KR100915179B1 - 프로브 카드 - Google Patents
프로브 카드Info
- Publication number
- KR100915179B1 KR100915179B1 KR1020077014131A KR20077014131A KR100915179B1 KR 100915179 B1 KR100915179 B1 KR 100915179B1 KR 1020077014131 A KR1020077014131 A KR 1020077014131A KR 20077014131 A KR20077014131 A KR 20077014131A KR 100915179 B1 KR100915179 B1 KR 100915179B1
- Authority
- KR
- South Korea
- Prior art keywords
- contactor
- probe
- elasticity
- elastic sheet
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims abstract description 65
- 230000002093 peripheral effect Effects 0.000 claims abstract description 25
- 238000013459 approach Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 235000012431 wafers Nutrition 0.000 description 26
- 238000007689 inspection Methods 0.000 description 9
- 230000003014 reinforcing effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (4)
- 피검사체의 전기적 특성을 검사하기 위한 프로브 카드로서,프로브를 피검사체측의 하나의 면에 지지하는 콘택터와,상기 콘택터의 다른 면에 대향하며, 상기 콘택터와 전기적으로 접속되는 회로 기판과,상기 콘택터의 다른 면과 상기 회로 기판 사이에 개재되어 상기 콘택터와 상기 회로 기판을 전기적으로 접속하며, 탄성을 갖는 접속체를 포함하고, 상기 접속체는 상기 콘택터의 외주측보다도 중앙측에 가까운 부분의 탄성이 작아지도록 형성되어 있는 것인, 프로브 카드.
- 제1항에 있어서,상기 접속체는, 상기 콘택터의 다른 면에 접촉하는 시트형으로 형성되며,상기 접속체는, 상기 콘택터의 외주측으로부터 중앙측에 근접함에 따라 단계적으로 탄성이 작아지도록 형성되어 있는 것인, 프로브 카드.
- 제2항에 있어서,상기 접속체에는, 평면에서 보아 상기 콘택터의 중심을 원심으로 하는 동심원 형으로 탄성이 상이한 영역이 형성되어 있는 것인, 프로브 카드.
- 제1항에 있어서,상기 접속체는, 상기 콘택터의 다른 면 내에 배치된 복수의 접속핀이며,상기 콘택터의 다른 면의 중앙측에는, 외주측의 접속핀보다 탄성이 작은 접속핀이 배치되어 있는 것인, 프로브 카드.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005203285A JP4472593B2 (ja) | 2005-07-12 | 2005-07-12 | プローブカード |
JPJP-P-2005-00203285 | 2005-07-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070104531A KR20070104531A (ko) | 2007-10-26 |
KR100915179B1 true KR100915179B1 (ko) | 2009-09-02 |
Family
ID=37636940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077014131A Expired - Fee Related KR100915179B1 (ko) | 2005-07-12 | 2006-06-27 | 프로브 카드 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7541820B2 (ko) |
JP (1) | JP4472593B2 (ko) |
KR (1) | KR100915179B1 (ko) |
TW (1) | TW200716987A (ko) |
WO (1) | WO2007007544A1 (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200525675A (en) * | 2004-01-20 | 2005-08-01 | Tokyo Electron Ltd | Probe guard |
WO2006095759A1 (ja) * | 2005-03-08 | 2006-09-14 | Tokyo Electron Limited | 接続ピンの形成方法,プローブ,接続ピン,プローブカード及びプローブカードの製造方法 |
KR100851392B1 (ko) * | 2007-03-16 | 2008-08-11 | (주)엠투엔 | 평탄화 수단을 구비한 프로브 카드 |
WO2008120654A1 (ja) * | 2007-03-30 | 2008-10-09 | Jsr Corporation | 異方導電性コネクター、プローブ部材およびウエハ検査装置 |
JP5015671B2 (ja) * | 2007-06-21 | 2012-08-29 | 日本電子材料株式会社 | プローブカード |
JP2009133722A (ja) * | 2007-11-30 | 2009-06-18 | Tokyo Electron Ltd | プローブ装置 |
JP5188161B2 (ja) * | 2007-11-30 | 2013-04-24 | 東京エレクトロン株式会社 | プローブカード |
JP2009204393A (ja) * | 2008-02-27 | 2009-09-10 | Renesas Technology Corp | プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法 |
JP2009301859A (ja) * | 2008-06-12 | 2009-12-24 | Japan Electronic Materials Corp | Icピンフレームおよびicピンを用いたプローブカード |
KR101593521B1 (ko) * | 2009-08-07 | 2016-02-15 | 삼성전자주식회사 | 테스터 및 이를 구비한 반도체 디바이스 검사 장치 |
DE202009014987U1 (de) * | 2009-10-28 | 2010-02-18 | Feinmetall Gmbh | Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen |
US8643394B2 (en) * | 2010-04-16 | 2014-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Non-reflow probe card structure |
WO2012095997A1 (ja) * | 2011-01-16 | 2012-07-19 | 日本電子材料株式会社 | プローブカード及びその製造方法 |
US9891273B2 (en) * | 2011-06-29 | 2018-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test structures and testing methods for semiconductor devices |
JP7075725B2 (ja) * | 2017-05-30 | 2022-05-26 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP7590820B2 (ja) * | 2020-06-17 | 2024-11-27 | 株式会社ヨコオ | プローブカード |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004077153A (ja) * | 2002-08-09 | 2004-03-11 | Japan Electronic Materials Corp | プローブカード |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
JP3114999B2 (ja) | 1994-11-15 | 2000-12-04 | フォームファクター,インコーポレイテッド | 柔軟性ワイヤからの電気的接触構造 |
US6483328B1 (en) | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
DE60238824D1 (de) * | 2001-02-09 | 2011-02-17 | Jsr Corp | "anisotroper leitfähiger verbinder, herstellungsverfahren dafür und sondenglied" |
US7396236B2 (en) * | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
JP3891798B2 (ja) * | 2001-06-19 | 2007-03-14 | 松下電器産業株式会社 | プローブ装置 |
US6677771B2 (en) * | 2001-06-20 | 2004-01-13 | Advantest Corp. | Probe contact system having planarity adjustment mechanism |
TW525273B (en) * | 2002-02-07 | 2003-03-21 | Via Tech Inc | Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof |
US7372286B2 (en) * | 2006-01-03 | 2008-05-13 | Chipmos Technologies (Bermuda) Ltd. | Modular probe card |
-
2005
- 2005-07-12 JP JP2005203285A patent/JP4472593B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-27 WO PCT/JP2006/312790 patent/WO2007007544A1/ja active Application Filing
- 2006-06-27 US US11/883,885 patent/US7541820B2/en not_active Expired - Fee Related
- 2006-06-27 KR KR1020077014131A patent/KR100915179B1/ko not_active Expired - Fee Related
- 2006-06-28 TW TW095123260A patent/TW200716987A/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004077153A (ja) * | 2002-08-09 | 2004-03-11 | Japan Electronic Materials Corp | プローブカード |
Also Published As
Publication number | Publication date |
---|---|
TW200716987A (en) | 2007-05-01 |
JP4472593B2 (ja) | 2010-06-02 |
WO2007007544A1 (ja) | 2007-01-18 |
US7541820B2 (en) | 2009-06-02 |
TWI293120B (ko) | 2008-02-01 |
KR20070104531A (ko) | 2007-10-26 |
JP2007024533A (ja) | 2007-02-01 |
US20080150558A1 (en) | 2008-06-26 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
PA0105 | International application |
Patent event date: 20070621 Patent event code: PA01051R01D Comment text: International Patent Application |
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PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20081031 Patent event code: PE09021S01D |
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E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20090529 |
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GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20090826 Patent event code: PR07011E01D |
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