KR100891316B1 - Heat Pipe Type Hot Plate by Induction Heating - Google Patents

Abstract

The present invention relates to a heat pipe type hot plate by induction heating for realizing uniformity of temperature and rapid heating, and more particularly, a lower plate having a non-thermal conductivity and having an induction coil wound from the center to the edge; A certain thickness of the lower center and the edge forms a protrusion, and the upper side is concentric with the center, and the upper side inducing heat generation of the induction coil by forming a barrier film on the upper edge and an induction film formed with guide grooves at regular intervals from the center. A plate; An upper plate coupled to the upper plate to induce induced heat of the upper plate; Including but not limited to

The outer side of the central side protrusion of the upper plate and the inner side of the edge protrusion is configured to be interviewed to the guide coil of the lower plate relates to a hot plate, characterized in that to combine the lower plate and the upper plate.

Hot Plates, Baking, Wafers, Heat Pipes, Semiconductors

Description

Heat Pipe Type Hot Plate by Induction Heating {Heat Pipe Type Hot Plate by Induction Heating}

1 is an exploded perspective view of a hot plate according to an embodiment of the present invention;

2 is a view showing a plane of the lower plate of FIG.

3 is a plan view of the upper plate of FIG.

4 is a perspective view showing a plane of the upper plate of FIG.

5 is a perspective view showing a bottom surface of the upper plate of FIG.

6 is an exploded perspective view of a hot plate according to another embodiment of the present invention;

7 is a bottom view of the upper plate of FIG. 6, FIG.

8 is a perspective view showing a plane of the upper plate of FIG.

9 is a perspective view illustrating a bottom surface of the upper plate of FIG. 6.

<Description of Symbols for Major Parts of Drawings>

10: lower plate 11: heating wire

20: upper plate 21, 22: protrusion

23: guide groove 24: guide membrane

25: barrier 30: top plate

The present invention relates to a heat pipe type hot plate by induction heating for heating a wafer having improved response speed and temperature uniformity in order to improve the degree of integration of a semiconductor.

Recently, as semiconductor integrated circuits are increasingly integrated, the critical dimension of a photo process is decreasing. Accordingly, when performing the photo process, it is required that the temperature of the wafer have uniformity. This is because the photoresist (photoresist film) for the exposure process is applied to the wafer (1 ~ 3㎛) so that a fine circuit pattern can be formed by differently responding to the irradiation of light when transferring the semiconductor circuit designed during the photo process to the wafer. After baking, the baking step of applying a high temperature heat to the wafer is required when baking the photosensitive film applied on the wafer to increase the adhesion of the photosensitive film when etching or developing it. . This is because if the temperature is not uniform, unexpected changes may be made to the photosensitive film deposited on the wafer.

On the other hand, the conventional hot plate is covered with a metal material to protect the heat wire from the outside after inserting the hot wire inside, and then performing a TIG welding, plasma welding and laser welding, in this case, the thermal deformation and residual stress is increased and the welding depth is limited There was a problem that the response speed and temperature uniformity of the hot plate is lowered.

Accordingly, the present invention has been made to solve the above problems, an object of the present invention is to provide a hot plate that contributes to the production of more precise semiconductor components by implementing a uniform temperature and rapid heating.

An object of the present invention as described above, the lower plate having a non-thermal conductivity and the induction coil is wound from the center to the edge; A certain thickness of the lower center and the edge forms a protrusion, and the upper side is concentric with the center, and the upper side inducing heat generation of the induction coil by forming a barrier film on the upper edge and an induction film formed with guide grooves at regular intervals from the center. A plate; An upper plate coupled to the upper plate to induce induced heat of the upper plate; Including but not limited to

The outer side of the center side protrusion of the upper plate and the inner side of the edge protrusion are configured to be interviewed by the induction coil of the lower plate, and is achieved by a heat pipe type hot plate by induction heating, characterized in that the lower plate and the upper plate are combined. .

Here, the upper side of the upper plate is injected with a working fluid, characterized in that the heat pipe is further provided between the induction film formed with the guide groove.

Further features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It should be interpreted as a meaning and concept that is consistent.

Hereinafter, with reference to the accompanying drawings showing a preferred embodiment of the present invention will be described in detail, in adding reference numerals to the components of each drawing, the same components are possible even if displayed on different drawings It should be noted that the same reference numerals are used. In describing the present invention, when it is determined that the detailed description of the related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

The present invention relates to a heat pipe type hot plate by induction heating for realizing uniformity of temperature and rapid heating, and has a large non-thermal conductivity and a lower plate 10 wound with an induction coil 11 from a center to an edge. ), And a predetermined thickness of the lower center and the edge forms the protrusions 21 and 22, and the upper side is concentric with the center, and the guide film 24 and the upper edge where the guide grooves 23 are formed at regular intervals from the center. An upper plate 20 for inducing heat generation of the induction coil 11 by forming a blocking film 25 in the upper plate, and an upper plate coupled to the upper plate 20 to induce induction heat of the upper plate 20 ( 30).

This hot plate is used for heating and drying semiconductor wafers, heating LCD (liquid crystal) display substrates, heating CVD, plasma etching, heating and drying other electronic components, and decisively affecting the quality and yield of the components. Since the temperature uniformity is one of the most important factors, the winding of the induction coil 11 and the upper plate 20 which induces the heat generation of the induction coil 11 and the upper plate which induces the induction heat of the upper plate 20. Material selection of (30) is key.

Accordingly, the upper plate 20 and the upper plate 30 are preferably made of a metal base material having excellent thermal conductivity such as inconel, titanium, nickel, sus, aluminum, and the like. In addition, the coating layer may be coated with a ceramic layer having excellent abrasion resistance, corrosion resistance, oxidation resistance, and heat insulation to improve durability and reliability of the metal base material.

In addition, the outer side of the center side protrusion 21 of the upper plate 20 and the inner side of the edge protrusion 22 are configured to be interviewed with the guide coil 11 of the lower plate 10 and the lower plate 10. Combining the upper plate 20 to improve the thermal conductivity. Specifically, the center of the lower plate 10 (where the induction coil is not wound) corresponds to the area of the central side protrusion 21 of the upper plate 20, and the height of the protrusion 21 is lower than that of the lower plate 10. It should coincide with the height of the guide coil 11 with respect to the center. This also applies to the relationship between the outer side of the induction coil 11 wound to the edge of the lower plate 10 and the protrusion 22 formed on the edge of the upper plate 20. Therefore, the upper plate 30 which induces the induced heat transferred to the upper plate 20 in such a configuration has a uniform heat distribution.

On the other hand, the hot plate of such a configuration may have a variety of forms, such as rectangular, octagonal, circular, etc. in consideration of the intended use, installation location, size, etc., the present invention will be described by taking an example of a circular shape as shown in the drawings. Reference should be made.

Coupling of the upper plate 20 and the upper plate 30 is made by brazing operation, and preferably uses electron beam welding with low thermal strain and excellent residual stress during welding.

Meanwhile, in the present invention, a working fluid is injected into the upper side of the upper plate 20, and a heat pipe is provided between the induction membranes 24 in which the induction grooves 23 are formed, together with the induction coil 11 of the lower plate 10. By generating heat, rapid heating and temperature uniformity of the hot plate can be achieved. In this case, the induction groove 23 and the induction film 24 are provided to serve as a supporting structure to prevent deformation of the upper plate in the case of applying pressure to the wafer working on the upper plate, so that there is no pressure applied from the upper plate. In the case of the induction groove 23 and the induction film 24, the entire space may be provided as a heat pipe. In this case, the guide groove 23 is formed at a position where the fluid does not interfere with the movement of the working fluid as much as possible through the different guide membranes 24. That is, the heat conduction of the working fluid is rapidly diffused into the entire space through the guide groove (23).

The heat pipe vacuums the inside of the metal tube, and then inserts a sensitive working fluid into contact with hot hot water or electricity on one side, and the working fluid turns into a vapor state inside the metal tube and moves in the other direction without applying heat to heat the entire metal tube. It is a heat transfer mechanism that transfers a large amount of heat in an instant by using evaporation of converting liquid into gas and high latent heat absorbed and released when the gas condenses into liquid. Therefore, the fluid receiving the heat of the heat pipe convex along the induction membrane 24 having the induction groove 23 formed therein, and evenly pressurizes the pressure field of the upper plate 20 by promoting the vaporization and condensation of the fluid. To maintain a uniform heat distribution on the top plate 30.

On the other hand, another embodiment of the hot plate according to the present invention has a non-thermal conductivity and the lower plate 10 is wound around the induction coil 11 from the center to the edge, and the predetermined thickness of the center and the edge of the lower protrusion 21, 22) and the upper side is formed to include a flat upper plate 20 to induce heat generation of the induction coil (11).

Here, the outer side of the center side protrusions 21 and 22 of the upper plate 20 and the inner side of the edge protrusions 21 and 22 are configured to be interviewed with the guide coil 11 of the lower plate 10. Features of the configuration are omitted because it is described in the above embodiment, the coupling of the upper plate 20 and the lower plate 10 can be coupled by various coupling means such as bolts, nuts.

The present invention as described above has the effect of improving the work function of the hot plate by achieving rapid heating and uniformity of temperature.

Although the present invention has been described in connection with a preferred embodiment, those of ordinary skill in the art will be able to easily make various changes and modifications without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation, and the true scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the equivalent scope are included in the present invention. Should be interpreted as.

Claims (8)

In a hot plate for realizing temperature uniformity and rapid heating, A lower plate 10 having a non-thermal conductivity and having a heating wire 11 wound from a center to an edge thereof; A predetermined thickness of the center and the edge of the lower side to form the protrusions (21, 22), the upper side is formed to be flat to induce heat generation of the heating wire (11); The outer side of the central side protrusion 21 of the upper plate 20 and the inner side of the edge protrusion 22 are configured to be interviewed by the heating wire 11 of the lower plate 10 so that the lower plate 10 and the upper plate ( 20) The material of the upper plate 20 is a heat pipe type hot plate by induction heating, characterized in that the metal material having electrical conductivity and thermal conductivity for induction heating. delete The method of claim 1, The coupling of the upper plate 20 and the lower plate 10 is brazing, or a heat pipe type hot plate by induction heating, characterized in that the coupling by the coupling means. In a hot plate for realizing temperature uniformity and rapid heating, A lower plate 10 having a non-thermal conductivity and having a heating wire 11 wound from a center to an edge thereof; A certain thickness of the lower center and the edge forms the protrusions 21 and 22, and the upper side is concentric with the center, and the induction film 24 having the guide grooves 23 formed at regular intervals from the center and the blocking film at the upper edge thereof. An upper plate 20 which forms 25 to induce heat generation of the heating wire 11; Including the upper plate 30 coupled to the upper plate 20 to induce the induced heat of the upper plate 20; The outer side of the center side protrusion 21 of the upper plate 20 and the inner side of the edge protrusion 22 are configured to be interviewed with the heating wire 0 of the lower plate 10 so that the lower plate 10 and the upper plate 20 Heat pipe type hot plate by induction heating, characterized in that combined). The method of claim 4, wherein The material of the upper plate 20 and the upper plate 30 is a heat pipe type hot plate by induction heating, characterized in that the metal material having thermal conductivity. The method of claim 4, wherein The coupling of the upper plate 20 and the lower plate 10, and the coupling of the upper plate 20 and the upper plate 30 is a heat pipe type by induction heating, characterized in that the coupling by brazing (Brazing). Hot plate. The method of claim 4, wherein The upper side of the upper plate 20 is injected into the working fluid, the heat pipe type hot plate by induction heating, characterized in that the heat pipe is further provided between the induction film 24, the induction groove 23 is formed. The method of claim 4, wherein The induction film 24 is a heat pipe type hot plate by induction heating, characterized in that provided to prevent deformation due to the pressure applied to the upper plate.

Images