KR100571512B1 - 소잉소터장치의 반도체 패키지 이송방법 및 그 시스템 - Google Patents
소잉소터장치의 반도체 패키지 이송방법 및 그 시스템 Download PDFInfo
- Publication number
- KR100571512B1 KR100571512B1 KR1020050010665A KR20050010665A KR100571512B1 KR 100571512 B1 KR100571512 B1 KR 100571512B1 KR 1020050010665 A KR1020050010665 A KR 1020050010665A KR 20050010665 A KR20050010665 A KR 20050010665A KR 100571512 B1 KR100571512 B1 KR 100571512B1
- Authority
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- South Korea
- Prior art keywords
- turntable
- package
- vision
- semiconductor
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000007689 inspection Methods 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (2)
- 볼 검사가 완료되어 버퍼테이블에 안착된 다수의 반도체 패키지를 마킹면 검사를 위해 제 1 및 제 2 턴테이블로 이송하는 소잉소터장치의 반도체 패키지 이송방법에 있어서,상기 버퍼테이블에 안착된 다수의 반도체 패키지 중 지그재그 형태로 위치한 반도체 패키지만을 흡착하여 제 1 턴테이블로 이송하는 단계; 및상기 버퍼테이블에 안착된 나머지 반도체 패키지를 흡착하여 제 2 턴테이블로 이송하는 단계를 포함하여 이루어지는 것을 특징으로 하는 반도체 패키지 이송방법.
- 볼 검사가 완료되어 버퍼테이블에 안착된 다수의 반도체 패키지를 마킹면 검사를 위해 제 1 및 제 2 턴테이블로 이송하는 소잉소터장치의 반도체 패키지 이송시스템에 있어서,상기 다수의 반도체 패키지를 지그재그 형태로 위치한 제 1 패키지군 및 나머지 반도체 패키지인 제 2 패키지군으로 구분하여 각 패키지군을 별도로 진공흡착하기 위하여 제 1 및 제 2 공압라인과 연결된 버퍼테이블;상기 제 1 패키지군 및 제 2 패키지군을 각각 별도로 진공흡착하기 위하여 제 3 및 제 4 공압라인과 연결된 비젼피커;상기 비젼피커에 연결된 상기 제 3 공압라인에 의해 진공흡착된 상기 제 1 패키지군을 안착하는 적재부가 구비된 제 1 턴테이블; 및상기 비젼피커에 연결된 상기 제 4 공압라인에 의해 진공흡착된 상기 제 2 패키지군을 안착하는 적재부가 구비된 제 2 턴테이블을 포함하여 이루어지는 것을 특징으로 하는 반도체 패키지 이송시스템.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050010665A KR100571512B1 (ko) | 2005-02-04 | 2005-02-04 | 소잉소터장치의 반도체 패키지 이송방법 및 그 시스템 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050010665A KR100571512B1 (ko) | 2005-02-04 | 2005-02-04 | 소잉소터장치의 반도체 패키지 이송방법 및 그 시스템 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100571512B1 true KR100571512B1 (ko) | 2006-04-14 |
Family
ID=37180602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050010665A Expired - Lifetime KR100571512B1 (ko) | 2005-02-04 | 2005-02-04 | 소잉소터장치의 반도체 패키지 이송방법 및 그 시스템 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100571512B1 (ko) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100861027B1 (ko) | 2007-06-26 | 2008-09-30 | 세크론 주식회사 | 반도체 패키지의 흡착 테이블 |
| KR100934418B1 (ko) * | 2008-02-20 | 2009-12-29 | (주) 예스티 | 소잉소터 시스템 |
| KR101391704B1 (ko) | 2012-10-24 | 2014-05-30 | 한미반도체 주식회사 | 반도체 패키지 핸들러 및 그 운용방법 |
| KR20140003499U (ko) * | 2012-11-30 | 2014-06-11 | 세메스 주식회사 | 반도체 패키지 이송 장치 |
| KR101578599B1 (ko) * | 2014-03-19 | 2015-12-17 | 세메스 주식회사 | 반도체 소자 수납 테이블 |
| KR20230051788A (ko) | 2021-10-12 | 2023-04-19 | 유득영 | 반도체 패키징 공정용 턴테이블 |
-
2005
- 2005-02-04 KR KR1020050010665A patent/KR100571512B1/ko not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100861027B1 (ko) | 2007-06-26 | 2008-09-30 | 세크론 주식회사 | 반도체 패키지의 흡착 테이블 |
| KR100934418B1 (ko) * | 2008-02-20 | 2009-12-29 | (주) 예스티 | 소잉소터 시스템 |
| KR101391704B1 (ko) | 2012-10-24 | 2014-05-30 | 한미반도체 주식회사 | 반도체 패키지 핸들러 및 그 운용방법 |
| KR20140003499U (ko) * | 2012-11-30 | 2014-06-11 | 세메스 주식회사 | 반도체 패키지 이송 장치 |
| KR200482350Y1 (ko) | 2012-11-30 | 2017-01-12 | 세메스 주식회사 | 반도체 패키지 이송 장치 |
| KR101578599B1 (ko) * | 2014-03-19 | 2015-12-17 | 세메스 주식회사 | 반도체 소자 수납 테이블 |
| KR20230051788A (ko) | 2021-10-12 | 2023-04-19 | 유득영 | 반도체 패키징 공정용 턴테이블 |
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