JPWO2006051577A1 - Load port and adapter - Google Patents

Abstract

Wafer carriers having different sizes can be selectively mounted on the mounting table, and wafers of different sizes accommodated in the wafer carriers mounted on the mounting table can be mapped. Provide an adapter that can be indirectly attached to the. The load port 100 is movably provided on the table 101, and indirectly mounts the wafer carrier 200 that accommodates the wafer 200A via the adapter 10, or directly mounts the wafer carrier 300 that accommodates the wafer 300A. A carrier determination unit 161 that detects which of the mounting table 110 and the wafer carriers 200 and 300 is mounted on the mounting table 110 and outputs a detection signal corresponding to the mounted wafer carriers 200 and 300, and a carrier determination unit 161. A mapping determination unit 162 for mapping the wafers 200A and 300A on the basis of the detection signal from 161.

Description

  The present invention provides a load port provided in a substrate processing apparatus to which various substrates such as silicon wafers (hereinafter referred to as wafers) are transferred, and for mounting a substrate storage container (hereinafter referred to as wafer carrier) that stores wafers at predetermined intervals. And an adapter attached to the wafer carrier.

Conventionally, this type of load port is usually used in a so-called pre-process for performing processing such as printing a circuit pattern on a wafer.
In Patent Document 1, a carrier door at the opening portion of a wafer carrier whose inside is kept highly clean is engaged with a load port door at the opening portion of a substrate processing apparatus which is kept highly clean, and both openings are provided. The carrier door is attached and detached while the peripheral parts of the parts are kept in close contact with each other while maintaining a high degree of cleanliness. The fine adjustment mechanism that finely adjusts the position of the positioning pin that positions the carrier door is engaged with the positioning pin. And a position holding mechanism for holding the position of the carrier door.

  The load port of Patent Document 1 is premised on being used in a pre-process that requires high cleanliness, and is a so-called post-process in which a wafer that has undergone the pre-process is chipped, bonded, and molded such as resin molding. It is not primarily intended for use.

  A factory that performs post-processes does not require a higher degree of cleanliness than a factory that performs pre-processes. Therefore, a carrier door has been removed in advance, FOSB (Front Ooening Shipping Box), and an open cassette without a carrier door is used. Sometimes. For this reason, the load port used in the subsequent process does not require a mechanism for engaging and disengaging the load port door and the carrier door disclosed in Patent Document 1 to attach and detach the carrier door.

  By the way, since the load port cannot be used for both the FOSB and the open cassette, the substrate processing apparatus corresponding to both the FOSB and the open cassette has a load port for the FOSB and a load port for the open cassette on the front surface thereof. Therefore, there is a problem that the cost is increased and the work space is reduced.

  Further, the specification of the 200 mm open cassette may be changed to 300 mm in the future. In that case, for example, a SMIF (Standard Mechanical Interface) that can be used for the 200 mm open cassette in the substrate processing apparatus. ) Is attached, it must be replaced with a load port that can be used for an open cassette for 300 mm according to the customer's request.

  Furthermore, it was very difficult to detect and map a 300 mm wafer housed in the FOSB or a 200 mm wafer housed in the open cassette using the same mechanism. The reason for this is that not only the size and thickness of the wafer are different, but also the pitch of the slots holding the wafer is different in the so-called SEMI standard-compliant FOSB and open cassette (for example, 10 mm in FOSB, open 6.35 mm for the cassette).

It is known that when the film type formed on the wafer is a Nitride or Oxide-based film, it is difficult to detect the wafer with a reflective sensor.
Therefore, when mapping a 300 mm wafer, a transmissive sensor is mainly used. However, the transmissive sensor needs to detect the tip of the wafer, and it has been difficult to detect wafers of different sizes with the same mechanism.

JP-A-2002-68362

  An object of the present invention is to load wafer carriers of different sizes selectively on a mounting table and to map wafers of different sizes accommodated in the wafer carriers mounted on the mounting table. And to provide an adapter capable of indirectly attaching the wafer carrier to the mounting table.

The present invention solves the above problems by the following means.
According to a first aspect of the present invention, a load port door is provided at a front surface of a door opening of a substrate processing apparatus in which a substrate is transferred, in which carriers for accommodating the substrates are placed at predetermined intervals, and the door opening is provided. A loading port for opening and closing the mounting table, a first carrier directly mounted on the mounting table for accommodating a first substrate, and a size different from the first carrier, and the mounting table via an adapter. The load port includes a second carrier that is placed and accommodates a second substrate having a size different from that of the first substrate, and a detection unit that detects which of the second carriers is placed on the placing table.

  According to a second aspect of the present invention, in the load port according to the first aspect, the detection unit outputs a detection signal corresponding to the first carrier or the second carrier placed on the mounting table, and the detection is performed. The load port further comprises a mapping unit that maps the first substrate or the second substrate based on a signal.

  According to a third aspect of the present invention, in the load port according to the second aspect, the mapping unit changes an initial setting value when performing the mapping based on the detection signal. is there.

  According to a fourth aspect of the present invention, in the load port according to the third aspect, the initial setting value is provided in the distance between the first substrates or between the second substrates, and in the first carrier or the second carrier. The load port is the distance between the lowermost or uppermost holding unit that holds the first substrate or the second substrate and the mounting table described above.

  A fifth aspect of the present invention is the load port according to the fourth aspect, wherein the mapping unit moves from the lowermost stage to the uppermost stage or from the uppermost stage to the lowermost stage of the holding unit while the first substrate or the A load port including a mapping sensor for detecting the second substrate.

  A sixth aspect of the present invention is the load port according to the fifth aspect, wherein the mounting table is a tip on the load port door side of the first substrate housed in the first carrier mounted on the mounting table. Move to the load port door side so that the portion and the front end portion of the second substrate accommodated in the second carrier placed on the mounting table on the load port door side are substantially at the same position. It is possible, and the mapping unit includes a pop-out sensor that is provided in the load port door and detects that the first substrate or the second substrate pops out from the holding unit to the load port door, After the table has moved to the load port door side, and when the tip portion is located within the sensor area of the pop-out sensor, the mapping is stopped.

  A seventh aspect of the present invention is the load port according to the sixth aspect, wherein the mapping portion is after the mounting table has moved to the load port door side, and the tip portion is outside the sensor area of the pop-out sensor. And wherein the mapping is started when the load port is located at.

  According to an eighth aspect of the present invention, in the load port according to the first aspect, the detection unit detects a displacement amount with respect to a lower surface of the first carrier when the first carrier is mounted on the mounting table. In addition, when the adapter is placed on the mounting table, a first sensor that detects the amount of displacement from the lower surface of the adapter and the lower surface of the adapter, the second carrier is provided via the adapter. And a second sensor that detects the amount of displacement with respect to the moving unit that moves to the side of the mounting table when mounted on the mounting table.

  According to a ninth aspect of the present invention, in the load port according to the eighth aspect, the adapter includes a push-down portion that is provided on an upper surface of the adapter and that is pushed down by a protrusion provided on a lower surface of the second carrier. Is a load port characterized in that when the push-down portion is pushed down, the push-portion moves to the mounting table side.

  According to a tenth aspect of the present invention, there is provided a first carrier which is directly placed on the mounting table and accommodates the first substrate, and a size which is different from the first carrier, and the first substrate is indirectly mounted on the mounting table. A second carrier for accommodating second substrates of different sizes can be selectively placed on the placing table, and a detection signal indicating that the second carrier is placed on the placing table is output. An adapter used for a load port system including a detection unit and arranged between the second carrier and the mounting table, the protrusion being provided on an upper surface of the adapter and provided on a lower surface of the second carrier. By the pressing portion that is pushed down by, and provided on the lower surface thereof, when the second carrier is indirectly placed on the mounting table, the pressing portion is pushed down to move to the mounting table side, And a moving unit that causes the detection unit to output the detection signal.

ADVANTAGE OF THE INVENTION According to this invention, the 1st carrier directly mounted on the mounting base and accommodating a 1st board|substrate, and the 2nd carrier indirectly mounted on the mounting base and accommodating a 2nd board|substrate selectively. Since it can be mounted on a substrate, cost reduction and space saving can be achieved.
Also, which of the first carrier and the second carrier is mounted on the mounting table is detected, and the first substrate or the second substrate is mapped based on the detection signal corresponding to the first carrier or the second carrier. Substrates of different sizes can be mapped by the same mechanism.

FIG. 3 is a perspective view showing a load port and an adapter according to an exemplary embodiment of the present invention. FIG. 3 is a perspective view showing a load port according to an embodiment of the present invention, a wafer carrier mounted on a mounting table via an adapter, and a wafer carrier directly mounted on the mounting table. It is an enlarged view which shows the inside of the mounting base of a load port shown in FIG. 1, and an adapter. FIG. 4 is a cross-sectional view taken along the line AA showing the adapter according to the exemplary embodiment of the present invention. FIG. 6 is a top view and a side view showing an adapter according to an embodiment of the present invention. It is a bottom view showing the adapter by the example of the present invention. 5A and 5B are a top view and a side view showing a positional relationship between a wafer carrier having different sizes mounted on a load port and a transmissive sensor and a mapping sensor provided on the load port according to an embodiment of the present invention. FIG. 3 is a block diagram showing a load port according to an embodiment of the present invention. 6 is a flowchart showing the operation of the load port according to the embodiment of the present invention.

Explanation of symbols

10 Adapter 11 Base Plate 22-1, 22-2 Moving Body 24-1, 24-2 Depressing Part 100 Load Port 110 Placement Table 121a-121d First Sensor 122a, 122b Second Sensor 141a, 141b Transmissive Sensor 150 Load Port Door opening/closing mechanism 152a, 152b Mapping sensor 161 Carrier determination unit 162 Mapping determination unit 163 Initial value setting unit 200,300 Wafer carrier 200A, 300A Wafer 200B, 300B Slot

  SUMMARY OF THE INVENTION The present invention has an object to allow wafer carriers of different sizes to be selectively mounted on a mounting table and to map wafers of different sizes accommodated in the wafer carriers mounted on the mounting table to the first substrate. Directly mounting the first carrier that stores the, or a mounting table that indirectly mounts the second carrier that stores the second substrate, and based on the detection signal corresponding to the first carrier or the second carrier, It is realized by including a mapping unit that maps the first substrate or the second substrate.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings and the like.
FIG. 1 is a perspective view showing a load port and an adapter according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a load port according to an embodiment of the present invention, a wafer carrier mounted on a mounting table via an adapter, and a wafer carrier directly mounted on the mounting table.
As shown in FIG. 1 and FIG. 2, the load port 100 includes a wall surface 130 having a door opening 131 for opening and closing the load port door 140, and the like. It is mounted on the wall surface of a substrate processing apparatus (not shown) that performs processing such as chip formation, bonding, and molding such as resin molding.
The load port 100 is a device that mounts the wafer carriers 200 and 300 whose one surface is opened by the carrier openings 202 and 302 and opens and closes the load port door 140 of the door opening 131. A support base 102 that supports the load port 100, a mounting base 110 that is movably provided on the table 101, a drive unit 120 (see FIG. 3) that is provided inside the table 101 and drives the mounting base 110, and a load. A load port door opening/closing mechanism 150 for opening/closing the port door 140 is provided.

The mounting table 110 is a table on which the wafer carriers 200 and 300 transferred by an automatic transfer device (not shown) are selectively mounted, and the wafer carrier 200 is indirectly mounted via the adapter 10, The carrier 300 is placed directly.
The load port door 140 is used near the upper end portion or the lower end portion when performing mapping described later, and one of the transmission type sensors 141a and 141b is a light emitting side and the other is a light receiving side. There is.
The mounting table 110 is provided with kinematic pins 111a to 111c for positioning the adapter 10 or the wafer carrier 300 on the upper part thereof.

As shown in FIGS. 2 and 7, the wafer carrier 200 is a so-called open cassette in which 200 mm wafers 200A are housed at predetermined intervals (about 6.35 mm), and the carrier shell 201 and the wafers 200A are included. It is provided with a slot 200B for holding and the like.
The carrier shell 201 is provided with a robot flange 203 on an upper portion thereof for being gripped by an automatic transport device, and pushes down the pressing portions 24-1 and 24-2 provided on the upper surface of the adapter 10 on the lower surface 210 thereof. A depression projection (not shown) is provided.

As shown in FIGS. 2 and 7, the wafer carrier 300 is a so-called FOSB in which 300 mm wafers 300A are housed at predetermined intervals (about 10 mm), and is a carrier shell 301 and a slot for holding the wafer 300A. 300B and the like.
The carrier shell 301 is provided with a robot flange 303 on an upper portion thereof, and a V-shaped groove portion (not shown) which engages with the kinematic pins 111a to 111c is formed on a lower surface 310 thereof.

FIG. 3 is an enlarged view showing the inside of the mounting table of the load port shown in FIG. 1 and the adapter.
As shown in FIG. 3, the drive unit 120 is provided inside the table 101, and a slide unit 123 that allows the mounting table 110 to move to the load port door 140 side, and a slide unit provided around the slide unit 123. It is provided with first sensors 121a to 121d, second sensors 122a and 122b, etc. that move together with 123.

  The slide portion 123 has a protrusion that penetrates a hole formed in the mounting table 110. The protrusion is capable of descending while moving horizontally, and holds the mounting table 110 on the driving unit 120 when the mounting table 110 is placed on the driving unit 120 as shown in FIGS. 1 and 2. So as to contact the upper surface of the mounting table 110.

  The first sensors 121 a to 121 d are contact-type sensors and have a first protrusion that penetrates a hole formed in the mounting table 110, and when the wafer carrier 300 is directly mounted on the mounting table 110. First, the displacement amount from the lower surface 310 of the wafer carrier 300 is detected, and the displacement amount from the lower surface of the adapter 10 is detected when the adapter 10 is mounted on the mounting table 110.

  The second sensors 122a and 122b are contact sensors, have a second protrusion that penetrates a hole formed in the mounting table 110, are provided on the lower surface of the adapter 10, and the wafer carrier 200 is used as the wafer carrier 200. When mounted on the mounting table 110 via the, the amount of displacement with respect to the moving bodies 22-1 and 22-2 (see FIG. 4) moving to the mounting table 110 side is detected.

FIG. 4 is a cross-sectional view taken along the line AA showing the adapter according to the embodiment of the present invention.
FIG. 5 is a top view and a side view showing an adapter according to an embodiment of the present invention.
FIG. 6 is a bottom view showing an adapter according to an embodiment of the present invention.
As shown in FIG. 2, the adapter 10 is arranged between the wafer carrier 200 and the mounting table 110, and is used to indirectly mount the wafer carrier 200 on the mounting table 110. As shown in FIG. 3, the base plate 11 and the grips 12a and 12b attached to the side surfaces of the base plate 11 are provided.
The base plate 11 has a cut portion 16 formed on a side surface which is the side of the load port door 140 when placed on the mounting table 110, and a groove portion 15 is formed substantially at the center of the cut portion 16. The base plate 11 has a plurality of transfer plates 14 which are provided on the upper surface thereof in the groove portions 15 and have the claw portions 14a and 14b at both end portions thereof, and are arranged substantially parallel to the transfer plate 14, and the lower surface 210 of the wafer carrier 200. Holding screws 21-1 and 21-21, which are formed along the longitudinal direction of the engaging plate 13 and engaging plate 13 in which engaging holes 13a and 13b for engaging with a convex portion (not shown) provided on the 2 and the insertion holes 11c and 11d into which the pressing portions 24-1 and 24-2 are inserted, respectively.

  The base plate 11 accommodates the V-shaped groove portions 17a to 17c engaging with the kinematic pins 111a to 111c and the moving bodies 22-1 and 22-2 on the lower surface thereof, and the holding screw portions 21-1 and 21-2. And a groove 11a and a circular groove 11b corresponding to the positions of the pressing portions 24-1 and 24-2, respectively.

Here, the positional relationship between the pressing unit 24-1 and the moving body 22-1 will be described. Since the pressing parts 24-1 and 24-2 have substantially the same structure, the positional relationship between the pressing part 24-2 and the moving body 22-2 will be omitted.
A holding table 23 having a flange portion is attached to the insertion hole 11d formed in the base plate 11. The upper surface side of the holding table 23 has a cylindrical shape, and the pressing portion 24-1 is inserted into the inside 23a thereof.
The pressing portion 24-1 is urged toward the upper surface side by the spring 25 so that the upper end thereof projects from the upper surface of the base plate 11. The lower end of the push-down portion 24-1 penetrates the holding table 23 and is fixed to an engagement hole 22a formed in the moving body 22-1.

  A holding screw portion 21-1 is screwed into the insertion hole 11c formed in the base plate 11, and a support column 26 is attached to the lower end of the holding screw portion 21-1. The support column 26 penetrates the engagement hole 22b formed in the moving body 22-1, and separates the moving body 22-1 with a gap so that the moving body 22-1 can move in the vertical direction of the base plate 11. keeping.

  Therefore, when the wafer carrier 200 is attached to the upper surface of the adapter 10, the pressing protrusion provided on the lower surface 210 of the wafer carrier 200 moves the pressing portion 24-1 against the spring 25 to the lower surface of the base plate 11. Push it down to the side. When the push-down section 24-1 is pushed down, the moving body 22-1 moves to the lower surface side of the base plate 11 while being held by the support column 26.

The lower surface 210 of the wafer carrier 200 is stably attached to the upper surface of the adapter 10 by engaging the claw portions 14a and 14b of the transfer plate 14 and the engaging holes 13a and 13b of the engaging plate 13. ..
Further, when the adapter 10 is mounted on the mounting table 110 with the wafer carrier 200 attached to the upper surface thereof, the V-shaped groove portions 17a to 17c engage with the kinematic pins 111a to 111c and the notch is formed. The groove portion 15 of the portion 16 engages with the uneven portion of the slide portion 123. As a result, the wafer carrier 200 is indirectly and stably mounted on the mounting table 110 via the adapter 10.

  Since the moving body 22-1 is moved to the mounting table 110 side when the wafer carrier 200 is mounted on the mounting table 110 via the adapter 10, the moving body 22-1 is not moved to the second protruding portions of the second sensors 122a and 122b. It contacts the upper end at the contact point 22A.

  The adapter 10 informs the carrier determination unit 161 (see FIG. 8) that the wafer carrier 200 is indirectly mounted on the mounting table 110 by bringing the moving body 22-1 into contact with the second sensors 122a and 122b. It can be detected (details will be described later).

Next, a state in which the wear carrier 200 or the wafer carrier 300 is mounted on the mounting table 110 of the load port 100 will be described with reference to FIGS. 7 and 8.
7A and 7B are a top view and a side view showing an arrangement relationship between a wafer carrier having a different size mounted on a load port according to an embodiment of the present invention and a transmissive sensor and a mapping sensor provided on the load port. .. In order to show the positional relationship between the wafers 200A and 300A, the transmissive sensors 141a and 141b, and the mapping sensors 152a and 152b in FIG. 7, the tips of the wafers 200A and 300A on the side of the load port door 140 should be aligned. FIG. 3 is a diagram showing a wafer carrier 200 and a wafer carrier 300 in an overlapping manner.
FIG. 8 is a block diagram showing a load port according to an embodiment of the present invention.
As shown in FIG. 8, the load port 100 includes a control unit 160, a carrier determination unit 161, a mapping determination unit 162, first sensors 121a to 121d, second sensors 122a and 122b, and a transmissive sensor 141a,. 141 b, an initial value setting unit 163, mapping sensors 152 a and 152 b, a load port door opening/closing mechanism 150, etc. are provided, and these members are electrically connected via a control unit 160.

  The carrier determination unit 161 detects which of the wafer carriers 200 and 300 is mounted on the mounting table 110, and sends a detection signal corresponding to the wafer carriers 200 and 300 mounted on the mounting table 110 to the mapping determination unit 162. It is a device for outputting.

  The mapping determination unit 162 is a device that maps the wafers 200A and 300A based on the detection signal output from the carrier determination unit 161. Here, the mapping means determining the presence/absence of the wafers 200A, 300A in the specific slots 200B, 300B and generating information indicating the presence/absence and positions of the wafers 200A, 300A in the wafer carriers 200, 300. The wafer transfer robot of the processing apparatus changes its movement based on the determination result of this mapping.

  The initial value setting unit 163 is a device that changes the initial setting value when performing mapping based on the detection signal. The initial set values are the distance between the wafers 200A or the wafers 300A, the distance between the wafers 200A or the uppermost or lowermost slots 200B and 300B (see FIG. 7B) holding the wafers 300A and the mounting table 110. Is.

  As shown in FIG. 7B, the mapping sensors 152a and 152b are rotatably provided on a support shaft 151 arranged along the vicinity of the upper end of the load port door opening/closing mechanism 150. The mapping sensors 152a and 152b rotate counterclockwise in FIG. 7B when starting the detection of the wafer 200A or the wafer 300A, and as the support shaft 151 moves in the vertical direction, the slots 200B, This is an apparatus for detecting the wafer 200A or the wafer 300A while moving from the uppermost stage to the lowermost stage of the 300B.

  Further, the mapping sensors 152a and 152b are positions where the wafers 200A and 300A can be detected without interfering with other members when the wafer carrier 200 or the wafer carrier 300 is mounted on the mounting table 110, that is, as shown in FIG. As shown in FIG. 7(a), it is arranged between the inner wall of the carrier opening 202 and the transmissive sensors 141a and 141b, and its end is inserted inside the tip of the wafers 200A and 300A. To be done.

  As shown in FIG. 7, the mounting table 110 is movable toward the load port door 140, and when the wafer carrier 200 or the wafer carrier 300 is mounted on the mounting table 110, the load port door 140 of the wafer 200A is installed. The leading end on the side of the wafer 300B and the leading end of the wafer 300B on the side of the load port door 140 can be located at substantially the same position.

  When the mounting table 110 is moved to the load port door 140 side and the tip of the wafer 200A or the wafer 300A is located outside the sensor area of the transmissive sensors 141a and 141b, the mapping determination unit 162 is located. In addition, it is a device that causes the mapping sensors 152a and 152b to start detection of the wafer 200A or the wafer 300A.

The operation when the load port 100 detects whether the wafer carrier 200 or the wafer carrier 300 is mounted on the mounting table 110 and maps the wafer 200A or the wafer 300A will be described below with reference to FIGS. The determination unit 161 and the mapping determination unit 162 will be mainly described.
FIG. 9 is a flowchart showing the operation of the load port according to the embodiment of the present invention.
First, the carrier determination unit 161 detects the detection signal A1 output from the first sensors 121a to 121d when the wafer carrier 300 or the adapter 10 is mounted on the mounting table 110 (S101). The detection signal A1 is generated when the first protrusions of the first sensors 121a to 121d contact the lower surface 310 of the wafer carrier 300 or the lower surface of the adapter 10.

  Next, the carrier determination unit 161 detects whether or not the detection signal A2 is output from the second sensors 122a and 122b (S102). The second sensors 122a and 122b output the detection signal A2 to the carrier determination unit 161 when the wafer carrier 200 is mounted on the mounting table 110 via the adapter 10. The detection signal A2 is generated when the second protrusions of the second sensors 122a and 122b come into contact with the contact points 22A and 22B of the moving bodies 22-1 and 22-2 of the adapter 10.

  When the detection signal A2 is output from the second sensors 122a and 122b (S102, YES), the carrier determination unit 161 detects that the wafer carrier 200 is mounted on the mounting table 110 via the adapter 10. At the same time, the detection result is output to the mapping determination unit 162.

  The mapping determination unit 162 reads the signal B1 from the initial value setting unit 163 in order to map the wafer 200A held in each slot 200B of the wafer carrier 200 (S103). The signal B1 is information indicating the pitch (for example, 6.35 mm) between the wafers 200A and the distance between the mounting table 110 and the uppermost slot 200B indicating the position where the mapping sensors 152a and 152b start detecting the wafer 200A. Have. The signal B1 may have the number of slots 200B as information, and thus the mapping determination unit 162 can calculate the position at which detection of the wafer 200A ends.

  On the other hand, when the detection signal A2 is not output from the second sensors 122a and 122b (S102, NO), the carrier determination unit 161 detects that the wafer carrier 300 is mounted on the mounting table 110, and The detection result is output to the mapping determination unit 162. Even when only the adapter 10 is mounted on the mounting table 110, only the detection signal A1 is output to the carrier determination unit 161, but in the manufacturing line for performing the post-process, the upper surface of the adapter 10 is Since the wafer carrier 200 is always attached, the carrier determination unit 161 detects that the wafer carrier 300 is mounted on the mounting table 110 as described above.

  Next, the mapping determination unit 162 reads the signal B2 from the initial value setting unit 163 in order to map the wafer 300A held in each slot 300B of the wafer carrier 300 (S104). The signal B2 has information indicating a pitch (for example, 10 mm) between the wafers 300A and a distance between the mounting table 110 and the uppermost slot 300B indicating a position where the mapping sensors 152a and 152b start detecting the wafer 300A. . The signal B2 may have the number of slots 300B as information, and thus the mapping determination unit 162 can calculate the position at which detection of the wafer 300A ends.

  The mapping determination unit 162 reads the signal C1 output from the transmissive sensors 141a and 141b (S105), and then outputs the signal D1 to the mapping sensors 152a and 152b to start detection of the wafer 200A or the wafer 300A ( S106).

  The signal C1 indicates a suitable position where the wafer 200A or the wafer 300A is mapped, that is, after all of the tips of the wafer 200A or the wafer 300A on the load port door 140 side move to the load port door 140 side. , And has information indicating that they are located outside the sensor regions of the transmissive sensors 141a and 141b.

The tip of the wafer 200A or the wafer 300A has a problem that the wafer 200A or the wafer 300A is displaced from the respective slots 200B and 300B due to, for example, vibration accompanying the movement of the mounting table 110, and pops out toward the load port door 140 side. When it occurs, it will be located in the sensor area of the transmission type sensors 141a and 141b.
At this time, the transmissive sensors 141a and 141b output a signal indicating that the position of the wafer 200A or the wafer 300A is deviated to the mapping determination unit 162, and the mapping determination unit 162 causes the mapping sensors 152a and 152b to detect the wafer 200A or the wafer 200A. Mapping is stopped without starting detection of the wafer 300A.
In this case, the mounting table 110 moves away from the load port door 140 side and returns to the original position again. At this time, the mapping determination unit 162 outputs a signal for generating a warning sound to a voice output unit (not shown) to warn an operator or the like that the position of the wafer 200A or the wafer 300A is deviated, or Alternatively, a signal for displaying a warning display on an appropriate display unit may be output. Furthermore, the mapping determination unit 162 can also output these signals to the substrate processing apparatus or the like.

  Then, the mapping determination unit 162 reads the signal C1 again and outputs the signal D1 again after the wafer 200A or the wafer 300A is appropriately held in each of the slots 200B and 300B by an operator or the like, and the mapping sensor 152a, The detection of the wafer 200A or the wafer 300A is started by the 152b.

Next, the control unit 160 outputs the signal E1 to the load port door opening/closing mechanism 150 (S107). The load port door opening/closing mechanism 150 opens the load port door 140 in the door opening 131 when the signal E1 is output from the control unit 160. As a result, the carrier openings 202 and 302 of the wafer carriers 200 and 300 and the processing space in the substrate processing apparatus are in a continuous state.
After that, the wafers 200A and 300A are transferred into the processing space by the wafer transfer robot of the substrate processing apparatus, and the post-process is performed.

According to the load port 100, since the wafer carrier 300 can be directly mounted on the mounting table 110 and the wafer carrier 200 can be indirectly mounted on the mounting table 110 via the adapter 10, the wafer carriers having different sizes can be mounted. 200 and 300 can be selectively mounted on the mounting table 110.
Therefore, the substrate processing apparatus can be adapted to wafer carriers of different sizes simply by mounting the load port 100 on the front surface thereof, and cost reduction and space saving can be achieved.

  In addition, the load port 100 detects which of the wafer carriers 200 and 300 is mounted on the mounting table 110, and when the wafer carriers 200 and 300 having different sizes are mounted on the mounting table 110, the load port 100 is initialized. Only by changing the initial value in the value setting unit 163, the wafers 200A and 300A having different sizes can be mapped by the same mechanism.

  The adapter 10 is arranged between the wafer carrier 200 and the mounting table 110, whereby the moving bodies 22-1 and 22-2 move to the mounting table 110 side, and the detection signals A2 are transmitted to the second sensors 122a and 122b. Is output, the load port 100 can detect that the wafer carrier 200 is indirectly mounted on the mounting table 110.

(Modification)
The present invention is not limited to the embodiments described above, and various modifications and changes can be made, which are also within the scope of the present invention.
(1) In the load port 100, the wafer carriers 200 and 300 can be selectively mounted on the mounting table 110. However, the present invention is not limited to this, and in order to mount an appropriate carrier conforming to the SEMI standard, the first The positions of the sensors 121a to 121d, the second sensors 122a and 122b, and the pressing portions 24-1 and 24-2 may be changed.
(2) The carrier determination unit 161 mounts the wafer carrier 300 on the mounting table 110 when the detection signal A1 is output from the first sensors 121a to 121d and the detection signal A2 is not output from the second sensors 122a and 122b. When the detection signal A2 is not output even after a predetermined time elapses, for example, when the detection signal A1 is output, a timer or the like is activated when the detection is performed (S101, S102). May detect that the wafer carrier 300 is mounted on the mounting table 110.
(3) The first sensors 121a to 121d and the second sensors 122a and 122b are contact sensors, but the invention is not limited to this, and the lower surface 310 of the wafer carrier 300 or the lower surface of the adapter 10 and the moving bodies 24-1 and 24-24. A non-contact type sensor may be used as long as the displacement amount of 2 can be detected.
(4) The mapping sensors 152a and 152b start detecting the wafer 200A or the wafer 300A from the uppermost slots 200B and 300B. However, the present invention is not limited to this, and the support shaft 151 is lowered in advance, and further, the lowermost stage. The information indicating the distance between the slots 200B and 300B and the mounting table 110 and the number of the slots 200B and 300B may be incorporated in the signals B1 and B2 to start from the lowest slots 200B and 300B.
(5) The load port 100 is premised to be used in the subsequent process, but the present invention is not limited to this and may be used in the previous process as long as it is used in a clean room in which the inside is kept at a high degree of cleanliness. .. The details will be described below.
A general load port is assumed to be used in a 300 mm factory that mainly processes 300 mm wafers. In the 300 mm factory, the cleanliness inside the clean room is lowered to maintain a high cleanliness locally.
In a 300 mm pre-process factory that performs a pre-process requiring high cleanliness in a 300 mm factory, a wafer carrier having a carrier door is used to process 300 mm wafers. On the other hand, in the 300 mm factory, the 300 mm post-process factory, which performs post-processes that do not require higher cleanliness than the pre-process, uses the wafer carriers 200 and 300 whose one side is open and uses only 300 mm wafers. 200 mm wafers may also be processed.
Therefore, the load port 100 can be suitably used in a 300 mm post-process factory.
On the other hand, in a 200 mm factory that processes 200 mm wafers, the inside of the clean room is maintained at a high degree of cleanliness, so the wafer carrier 200 with one side open is used not only in the 200 mm post-process factory but also in the 200 mm pre-process factory. A 200 mm wafer may be processed. Therefore, the load port 100 can be used not only in the 200 mm post-process factory but also in the 200 mm pre-process factory.
Further, even in a 300 mm factory, in a mini-fab in which a minimum production line for conducting experiments etc. is constructed, the inside of the clean room is maintained at a high degree of cleanliness, so the wafer carriers 200, 300 with one side open It can be used, so that the load port 100 can be used in the previous step.
Further, the load port 100 can be used in the previous process not only in the above-mentioned factories but also in a laboratory having a clean room in which the inside is maintained at a high degree of cleanliness.

Claims (10)

A load port which is provided in front of a door opening of a substrate processing apparatus where substrates are transferred, in which carriers for accommodating the substrates are placed at predetermined intervals, and which opens and closes a load port door of the door opening. hand,
A mounting table,
A first carrier directly mounted on the mounting table and housing the first substrate, and a size different from the first carrier, and a size different from the first substrate mounted on the mounting table via an adapter. A second carrier that accommodates the two substrates; and a detection unit that detects which of the second carriers is mounted on the mounting table.
Load port including. The load port according to claim 1,
The detection unit outputs a detection signal according to the first carrier or the second carrier mounted on the mounting table,
Further comprising a mapping unit that maps the first substrate or the second substrate based on the detection signal,
Load port characterized by. The load port according to claim 2,
The mapping unit changes an initial setting value when performing the mapping based on the detection signal,
Load port characterized by. The load port according to claim 3,
The initial setting value is provided on the distance between the first substrates or between the second substrates, and on the first carrier or the second carrier, and the lowermost step for holding the first substrate or the second substrate or The distance between the uppermost holding part and the above-mentioned mounting table,
Load port characterized by. The load port according to claim 4,
The mapping unit includes a mapping sensor that detects the first substrate or the second substrate while moving from the lowermost stage to the uppermost stage or the uppermost stage to the lowermost stage of the holding unit,
Load port characterized by. The load port according to claim 5,
The mounting table is housed in the tip portion of the first substrate, which is accommodated in the first carrier mounted on the mounting table, on the load port door side, and in the second carrier mounted on the mounting table. And a distal end portion of the second substrate on the side of the load port door, which is formed, is movable to the side of the load port door,
The mapping unit includes a pop-out sensor that is provided on the load port door and that detects that the first substrate or the second substrate pops out of the holding unit toward the load port door, and the mounting table is the load unit. Stopping the mapping when the tip portion is located within the sensor area of the pop-out sensor after moving to the port door side,
Load port characterized by. The load port according to claim 6,
The mapping unit, after the mounting table has moved to the load port door side, when the tip portion is located outside the sensor area of the pop-out sensor, to start the mapping,
Load port characterized by. The load port according to claim 1,
The detection unit,
When the first carrier is mounted on the mounting table, the displacement amount from the lower surface of the first carrier is detected, and when the adapter is mounted on the mounting table, the lower surface of the adapter is A first sensor for detecting the displacement amount of
A second sensor which is provided on a lower surface of the adapter, and which detects a displacement amount with respect to a moving unit which moves to the mounting table side when the second carrier is mounted on the mounting table via the adapter;
Load port characterized by including. The load port according to claim 8,
The adapter includes a push-down portion that is provided on an upper surface of the adapter and is pushed down by a protrusion provided on a lower surface of the second carrier,
The moving unit is moved to the mounting table side by pressing down the pressing unit,
Load port characterized by. A first carrier mounted directly on the mounting table and housing the first substrate, and a second substrate having a size different from that of the first carrier and indirectly mounted on the mounting table and having a size different from the first substrate. And a second carrier for storing the load carrier, the load port including a detection unit that outputs a detection signal indicating that the second carrier is placed on the mounting table. An adapter used in the system, which is arranged between the second carrier and the mounting table,
A push-down portion provided on the upper surface thereof and pushed down by a projection provided on the lower surface of the second carrier;
When the second carrier is provided on the lower surface of the mounting table and is indirectly mounted on the mounting table, the pressing unit is pressed to move to the mounting table side and the detection signal is sent to the detection unit. And a moving part that outputs
Including adapter.

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