JPWO2014129118A1 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JPWO2014129118A1 JPWO2014129118A1 JP2015501307A JP2015501307A JPWO2014129118A1 JP WO2014129118 A1 JPWO2014129118 A1 JP WO2014129118A1 JP 2015501307 A JP2015501307 A JP 2015501307A JP 2015501307 A JP2015501307 A JP 2015501307A JP WO2014129118 A1 JPWO2014129118 A1 JP WO2014129118A1
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- 238000003384 imaging method Methods 0.000 title claims abstract description 75
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- 238000012546 transfer Methods 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 230000003321 amplification Effects 0.000 claims description 13
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 14
- 230000003071 parasitic effect Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 230000007423 decrease Effects 0.000 description 7
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14638—Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
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- Computer Hardware Design (AREA)
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Abstract
Description
図1は、実施の形態に係る固体撮像装置の全体構成を示す機能ブロック図である。また、図2は、実施の形態に係る固体撮像装置が有する画素(単位セル)の回路図である。
ここで、本実施の形態に係る固体撮像装置の理解を容易とするため、一般的な固体撮像装置について、図面を参照しながら説明する。
次に、本実施の形態に係る固体撮像装置1の光信号を読み出すまでの動作を説明する。
図8は、実施の形態の変形例に係る固体撮像装置の全体構成を示す機能ブロック図である。本変形例に係る固体撮像装置2は、図1に示された固体撮像装置1の構成に対して、列電流源を構成するトランジスタM1y(1≦y≦j)が追加されている。以下、実施の形態に係る固体撮像装置1と同じ点は説明を省略し、固体撮像装置1と構成が異なる点のみを説明する。
100、500 画素(単位セル)
101、501 撮像領域
102、502 行選択回路
103、203、503 バイアス発生回路
104、204、504 タイミング制御回路
105、205、505 電流源
105−1、105−j、105−y、205−1、205−j、205−y、505−1、505−j、505−y 列電流源
106、506 AD変換回路
107、107−1、107−i、107−x 行選択線
108、108−1、108−j、108−y、508、508−1、508−j、508−y 垂直信号線
109、509 メモリ/列走査回路
110、510 外部出力端子
400 フォトダイオード
401 フローティングディフュージョン(FD)
402 転送トランジスタ
403 リセットトランジスタ
404 増幅トランジスタ
M1y、M2y、M3y、M4y、M5y、M6y、M7y トランジスタ
Claims (5)
- 入射光を画素信号に光電変換する画素が行列状に配列された撮像部と、
画素列ごとに配置され、前記画素信号を読み出す垂直信号線と、
前記垂直信号線に接続された電流源とを備え、
前記電流源は、
前記垂直信号線と基準電位線との間に配置された、直列に接続された3つ以上の複数の第1トランジスタと、
第1端子、第2端子及び第1制御端子を有し、隣接する前記第1トランジスタ同士を接続する複数の接続点のうちの異なる2つの前記接続点に、それぞれ、前記第1端子及び前記第2端子が接続された第2トランジスタとを備える
固体撮像装置。 - 前記電流源は、さらに、
前記垂直信号線と前記複数の第1トランジスタとの間に直列挿入された第3トランジスタを備え、
前記第3トランジスタのゲート端子には、所定のバイアス電圧が印加される
請求項1に記載の固体撮像装置。 - 前記複数の第1トランジスタのそれぞれは、第3端子、第4端子、及び前記第3端子と前記第4端子との間の導通状態を制御する第2制御端子を有し、
前記固体撮像装置は、さらに、
前記第2制御端子に所定のバイアス電圧を供給するバイアス発生回路と、
前記バイアス発生回路と、前記第2制御端子とを接続するバイアス線とを備える
請求項1または2に記載の固体撮像装置。 - 前記画素は、
入射光を変換して信号電荷を生成する光電変換部と、
前記光電変換部で生成された前記信号電荷を転送する転送トランジスタと、
前記転送トランジスタにより転送された前記信号電荷を蓄積する電荷蓄積部と、
前記電荷蓄積部に蓄積された前記信号電荷を排出するリセットトランジスタと、
前記電荷蓄積部に蓄積された前記信号電荷を電圧に変換し、当該電圧を前記画素信号として前記垂直信号線に出力する増幅トランジスタとを備える
請求項1〜3のいずれか1項に記載の固体撮像装置。 - さらに、
前記画素信号を前記垂直信号線に出力するタイミングで、前記第2トランジスタの前記第1端子と前記第2端子との間が導通状態となるための制御信号を、前記第1制御端子に供給するタイミング制御回路を備える
請求項1〜4のいずれか1項に記載の固体撮像装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013032636 | 2013-02-21 | ||
JP2013032636 | 2013-02-21 | ||
PCT/JP2014/000422 WO2014129118A1 (ja) | 2013-02-21 | 2014-01-28 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2014129118A1 true JPWO2014129118A1 (ja) | 2017-02-02 |
JP6384795B2 JP6384795B2 (ja) | 2018-09-05 |
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US (1) | US9881961B2 (ja) |
JP (1) | JP6384795B2 (ja) |
WO (1) | WO2014129118A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6384795B2 (ja) * | 2013-02-21 | 2018-09-05 | パナソニックIpマネジメント株式会社 | 固体撮像装置 |
JP6480768B2 (ja) * | 2015-03-17 | 2019-03-13 | キヤノン株式会社 | 固体撮像装置及びその駆動方法 |
JP6690650B2 (ja) * | 2015-09-30 | 2020-04-28 | 株式会社ニコン | 撮像素子、撮像装置、及び電子機器 |
US10171765B1 (en) * | 2017-12-22 | 2019-01-01 | Omnivision Technologies, Inc. | Bit line boost for fast settling with current source of adjustable size |
JP7175712B2 (ja) * | 2018-10-25 | 2022-11-21 | キヤノン株式会社 | 撮像装置及びその制御方法、プログラム、記憶媒体 |
KR102633135B1 (ko) * | 2019-01-28 | 2024-02-02 | 삼성전자주식회사 | 이미지 센서 및 그의 동작 방법 |
EP3706409B1 (en) | 2019-03-07 | 2022-05-11 | Melexis Technologies NV | Pixel voltage regulator |
CN113434090B (zh) * | 2021-06-30 | 2023-03-28 | 同济大学 | 一种用于高速视频测量的海量数据异步存储方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006279469A (ja) * | 2005-03-29 | 2006-10-12 | Konica Minolta Holdings Inc | 固体撮像装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6855937B2 (en) * | 2001-05-18 | 2005-02-15 | Canon Kabushiki Kaisha | Image pickup apparatus |
JP3962561B2 (ja) | 2001-07-12 | 2007-08-22 | キヤノン株式会社 | 固体撮像装置及びそれを用いた撮像システム |
GB2381644A (en) * | 2001-10-31 | 2003-05-07 | Cambridge Display Tech Ltd | Display drivers |
JP4082134B2 (ja) * | 2002-08-22 | 2008-04-30 | セイコーエプソン株式会社 | 電子回路、電気光学装置及び電子機器 |
US7317484B2 (en) * | 2003-02-26 | 2008-01-08 | Digital Imaging Systems Gmbh | CMOS APS readout scheme that combines reset drain current and the source follower output |
US7157683B2 (en) * | 2004-07-16 | 2007-01-02 | Micron Technology, Inc. | Method, apparatus and system providing configurable current source device for image sensors |
JP4792934B2 (ja) * | 2005-11-17 | 2011-10-12 | ソニー株式会社 | 物理情報取得方法および物理情報取得装置 |
JP4967489B2 (ja) | 2006-07-12 | 2012-07-04 | ソニー株式会社 | 固体撮像装置 |
JP4238900B2 (ja) * | 2006-08-31 | 2009-03-18 | ソニー株式会社 | 固体撮像装置、撮像装置 |
JP5006281B2 (ja) * | 2008-07-24 | 2012-08-22 | パナソニック株式会社 | 固体撮像装置、カメラ |
JP4686582B2 (ja) | 2008-08-28 | 2011-05-25 | 株式会社東芝 | 固体撮像装置 |
US20100301398A1 (en) * | 2009-05-29 | 2010-12-02 | Ion Torrent Systems Incorporated | Methods and apparatus for measuring analytes |
WO2011030391A1 (ja) * | 2009-09-11 | 2011-03-17 | パナソニック株式会社 | アナログ・デジタル変換器、イメージセンサシステム、カメラ装置 |
DE102010001918B4 (de) * | 2010-02-15 | 2017-05-18 | Robert Bosch Gmbh | Bildwandler |
JP2011239068A (ja) * | 2010-05-07 | 2011-11-24 | Toshiba Corp | 固体撮像装置 |
JP2011248932A (ja) * | 2010-05-21 | 2011-12-08 | Panasonic Corp | 半導体記憶装置 |
GB2481970A (en) * | 2010-07-06 | 2012-01-18 | St Microelectronics Res & Dev Ltd | Image sensor with sample and hold circuitry for noise reduction |
AU2011226766A1 (en) * | 2010-09-24 | 2012-04-12 | Life Technologies Corporation | Matched pair transistor circuits |
US8587708B2 (en) * | 2011-01-27 | 2013-11-19 | Aptina Imaging Corporation | Image sensors with low noise mode for pixel array current bias |
US9191598B2 (en) * | 2011-08-09 | 2015-11-17 | Altasens, Inc. | Front-end pixel fixed pattern noise correction in imaging arrays having wide dynamic range |
JP6029352B2 (ja) * | 2011-10-07 | 2016-11-24 | キヤノン株式会社 | 固体撮像装置 |
JP5967915B2 (ja) * | 2011-12-09 | 2016-08-10 | キヤノン株式会社 | 固体撮像装置の駆動方法 |
KR102007275B1 (ko) * | 2012-12-27 | 2019-08-05 | 삼성전자주식회사 | 3차원 이미지 센서의 거리 픽셀 및 이를 포함하는 3차원 이미지 센서 |
JP6384795B2 (ja) * | 2013-02-21 | 2018-09-05 | パナソニックIpマネジメント株式会社 | 固体撮像装置 |
FR3028702A1 (fr) * | 2014-11-13 | 2016-05-20 | Commissariat Energie Atomique | Capteur d'images cmos a conversion analogique-numerique de type sigma-delta |
TWI684004B (zh) * | 2014-12-18 | 2020-02-01 | 美商生命技術公司 | 用於使用大規模fet陣列量測分析物之方法及設備 |
KR102383101B1 (ko) * | 2015-02-25 | 2022-04-05 | 삼성전자주식회사 | 다른 기판 바이어스 전압들을 갖는 이미지 센서 |
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JP2006279469A (ja) * | 2005-03-29 | 2006-10-12 | Konica Minolta Holdings Inc | 固体撮像装置 |
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US20150357369A1 (en) | 2015-12-10 |
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JP6384795B2 (ja) | 2018-09-05 |
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