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KR100398314B1 - 고접착력 3층 구조 ａｃａ 필름 - Google Patents

고접착력 3층 구조 ａｃａ 필름 Download PDF

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Publication number
KR100398314B1
KR100398314B1 KR10-2001-0043429A KR20010043429A KR100398314B1 KR 100398314 B1 KR100398314 B1 KR 100398314B1 KR 20010043429 A KR20010043429 A KR 20010043429A KR 100398314 B1 KR100398314 B1 KR 100398314B1
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KR
South Korea
Prior art keywords
aca film
aca
film
conductive particles
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2001-0043429A
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English (en)
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KR20030008607A (ko
Inventor
백경욱
임명진
Original Assignee
한국과학기술원
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Filing date
Publication date
Application filed by 한국과학기술원 filed Critical 한국과학기술원
Priority to KR10-2001-0043429A priority Critical patent/KR100398314B1/ko
Priority to JP2002204194A priority patent/JP2003176461A/ja
Priority to US10/193,264 priority patent/US6878435B2/en
Priority to DE10232991A priority patent/DE10232991A1/de
Publication of KR20030008607A publication Critical patent/KR20030008607A/ko
Application granted granted Critical
Publication of KR100398314B1 publication Critical patent/KR100398314B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

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  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
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Abstract

일반적인 단일층 ACF의 접착력을 향상시키기 위하거나 특히 플립 칩 본딩 시에 ACA 필름의 접착력을 증강시킬 수 있도록 한 3층 구조 ACA 필름에 관하여 개시한다. 본 발명에 따른 ACA 필름은, 에폭시 수지를 기반으로 하여 이루어지며, 0.1 내지 1㎛의 크기를 가지는 비전도성 입자와 3 내지 10㎛ 크기를 가지는 전도성 입자를 포함하는 메인 ACA 필름 또는 3 내지 10㎛ 크기를 가지는 전도성 입자만을 포함하는 메인 ACA 필름; 및 상기 메인 ACA 필름 양면 각각에 1 내지 5 ㎛ 의 두께로 형성된 에폭시 수지 기반의 접착력 증강층을 포함하는 것을 특징으로 한다.

Description

고접착력 3층 구조 ＡＣＡ 필름 {High Adhesion Triple layered anisotropic conductive adhesive film}
본 발명은 ACA(anisotropic conductive adhesive) 필름에 관한 것으로서, 일반적인 단일층 ACF의 접착력을 향상시키기 위하거나 특히 플립칩 본딩 시에 ACA 필름의 접착력을 증강시킬 수 있도록 한 3층 구조 ACA 필름에 관한 것이다.
전자 패키지 기술은 반도체 소자에서부터 최종 완성제품까지의 모든 단계를포함하는 광범위하고 다양한 시스템 제조 기술이다. 최근 급속히 발전하는 반도체 기술은 이미 백만개 이상의 셀(cell)이 집적화되고 있으며, 비메모리 소자의 경우는 많은 I/O핀 개수, 큰 다이(die) 크기, 많은 열 방출, 고전기적 성능 등의 경향으로 발전하고 있다. 그러나, 상대적으로 이러한 소자를 패키지 하기 위한 전자 패키징 기술은 급속한 반도체 산업에 보조를 못 맞추고 있다.
전자 패키징 기술은 최종 전자 제품의 성능, 크기, 가격, 신뢰성 등을 결정하는 매우 중요한 기술로서, 특히 고전기적 성능, 극소형/고밀도, 저 전력, 다기능, 초고속 신호처리, 영구적 신뢰성 등을 추구하는 최근의 전자제품에 있어서는 그 위상이 더욱 커지고 있다.
이러한 추세에 부응하여, 칩(chip)을 기판에 전기적으로 연결시키는 기술 중의 하나인 플립 칩(flip chip) 본딩 기술이 최근 많이 각광을 받고 있다. 그러나, 종래의 플립 칩 본딩 기술은 솔더(solder)를 이용한 복잡한 본딩공정, 즉 기판에의 솔더 플럭스(flux) 도포, 솔더 범프(solder bump)가 형성된 칩과 표면전극이 형성된 기판의 정렬, 솔더 범프의 리플로우(reflow), 잔여 플럭스의 제거, 및 언더필(under fill)의 충진 및 경화 등의 공정을 거치기 때문에 공정이 복잡하고 완성 제품이 비싸진다는 단점을 갖고 있었다.
이에 따라, 최근에는 이러한 복잡한 공정을 줄이기 위해 웨이퍼 상태에서 플럭스와 언더필의 기능을 갖는 폴리머 재료를 도포하여 가공하는 웨이퍼 차원의 패키지 기술에 대한 관심이 대두되고 있다. 이외에도 일반적인 솔더 플립 칩에 비해 저가이고, 극미세 전극 피치가 가능하며, 플럭스나 납(lead) 성분을 사용하지 않아환경 친화적이고, 저온에서 공정을 진행한다는 등의 장점을 가지는 전도성 접착제를 이용한 플립 칩 본딩 기술에 대한 연구도 많이 진행되고 있다.
전도성 접착제는 크게 이방성 전도 접착제(anisotropic conductive adhesive; ACA)와 등방성 전도 접착제(isotropic conductive adhesive)로 구분되며, 기본적으로 Ni, Au/고분자, 또는 Ag 등의 도전성 입자들과, 열경화성이나 열가소성 또는 이 둘의 특성을 혼합한 혼합형 절연수지(blend type insulating resin)로 구성된다.
도 1a는 종래의 ACA 필름을 설명하기 위한 단면도이다. 도 1a를 참조하면, ACA 필름(10)은 폴리머 수지를 기반(based)으로 하여 이루어지며 전도성을 갖도록 전도성 입자(20)가 미세하게 분산된 구조를 갖는다. ACA 필름(10)의 양면에는 이형제 필름(30)이 부착되어 있다.
도 1b는 도 1a의 ACA 필름을 이용한 플립 칩 본딩을 설명하기 위한 단면도이다. 먼저, 한 쪽 면에 있는 이형제 필름(30)을 제거하고 노출된 ACA 필름(10)을 기판(50) 위에 열압착시킨다. 다음에, 나머지 한 쪽 면에 있는 이형제 필름(30)을 제거하고, 범프(45)가 형성되어 있는 IC 칩(40)을 기판(50) 상의 전극(55)에 정렬시킨다. 그리고, 이들을 열압착시키면 ACF의 전도성 입자가 소성변형되면서 범프(45)와 전극(55)이 기계적 및 전기적으로 연결되게 된다.
그러나, 기판(50)이 열팽창계수가 큰 FR-4와 같은 유기 기판 등이고, IC 칩(40)이 상대적으로 열팽창계수가 작은 Si 칩일 경우에는 열팽창계수의 차이에서 오는 열적 응력 때문에 열사이클을 받을 경우 플립 칩 패키지의 신뢰성이 저하되는문제가 생긴다.
이러한 문제점을 해결하기 위해 비전도성 입자를 30wt% 이상 포함시켜 열팽창계수를 작게한 개량된 ACA 필름이 제안되었는데, 이를 도 1c에 도시하였다. 도 1c를 참조하면, ACA 필름(10)의 열팽창계수를 작게 하기 위하여 ACA 필름(10) 내에 도 1a와 달리 전도성 입자(20)보다 크기가 작은 비전도성 입자(60)가 더 포함되어 있다.
ACA 필름(10)의 접착력은 폴리머 수지에 의하여 생긴다. 그런데, 이와 같이 폴리머 수지 내에 전도성 및 비전도성 입자들(20, 60)이 다량 포함되게 되면, 폴리머 수지의 유효 면적이 줄어들게 되어 IC칩(40)과 기판(50) 사이의 계면 접착력 및 계면 인성이 나빠져서 플립 칩 패키지의 신뢰성이 나빠지게 된다.
따라서, 본 발명이 이루고자 하는 기술적 과제는, 일반적인 단일층 ACF의 접착력을 향상시키기 위하거나, 또는 열팽창계수를 작게 하기 위하여 비전도성 입자를 포함시키더라도 플립 칩 본딩 시에 여전히 큰 접착력을 갖게 되는 3층구조 ACA 필름을 제공하는 데 있다.
도 1a는 종래의 ACA 필름을 설명하기 위한 단면도;
도 1b는 도 1a의 ACA 필름을 이용한 플립 칩 본딩을 설명하기 위한 단면도;
도 1c는 개량된 종래의 ACA 필름을 설명하기 위한 단면도;
도 2a는 본 발명에 따른 ACA 필름을 설명하기 위한 단면도;
도 2b는 도 2a의 ACA 필름을 이용하여 플립 칩 본딩한 것을 나타낸 단면도이다.
상기 기술적 과제를 달성하기 위한 본 발명에 따른 3층 구조 ACA 필름은, 에폭시 수지를 기반으로 하여 이루어지며, 0.1 내지 1㎛의 크기를 가지는 비전도성입자와 3 내지 10㎛ 크기를 가지는 전도성 입자를 포함하는 메인 ACA 필름 또는 3 내지 10㎛ 크기를 가지는 전도성 입자만을 포함하는 메인 ACA 필름; 및 상기 메인 ACA 필름 양면 각각에 1 내지 5 ㎛ 의 두께로 형성된 에폭시 수지 기반의 접착력 증강층을 포함하는 것을 특징으로 한다.
여기서, 상기 메인 ACA 필름으로는 고상의 에폭시 수지, 액상의 에폭시 수지, 고상의 페녹시 수지, 메틸에틸케톤과 톨루엔이 혼합된 솔벤트, 액상의 아미다졸 경화제, 0.1 내지 1㎛의 크기를 가지며 상기 솔벤트를 제외한 총중량에 대해 0 내지 50 wt% 를 차지하는 비전도성 입자, 3 내지 10㎛ 크기를 가지며 상기 솔벤트를 제외한 총중량에 대해 5 내지 20 wt% 를 차지하는 전도성 입자를 서로 혼합한 후 건조하여 형성시킨 것을 사용할 수 있다. 이 때, 상기 건조는 80 내지 100℃ 의 온도범위에서 1 내지 3분 동안 행하는 것이 바람직하다.
상기 접착력 증강층은 5 내지 10 wt% 를 차지하는 전도성 입자를 더 포함할 수도 있다.
상기 접착력 증강층으로는, 고상의 에폭시 수지, 액상의 에폭시 수지, 고상의 페녹시 수지, 메틸에틸케톤과 톨루엔이 혼합된 솔벤트, 액상의 아미다졸 경화제를 서로 혼합한 후 건조하여 형성된 것을 사용할 수 있다.
상기 메인 ACA 필름은 25 내지 50 ㎛ 의 두께를 가지는 것이 바람직하다.
상기 접착력 증강층에는 열가소성 수지가 0 내지 10 wt% 함유될 수도 있다.
이하에서, 본 발명의 바람직한 실시예를 첨부한 도면들을 참조하여 상세히 설명한다.
도 2a는 본 발명에 따른 3층 구조 ACA 필름을 설명하기 위한 단면도이다.
도 2a를 참조하면, 3층 구조 ACA 필름(110)은 하부 접착증강층(114a), 메인 ACA 필름 (main ACA film, 112), 및 상부 접착증강층(114b)의 3층 구조를 갖는다.
메인 ACA 필름(112)은 에폭시 수지를 기반(based)으로 하여 이루어지며, 3 내지 10㎛ 크기를 가지는 전도성 입자(120) 및 0.1 내지 1㎛의 크기를 가지는 비전도성 입자(160)가 미세 분산된 구조를 갖는다.
메인 ACA 필름(112)은 하부 접착력 증강층(114a) 및 상부 접착력 증강층(114b) 사이에 개재(介在)된다. 하부 및 상부 접착력 증강층(114a, 114b)은 에폭시 수지를 기반으로 하여 이루어지며, 1 내지 5 ㎛ 두께를 갖는다. 하부 및 상부 접착력 증강층(114a, 114b)도 전도성을 갖도록 하기 위하여 하부 및 상부 접착력 증강층(114a, 114b) 각각에 전도성 입자가 5 내지 10 wt% 만큼 더 포함될 수도 있다. 3층구조 ACA 필름(110)의 양면에는 이형제 필름(130a, 130b)이 접착되어 있다.
3층구조 ACA 필름(110)은 다음과 같이 만들어진다.
먼저, 고상의 에폭시 수지, 액상의 에폭시 수지, 고상의 페녹시 수지, 메틸에틸케톤과 톨루엔이 1대 3의 비율로 혼합된 솔벤트, 및 액상의 아미다졸 경화제가 혼합된 것을 콤마 롤 코팅 장비 등으로 폴리에틸렌으로 이루어진 하부 이형지 필름(130a) 상에 도포한 후에 이를 B-스테이지(B-stage) 경화시켜 하부 접착력 증강층(114a)을 형성한다.
다음에, 고상의 에폭시 수지, 액상의 에폭시 수지, 고상의 페녹시 수지, 메틸에틸케톤과 톨루엔이 1대 3의 비율로 혼합된 솔벤트, 3 내지 10㎛ 크기를 가지는 전도성 입자, 0.1 내지 1㎛ 크기를 가지는 비전도성 입자, 액상의 아미다졸 경화제를 혼합한 후에 이를 하부 접착력 증강층(114a) 상에 도포한다. 전도성 입자는 솔벤트를 제외한 총중량에 대해 5 내지 20 wt% , 비전도성 입자는 0 내지 50 wt% 를 갖도록 혼합한다. 그리고, 솔벤트가 충분히 증발되어 없어지도록 80 내지 100℃ 의 온도범위에서 1 내지 3분 동안 건조시켜 30 내지 40㎛ 의 두께를 갖는 메인 ACA 필름(112)을 형성한다.
이어서, 고상의 에폭시 수지, 액상의 에폭시 수지, 고상의 페녹시 수지, 메틸에틸케톤과 톨루엔이 1대 3의 비율로 혼합된 솔벤트, 및 액상의 아미다졸 경화제가 혼합된 것을 콤마 롤 코팅 장비 등으로 메인 ACA 필름(112) 상에 도포한 후에 이를 열 압착 라미네이션하여 상부 접착력 증강층(114b)을 형성한다. 그리고, 마지막으로 상부 접착력 증강층(114b)에 상부 이형지 필름(130b)을 부착한다.
도 2b는 도 2a의 3층 구조 ACA 필름(110)을 이용하여 플립 칩 본딩한 것을 나타낸 단면도이다. 도 1b와 동일한 참조번호는 동일 기능을 수행하는 구성요소를 나타낸다. 하부 이형지 필름(130a)을 제거하고 노출된 하부 접착력 증강층(114a)을 기판(50)에 80℃에서 1~3 kgf/cm2로 열압착 한다. 다음에, 상부 이형지 필름(130b)을 제거 한 후에 IC 칩(40)과 기판(50)을 정렬하여 이들을 열압착시킨다.
하부 및 상부 접착력 증강층(114a, 114b)이 폴리우레단, 아크릴 수지 등의 열가소성 수지를 0 내지 10 wt% 함유하도록 할 수도 있다. 이 경우에는 열을 약간가하게 되면 IC 칩(40)과 기판(50)이 쉽게 분리가 되므로 IC 칩(40)의 수리가 필요한 경우에 매우 유익하다.
상술한 바와 같은 본 발명에 3층 구조 ACA 필름에 의하면, 일반적인 단일층 ACF의 접착력을 향상시키기 위하거나, 또는 열팽창계수를 작게 하기 위하여 비전도성 입자를 ACA 필름 내에 미세 분산시키더라도 에폭시 수지 기반의 접착력 증강층에 의하여 ACA 필름의 접착력이 증강되므로 IC 칩과 기판이 강하게 접착되게 된다. 또한, 접착력 증강층에 열가소성 수지를 일부 함유시켜 IC 칩의 수리 시에 탈착이 가능하도록 할 수도 있다.
본 발명은 상기 실시예에만 한정되지 않으며, 본 발명의 기술적 사상 내에서 당 분야에서 통상의 지식을 가진 자에 의해 많은 변형이 가능함은 명백하다.

Claims (7)

  1. 에폭시 수지를 기반으로 하여 이루어지며, 0.1 내지 1㎛의 크기를 가지는 비전도성 입자와 3 내지 10㎛ 크기를 가지는 전도성 입자를 포함하는 메인 ACA 필름 또는 3 내지 10㎛ 크기를 가지는 전도성 입자만을 포함하는 메인 ACA 필름; 및
    상기 메인 ACA 필름 양면 각각에 1 내지 5 ㎛ 의 두께로 형성된 에폭시 수지 기반의 접착력 증강층을 포함하는 것을 특징으로 하는 3층 구조 ACA 필름.
  2. 제1항에 있어서, 상기 메인 ACA 필름이, 고상의 에폭시 수지, 액상의 에폭시 수지, 고상의 페녹시 수지, 메틸에틸케톤과 톨루엔이 혼합된 솔벤트, 액상의 아미다졸 경화제, 0.1 내지 1㎛의 크기를 가지며 상기 솔벤트를 제외한 총중량에 대해 0 내지 50 wt% 를 차지하는 비전도성 입자, 3 내지 10㎛ 크기를 가지며 상기 솔벤트를 제외한 총중량에 대해 5 내지 20 wt% 를 차지하는 전도성 입자를 서로 혼합한 후 건조하여 형성되는 것을 특징으로 하는 3층구조 ACA 필름.
  3. 제1항 또는 제2항에 있어서, 상기 접착력 증강층이 5 내지 10 wt% 를 차지하는 전도성 입자를 더 포함하는 것을 특징으로 하는 3층구조 ACA 필름
  4. 제1항 또는 제2항에 있어서, 상기 접착력 증강층이 고상의 에폭시 수지, 액상의 에폭시 수지, 고상의 페녹시 수지, 메틸에틸케톤과 톨루엔이 혼합된 솔벤트,액상의 아미다졸 경화제를 서로 혼합한 후 건조하여 형성되는 것을 특징으로 하는 3층구조 ACA 필름.
  5. 제1항 또는 제2항에 있어서, 상기 메인 ACA 필름이 25 내지 50 ㎛ 의 두께를 가지는 것을 특징으로 하는 3층 구조 ACA 필름.
  6. 제2항에 있어서, 상기 메인 ACA 필름이 80 내지 100℃ 의 온도범위에서 1 내지 3분 동안의 상기 건조과정을 거쳐 형성되는 것을 특징으로 하는 3층구조 ACA 필름.
  7. 제1항 또는 제2항에 있어서, 접착력 증강층이 열가소성 수지를 0 내지 10 wt% 함유하는 것을 특징으로 하는 3층구조 ACA 필름.
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