KR100216499B1 - Test Socket For Chip On Board Package - Google Patents

Abstract

The present invention relates to an insertable test socket for a chip on board package using an elastic connecting means. In the case of a conventional retractable test socket, a package to be tested is placed in a socket body and the socket lid is closed. In order to solve the problem that the test is carried out by crimping and making a connection between the package and the external connection pin, the test socket body is formed in the test socket body, An insert test socket having a resilient connecting means is provided.

That is, a connection hole corresponding to the external connection terminal of the package is formed in the lower surface of the package insertion port of the test socket, and elastic connection means, for example, metal balls and springs, are respectively formed at the lower portion thereof to be connected to the external connection pins. An insertion type test socket making a connection by the elasticity of the connecting means. Such a structure has the advantage of reducing the time required for testing and increasing work efficiency because the test is performed by a simple insertion process.

Description

Test socket for chip on board package

The present invention relates to an insertable test socket of a chip on board package, and more particularly to an insertable test socket of a chip on board package employing a connection method using a rotatable metal ball and a spring.

According to the trend of technology development of semiconductor chip package, a new packaging method for directly mounting a semiconductor chip onto a substrate by eliminating the process of mounting the package after forming the package using a lead frame according to the trend of high density and miniaturization. This is attracting attention. Such a package in which a semiconductor chip is directly mounted on a substrate is referred to as a chip on board (hereinafter referred to as a 'COB') package. This chip-on-board (COB) package is mainly used for IC cards, which are expected to replace the current magnetic stripe cards, public telephone cards It is expected that the range of application will be gradually expanded, including e-resident's card and electronic resident card.

Hereinafter, a general chip on board (COB) package will be described with reference to the accompanying drawings.

1 and 2 are plan views illustrating top and bottom surfaces of a typical chip on board (COB) package.

3 is a cross-sectional view taken along line 3-3 of FIGS. 1 and 2.

1 to 3, a typical chip on board (COB) package 100 includes a semiconductor chip 120 attached to one side of a printed circuit board 110 by an adhesive 122. The circuit pattern 112 is formed on the surface as a pattern of a thin copper (Cu) layer. In addition, gold (Au) plating is performed on the circuit pattern 112, and an electrical connection is made between the circuit pattern 112 and the semiconductor chip 120 by a bonding wire 124. The bonding wire 124 is typically a gold (Au) or aluminum (Al) wire. In addition, a die pad (not shown) made of the same copper material as the circuit pattern 112 may be formed at a portion to which the semiconductor chip 120 is attached on the printed circuit board 110. In addition, a through hole 118 is formed in the printed circuit board 110, and a ground terminal 116 and an external connection terminal 114 are formed on a surface opposite to the surface on which the chip 120 is attached. . The circuit pattern 112 electrically connected to the chip 120 by the bonding wire 124 is electrically connected to the external connection terminal 114 through the through hole 118. Finally, the chip on board (COB) package 100 is completed by encapsulating the encapsulating resin 126 to protect the chip 120 and the bonding wire 124.

The chip on board (COB) package 100 formed as described above is used by being assembled to a chip card (not shown). At this time, the chip-on-board (COB) package 100 is assembled in an inverted form so that the semiconductor chip 120 faces the inside of the chip card and the lower surface of the substrate 110 is exposed to the outside of the chip card. Therefore, the terminal 110 may be connected to an external terminal (not shown) through the external connection terminal 114 formed on the lower surface of the substrate 110.

The conventional chip on board (COB) package 100 as described above adopts a coating method using a printed circuit board 110 and a liquid epoxy resin 126 having metal circuit layers 112 and 114 on both sides. In other cases, epoxy molding is performed on a chip-on-board (COB) package coated with a liquid epoxy resin or a printed circuit board having cavities using a substrate having metal circuit layers 112 and 114 formed on one surface thereof. Chip-on-board (COB) packages employing molding using compound (EMC).

Next, a conventional chip-on-board (COB) package test socket will be described.

4 is a front view showing a retractable test socket of a chip on board (COB) package according to the prior art.

4 and 1 to 3, the conventional open and close test socket 200 is composed of a socket body 210, a socket cap 220, a locking means 230, a connection pin 240. To test the chip on board (COB) package 100, first open the socket lid 220, insert the chip on board (COB) package 100 to be tested into the socket body 210, and then the socket. The lid 220 is closed and locked by the locking means 230. The socket lid 220 and the locking means 230 is coupled to the socket body 210 by a hinge 232, the rotation around the hinge 232 is free. Since the socket lid 220 compresses the package 100 by the locking means 230, the external connection terminal 114 of the package 100 penetrates from the inside to the outside of the socket body 210. The external contact pins 240 are fastened to each other. The external connection pin 240 is a path electrically connected to a predetermined test board (not shown). When the predetermined test is completed, the locking means 230 may be released, the socket lid 220 may be opened, and then the package 100 may be taken out.

Since the conventional test socket 200 has to open and close the socket lid 220 every time in order to test the package 100, and the locking means 230 must be repeatedly locked and released every time, many packages 100 ), There are problems such as time loss, deterioration of worker's efficiency and fatigue.

Accordingly, an object of the present invention is to reduce the time required for testing a chip-on-board (COB) package, and to provide an insertable test socket capable of collectively testing a large number of packages with a simple insertion process.

1 and 2 are plan views showing top and bottom surfaces of a typical chip on board package.

3 is a cross-sectional view taken along line 3-3 of FIGS. 1 and 2;

4 is a front view showing a retractable test socket of a chip on board package according to the prior art.

FIG. 5 is a perspective view illustrating an insertable test socket of a chip on board package and a chip on board package inserted into a test socket according to an embodiment of the present invention; FIG.

6A and 6B are enlarged portions A of FIG. 5 and are partial perspective views illustrating a change state of the metal ball before and after the chip on board package is inserted into the test socket.

Explanation of symbols for the main parts of the drawings

100: Chip On Board Package

110: printed circuit board 112: circuit pattern

114: External contact terminal 116: Ground terminal

200: retractable test socket 300: pluggable test socket

210, 310: socket body 220: socket lid

240, 350: external connection pin 310: socket body

320: package insertion opening 330: package support surface

332: connection hole 340: metal ball

342: spring 344: conductor metal

In order to achieve the above object, a test socket for testing a chip on board package having a plurality of external connection terminals, comprising: a socket body; A package insertion hole extending from one side of the socket body to an inside of the other side of the socket body; A flat package support surface having a plurality of connection holes respectively corresponding to external connection terminals of the chip on board package and forming a bottom surface of the package insertion hole; Resilient connecting means formed below the package support surface corresponding to the connecting holes, respectively; It provides a pluggable test socket of the chip on board package comprising a; a plurality of external connection pins connected to the elastic connection means and extending out of the socket body.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 5 is a perspective view illustrating an inserted test socket of a chip on board (COB) package and a chip on board (COB) package inserted into a test socket according to an exemplary embodiment of the present invention.

6A and 6B are enlarged portions A of FIG. 5 and are partial perspective views illustrating a change state of the metal ball before and after the chip on board (COB) package is inserted into the test socket.

5, 6A, 6B and 1 to 3, the test socket 300 of the present invention is largely the socket body 310, the package insertion hole 320, the package support surface 330, the elastic connection Means 340 and 342 and external connection pins 350.

The socket body 310 forms the outer shape of the test socket 300 and has a rectangular parallelepiped shape, for example, as shown in FIG. 5.

The package insertion hole 320 extends from one side of the socket body 310 to the inside of the other side of the socket body 310. The package insertion hole 320 is a passage through which the chip on board (COB) package 100 to be tested is inserted into the test socket 300. The chip-on-board (COB) package 100 is a general chip-on-board (COB) package described above, which is typically in the form of a strip in which several packages are bundled, and a plurality of external connection terminals for each package. 114, for example, has eight external connection terminals 114;

The lower surface of the package insertion hole 320 forms a flat surface 330, and a plurality of connection holes 332 are formed. Hereinafter, the flat surface 330 will be referred to as a package support surface 330. In addition, the connection hole 332 is formed to correspond to the external connection terminal 114 of the package 100, respectively, the lower portion of each connection hole 332 has elastic connection means (340, 342), the package When 100 is not inserted, a portion of the connecting means 340, 342 protrudes above the connecting hole 332.

The reason why the connection means 340 and 342 are elastic is that the pressure of the external connection terminal 114 of the package 100 when the package 100 is inserted into the test socket 300 through the package insertion hole 320. The connection means 340, 342 is pushed down by the back and then rebounds upward to form a natural connection.

The connection means 340 and 342 of this embodiment are comprised from the metal ball 340 and the spring 342 of elasticity. In addition, since the diameter of the metal ball 340 is larger than that of the connection hole 332, a predetermined portion or more cannot protrude above the connection hole 332. For example, if the diameter of the connection hole 332 is 0.8 mm, the diameter of the metal can be formed to 1 mm.

The detailed structure of the resilient connecting means 340, 342, that is, the metal ball 340 and the spring 342 of this embodiment, and the operating state when the chip on board (COB) package 100 is inserted are shown in FIGS. It is shown in Figure 6b. Here, reference numeral 344 denotes a conductor metal, which serves as a physical and electrical medium between the connecting means 340 and 342 and the external connecting pin 350.

The external connection pin 350 has the same structure and function as the conventional external connection pin 240. That is, it is fastened through the bottom surface of the socket body 310 from the inside of the socket body 310 to the outside, and has a function of being electrically connected to a predetermined test board (not shown).

As described above, according to the structure of the present invention, since the test of the chip-on-board package is made by the elastic connecting means in the test socket of the package insert type, the time required for the test is short, and a large number of packages can be obtained by a simple insertion process. The test can be performed in a batch and the work efficiency of the operator can be increased.

Claims (5)

A test socket for testing a chip on board package having a plurality of external connection terminals formed on the bottom surface, The test socket includes a socket body; A package insertion hole configured to extend from one side of the socket body to the inside of the other side of the socket body to allow the chip on board package to be inserted in a horizontal direction; A flat package support surface formed with a plurality of connection holes respectively corresponding to external connection terminals of the chip on board package and forming a bottom surface of the package insertion hole; Resilient connecting means formed below the package support surface corresponding to the connecting holes, respectively; And a plurality of external connection pins connected to the resilient connection means and extending out of the socket body. The resilient connecting means may include a metal ball partially protruding from the connection hole through the connection hole, the metal ball and the metal ball so as to be resilient in the connection hole and to be rotatable. It is made of a spring interposed between the external connection pin, the insertion test of the chip-on-board package, characterized in that the external connection terminal is connected to the metal ball when the chip-on-board package is inserted into the package insertion hole in the horizontal direction socket. The test socket of claim 1, wherein a diameter of the metal ball is larger than a connection hole of the package support surface. 3. The plug-in test socket of a chip on board package according to claim 2, wherein the diameter of the metal ball is 1 mm and the diameter of the connection hole of the package support surface is 0.8 mm. The plug-in test socket of claim 1, wherein the spring is coupled to a conductive metal and connected to an external connection pin. 2. The plug-in test socket of a chip on board package according to claim 1, wherein a plurality of bundles are formed by forming eight bundles of four connecting holes at both edges of the package support surface.