predetermined number of semiconductor elements are loaded in the buffer; Characterized in that it further comprises A method of transferring a semiconductor device of a test handler. delete Transfer and stack the semiconductor elements from the first loading element to the second loading element, The semiconductor element (s) in positions not to be transported are placed in a buffer, Change the loading position of the semiconductor element (s) in the non-transferred position loaded on the buffer, Characterized in that for transporting and stacking the semiconductor element (s) of the position that should not be transferred later changed to the second loading element Method of transferring semiconductor device of test handler. The method of claim 16, Move the buffer below a hand provided to change the loading position to change the loading position of the semiconductor element (s) in the non-transferred position loaded on the buffer, Operating the hand in a state where the buffer is moved below the hand to change the loading position of the semiconductor element (s); Method of transferring semiconductor device of test handler.

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