KR100262268B1 - Carrier module of test tray for testing semiconductor device - Google Patents

Abstract

PURPOSE: A carrier module of a test tray for testing a semiconductor device is provided to lengthen the life of holding members in spite of the repetition operation according to load/unload of the device and be capable of moving a device load member from a housing in testing the device. CONSTITUTION: A cover is coupled to an aperture of a housing(16) and has a through hole in the center of the cover. A loading member is mounted to be lifted to the housing and has a cavity for loading the semiconductor device. A plurality of first elastic members(24) are mounted between the cover and the loading member to push the loading member. A pair of holding members(25) are hinged to be horizontally moved to the loading member to support the semiconductor device within the cavity. Two drivers(28) are mounted to be contacted to one side of the loading member to compress the holding member. Two links(29) switch the lift movement of the drivers by 90 deg. to transfer a horizontal movement to the holding member. A plurality of second elastic members(30) are mounted between the cover and driver to push the driver.

Description

Carrier module of test tray for semiconductor device test

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier module of a test tray for testing a semiconductor device, which is used to carry and transport a semiconductor device on a test tray during testing of the semiconductor device. will be.

In recent years, semiconductor devices (hereinafter referred to as "devices") are also gradually thinner and smaller in size, due to the trend toward thinner and shorter components. Among them, thinner small outline packages (TSOP) and micro-BGA (Micro) Ball Grid Array).

The TSOP or μBGA has a thickness of about 1 mm, and when the impact is applied to the upper or lower surface due to carelessness or the like between test processes that are completed in the manufacturing process and inspect the performance, the characteristics of the device are deteriorated and the impact is severe. The molded chip is damaged during the process, so care must be taken not to impact the device during transfer or testing within the handler.

This TSOP or [mu] BGA is loaded on the metal test tray 1 as shown in FIG. 1 and transferred between the test processes.

The test tray 1 has a plurality of flesh 3 formed parallel to each other at equal intervals in a frame 2 of a quadrangular frame shape, and the sides 2a of the frame 2 opposing both sides of the flesh and the flesh ( Apparatuses 4 are projected at equal intervals in 2b), respectively, and approximately 64 carrier module accommodating portions are formed between the flesh 3 or the sides 2a and 2b and by the two apparatus pieces 4. (5) is provided in the test tray 1.

In each of the carrier module accommodating parts 5, a carrier module 6 on which an element is loaded is mounted in a floating state by the fastener 7.

Figure 2 is a perspective view showing an embodiment of a conventional carrier module and Figure 3 is a cross-sectional view taken along the line A-A of Figure 2, the cavity (Cavity) 9 is seated on the upper surface of the carrier module 6 (Cavity) (9) And long grooves 10 are formed on both sides of the cavity so that the lead 8a of the device is exposed downward, and the wing pieces 11 formed on both sides of the carrier module 6 Positioning groove 12 for determining the position of the carrier module at the time of loading (8), and fastening hole 13 for mounting the carrier module 6 to the test tray 1 as a fastener 7 is formed have.

Therefore, when the plurality of carrier modules 6 of the above structure are coupled to the test tray 1 and the test tray 1 is transferred to the loading position of the element 8 by the transfer means, the elements contained in the customer tray are separated. Element adsorption means is absorbed and transferred to the upper part of the test tray 1, and the element absorbed by the picker is released into the cavity 9 of the carrier module 6 by its own weight by releasing the element's attraction force. The lid 8a is exposed downward through the long groove 10 formed long on both sides of the cavity 9.

Then, the insulator (not shown) comes down from the top of the test tray while the test tray 1 is transferred to the test site by the transfer means, and presses the lead of the device, and at the same time, the contactor (not shown) When omitted) is raised through the long groove 10 is connected to the lead (8a) of the device, the lead (8a) and the contactor is electrically through the electrical properties of the device in the CPU (central processing unit) is tested.

However, because the longitudinal width of the cavity 9 formed in the carrier module 6 of this conventional test tray 1 is larger than the longitudinal width L of the device for easy loading of the device 8 When the adsorption means adsorbs the element 8 and free-falls the element from the top of the cavity 9 and loads it into the cavity 9, the element 8 is correctly loaded into the cavity 9 as shown in FIG. Not frequently occurred.

If the test is conducted by contacting the lead 8a of the element 8 to the contactor in such a state in this state, the contactor may not be connected to the lead correctly, thereby causing a fatal problem in that the good element is incorrectly judged as defective.

In addition, even when the device 8 is correctly loaded in the cavity 9, when the test tray is shocked due to vibration or the like during the transfer of the test tray 1, the device 8 is simply the cavity 9 of the carrier module 6. Since it is in the state of), the correct position of the device is off, thereby causing the problem as described above.

4A to 4D are perspective views showing another embodiment of the conventional carrier module, and have been developed to solve the problems of the carrier module 6 as in the above-described embodiment.

Looking at the configuration, a pair of latches 14 are integrally formed to move left and right from the cavity to both sides of the cavity 9 formed in the carrier module 6.

The latch 14 of this structure is integrally formed upward from the bottom of the cavity 9 to accommodate the element 8 in the cavity 9 by using the elastic force of the resin material of the carrier module 6, or in the cavity The element 8 is accommodated in the cavity while the two latches 14 are simultaneously opened to both sides by the latch release mechanism 15 which moves simultaneously with the element adsorption means for adsorbing the element 8 when taken out from the (9). The device stored in the cavity is taken out.

When the element 8 is loaded into the cavity 9 and the latch release mechanism 15 is released from the latch 14, the latch 14 is reduced to its initial state by its elastic force and the element 8 loaded on the carrier module is loaded. Since the upper surface of the) is pressed, the position of the element 8 loaded in the carrier module is not changed even when an impact is applied when the test tray 1 is transferred between processes.

However, the carrier module 6 of this structure also has a drawback of very short life because the latch 14 is formed integrally with the resin body so that the restoring force of the latch is decreased when repeated use.

In addition, the carrier module having the above-described structure has an element 8 housed in the cavity 9 so that a test contactor should be inserted into the cavity during the test operation so that electrical connection with the lead 8a is possible. Another problem was that the length of the test contactor had to be long.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem in the related art, and an object thereof is to improve the structure of a carrier module to provide a carrier module having a holding member having a long life even in a repeated operation according to the storage and discharging of the device. .

Another object of the present invention is to provide a carrier module in which the element receiving member is movable from the housing during the test of the element.

It is still another object of the present invention to provide a carrier module in which the driving stroke of the holding member which suppresses the element with respect to a constant external driving stroke for opening the holding member is adjusted.

According to an aspect of the present invention for achieving the above object, a housing formed with a through-hole in the center, the receiving member is resiliently installed in the housing so that the cavity on which the element is placed is exposed to the outside through the through-hole, the housing and A first elastic member provided between the receiving members to bias the receiving member, a pair of holding members axially coupled to the receiving member to support the elements in the cavity, and connected to one side of the receiving member; Drive body for mutually retracting the holding member in accordance with the pressing operation, the link is transferred between the housing and the drive body and the link to transfer the left and right linear movement to the holding member by switching the lifting movement of the drive 90 ° A carrier module of a test tray for testing a semiconductor device, which is composed of a second elastic member for biasing a sieve, is provided.

According to another aspect of the present invention, a housing having an opening on one side, a cover coupled to the opening of the housing and having a hole formed in the center thereof, and a cavity in which the element is placed on the housing so as to be lifted and lowered, is placed through the hole. A first elastic member provided between the cover and the housing member to be exposed to the outside, the first elastic member to bias the housing member, and a pair of holding members axially coupled to the housing member to support the element in the cavity; A drive body installed to be connected to one side of the housing member to retract the holding members according to a pressing operation, and a link for transferring the lifting member of the drive body by 90 ° to transfer the left and right linear motions to the holding member; And a carrier module of the test tray for testing a semiconductor device, comprising a second elastic member provided between the cover and the driving body to bias the driving body. Ball.

1 is an exploded perspective view showing a test tray for testing a conventional semiconductor device

Figure 2 is a perspective view showing an embodiment of a conventional carrier module

3 is a cross-sectional view taken along the line A-A of FIG.

4a to 4d is a perspective view showing another embodiment of the conventional carrier module

5 is an exploded bottom perspective view of an embodiment of the present invention;

Figure 6 is a longitudinal cross-sectional view of the coupled state of FIG.

FIG. 7 is a bottom view of FIG. 6

8 is a cross-sectional view taken along the line B-B of FIG.

9 is a perspective view of a holding member applied to the present invention

10 is a perspective view of a link for transferring the linear motion of the driving body by 90 ° to the holding member;

11A to 11C are state diagrams for explaining the operation of the present invention.

Figure 11a is a state in which the holding member is opened to both sides by the storage member is lowered from the carrier module

11B is a state in which the holding members are retracted inward to each other by pressing the driving body, and the holding members hold the elements in the cavity.

11C is a state diagram showing the test

12 is an exploded bottom perspective view showing another embodiment of the present invention.

13 is a longitudinal cross-sectional view of the coupled state of FIG.

FIG. 14 is a bottom view of FIG. 13

15 is a cross-sectional view taken along the line C-C of FIG.

Explanation of symbols for main parts of the drawings

16 housing 19 storage member

20: cavity 24: first elastic member

25 holding member 28 driving body

29 link 30 second elastic member

36: cover

Hereinafter, the present invention will be described in more detail with reference to FIGS. 5 to 11 as an embodiment.

5 is an exploded bottom perspective view showing an embodiment of the present invention, FIG. 6 is a longitudinal cross-sectional view of the coupled state of FIG. 5, and FIG. 8 is a cross-sectional view taken along line B-B of FIG. 6, and the present invention is provided in the center of the housing 16. An elongated rectangular through hole 17 is formed and the housing member 19 is exposed to the outside through the through hole inside the housing 16, and the receiving member 19 integrally formed with the opposite first guide pieces 18 on both sides thereof is liftable. It is installed elastically.

The cavity 20 on which the element 8 is placed is formed on one surface of the housing member 19, and the second guide piece 21 is formed on both sides of the cavity 20 to maintain the correct position of the loaded element. It is.

In the cavity 20 in which the element 8 is loaded, an element detecting hole 22 for confirming the state of loading of the element by a known detection means is formed therethrough.

This is because, as indicated by the double-dotted line in FIG. 6, the element detecting pin 23 elastically installed with a spring (not shown) when the element 8 is loaded is exposed on the cavity 20 through the element detecting hole 22. This is to detect whether the detection pin exposed on the element detection hole 22 is pressed by the element and to inform the CPU of the result.

When the external force is not applied to the housing member between the housing 16 and the housing member 19, four first elastic members 24 for biasing the housing member upward are provided, and the cavity 20 is installed in the housing member. The pair of holding members 25 supporting the elements 8 loaded in the c) are coupled to the shaft 26 so as to be movable left and right.

The pair of holding members 25 are located at both sides of the cavity 20 formed in the receiving member 19 as shown in FIG. 7, and is held between one end of the holding member 25 and the end of the through hole 17. Space (S) is formed so that the member can be transferred to the left and right.

The holding member 25 holding the element 8 loaded in the cavity 20 of the accommodating member 19 includes an upper surface inhibiting piece 27a that restrains the upper surface of the element 8, as shown in FIG. The side restraining piece 27b which restrains both side surfaces is provided, and the side surface of the said restraining piece, ie, the connection surface 27c with an element, consists of an inclined surface.

This is because the pair of holding members 25 hold the device 8 while moving in opposite directions, or release the holding state, so that the device 8 can be stably moved without causing interference with the device when the holding member is moved. To hold it.

The upper surface restraining piece 27a and the side restraining piece 27b are integrally formed. When the pair of holding members 25 move inward, the upper restraining piece 27a and the side restraining piece 27b are held in the form of being wrapped around the element 8 as shown in FIG.

As shown in FIG. 6, a driving body 28 is provided at a side of the accommodating member 19 so that the bottom surface thereof is connected to the first guide piece 18 and between the holding member 25 and the driving body 28. The link 29 which rotates the lifting movement of the driving body by 90 ° and transmits it to the holding member in a left and right linear motion is rotatably installed, and the driving body is connected between the housing 16 and the driving body 28. The second elastic member 30 is provided to bias the driving body upward when no external force is applied to the 28.

In an embodiment of the present invention, the first and second elastic members 24 and 30 are applied as coil springs, but various types of elastic members such as torsion springs and shock absorbing members may be applied.

The hinge pin 31 is integrally formed or inserted into and fixed to one end of the link 29 which is rotatably installed between the holding member 25 and the driving body 28, and the hinge pin is connected to the holding member 25. A hook groove 25a into which the 31 is fitted is formed.

In addition, an insertion hole 29a is formed at the other end of the link 29, and an insertion hole 32a is also formed in the downwardly protruding piece 32 formed in the driving body, so that the pins are inserted through the insertion holes 29a and 32a. 33 will be inserted and assembled.

Therefore, when an external force is applied to the driving body 28, the force is transmitted to the holding member 25 due to the rotational movement of the link 29.

The hinge point O (O ') of the said link 29 is mutually shift | deviated.

Therefore, it is possible to vary the left and right feed amount of the holding member 25 according to the installation angle θ of the link 29 installed between the holding member 25 and the driving body 28.

In addition, the left and right conveying amounts of the holding member 25 may be varied by adjusting the distance between the hinge points O and O 'of the link 29.

This is because it is necessary to vary the amount of movement of the holding member 25 according to the type of element loaded in the cavity 20.

That is, it is necessary to vary the connection area between the holding member 25 and the top surface of the device according to the type of the device 8, in which case the second pusher is installed in the handler for pressing the driving body 28 and moves up and down. This is to adjust the stroke of the holding member 25 by varying only the installation angle of the link 29 or the interval between the hinge points O and O 'without adjusting the stroke of the 40.

The first and second elastic members 24 and 30 are installed between the housing 16 and the driving body 28, and between the housing 16 and the receiving member 19, so that the driving body 28 is disposed in the housing. A locking means is provided in the housing 16 and the drive body 28 so as not to be separated from the 16.

The locking means includes a pair of hooks 34 formed on both sides of the housing 16 so as to face each other, and a driving body in which the hooking jaw 28a is formed so that the hook is caught and the driving body 28 is not separated from the housing 16. It consists of 28.

Accordingly, when an external force is applied to the housing member 19 or the driving body 28, the housing member 16 is connected to the housing 16 so that the element 8 loaded in the cavity 20 is electrically connected to the contactor 35. Exit from

12 to 15 show another embodiment of the present invention, FIG. 12 is an exploded bottom perspective view showing another embodiment of the present invention, FIG. 13 is a longitudinal cross-sectional view of FIG. 12, and FIG. 14 is a bottom view of FIG. 13. It is also.

In the configuration of another embodiment of the present invention, the same parts as those of the embodiment are omitted, and the same reference numerals are given to the embodiments.

Another embodiment of the present invention is different from the one embodiment is that one side of the housing 16 is completely open and on the opposite side is formed with a latching jaw (16a) for preventing the falling of the built-in parts through the housing The driving body 28 and the receiving member 19 in which the holding member 25 and the link 29 are coupled to each other are sequentially inserted in the 16, and then the opening is closed by a separate cover 36.

The cover 36 is coupled to the housing 16 by a plurality of pins 37, so that the cover 36 is easily separated from the housing 16 during the replacement operation due to the breakage of a part (link, holding member, etc.).

Concave grooves 36a are formed on both sides of the cover 36 to facilitate the assembly of the pins 37.

Therefore, the cover 36 can be assembled to the housing 16 using the short pin 37.

In addition, in a state in which the housing member 19 coupled with the holding member 25 and the link 29 is coupled to the housing 16, the driving body 28 is caught by the locking jaw 16a so as not to be separated from the housing 16. Do not.

In another embodiment of the present invention described above, unlike one embodiment, the driving body 28 is composed of one.

Therefore, the through hole 28b should be formed in the center of the driving body 28 so as not to interfere with the receiving member 19 during the pressing operation.

Referring to the operation of the present invention configured as described above is as follows.

The plurality of carrier modules having the above-described structure are mounted on the frame of the test tray (not shown) by using the fastening hole 13 formed to face the housing 16 (about 64).

In the present invention, the process of loading and unloading the device 8 in a state in which the carrier module is mounted on the frame such that the cavity 20 faces downward, will not be limited thereto.

The reason for this is that loading and unloading of the element 8 can be performed even in the state where the cavity 20 faces upwards, which will be described later.

5 to 11 and another embodiment shown in FIGS. 12 to 15 are the same in principle, and therefore, the operation will be described with reference to FIGS. 11A to 11C.

11A to 11C are state diagrams for explaining the operation of the present invention, in which a test tray equipped with a plurality of carrier modules is formed on the carrier module to test the device 8 to be tested while being transferred to the loading and unloading position of the device. When the aligner 38 containing the element for loading in the cavity 20 is transferred downward of the test tray and vertically coincides with the cavity 20 formed in the housing 16, the transfer of the aligner is stopped.

In this way, after the aligner 38 is transferred to the lower side of the test tray in accordance with the carrier modules in the first row, the first pusher 39 is lowered to press the receiving member 19 downward so that the receiving member has a first elasticity. The member 24 is moved downward while being compressed, and is drawn out of the housing 16.

In the operation as described above, the pair of holding members 25 coupled to the shaft 26 to the housing member 19 is also lowered together with the housing member 19.

At this time, the hinge pin 31 fixed to the link 29 is caught in the hanging groove 25a of the holding member 25 and the other end of the link 29 is upwardly by the second elastic member 30. Since the pin 33 is fitted to the convenient driving body 28, the position of the pin 33 is not variable, while the position of the hinge pin 31 is variable due to the lowering of the receiving member 19, so that the link 29 is eventually used. Rotates about the pin 33.

Accordingly, the holding member 25 coupled with the hinge pin 31 is opened to both sides along the shaft 26 to be in a state as shown in FIG. 11A.

In this manner, when the housing member 19 exits downward from the housing 16 and the pair of holding members 25 are extended to both sides, the elements 8 in the aligner 38 are raised in a state where they are placed on the element seating block. The device is thus located in the cavity 20.

In the above operation, the element 8 mounted on the element seating block is guided by the second guide pieces 21 formed on both sides of the cavity 20 to be accurately positioned in the cavity 20.

Thereafter, the second pusher 40 is lowered to hold the element 8 positioned in the cavity 20 and the downwardly presses the driving body 28 biased upward by the second elastic member 30. Since one end of the link 29 fitted into the pin 33 on the main projection downwardly protruding piece 32 is pressed, the distance between the hinge points O and O ', which is the horizontal distance of the link 29, is varied.

That is, while the horizontal distance between the hinge points (O) (O ') minimized apart from each other is maximized by the rotation of the link 29, the hinge pin (31) fitted in the hook groove (25a) is holding the holding member (25) Since the holding member 25 is moved inward along the axis 26, the holding member 25 is held in the cavity 20 to hold the device 8 positioned in the cavity 20 as shown in FIG. 11B.

The holding member 25 is provided with an upper surface restraining piece 27a and a side restraining piece 27b so as to support the element 8 positioned in the cavity 20 in a wrapped form. It is possible to maintain a stable holding state of the element 8 in between.

In order to hold the device 8 located in the cavity 20, the first pusher 39 is lowered together with the device detection pin 23 when the device is lowered to detect whether the device 8 is loaded in the cavity 20. The result is reported to the central processing unit.

After holding the element 8 in the cavity 20 in the above-described operation, the first and second pushers 39 and 40 which are pressed down while the housing member 19 and the driving body 28 are raised are raised. At the same time, the device seating block descends to complete the loading of the device.

In the above operation, the first and second pushers 39 and 40 may simultaneously rise, but the first pusher 39 first raises the second pusher 40 so that the holding state of the more stable element 8 can be maintained. It is more preferable that) increases.

The reason is that while the driving body 28 is pressed, a force is applied to move the pair of holding members 25 inwardly.

After the device is completely loaded in a plurality of rows of carrier modules in a repeated operation, the test tray is moved to the test site by a transfer means while the test tray is maintained in a horizontal or vertical state, and the electrical characteristics of the device are examined. At the time, the element loaded in the cavity 20 should be connected to the contactor 35.

To this end, when the third pusher 41 presses the driving body 28, the bottom surface of the driving body contacts the first guide piece 18 formed to extend to both sides of the housing member 19, thereby accommodating the housing member 19. Since the position of the link 29 is not changed because it is pressed at the same time, the element in the cavity 20 is pulled out of the housing 16 under the state supported by the holding member 25, the lead of the element or Since the ball is connected to the contactor 35 as shown in Figure 11c it becomes possible to test.

After the test is performed for a predetermined time in the state as shown in FIG. 11C, and after the third pusher 41 is restored to the initial state, the housing member 19 and the driving body 28 which are pulled out of the housing 16 are removed. 2 is accommodated in the housing 16 by the restoring force of the elastic members 24, 30, it is possible to transfer the test tray.

Hereinafter, a process of unloading the device 8 loaded in the cavity 20 after completion of the test will be briefly described.

In order to unload the device 8 suspended from the carrier module while the test tray is located at the unloading position, the aligner 38 is transferred to the lower side of the test tray in the same manner as in loading, so that the cavity formed in the housing 16 ( 20) should be vertically aligned.

However, the element is not mounted on the aligner 38 unlike when the element 8 is loaded.

As such, the aligner is transferred directly below the cavity 20 loaded with the element 8, and then the first pusher 39 descends while the element seating block rises to reach the bottom of the element, thereby lowering the housing member 19. When pressed, the pair of holding members 25 supporting the device are opened to both sides as described above, so that the holding state of the device is released.

As a result, the element located in the cavity 20 is seated in the aligner 38 by the lowering of the element mounting block.

Until now, the state in which the device 20 is loaded and unloaded by the holding member 25 in the suspended state in the state in which the cavity 20 faces downward has been described, but according to the following description, the cavity 20 moves upward. It will be appreciated that the device can be loaded and unloaded into the cavity 20 even when facing.

In this case, it is not necessary to press the driving body 28 separately during the loading and unloading operation of the device 8.

That is, only pushing the storage member 19 elastically installed by the first elastic member 24 upwards to open the holding member 25 coupled to the storage member 19 by the shaft 26 to both sides, When the element 8 is loaded into the cavity 20 and the external force is removed from the housing member 19 which has been pushed up, the housing member 25 descends while the housing member descends and is opened outward by the restoring force of the first elastic member 24. Since the holding element 8 in the cavity 20 while moving inward, it is not necessary to press the driving body 28.

Only when the device 8 is electrically connected to the contactor 35 at the test site, the driving body 28 needs to be pressed.

The present invention as described above has the following advantages over the conventional carrier module.

First, since the holding member is operated using an elastic member such as a coil spring instead of restoring to an initial position using the elastic force of the resin material, the life of the carrier module becomes longer.

Second, since the force is transmitted by connecting the driving member and the holding member with a link without the force concentrated on the external force from the outside, the dispersion of the force is possible, so that the endurance life of each component is long.

Third, since the housing member is drawn out of the housing to reduce the length of the contactor as much as the draw amount of the housing member, it is possible to minimize the effects of high frequency when testing a high-capacity device. It is possible to improve the reliability.

Fourth, even if the shape or size of the holding member is changed according to the loading of devices having various sizes and shapes, the distance between the linking angle and the hinge point is changed without changing the stroke of the initially set pusher. As the amount of spread can be controlled, the utilization rate of expensive equipment can be maximized.

Fifth, since the device can be held in the form of a device wrapped by the holding member, it is possible to maintain a stable holding state of the device between the transfer of the test tray or the test process.

Claims (25)

A housing having a through-hole formed in the center thereof, a receiving member elastically installed to be movable up and down on the housing, and having a cavity on which the element is placed to be exposed to the outside through the through-hole; An elastic member, a pair of holding members which are axially coupled to the housing member to support the elements in the cavity, and a driving body which is installed to be connected to one side of the housing member to retract the holding members according to the pressing operation And a link for transferring the lifting motion of the driving body by 90 ° to transfer the left and right linear motions to the holding member, and a second elastic member installed between the housing and the driving body to comfort the driving body. Carrier module in test tray for test. The method of claim 1, A carrier module of a test tray for testing a semiconductor device, wherein the hinge points of the links are shifted from each other. The method of claim 2, The carrier module of the test tray for testing a semiconductor device, characterized in that the left and right transfer amount of the holding member is variable according to the installation angle of the link provided between the holding member and the driving body. The method of claim 2, The carrier module of the test tray for testing a semiconductor device, characterized in that the left and right conveying amount of the holding member is variable according to the change in distance between the hinge points of the link. The method of claim 1, A holding module comprising a top restraining piece for restraining an upper surface of an element and a side restraining piece for restraining both sides on a holding member. The method of claim 5, A carrier module of a test tray for testing a semiconductor device, wherein the connection surface of the device comprises an inclined surface. The method of claim 5, A carrier module of a test tray for testing a semiconductor device, characterized in that the upper restraining piece and the side restraining piece are integrally formed so that a pair of holding members can hold the device in a form of wrapping the device. The method of claim 1, A carrier module of a test tray for testing a semiconductor device, characterized in that an element detecting hole for checking an element loading state is formed through a cavity by known detection means. The method of claim 1, A pair of first guide pieces are formed on both sides of the housing member, and a driving body having a bottom surface connected to an upper surface of the first guide piece is provided with a downwardly protruding piece that is in close contact with an inner surface of the first guide piece and connected to a link. Carrier module in the test tray for device testing. The method of claim 1, A carrier module of a test tray for testing a semiconductor device, characterized in that the housing member is mounted on the housing such that the loaded device is electrically connected to the connector while the cavity of the housing member is drawn out from the housing. The method of claim 1, A carrier module of a test tray for testing a semiconductor device, characterized in that a locking means is provided in the housing and the drive body so that the pair of drive bodies are not separated from the housing. The method of claim 11, The locking means is a carrier module of a test tray for a semiconductor device test, comprising a pair of hooks formed opposite to each other on both sides of the housing, and a driving member having a locking jaw formed to prevent the hook from being caught from the housing. The method of claim 1, A carrier module of a test tray for testing a semiconductor device, characterized in that the first and second elastic members are made of coil springs. A housing having an opening on one side, a cover coupled to the opening of the housing and having a through hole formed in the center thereof, and a housing in which the cavity on which the element is placed is resiliently installed on the housing and exposed to the outside through the through hole; A first elastic member provided between the cover and the housing member to bias the housing member, a pair of holding members pivotally coupled to the housing member to support the element in the cavity, and connected to one side of the housing member; A drive body which is installed to hold the holding members mutually according to the pressing operation, a link transferring 90 degrees of the lifting body of the driving body to the holding member in a left and right linear motion, and between the cover and the driving body. A carrier module of a test tray for testing a semiconductor device, comprising a second elastic member provided to bias the driving body. The method of claim 14, A carrier module of a test tray for testing a semiconductor device, wherein the hinge points of the links are shifted from each other. The method of claim 15, The carrier module of the test tray for testing a semiconductor device, characterized in that the left and right transfer amount of the holding member is variable according to the installation angle of the link provided between the holding member and the driving body. The method of claim 15, The carrier module of the test tray for testing a semiconductor device, characterized in that the left and right conveying amount of the holding member is variable according to the change in distance between the hinge points of the link. The method of claim 14, A holding module comprising a top restraining piece for restraining an upper surface of an element and a side restraining piece for restraining both sides on a holding member. The method of claim 18, A carrier module of a test tray for testing a semiconductor device, wherein the connection surface of the device comprises an inclined surface. The method of claim 18, A carrier module of a test tray for testing a semiconductor device, characterized in that the upper restraining piece and the side restraining piece are integrally formed so that a pair of holding members can hold the device in a form of wrapping the device. The method of claim 14, A carrier module of a test tray for testing a semiconductor device, characterized in that an element detecting hole for checking an element loading state is formed through a cavity by known detection means. The method of claim 14, A pair of first guide pieces are formed on both sides of the housing member, and a driving body having a bottom surface connected to an upper surface of the first guide piece is provided with a downwardly protruding piece that is in close contact with an inner surface of the first guide piece and connected to a link. Carrier module in the test tray for device testing. The method of claim 14, A carrier module of a test tray for testing a semiconductor device, characterized in that the housing member is mounted on the housing such that the loaded device is electrically connected to the connector while the cavity of the housing member is drawn out from the housing. The method of claim 14, A carrier module of a test tray for testing a semiconductor device, characterized in that the first and second elastic members are made of coil springs. The method of claim 14, The carrier module of the test tray for testing a semiconductor device, characterized in that the driving body is formed integrally.