KR100349367B1 - Method of manufacturing semiconductor device - Google Patents

Abstract

The present invention provides a method of manufacturing a semiconductor device that can reduce the manufacturing cost while forming a gate in an inverted T shape to prevent hot carrier and punch-through phenomenon.

According to the present invention, a gate oxide film, a first conductive film of a second conductive type opposite to the first conductive type, and a first insulating film are sequentially formed on the first conductive semiconductor substrate, and the first insulating film is formed on the first insulating film. A trench for exposing a part of the conductive film is formed. Then, a first spacer of the second insulating film is formed on the sidewalls of the trench, and a second conductive film is embedded in the trench where the first spacer is formed to form an upper gate, and then the upper gate and the first spacer are used as an etching mask. The lower insulating layer is formed by etching the first insulating layer and the first conductive layer to form an inverted T-type gate including an upper gate and a lower gate. Then, the LDD regions of the second conductivity type are formed on the substrates on both sides of the lower gate, the first spacer is removed to completely expose the inverse T-type gate, and the substrates on both sides of the upper gate are surrounded by the LDD regions. A punch stop layer of the first conductivity type is formed. Then, a second spacer of the third insulating film is formed on the sidewall of the upper gate, and a third spacer of the fourth insulating film is formed on the sidewall of the inverted T-type gate on which the second spacer is formed. A second conductivity type source / drain is formed in the punch stop layer.

Description

Method of manufacturing semiconductor device

The present invention relates to a method for manufacturing a semiconductor device, and more particularly, to a method for manufacturing a semiconductor device having an inverted T-type gate.

As semiconductor devices become more integrated, research on devices capable of maintaining reliability under high current while reducing channel length between sources and drains of MOS devices continues. On the other hand, in a MOS device having a short channel length, punchthrough occurs rather than pinch-off as the drain voltage increases, and determining the electrical potential and the electric field in the channel determines the characteristics of the device. Done. On the other hand, as the potential on the channel from the source to the drain becomes high, a strong electric field is applied to the channel of the unit MOS, and the electrons in the electric field have high energy, resulting in a hot carrier phenomenon, which makes the threshold voltage unstable. As a result, severe punch-through problems may occur, thereby reducing the reliability of the device.

In contrast, a method of forming a source / drain in a lightly doped drain (LDD) structure and a method of forming a separate punch-stop layer in forming a MOS device have been applied. Here, the punch stop layer is formed by implanting ions deeper than the channel region of the device or implanting ions into corners on both sides of the gate bottom while rotating the wafer at a predetermined angle.

However, when the punch stop layer is applied, the punch through phenomenon is prevented, whereas the ion implantation causes variations in the swing voltage and the threshold voltage of the gate, resulting in characteristics and reliability of the device. Is lowered. In addition, uniform ion implantation is difficult for the entire wafer, and a separate ion implantation mask is required, thereby increasing manufacturing costs.

Accordingly, an object of the present invention is to provide a method of manufacturing a semiconductor device capable of reducing the manufacturing cost while preventing the hot carrier and punch-through phenomenon by forming the gate in an inverted T-shape. There is this.

1A to 1J are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with an embodiment of the present invention.

(Explanation of symbols for the main parts of the drawing)

10 semiconductor substrate 11 gate oxide film

12: first conductive film 12A: lower gate

13 oxide film 14 first spacer

15: upper gate 16: LDD region

17: punch stop layer 18: second spacer

19: second spacer 20: source / drain

100: trench 200: reverse T-gate

In order to achieve the above object of the present invention, according to the present invention, a gate oxide film, a first conductive film of a second conductivity type opposite to the first conductivity type, and a first insulating film are formed on a first conductivity type semiconductor substrate. It forms sequentially and forms the trench which exposes a part of 1st conductive film in a 1st insulating film. Then, a first spacer of the second insulating film is formed on the sidewalls of the trench, and a second conductive film is embedded in the trench where the first spacer is formed to form an upper gate, and then the upper gate and the first spacer are used as an etching mask. The lower insulating layer is formed by etching the first insulating layer and the first conductive layer to form an inverted T-type gate including an upper gate and a lower gate. Then, the LDD regions of the second conductivity type are formed on the substrates on both sides of the lower gate, the first spacer is removed to completely expose the inverse T-type gate, and the substrates on both sides of the upper gate are surrounded by the LDD regions. A punch stop layer of the first conductivity type is formed. Then, a second spacer of the third insulating film is formed on the sidewall of the upper gate, and a third spacer of the fourth insulating film is formed on the sidewall of the inverted T-type gate on which the second spacer is formed. A second conductivity type source / drain is formed in the punch stop layer.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention.

1A to 1J are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with an embodiment of the present invention.

Referring to FIG. 1A, a gate oxide film 11 is formed on a P-type semiconductor substrate 10, and a first conductive film 12 for lower gate is formed on the gate oxide film 11. Here, the first conductive film 12 is formed of an N-type polysilicon film with a thickness of 250 to 350 GPa. Then, an oxide film 13 is formed on the first conductive film 12 as a first insulating film with a thickness of 2,000 to 3,000 kPa, and the oxide film 13 is patterned by photolithography and etching, and the result is shown in FIG. 1B. As shown, a trench 100 exposing a part of the first conductive film 12 is formed in the oxide film 13.

Referring to FIG. 1C, a film serving as an etch stop film for the oxide film 13 as the second insulating film on the structure of FIG. 1B is preferably deposited with a nitride film and etched by dry etching to form sidewalls of the trench 100. The first spacer 14 of the nitride film is formed. Referring to FIG. 1D, the second conductive layer for the upper gate is deposited on the oxide layer 13 so as to be embedded in the trench 100 on which the first spacer 14 is formed, and the trench 100 is etched to expose the surface of the oxide layer 13. The upper gate 15 of the inverted T-type gate is formed by leaving the second conductive film only inside. Here, the second conductive film is formed of a metal silicide film, preferably a titanium silicide film.

Then, the oxide film 13 and the first conductive film 12 are etched using the upper gate 15 and the first spacer 14 as an etch mask to form the lower gate 12A, as shown in FIG. 1E. As a result, an inverted T-type gate 200 including the lower gate 12A and the upper gate 15 is formed. Referring to FIG. 1F, low concentration N-type impurity ions are implanted into the substrate 10 by using the inverted T-type gate 200 and the first spacers 14, and then formed on both substrates 10 of the lower gate 12A. LDD region 16 is formed.

As shown in FIG. 1G, the first spacer 14 is removed to fully expose the inverse T-type gate 200. Then, P-type impurity ions are implanted into the substrate 10 using the inverted T-type gate 200, and as shown in FIG. 1H, the LDD region ( The punch stop layer 17 is formed to surround 16.

Referring to FIG. 1I, an oxide film is deposited and dry-etched as a third insulating film on the structure of FIG. 1H to form second spacers 18 of the oxide film on sidewalls of the upper gate 15. Then, as a film acting as an etch stop film for the oxide film as a fourth insulating film on the entire surface of the substrate, an inverse T on which the second spacer 18 is formed by depositing a nitride film and dry etching so that the surface of the substrate 10 is exposed. A third spacer 19 of the nitride film is formed on the sidewall of the type gate 200. Then, a high concentration of N-type impurity ions are implanted into the substrate 10 by using the inverse T-type gate 200, the second and third spacers 18 and 19, and as shown in FIG. 1J, the third spacer (19) A source / drain 20 is formed in the punch stop layer 17 on both sides.

According to the present invention described above, the punch-through phenomenon is effectively prevented because the punch stop layer is formed to completely surround the drain region to completely surround the source and drain regions by an ion implantation process using an inverted T-type gate. In addition, since the source / drain is formed using the double spacer, a more stable LDD structure can be obtained, and the hot carrier phenomenon is effectively prevented by this LDD structure. As a result, the characteristics and reliability of the device are improved. In addition, since the inverse T-type gate is formed by the trench technology without using a mask and the inverse T-type gate and the spacer are used to form the punch stop layer by self-alignment, manufacturing cost is reduced and in the wafer. Ion implantation is performed uniformly.

In addition, this invention is not limited to the said Example, It can variously deform and implement within the range which does not deviate from the technical summary of this invention.

Claims (10)

Sequentially forming a gate oxide film, a first conductive film of a second conductivity type opposite to the first conductivity type, and a first insulating film on a first conductivity type semiconductor substrate; Forming a trench in the first insulating film to expose a portion of the first conductive film; Forming a first spacer of a second insulating film on sidewalls of the trench; Forming an upper gate by filling a second conductive layer in the trench in which the first spacer is formed; Forming a lower gate by etching the first insulating layer and the first conductive layer using the upper gate and the first spacer as an etching mask to form an inverted T-type gate including an upper gate and a lower gate; Forming LDD regions of a second conductivity type on substrates on both sides of the lower gate; Removing the first spacer to completely expose the inverse T-type gate; Forming a punch stop layer of a first conductivity type on the substrate on both sides of the upper gate to surround the LDD region; Forming a second spacer of a third insulating film on sidewalls of the upper gate; Forming a third spacer of a fourth insulating film on sidewalls of the inverted T-type gate on which the second spacer is formed; And Forming a second conductivity type source / drain in the punchstop layer on both sides of the third spacer. The method of claim 1, wherein the first conductive film is formed of a polysilicon film, and the second conductive film is formed of a metal silicide film. 4. The method of claim 3, wherein the metal silicide film is a titanium silicide film. The method of manufacturing a semiconductor device according to claim 3, wherein the first conductive film is formed to a thickness of 250 to 350 GPa. The method of claim 1, wherein the first insulating film is an oxide film and the second insulating film is a nitride film. The method of manufacturing a semiconductor device according to claim 1 or 5, wherein the first insulating film is formed to a thickness of 2,000 to 3,000 kPa. The method of claim 1, wherein the forming of the LDD region is performed. And injecting a second conductivity type low concentration impurity ion into the substrate using the inverted T-type gate and the first spacer. The method of claim 1, wherein forming the punch stop layer And injecting first conductivity type impurity ions into the substrate using the inverted T-type gate. The method of claim 1, wherein forming the source / drain is And a second conductivity type high concentration impurity ion is implanted using the second and third spacers and the inverted T-type gate. The method of claim 1, wherein the third insulating film is an oxide film, and the fourth insulating film is a nitride film.