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JPWO2021131423A1 - - Google Patents

Info

Publication number
JPWO2021131423A1
JPWO2021131423A1 JP2021566919A JP2021566919A JPWO2021131423A1 JP WO2021131423 A1 JPWO2021131423 A1 JP WO2021131423A1 JP 2021566919 A JP2021566919 A JP 2021566919A JP 2021566919 A JP2021566919 A JP 2021566919A JP WO2021131423 A1 JPWO2021131423 A1 JP WO2021131423A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021566919A
Other versions
JP7449962B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131423A1 publication Critical patent/JPWO2021131423A1/ja
Application granted granted Critical
Publication of JP7449962B2 publication Critical patent/JP7449962B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Casings For Electric Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Credit Cards Or The Like (AREA)
JP2021566919A 2019-12-27 2020-11-18 非接触通信媒体 Active JP7449962B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019239800 2019-12-27
JP2019239924 2019-12-27
JP2019239800 2019-12-27
JP2019239924 2019-12-27
PCT/JP2020/043083 WO2021131423A1 (ja) 2019-12-27 2020-11-18 非接触通信媒体

Publications (2)

Publication Number Publication Date
JPWO2021131423A1 true JPWO2021131423A1 (ja) 2021-07-01
JP7449962B2 JP7449962B2 (ja) 2024-03-14

Family

ID=76575346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021566919A Active JP7449962B2 (ja) 2019-12-27 2020-11-18 非接触通信媒体

Country Status (4)

Country Link
JP (1) JP7449962B2 (ja)
KR (1) KR20220106800A (ja)
CN (1) CN114902234A (ja)
WO (1) WO2021131423A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006127141A (ja) * 2004-10-28 2006-05-18 Electronic Authentication System Association コイン型記録媒体
JP3141694U (ja) * 2008-02-29 2008-05-22 株式会社リプロ 標示器
JP2008310387A (ja) * 2007-06-12 2008-12-25 Techno Links:Kk Icタグ
JP2009302311A (ja) * 2008-06-13 2009-12-24 Yamaha Corp 半導体装置用パッケージ、半導体装置、並びにマイクロフォンパッケージ
JP2013250945A (ja) * 2012-06-04 2013-12-12 Toppan Printing Co Ltd Icタグ及びicタグの製造方法
CN104966118A (zh) * 2015-06-09 2015-10-07 南通富士通微电子股份有限公司 电子标签封装结构和方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773320B2 (ja) 2006-11-21 2011-09-14 株式会社神戸製鋼所 高温用rfidタグ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006127141A (ja) * 2004-10-28 2006-05-18 Electronic Authentication System Association コイン型記録媒体
JP2008310387A (ja) * 2007-06-12 2008-12-25 Techno Links:Kk Icタグ
JP3141694U (ja) * 2008-02-29 2008-05-22 株式会社リプロ 標示器
JP2009302311A (ja) * 2008-06-13 2009-12-24 Yamaha Corp 半導体装置用パッケージ、半導体装置、並びにマイクロフォンパッケージ
JP2013250945A (ja) * 2012-06-04 2013-12-12 Toppan Printing Co Ltd Icタグ及びicタグの製造方法
CN104966118A (zh) * 2015-06-09 2015-10-07 南通富士通微电子股份有限公司 电子标签封装结构和方法

Also Published As

Publication number Publication date
CN114902234A (zh) 2022-08-12
JP7449962B2 (ja) 2024-03-14
WO2021131423A1 (ja) 2021-07-01
KR20220106800A (ko) 2022-07-29

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