KR100917801B1 - Apparatus for attaching substrates - Google Patents

Abstract

Substrate bonding apparatus according to an embodiment of the present invention is the upper chamber, the upper plate is disposed below the upper chamber and the upper plate is attached to the lower surface, the upper plate is fixed to the upper plate through the upper chamber and the upper plate lifting means for lifting the upper plate Is provided between the lower surface of the upper chamber and the upper surface of the upper plate and an elastic member for elastically supporting the upper chamber to prevent sagging of the upper plate, the lower chamber and the lower chamber in contact with the upper chamber to form a closed space formed on the upper surface of the lower And a lower plate to which the substrate is attached.

Top plate lifting means, elastic member, linear gauge

Description

Substrate Bonding Device {APPARATUS FOR ATTACHING SUBSTRATES}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding apparatus, and more particularly, to a substrate bonding apparatus for a flat panel display panel provided for bonding substrates in a manufacturing process of a flat panel display panel.

As information society has developed, the demand for display devices has increased in various forms. Recently, various flat panel display devices such as liquid crystal display (LCD), plasma display pannel (PDP), and electro luminescent display (ELD) have been studied, and some of them are widely used in real life.

Among them, LCDs are being used for mobile image display devices because of their excellent image quality compared to CRT (Cathode Ray Tube) and the advantages of light weight, thinness, and low power consumption.

A representative example of the liquid crystal display panel used in the LCD is a TFT-LCD panel. The TFT-LCD panel is composed of a TFT array substrate having a plurality of TFTs (Thin Film Transistor) formed in a matrix, a color filter substrate having a color filter, a light shielding film, or the like, and a liquid crystal layer formed between the two substrates.

Here, the TFT array substrate includes a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged in a direction perpendicular to the gate lines to define a pixel region, and formed in each pixel region. And a plurality of pixel electrodes for displaying an image, and a pixel area formed at a portion where the gate lines and the data lines cross each other, and are turned on / off by a driving signal of the gate lines to convert the image signals of the data lines to each pixel electrode. It is provided with a plurality of thin film transistors to transfer to. The color filter substrate includes a black matrix layer that blocks light in portions other than the pixel region, and R (Red), G (Green), and B (Blue) color formed in portions corresponding to the pixel regions to implement color. A filter layer and a common electrode formed on the entire surface including the color filter layer are provided.

Accordingly, in manufacturing a liquid crystal display panel used in LCD, a process of encapsulating a liquid crystal material between a TFT array substrate and a color filter substrate is required. As a method of encapsulating a liquid crystal between a TFT array substrate and a color filter substrate, a conventional liquid crystal injection method in which a liquid crystal is injected through an injection hole of a sealing agent after bonding a substrate in a vacuum, and a liquid crystal and a sealing agent are added dropwise. Can be largely classified into a liquid crystal dropping method of bonding a substrate with another substrate in a vacuum.

Here, in the liquid crystal injection method or the liquid crystal drop method substrate bonding process, the bonding of the two substrates is one of the important processes for determining the quality of the LCD. As such, a gap must be maintained between the two substrates in the vacuum chamber to bond the two substrates together, and the two substrates are brought into close proximity to each other while the gap is maintained. At this time, the substrate bonding apparatus having a structure of the upper chamber and the lower chamber is provided with a support bar on the outer end of the upper plate positioned below the upper chamber. In addition, the driving module located at the edge of the lower chamber supports the support bar installed at the outer end of the upper plate.

However, in the case of a substrate bonding apparatus for a large substrate, deflection of the central portion of the upper plate may occur, so that a constant gap between the two substrates may not be formed. Therefore, a problem arises that it is difficult to expect a precise and accurate alignment quality between the two substrates when bonding between the two substrates.

An object of the present invention is to provide a substrate bonding apparatus capable of bonding both substrates by maintaining a constant gap between the upper substrate and the lower substrate.

In order to solve the above problems, the substrate bonding apparatus according to the present invention, the upper chamber; An upper plate disposed under the upper chamber and having an upper substrate attached to a lower surface thereof; An upper plate elevating means fixed to the upper plate through the upper chamber and elevating the upper plate; An elastic member provided between the lower surface of the upper chamber and the upper surface of the upper plate to elastically support the upper chamber to prevent the upper plate from sagging; A lower chamber in contact with the upper chamber to form a closed space; A lower plate disposed above the lower chamber and having a lower substrate attached to an upper surface thereof; And a linear gauge capable of measuring a gap between the upper substrate and the lower substrate.
In addition, the upper plate lifting means may be provided with a linear actuator (linear actuator).
In addition, the elastic member may be provided with a spring.

The present invention has the effect of improving the alignment quality of the bonded substrate because the two substrates are bonded to each other by maintaining a constant gap between the upper substrate and the lower substrate. In addition, since the alignment quality of the bonded substrate is improved, there is an effect of increasing the bonding yield of the substrate bonding apparatus.

1 is a schematic cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate bonding apparatus 100 includes an upper chamber 200, an upper plate lifting means 240, an elastic member 250, and a lower chamber 300.

The upper chamber 200 is elevated by the driving unit 400. The lower surface of the upper chamber 200 is in close contact with the lower chamber 300 to form a closed space. The upper plate 210 is disposed below the upper chamber 200 and is formed in a plate shape. The lower surface of the upper plate 210 is attached to the upper substrate (S1). Therefore, the upper plate 210 may include an electrostatic chuck (ESC) for attaching the upper substrate S1 by electrostatic power.

On the upper surface of the upper chamber 200, the camera unit 220 for adjusting the relative position of the upper substrate (S1) and the lower substrate (S2), and when the upper substrate (S1) is attached to or detached from the upper plate (210) In order to increase the height of the upper substrate S1, a substrate separation device 230 is disposed.

The camera unit 220 is in an alignment state of the upper substrate S1 attached to the upper plate 210 and the lower substrate S2 to be described later through the through holes 221 formed in the upper chamber 200 and the upper plate 210. Read it.

The camera unit 220 is mounted so that the alignment marks (not shown) provided on the upper substrate S1 and the lower substrate S2 may be superimposed, and at least of the upper substrate S1 and the lower substrate S2. It is arranged to superimpose two or more diagonal edges. In this case, the lighting device 320 is installed below the lower chamber 300 to provide the camera unit 220 with illumination so that the camera unit 220 can photograph the alignment mark.

The substrate separating apparatus 230 may include a plurality of separation pins 231 disposed through the upper chamber 200 and the upper plate 210, and an outside of the upper chamber 200 to lift the separation pins 231. And a separating pin actuator 232. Separation pin 231 is installed in a hollow tube shape, a vacuum pressure is formed inside the separation pin 231 to adsorb the upper substrate (S1).

Although not shown in the drawings, the alignment unit aligns the upper substrate S1 with respect to the lower substrate S2. The alignment between the upper substrate S1 and the lower substrate S2 may be repeatedly performed a plurality of times by pre-alignment, final alignment, and the like.

In addition, although not shown, a vacuum pump is connected to form a vacuum pressure in the bonding space formed by the upper chamber 200 and the lower chamber 300. The vacuum pump may be a dry pump, a turbomolecular pump (TMP), a mechanical booster pump (MBP), or the like. In addition, the exhaust pipe (not shown) connects the bonding space and the vacuum pump to form a vacuum pressure in the bonding space. At the same time, the exhaust pipe may not only supply nitrogen gas necessary for coalescence, but also allow a pressure gas to be supplied to form the pressure in the coalescing space at an atmospheric pressure.

The upper plate lifting means 240 is fixed to the upper plate 210 by penetrating the upper chamber 200 and elevating the upper plate 210. The upper plate elevating means 240 is fixed to the upper plate 210 to support the upper plate 210 as well as by elevating the upper plate 210, the interval between the upper substrate (S1) and the lower substrate (S2) ( gap) can be adjusted. The upper plate elevating means 240 may be installed anywhere on the upper surface of the upper plate 240 if it is possible to elevate the upper plate 210. In addition, the upper plate lifting means 240 may be configured in plurality in accordance with the size of the upper plate 210 and the size of the corresponding substrate (S1, S2).

The upper plate lifting means 240 may be a linear actuator. By providing the upper and lower lifting means 240 as a linear actuator, it is preferable to be able to adjust the spacing between the two substrates (S1, S2) very finely.

The elastic member 250 elastically supports the upper plate 210 or the upper chamber 200. The elastic member 250 is installed on the upper surface of the upper plate 210 to compensate for the deflection of the upper plate 210. For example, when the top plate lifting means 240 are respectively installed at the top edge of the top plate 210, the central portion of the top plate 210 may be sag by its own weight. Therefore, an elastic member 250 is installed to support the upper plate 210 with respect to the upper chamber 200 to prevent the upper plate 210 from sagging.

At this time, the elastic member 250 is installed on the upper surface of the upper surface plate 210 to elastically support the upper surface plate 210, if the deflection of the upper surface plate 210 can compensate for the upper surface of the upper surface plate 210 It may be installed. The elastic member 250 may be formed in plural numbers according to the size of the upper surface plate 210 and the sizes of the substrates S1 and S2. For example, the elastic member 250 may be a spring. In addition, any member having elasticity may be used.

Although not shown in the drawings, the linear gauge may measure a gap between the upper substrate S1 and the lower substrate S2. The gap between the two substrates S1 and S2 measured by the linear gauge (not shown) is transmitted to the upper plate lifting means 240, and the upper plate lifting means 240 is the gap between the two substrates S1 and S2. Adjust.

The lower chamber 300 is disposed below the upper chamber 200, and the upper chamber 200 is lowered to the lower chamber 300 by the driving unit 400 so that the upper chamber 200 and the lower chamber 300 are bonded together. Form a space. The lower plate 310 is disposed above the lower chamber 300 and is formed in a plate shape. The upper surface of the lower plate 310 attaches the lower substrate S2. Therefore, the lower plate 310 may include an electrostatic chuck (ESC) for attaching the lower substrate S2 by electrostatic power.

The edge of the lower chamber 300 is provided with a sealing member 330 for contacting the lower surface of the upper chamber 200 to maintain the airtightness of the sealed space.

The lower surface of the lower chamber 300 is a substrate lifting device for attaching the lower substrate (S2) to the lower plate (310) or to separate the lower substrate (S2) attached to the lower plate (310) ( 340 is disposed.

The substrate lifting device 340 is provided with a plurality of lifting pins 341 disposed through the lower chamber 300 and the lower plate 310, and is provided outside the lower chamber 300 to lift the plurality of lifting pins 341. Lift pin actuator 342 to be included.

When the lower substrate S2 is carried between the upper chamber 200 and the lower chamber 300, the lifting pins 341 are raised to support the lower substrate S2, and then the lifting pins 341 are lowered. The lower substrate S2 serves to position the lower plate 310. In addition, when the bonding process is completed to take out the bonded substrate to the outside, the lifting pin 341 serves to raise the bonded substrate relative to the lower chamber (300).

The driving unit 400 raises and lowers the upper chamber 200 toward the lower chamber 300 so that the upper chamber 200 and the lower chamber 300 form a sealed space.

2a to 2e is an operation diagram showing an operating state of the substrate bonding apparatus according to an embodiment of the present invention.

2A to 2E, first, the upper substrate S1 and the lower substrate S2 are supplied between the upper chamber 200 and the lower chamber 300 by a substrate supply device (not shown) (see FIG. 2A). .

When the upper substrate S1 is supplied first, as the upper substrate S1 enters between the upper chamber 200 and the lower chamber 300, the separating pin 231 descends to adsorb the upper substrate S1. Thereafter, the separating pin 231 raises the upper substrate S1, and the upper substrate S1 is attached to the upper surface plate 210.

As the lower substrate S2 is supplied, the elevating pin 341 disposed in the lower chamber 300 ascends to the upper portion of the lower chamber 300 by the elevating pin actuator 342, and the elevating pin 341 is elevated. The lower substrate S2 positioned between the upper chamber 200 and the lower chamber 300 is supported. As the lifting pin 341 is lowered by the lifting pin actuator 342, the lower substrate S2 supported by the lifting pin 341 is lowered together, and the lower plate 310 located at the lower portion of the lower substrate S2. It is attached by the adhesive force.

When the attachment of the upper substrate S1 and the lower substrate S2 is completed, the upper chamber 200 is elevated to the lower chamber 300 by the driving unit 400, and the lower surface of the upper chamber 200 is lower chamber 300. While being in close contact with the upper surface of the) is formed a closed space for the bonding of the upper substrate (S1) and the lower substrate (S2) (see Figure 2b). At this time, the upper chamber 200 and the lower chamber 300 is kept airtight by the sealing member 330 disposed on the upper edge of the lower chamber 300.

When the closed space is formed, a vacuum pressure is formed in the closed space. When the vacuum pressure is formed in the sealed space, the alignment between the upper substrate (S1) and the lower substrate (S2) is performed by the alignment unit (not shown). In addition, the upper plate elevating means 240 by elevating the upper plate 210 to adjust the gap (gap) between the upper substrate (S1) and the lower substrate (S2). At this time, the gap between the upper substrate S1 and the lower substrate S2 is measured by a linear gauge (not shown). The measured value is transmitted to the upper plate lifting means 240, and the upper plate lifting means 240 adjusts the interval between the two substrates (S1, S2) by using the measured value.

Then, the upper plate 210 including the electrostatic chuck cuts off the electrostatic power, and the upper substrate S1 attached to the upper plate 210 freely falls and comes into close contact with the lower substrate S2. In addition, by supplying nitrogen gas to the outside of the upper substrate (S1) and the lower substrate (S2) in close contact, the upper substrate (S1) and the lower substrate (S2) is firmly bonded (see Fig. 2d). . That is, the upper substrate S1 and the lower substrate S2 are bonded by the pressure difference between the inside of the upper substrate S1 and the lower substrate S2, which are in close contact with each other by increasing the pressure of the closed space.

When the bonding of the upper substrate S1 and the lower substrate S2 is completed, the pressure in the sealed space is restored to the atmospheric pressure state, and the bonded substrate is taken out of the substrate bonding apparatus 100 (see FIG. 2E). At this time, the reason for restoring to the atmospheric pressure state is that the pressure can be easily controlled, and since the substrate carrying out operation is performed at the atmospheric pressure state, no further process is necessary.

Although described in detail with respect to preferred embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims Various modifications may be made to the invention. Accordingly, modifications to future embodiments of the present invention will not depart from the technology of the present invention.

1 is a schematic cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

2a to 2e is an operation diagram showing an operating state of the substrate bonding apparatus according to an embodiment of the present invention.

** Description of Signs of Major Parts of Drawings **

100: substrate bonding device

200: upper chamber

240: lifting platform

250: elastic member

300: lower chamber

400: drive unit

Claims (4)

Upper chamber; An upper plate disposed under the upper chamber and having an upper substrate attached to a lower surface thereof; An upper plate elevating means fixed to the upper plate through the upper chamber and elevating the upper plate; An elastic member provided between the lower surface of the upper chamber and the upper surface of the upper plate to elastically support the upper chamber to prevent the upper plate from sagging; A lower chamber in contact with the upper chamber to form a closed space; A lower plate disposed above the lower chamber and having a lower substrate attached to an upper surface thereof; And And a linear gauge capable of measuring a gap between the upper substrate and the lower substrate. The method of claim 1, And said upper plate elevating means is a linear actuator. The method of claim 1, The substrate bonding apparatus, characterized in that the elastic member is a spring. delete

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