KR100745867B1 - 수직열처리장치 및 피처리체를 운송하는 방법 - Google Patents
수직열처리장치 및 피처리체를 운송하는 방법 Download PDFInfo
- Publication number
- KR100745867B1 KR100745867B1 KR1020010050801A KR20010050801A KR100745867B1 KR 100745867 B1 KR100745867 B1 KR 100745867B1 KR 1020010050801 A KR1020010050801 A KR 1020010050801A KR 20010050801 A KR20010050801 A KR 20010050801A KR 100745867 B1 KR100745867 B1 KR 100745867B1
- Authority
- KR
- South Korea
- Prior art keywords
- holder
- loading
- transport
- heat treatment
- wafer
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 202
- 238000000034 method Methods 0.000 title description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 265
- 238000011068 loading method Methods 0.000 claims description 391
- 238000011084 recovery Methods 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 abstract description 149
- 238000012545 processing Methods 0.000 abstract description 39
- 239000011261 inert gas Substances 0.000 abstract description 14
- 238000005192 partition Methods 0.000 abstract description 11
- 238000011282 treatment Methods 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 252
- 230000032258 transport Effects 0.000 description 177
- 230000007723 transport mechanism Effects 0.000 description 85
- 239000004065 semiconductor Substances 0.000 description 58
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 41
- 229910001873 dinitrogen Inorganic materials 0.000 description 39
- 238000001816 cooling Methods 0.000 description 36
- 239000012809 cooling fluid Substances 0.000 description 34
- 239000007789 gas Substances 0.000 description 24
- 230000003028 elevating effect Effects 0.000 description 21
- 230000033001 locomotion Effects 0.000 description 19
- 230000005540 biological transmission Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 10
- 239000012535 impurity Substances 0.000 description 9
- 238000000926 separation method Methods 0.000 description 9
- 238000007664 blowing Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000036961 partial effect Effects 0.000 description 6
- 230000006641 stabilisation Effects 0.000 description 6
- 238000011105 stabilization Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 230000008602 contraction Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007670 refining Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000009993 protective function Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 241000761557 Lamina Species 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/0084—Charging; Manipulation of SC or SC wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
- F27D5/0037—Supports specially adapted for semi-conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (21)
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 복수의 열처리된 피처리체를 적층형태로 지지하기 위하여 홀더를 그 위에 적재하기 위한 홀더적재테이블 및;홀더의 바닥판의 형태에 대응하는 복수의 돌출부와 복수의 돌출부 사이의 거리를 변화시키기 위한 거리변환기구를 포함하는 홀더위치조절기구로 구성된 홀더지지기구를 가지는 것을 특징으로 하는 수직열처리장치.
- 제11항에 있어 상기 홀더지지기구는 상기 홀더적재테이블을 상기 홀더적재테이블의 홀더적재표면을 따른 평면 위에서 이동하도록 하기 위한 슬라이딩기구를 더 구비하는 것을 특징으로 하는 수직열처리장치.
- 제11항에 있어, 상기 홀더지지기구는 상기 홀더적재테이블을 소정의 위치로 복귀시키는 복구기구이며, 상기 홀더적재테이블의 홀더적재표면을 따른 평면 위에서 상기 홀더적재테이블을 다른 방향으로 힘을 가하기 위한 힘 인가기구를 포함하는 복구기구를 더 구비하는 것을 특징으로 하는 수직열처리장치.
- 적층형태로 열처리된 복수의 피처리체를 고정하는 역할을 하는 홀더를 홀더적재테이블 위에 적재시키는 적재단계와;상기 적재단계에서 상기 홀더적재테이블 위에 적재된 상기 홀더를, 상기 홀더적재테이블과 함께 상기홀더적재테이블의 홀더적재표면을 따른 평면 위에서 이동시켜, 상기 홀더를 소정의 위치에 위치시키기 위한 위치조절단계와;상기 피처리체를 상기 위치조절단계에서 위치조절된 상기 홀더에 운송하기 위한 운송단계 및;상기 운송단계에서 상기 피처리체가 운송된 상기 홀더를, 홀더적재테이블을 소정의 위치에 복귀시키기 위하여, 상기 홀더적재테이블로부터 상기 홀더를 제거하는 복구단계로 구성되는 것을 특징으로 하는 피처리체 운송방법.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000253201A JP3941359B2 (ja) | 2000-08-23 | 2000-08-23 | 被処理体の処理システム |
JPJP-P-2000-00253201 | 2000-08-23 | ||
JPJP-P-2000-00372099 | 2000-12-06 | ||
JP2000372098A JP3578983B2 (ja) | 2000-12-06 | 2000-12-06 | 縦型熱処理装置、および被処理体移載方法 |
JP2000372099A JP3593025B2 (ja) | 2000-12-06 | 2000-12-06 | 熱処理装置及びローディング室の冷却方法 |
JPJP-P-2000-00372098 | 2000-12-06 | ||
JP2001004971A JP2002208623A (ja) | 2001-01-12 | 2001-01-12 | 縦型熱処理装置およびその制御方法 |
JPJP-P-2001-00004971 | 2001-01-12 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070007834A Division KR100825134B1 (ko) | 2000-08-23 | 2007-01-25 | 수직열처리장치 |
KR1020070007836A Division KR100733168B1 (ko) | 2000-08-23 | 2007-01-25 | 수직열처리장치와 수직열처리장치의 제어방법 |
KR1020070007838A Division KR100733169B1 (ko) | 2000-08-23 | 2007-01-25 | 열처리장치 및 그 장치의 적재챔버를 냉각하는 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020015966A KR20020015966A (ko) | 2002-03-02 |
KR100745867B1 true KR100745867B1 (ko) | 2007-08-02 |
Family
ID=27481554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010050801A KR100745867B1 (ko) | 2000-08-23 | 2001-08-22 | 수직열처리장치 및 피처리체를 운송하는 방법 |
Country Status (4)
Country | Link |
---|---|
US (4) | US7059849B2 (ko) |
EP (3) | EP1182693A3 (ko) |
KR (1) | KR100745867B1 (ko) |
TW (1) | TW522482B (ko) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1347496A3 (en) * | 2002-03-12 | 2006-05-03 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus and substrate treating method |
JP4278676B2 (ja) | 2005-11-30 | 2009-06-17 | Tdk株式会社 | 密閉容器の蓋開閉システム |
KR101333363B1 (ko) * | 2006-10-13 | 2013-11-28 | 도쿄엘렉트론가부시키가이샤 | 열처리 장치 |
US8747052B2 (en) * | 2006-11-22 | 2014-06-10 | Beijing Sevenstar Electronics Co., Ltd. | Automation for high throughput semiconductor batch-wafer processing equipment |
JP4327206B2 (ja) * | 2007-01-30 | 2009-09-09 | 東京エレクトロン株式会社 | 縦型熱処理装置及び縦型熱処理方法 |
KR100819098B1 (ko) * | 2007-04-16 | 2008-04-03 | 삼성전자주식회사 | 로트단위 운송처리기능을 갖는 종형로 반도체 제조설비 및그 운송처리방법 |
US7758338B2 (en) * | 2007-05-29 | 2010-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate carrier, port apparatus and facility interface and apparatus including same |
JP5050761B2 (ja) * | 2007-10-03 | 2012-10-17 | 東京エレクトロン株式会社 | 被処理体の処理システム及び被処理体の熱処理方法 |
JP4821756B2 (ja) * | 2007-10-19 | 2011-11-24 | 東京エレクトロン株式会社 | 被処理体の移載機構、被処理体の移載方法及び被処理体の処理システム |
DE102007051726A1 (de) * | 2007-10-25 | 2009-04-30 | Hänel & Co. | Lageranordnung mit vorgebbarer Lagerungsatmosphäre |
WO2009079636A2 (en) * | 2007-12-18 | 2009-06-25 | Entegris, Inc. | Methods and apparatuses for controlling contamination of substrates |
US9633881B2 (en) | 2008-02-05 | 2017-04-25 | Brooks Automation, Inc. | Automatic handling buffer for bare stocker |
KR101702901B1 (ko) * | 2008-02-05 | 2017-02-06 | 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 | 베어 스토커용 자동 취급 버퍼 |
US8070410B2 (en) * | 2008-02-05 | 2011-12-06 | Lutz Rebstock | Scalable stocker with automatic handling buffer |
KR101119497B1 (ko) * | 2009-01-05 | 2012-02-28 | 김영희 | 가스 순환장치를 구비한 열처리로 |
JP4973675B2 (ja) * | 2009-02-26 | 2012-07-11 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP5452152B2 (ja) * | 2009-09-30 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | 検査装置 |
JP5477955B2 (ja) | 2010-02-25 | 2014-04-23 | 株式会社日立国際電気 | 熱処理装置および半導体装置の製造方法 |
JP5398595B2 (ja) * | 2010-03-04 | 2014-01-29 | 東京エレクトロン株式会社 | 基板収納装置 |
JP5806811B2 (ja) * | 2010-10-01 | 2015-11-10 | 株式会社日立国際電気 | 基板処理装置、基板処理方法および半導体装置の製造方法 |
JP5625981B2 (ja) * | 2011-02-10 | 2014-11-19 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
JP5614352B2 (ja) * | 2011-03-29 | 2014-10-29 | 東京エレクトロン株式会社 | ローディングユニット及び処理システム |
US9557090B2 (en) * | 2011-04-06 | 2017-01-31 | Celltronix | Method and scalable devices for hyper-fast cooling |
US9234369B2 (en) | 2012-03-21 | 2016-01-12 | Carrier Corporation | Furnace door latch assembly |
US8932945B2 (en) * | 2012-07-09 | 2015-01-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer alignment system and method |
JP5993252B2 (ja) * | 2012-09-06 | 2016-09-14 | 東京エレクトロン株式会社 | 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法 |
KR102297447B1 (ko) | 2013-08-12 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 팩토리 인터페이스 환경 제어들을 갖는 기판 프로세싱 시스템들, 장치, 및 방법들 |
KR20170091661A (ko) | 2014-11-25 | 2017-08-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 캐리어 및 퍼지 챔버 환경 제어들을 이용하는 기판 프로세싱 시스템들, 장치, 및 방법들 |
KR101957751B1 (ko) | 2015-01-21 | 2019-03-13 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치 |
JP6366515B2 (ja) * | 2015-01-23 | 2018-08-01 | 東京エレクトロン株式会社 | 連結構造及びこれを用いた磁気アニール装置、並びに連結方法 |
US10062599B2 (en) * | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
JP6505001B2 (ja) * | 2015-11-18 | 2019-04-24 | 東京エレクトロン株式会社 | ウエハボート支持台及びこれを用いた熱処理装置 |
US20170191685A1 (en) * | 2015-12-30 | 2017-07-06 | Lam Research Corporation | Self-sustained in-situ thermal control apparatus |
JP6441244B2 (ja) | 2016-02-02 | 2018-12-19 | 株式会社Kokusai Electric | 基板処理装置 |
WO2017163376A1 (ja) | 2016-03-24 | 2017-09-28 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法および記録媒体 |
US11694907B2 (en) * | 2016-08-04 | 2023-07-04 | Kokusai Electric Corporation | Substrate processing apparatus, recording medium, and fluid circulation mechanism |
CN108318297B (zh) * | 2017-12-28 | 2020-11-10 | 安徽环科检测中心有限公司 | 一种工业污水检测用抽样设备 |
US10858738B2 (en) * | 2018-03-29 | 2020-12-08 | Asm International N.V. | Wafer boat cooldown device |
JP7206678B2 (ja) * | 2018-07-30 | 2023-01-18 | Tdk株式会社 | ロードポート装置、半導体製造装置及びポッド内雰囲気の制御方法 |
JP7093318B2 (ja) * | 2019-02-18 | 2022-06-29 | 台湾大福高科技設備股▲分▼有限公司 | 物品保管設備 |
JP7422577B2 (ja) * | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | ロードポート及び制御方法 |
CN111790582B (zh) * | 2020-07-28 | 2021-06-29 | 苏州市鑫达试验设备有限公司 | 一种立式多层高精度多腔式加热装置 |
CN111944956B (zh) * | 2020-08-06 | 2022-07-05 | 陈丹 | 一种便于工件收集的热处理工装 |
KR20220053854A (ko) * | 2020-10-23 | 2022-05-02 | 피코앤테라(주) | 이에프이엠 |
TW202249142A (zh) * | 2021-02-25 | 2022-12-16 | 日商東京威力科創股份有限公司 | 基板搬送機構及基板搬送方法 |
TWI838699B (zh) * | 2022-02-21 | 2024-04-11 | 晟耀光電科技股份有限公司 | 一種晶圓多向翻轉檢測機台 |
CN118448301B (zh) * | 2024-04-23 | 2024-09-24 | 上海稷以科技有限公司 | 气体内外循环-晶圆冷却方法及系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224144A (ja) * | 1993-01-21 | 1994-08-12 | Tokyo Electron Tohoku Ltd | 処理装置 |
JPH11274267A (ja) * | 1998-03-23 | 1999-10-08 | Tokyo Electron Ltd | 処理方法および処理装置 |
KR20000034872A (ko) * | 1998-11-18 | 2000-06-26 | 히가시 데쓰로 | 기판 처리장치 및 기판 처리방법 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2830923B2 (ja) * | 1990-03-19 | 1998-12-02 | 松下電器産業株式会社 | 基板サポート部の自動段取り替え方法およびその装置 |
US5261935A (en) * | 1990-09-26 | 1993-11-16 | Tokyo Electron Sagami Limited | Clean air apparatus |
KR0148384B1 (ko) | 1990-09-26 | 1998-12-01 | 이노우에 다케시 | 종형열처리장치 |
JP3086910B2 (ja) | 1990-11-15 | 2000-09-11 | 東京エレクトロン株式会社 | 半導体処理装置 |
US5055036A (en) * | 1991-02-26 | 1991-10-08 | Tokyo Electron Sagami Limited | Method of loading and unloading wafer boat |
JP2756734B2 (ja) * | 1991-03-22 | 1998-05-25 | 大日本スクリーン製造株式会社 | 表面処理装置のウエハ移替装置 |
JPH0521581A (ja) | 1991-07-15 | 1993-01-29 | Tokyo Electron Ltd | 真空処理装置 |
US5697749A (en) * | 1992-07-17 | 1997-12-16 | Tokyo Electron Kabushiki Kaisha | Wafer processing apparatus |
JP3177035B2 (ja) * | 1992-11-26 | 2001-06-18 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
US5514196A (en) * | 1993-02-04 | 1996-05-07 | Tokyo Electron Limited | Air cleaning apparatus |
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
JP3543987B2 (ja) * | 1993-12-03 | 2004-07-21 | 東京エレクトロン株式会社 | 処理装置 |
JP3279727B2 (ja) | 1993-04-30 | 2002-04-30 | 東京エレクトロン株式会社 | 熱処理装置 |
JPH06349749A (ja) | 1993-06-07 | 1994-12-22 | Kokusai Electric Co Ltd | 半導体製造装置 |
JP3331746B2 (ja) * | 1994-05-17 | 2002-10-07 | 神鋼電機株式会社 | 搬送システム |
DE59611078D1 (de) | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
US5846073A (en) * | 1997-03-07 | 1998-12-08 | Semitool, Inc. | Semiconductor furnace processing vessel base |
JPH10284577A (ja) * | 1997-04-09 | 1998-10-23 | Tokyo Electron Ltd | 被処理基板の移載方法 |
US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
US6000638A (en) | 1997-11-03 | 1999-12-14 | Caterpillar Inc. | Apparatus for strengthening a fuel injector tip member |
JP3264879B2 (ja) | 1997-11-28 | 2002-03-11 | 東京エレクトロン株式会社 | 基板処理システム、インターフェイス装置、および基板搬送方法 |
US6222161B1 (en) * | 1998-01-12 | 2001-04-24 | Tokyo Electron Limited | Heat treatment apparatus |
JP4042812B2 (ja) | 1998-03-06 | 2008-02-06 | 株式会社日立国際電気 | 半導体製造装置 |
JPH11284044A (ja) | 1998-03-27 | 1999-10-15 | Mecs Corp | 薄型基板搬送ロボット |
JP4096404B2 (ja) * | 1998-04-15 | 2008-06-04 | 神鋼電機株式会社 | 半導体製造装置における外部設置型ロードポート装置 |
US6079927A (en) | 1998-04-22 | 2000-06-27 | Varian Semiconductor Equipment Associates, Inc. | Automated wafer buffer for use with wafer processing equipment |
JPH11329989A (ja) * | 1998-05-21 | 1999-11-30 | Kokusai Electric Co Ltd | 基板処理装置 |
JP2000353665A (ja) | 1999-06-11 | 2000-12-19 | Kokusai Electric Co Ltd | 基板処理装置 |
WO2001006560A1 (fr) | 1999-07-14 | 2001-01-25 | Tokyo Electron Limited | Dispositif d'ouverture/fermeture pour un couvercle d'ouverture/fermeture de boite de stockage d'objet non traite et systeme de traitement d'objet non traite |
-
2001
- 2001-08-22 KR KR1020010050801A patent/KR100745867B1/ko active IP Right Grant
- 2001-08-22 TW TW090120653A patent/TW522482B/zh not_active IP Right Cessation
- 2001-08-23 EP EP01203171A patent/EP1182693A3/en not_active Withdrawn
- 2001-08-23 EP EP08161737A patent/EP1986216B1/en not_active Expired - Lifetime
- 2001-08-23 US US09/934,756 patent/US7059849B2/en not_active Expired - Lifetime
- 2001-08-23 EP EP06076596A patent/EP1734564B1/en not_active Expired - Lifetime
-
2004
- 2004-09-14 US US10/939,432 patent/US7210924B2/en not_active Expired - Lifetime
-
2007
- 2007-02-13 US US11/705,443 patent/US7819658B2/en not_active Expired - Fee Related
-
2010
- 2010-08-03 US US12/849,317 patent/US8147241B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224144A (ja) * | 1993-01-21 | 1994-08-12 | Tokyo Electron Tohoku Ltd | 処理装置 |
JPH11274267A (ja) * | 1998-03-23 | 1999-10-08 | Tokyo Electron Ltd | 処理方法および処理装置 |
KR20000034872A (ko) * | 1998-11-18 | 2000-06-26 | 히가시 데쓰로 | 기판 처리장치 및 기판 처리방법 |
Also Published As
Publication number | Publication date |
---|---|
US7210924B2 (en) | 2007-05-01 |
EP1986216B1 (en) | 2011-10-26 |
EP1734564A1 (en) | 2006-12-20 |
KR20020015966A (ko) | 2002-03-02 |
US20020023458A1 (en) | 2002-02-28 |
TW522482B (en) | 2003-03-01 |
US20050053891A1 (en) | 2005-03-10 |
EP1734564B1 (en) | 2008-10-08 |
US7819658B2 (en) | 2010-10-26 |
EP1986216A1 (en) | 2008-10-29 |
US7059849B2 (en) | 2006-06-13 |
EP1182693A3 (en) | 2006-02-08 |
US8147241B2 (en) | 2012-04-03 |
US20100316968A1 (en) | 2010-12-16 |
US20070166657A1 (en) | 2007-07-19 |
EP1182693A2 (en) | 2002-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100745867B1 (ko) | 수직열처리장치 및 피처리체를 운송하는 방법 | |
US6486444B1 (en) | Load-lock with external staging area | |
US6108937A (en) | Method of cooling wafers | |
USRE43023E1 (en) | Dual loading port semiconductor processing equipment | |
EP3734651A1 (en) | Thin plate-shaped substrate holding device, and holding device equipped transport robot | |
KR20010012366A (ko) | 웨이퍼 이송 방법 및 그 제조 방법과 고 진공 웨이퍼 처리장치 | |
KR20020015957A (ko) | 피처리체의 처리시스템 | |
KR101194547B1 (ko) | 종형 열처리 장치 및 종형 열처리 방법 | |
JP2009088438A (ja) | 被処理体の処理システム及び被処理体の熱処理方法 | |
JPH09104982A (ja) | 基板処理装置 | |
JPH10256346A (ja) | カセット搬出入機構及び半導体製造装置 | |
KR100733169B1 (ko) | 열처리장치 및 그 장치의 적재챔버를 냉각하는 방법 | |
EP3796368A1 (en) | Transport device having local purge function | |
KR100733168B1 (ko) | 수직열처리장치와 수직열처리장치의 제어방법 | |
JP3570827B2 (ja) | 処理装置 | |
KR100825134B1 (ko) | 수직열처리장치 | |
US5236181A (en) | Vertical heat treating apparatus | |
US6957690B1 (en) | Apparatus for thermal treatment of substrates | |
JPH09104983A (ja) | 基板処理装置 | |
JP2002076089A (ja) | 被処理体の処理システム | |
JP2002246439A (ja) | 被処理体の搬出入装置と処理システム | |
JPH09107015A (ja) | 基板処理装置 | |
JP2003007794A (ja) | 基板搬送機構および基板処理装置 | |
JP2002184771A (ja) | 熱処理装置 | |
JP2002043389A (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
A107 | Divisional application of patent | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
G170 | Re-publication after modification of scope of protection [patent] | ||
FPAY | Annual fee payment |
Payment date: 20120629 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20130705 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150626 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20160630 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20170704 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20180717 Year of fee payment: 12 |