JP7561059B2 - Storage container installation stand and semiconductor manufacturing equipment - Google Patents

Description

The present invention relates to a stage for mounting containers (hereafter referred to as cassettes) that contain wafers in semiconductor manufacturing equipment.

In semiconductor manufacturing equipment, the operation of removing wafers from a cassette and carrying them into the equipment, or removing wafers from the equipment and storing them in a cassette, is performed by a wafer transport robot. The wafer transport robot transports wafers by placing them on a hand attached to a handling arm. When removing a wafer from a cassette or returning a wafer to a cassette, the coordinate position of the hand is adjusted so that it does not come into contact with the wafer or cassette. For this reason, the placement table on which the cassette is placed, as in Patent Documents 1, 2, and 3, is designed to allow the placement of the cassette with good reproducibility no matter how many times it is placed.

Patent No. 5887719 International Publication No. WO2006/051577 Patent No. 5621451

However, if the size of the wafer being transported changes, the size of the cassette also changes. In semiconductor manufacturing equipment that can transport multiple sizes of wafers, size-changing parts such as stands and adapters that match the cassette size must be prepared so that the same port can transport multiple sizes of wafers, as in Patent Documents 2 and 3, and cassettes can be installed with good reproducibility for each size. Size-changing parts are costly because they must be manufactured for each cassette size, and they must be managed to prevent them from getting lost.

In addition, because size-changing parts such as the stand and adapters require work such as replacement and installation, changing the wafer size on the cassette stand takes time.

The present invention has been made to solve the above-mentioned problems, and aims to provide a storage container installation stand and semiconductor manufacturing equipment that can easily change the wafer size of the cassette stand.

In order to achieve the above object, the storage container installation stand of the present invention is capable of detachably installing a first storage container for storing wafers of a first size at a first position, or a second storage container for storing wafers of a second size larger than the first size at a second position, and is equipped with a first member having an engagement portion that can engage with a first protrusion on the bottom surface of the first storage container and a second protrusion on the bottom surface of the second storage container, and a first movable mechanism that moves the first member in a first direction to position the first or second position, the first direction being a direction in which the wafers of the first size are stored in the first storage container, or a direction in which the wafers of the second size are stored in the second storage container. Other aspects of the present invention will be described in the embodiments described later.

The present invention eliminates the need to manufacture and manage size-changing parts for multiple cassette sizes and makes it easier to change the wafer size of the cassette stand.

FIG. 2 is an oblique view showing the entire semiconductor inspection device. FIG. 2 is a front view of a cassette containing wafers. FIG. 2 is a top view showing a schematic configuration of a wafer transport unit. FIG. 2 is a side view showing a schematic configuration of a wafer transport unit. FIG. 2 is a perspective view of the underside of the first cassette. FIG. 13 is a perspective view of the underside of the second cassette. FIG. 1 is a top view of a 100 mm compatible cassette stand on which a first cassette is placed. FIG. This is a cross-sectional view of AA in FIG. 7A. 11 is a top view of a 200 mm compatible cassette stand on which a second cassette is placed. FIG. 10A and 10B are explanatory diagrams showing block movement in the present embodiment. 13 is a top view showing a configuration example of a block movable cassette placement stand. FIG. This is a cross-sectional view taken along line BB of FIG. 10A. This is a diagram showing the state of the horizontal tie plate before the block is moved. This is a diagram showing the state of the horizontal tie plate after the block is moved. 13 is an example of a cassette support for a stepped positioning block. FIG. 4 is an explanatory diagram of a linear guide clamper. This is an example of the configuration of a block movable cassette stand using a linear guide clamper. 1 is an example of a cassette support for a triangular positioning block. 1 shows examples of various block shapes. 13 is a rear view of an example of installation of a cassette size information sensor on the cassette placement table. FIG. FIG. 18B is a view taken from the direction C in FIG. 18A.

Hereinafter, the present embodiment will be described with reference to the attached drawings. In the attached drawings, functionally identical elements may be indicated by the same or corresponding numbers. Note that the attached drawings show embodiments and implementation examples according to the principles of the present disclosure, but these are for understanding the present disclosure and are in no way used to interpret the present disclosure in a restrictive manner. The descriptions in this specification are merely typical examples and do not limit the scope or application examples of the present disclosure in any sense.

In this embodiment, the disclosure is described in sufficient detail for a person skilled in the art to implement the disclosure, but it should be understood that other implementations and forms are possible, and that changes to the configuration and structure and substitutions of various elements are possible without departing from the scope and spirit of the technical ideas of the disclosure. Therefore, the following description should not be interpreted as being limited to this.

In the embodiment described below, a semiconductor inspection device is used as an example of a "wafer processing device (semiconductor manufacturing device)" used in the semiconductor manufacturing process, but the present disclosure is not limited to this and can be applied to all devices that observe, inspect, measure, analyze, process, etch, clean, dry, heat treat, ion implant, and transport wafers in the semiconductor manufacturing process (hereinafter referred to as "processing"). In addition, the present disclosure can be applied to examples of wafer processing devices related to wafer surface processing, such as devices that perform film formation processes such as sputtering and chemical vapor deposition (CVD), surface modification processes such as surface oxidation and surface nitridation, and even ashing processes.

In the embodiments described below, the term "semiconductor inspection equipment" refers to equipment that measures the dimensions of patterns formed on semiconductor wafers, equipment that inspects patterns formed on semiconductor wafers for defects, or equipment that inspects bare wafers on which no patterns are formed for defects, and also includes composite equipment that combines multiple of these devices.

In the embodiments described below, the term "cassette (storage container)" includes FOUPs (Front Opening Unified Pods), SMIFs (Standard Of Mechanical Interfaces), and other pods, cases, cassettes, and containers for storing wafers.

Below, an overview of the wafer processing device (semiconductor manufacturing device) and wafer transport according to the present disclosure will be explained using Figures 1, 2, 3, and 4. In particular, the explanation will focus on a semiconductor inspection device as an example of a wafer processing device (semiconductor manufacturing device).

Figure 1 is a perspective view showing the entire semiconductor inspection device 100. Figure 2 is a front view of a cassette containing wafers 10. Figure 3 is a top view showing the schematic configuration of a wafer transport unit. Figure 4 is a side view showing the schematic configuration of a wafer transport unit.

The semiconductor inspection device 100 in FIG. 1 has a wafer transport unit 101 (wafer transport device) inside a door at the front of the device. The wafer 10 is removed from the cassette 200 in FIG. 2 and transported to the wafer processing unit 102, which is a higher-level device at the rear of the device.

The wafer processing unit 102 has the main function of a semiconductor inspection device for inspecting or measuring the wafer 10, and a control unit including a computer system and power supply that controls that function. For example, a critical dimension SEM (Scanning Electron Microscope) has an electron gun unit, stage unit, vacuum exhaust unit, and power supply unit, and the control unit controls these units and measures the dimensions of the fine patterns formed on the wafer 10.

The cassette 200 in FIG. 2 has multiple stages of wafer guides 201 on which the wafers 10 are placed, and can store multiple wafers 10. The grooves formed between the wafer guides 201 are called pockets or slots, and hereafter will be referred to as slots 202. The cassette 200 is also called a wafer transport container, a wafer storage container, an open cassette, etc.

The wafer transport unit 101 may have any configuration as long as it can transport the wafer 10 in and out. For example, the semiconductor manufacturing device of FIG. 1 is composed of a control unit 301, a pre-aligner 303, a wafer transport robot 310, a cassette stand 320, and a shutter 103, as shown in FIGS. 3 and 4.

The shutter 103 is an enclosure installed to prevent the wafer transport robot 310 from coming into contact with people or objects while in operation. It is opened when the cassette 200 is placed or removed, and closed when the wafer transport robot 310 is in operation.

In accordance with the command of the control unit 301, the wafer transport robot 310 is used to remove the wafer 10 from the cassette 200 on the cassette placement table 320 and place it on the pre-aligner 303.

The pre-aligner 303 is a unit that measures the amount of eccentricity of the placed wafer 10 and aligns the orientation of the orientation flat and notch. The wafer transport robot 310 uses the measurement results of the pre-aligner 303 via the control unit 301 to correct the amount of eccentricity, aligns the orientation of the wafer 10, and removes it, transporting it to the upper port 302 that transfers the wafer 10 to and from the wafer processing unit 102.

The wafer transport robot 310 takes out the wafer 10 that has been processed in the wafer processing unit 102 and returned from the upper port 302, and stores the wafer 10 in the unprocessed slot of the cassette 200 on the cassette stand 320. As shown in Figures 3 and 4, the wafer transport robot 310 has, as drive axes, a Y axis 401 from the cassette stand 320 to the upper port 302, an X axis 402 perpendicular to the Y axis 401 in the horizontal plane, a Θ axis 403 that rotates the hand 312 on the XY plane, and a Z axis 404 in the vertical up-down direction, and transports the wafer 10 by moving along each of these drive axes.

The arm 313 of the wafer transport robot 310 has a hand 312 that vacuum-sucks or grips the wafer 10, and on the opposite side has a mapping sensor 311 that senses the Z-axis 404 position of the wafer 10 stored in the cassette 200. The wafer transport robot 310 moves in the Z-axis 404 direction from the first stage to the top stage of the slot 202, and the mapping sensor 311 senses the position of the wafer 10. This operation is called a mapping operation, and since the first stage to the top stage of the slot 202 differ depending on the size (diameter) of the cassette 200, the mapping operation differs depending on the size (diameter) of the cassette 200.

The cassette placement stage 320 is a stage for placing the cassette 200, and at least one is provided in the semiconductor manufacturing equipment. For example, in the semiconductor manufacturing equipment of FIG. 1, two cassette placement stages 320 are provided, and two cassettes 200 can be placed on them at the same time. Although not shown, the cassette placement stage 320 is equipped with sensors, switches, and readers. The control unit 301 checks whether the cassette 200 is placed correctly, saves a history of whether the cassette 200 is placed or removed, and checks whether the wafers 10 protrude from the cassette 200 when the cassette 200 is placed.

The drive amount of the wafer transport robot 310 and the extension amount of the arm 313 are adjusted so that the hand 312 of the wafer transport robot 310 does not come into contact with the cassette 200 and the wafer 10 during wafer transport. Therefore, if the cassette 200 placed on the cassette stand 320 is not placed with good repeatability, there is a risk that the hand 312 will come into contact with the cassette 200 or the wafer 10. The adjustment of the drive amount of the wafer transport robot 310 and the extension amount of the arm 313 differs depending on the size of the cassette 200.

The size of the cassette 200 is set in advance in the control unit 301, and the wafer transport robot 310 performs mapping operations and wafer transport operations that match the size of the cassette 200.

The cassette support method will be described below with reference to Figures 5A, 5B, 6, 7A, 7B, and 8. Figure 5A is a perspective view of the underside of the first cassette 200A. Figure 5B is a perspective view of the underside of the second cassette 200B. Figure 6 is a perspective view of the cassette stand 320. Figure 7A is a top view of the 100 mm compatible cassette stand on which the first cassette 200A is placed. Figure 7B is a cross-sectional view of Figure 7A taken along line A-A. Figure 8 is a top view of the 200 mm compatible cassette stand on which the second cassette 200B is placed.

The underside of the first cassette 200A shown in FIG. 5A has a long, convex T-bar 501A, which is inserted into the T-bar insertion block 601 on the cassette stand 320 in FIG. 6 to support the first cassette 200A. The first cassette 200A is also supported by pressing the protruding portion 502A on the back surface of the first cassette 200A (with the wafer storage opening facing forward) against the left positioning block 602 and right positioning block 603 on the cassette stand 320 from the inside.

Similarly, the underside of the second cassette 200B shown in FIG. 5B has a long, convex T-bar 501B, which is inserted into the T-bar insertion block 601 on the cassette stand 320 in FIG. 6 to support the second cassette 200B. Also, the protruding portion 502B on the back surface of the second cassette 200B (with the wafer storage opening facing forward) is supported by pressing the left positioning block 602 and right positioning block 603 on the cassette stand 320 from the inside.

Figure 7A shows a cassette stand on which a first cassette 200A for wafers of 100 mm can be placed, and Figure 8 shows a cassette stand on which a second cassette 200B for wafers of 200 mm can be placed.

As described above, the cassette placement table 320 is equipped with a sensor that can check whether the wafer 10 has protruded from the cassette 200 when the cassette 200 is placed thereon. When the wafer 10 enters the wafer protrusion detection range 701, the protrusion of the wafer 10 is detected, and the controller 301 is notified that the wafer 10 has protruded. Therefore, the wafer 10 must be in a position that will enter the wafer protrusion detection range 701 when it protrudes. The position of the wafer 10 depends on the position of the cassette 200 that contains the wafer 10, but the position of the cassette 200 depends on the position of the T-bar insertion block 601 in which the T-bar is inserted. The position of the T-bar insertion block 601 will be in a position that will enter the wafer protrusion detection range 701 when the wafer 10 protrudes.

The size of the cassette 200 is proportional to the size of the wafers 10 to be stored. If the size of the wafers 10 becomes smaller, the cassette 200 becomes smaller, and if the size of the wafers 10 becomes larger, the cassette 200 becomes larger. If the size of the cassette 200 changes, the positions of the T-bar insertion block 601, the left positioning block 602, and the right positioning block 603 also change.

For example, when comparing a first cassette 200A compatible with a wafer size of 100 mm and a second cassette 200B compatible with a wafer size of 200 mm, taking into consideration the position of the wafer 10, the second cassette 200B compatible with a wafer size of 200 mm has a longer distance 702 from the wafer protrusion detection range 701 to the T-bar insertion block 601. In addition, the position of the cassette protrusion portion 502 when the cassette 200 is installed also changes, and the second cassette 200B compatible with a wafer size of 200 mm has a longer distance 703 from the left positioning block 602 and right positioning block 603 to the T-bar insertion block 601, and a longer distance 704 from the left positioning block 602 to the right positioning block 603.

It is not possible to install multiple T-bar insertion blocks 601, left positioning blocks 602, and right positioning blocks 603 on the cassette stand 320. For example, if the T-bar insertion blocks 601, left positioning blocks 602, and right positioning blocks 603 supporting the first cassette 200A corresponding to a wafer size of 100 mm and the second cassette 200B corresponding to a wafer size of 200 mm are installed, the second cassette 200B corresponding to the wafer size of 200 mm interferes with the left positioning block 602 and right positioning block 603 supporting the first cassette 200A corresponding to the wafer size of 100 mm and cannot be installed. For this reason, conventionally, cassette stands 320 with different block positions are prepared for each size of cassette 200, and are replaced by changing the wafer size of the cassette stand 320.

In this embodiment, by making it possible to mount multiple sizes of cassettes (e.g., first cassette 200A, second cassette 200B) on one cassette stand 320, it is possible to eliminate the need to manufacture and manage size-changing parts and to facilitate the task of changing the wafer size of the cassette stand 320.

<Embodiment 1>
Hereinafter, the first embodiment will be described with reference to Figures 9, 10, 11, 12, and 13. Figure 9 is an explanatory diagram showing the movement of the block in the first embodiment. Figure 10A is a top view showing an example of the configuration of the block moving cassette stand. Figure 10B is a cross-sectional view taken along the line B-B in Figure 10A. Figure 11 is a diagram showing the state of the horizontal tie plate before the block is moved. Figure 12 is a diagram showing the state of the horizontal tie plate after the block is moved. Figure 13 is an example of cassette support by a stepped positioning block.

In order to allow cassettes of multiple sizes to be placed on one cassette stand 320, as shown in FIG. 9, the T-bar insertion block 601 is made movable in the 901 direction, the left positioning block 602 in the 902 direction, and the right positioning block 603 in the 903 direction. As long as cassettes of multiple sizes can be placed reproducibly by moving the blocks, the movement method, fixing method, and shape of the blocks are not important.

For example, a method of movement is one that uses a linear guide (movable mechanism). Specifically, the linear guide is a component that allows the first central linear guide block 1011 to move smoothly on the central linear guide rail 1001. Figures 10A and 10B show an example in which the central linear guide rail 1001 is inserted into the cassette stand 320. The first central linear guide block 1011 and the second central linear guide block 1014 are movably placed on the central linear guide rail 1001. The T-bar insertion block 601 is fixed to the first central linear guide block 1011. The second central linear guide block 1014 has a horizontal connecting plate 1030 fixed thereto. The first central linear guide block 1011 and the second central linear guide block 1014 are connected by a vertical connecting plate 1020.

The left linear guide block 1012 is movably mounted on the left linear guide rail 1002. The left positioning block 602 is fixed to the left linear guide block 1012. The right linear guide block 1013 is movably mounted on the right linear guide rail 1003. The right positioning block 603 is fixed to the right linear guide block 1013. The left linear guide block 1012 and the right linear guide block 1013 are connected by a horizontal connecting plate 1004, and the left linear guide block 1012 and the right linear guide block 1013 move in accordance with the movement of the horizontal connecting plate 1004. In this configuration, when the T-bar insertion block 601 is moved, the left positioning block 602 and the right positioning block 603 move via the connecting plate.

The T-bar insertion block 601, left positioning block 602, and right positioning block 603 can be fixed with screws. Screw holes 1005 are drilled to allow the T-bar insertion block 601 to be fixed in an appropriate position for each size of wafer 10. The T-bar insertion block 601 is moved to match the size of the wafer 10 being used, and screwed into place according to the position of the screw holes. When the T-bar insertion block 601 is fixed, the left positioning block 602 and right positioning block 603, which are connected by a connecting plate, are also positioned.

The cassette placement stand 320 (container placement stand) has a first movable mechanism 801 that moves the first central linear guide block 1011 (first member) in the 901 direction (first direction, T-bar insertion block movable direction) to position it at the first position or the second position, a second movable mechanism 802 that moves the left positioning block 602 (second member) in the 902 direction (second direction) to support the first cassette 200A placed at the first position or the second cassette 200B placed at the second position, and a third movable mechanism 803 that moves the right positioning block 603 (third member) in the 903 direction (third direction) to support the first cassette 200A placed at the first position or the second cassette 200B placed at the second position.

Figures 11 and 12 show examples of the left positioning block 602 and the right positioning block 603 before and after movement. Oval holes 1110 are drilled at the left and right ends of the horizontal connecting plate 1030, and a threaded bearing 1101 is attached to the left linear guide block 1012. Similarly, a threaded bearing 1101 is attached to the right linear guide block 1013. The horizontal connecting plate 1030 is connected to the left linear guide block 1012 and the right linear guide block 1013 by fitting the left and right threaded bearings 1101 into the oval holes 1110 of the horizontal connecting plate 1030.

When the horizontal tie plate 1030 moves in the 901 direction, the threaded bearing 1101 is pulled, moving the left linear guide block 1012 and the right linear guide block 1013. The left linear guide block 1012 moves the left positioning block 602 in the 902 direction, and the right linear guide block 1013 moves the right positioning block 603 in the 903 direction, and the threaded bearing 1101 rolls and moves in the oval hole 1110 in accordance with the movement of the left linear guide block 1012 and the right linear guide block 1013.

Figure 13 shows an example of the shape of the left positioning block 602 and the right positioning block 603, which are stepped. Each step supports a cassette protrusion 502 of a different size.

<Embodiment 2>
Fig. 14 is an explanatory diagram of a linear guide clamper 1401. In this embodiment 2, the linear guide clamper 1401 shown in Fig. 14 is used to fix the blocks shown in embodiment 1. The linear guide clamper 1401 is connected to the first central linear guide block 1011, and the first central linear guide block 1011 can be fixed by turning the linear guide clamper fastening part 1402 and clamping (fastening from the side) the central linear guide rail 1001. Since it can be fixed anywhere on the central linear guide rail 1001, if it is connected to the first central linear guide block 1011 on which the T-bar insertion block 601 is placed, the position of the T-bar insertion block 601 can be finely adjusted.

<Embodiment 3>
FIG. 15 shows an example of the configuration of a block movable cassette stand using a linear guide clamper 1401. In FIG. 15, the vertical tie plate 1020 is removed, and the left positioning block 602 and the right positioning block 603 are triangular in shape. In the SEMI standard, only the maximum value is standardized for the outer dimensions of a cassette that stores a wafer 10 of 150 mm or less. In addition, an error of about ±1 mm is allowed for the outer dimensions of a cassette that stores a wafer 10 of 200 mm. Therefore, the position of the cassette protruding part 502 may differ, and the cassette may not be supported sufficiently. By removing the vertical tie plate 1020, the left positioning block 602 and the right positioning block 603 do not depend on the movement of the T-bar insertion block 601, and can be fixed at a position that matches the cassette protruding part 502. For fixing, the linear guide clamper 1401 shown in the second embodiment is used.

Figure 16 shows an example of a cassette supported by triangular positioning blocks. The left positioning block 602 and the right positioning block 603 are triangular in shape and adjusted to press against the cassette protruding portion 502, thereby supporting the cassette 200 as shown in Figure 16.

<Embodiment 4>
Fig. 17 shows examples of various shapes of blocks. Fig. 17 shows that the pressing portions of the left positioning block 602 and the right positioning block 603 shown in the third embodiment are wavy or circular.

<Embodiment 5>
Fig. 18A is a rear view of an example of installation of a cassette size information sensor on the cassette stand 320. Fig. 18B is a view seen in the direction C of Fig. 18A. In accordance with the wafer size changing work on the cassette stand 320 by moving the block as shown in the first embodiment, the control unit 301 is made to be able to determine the cassette size that can be installed on the cassette stand 320.

As an example, FIG. 18 shows a method using a light projecting sensor 1802 and a light receiving sensor 1803. A light shielding plate 1801 is attached to the rear surface of the T-bar insertion block 601. The light projecting sensor 1802 and the light receiving sensor 1803 are attached to the rear surface of the cassette placement stand 320 in a position where the light shielding plate 1801 blocks the light path 1804 when the T-bar insertion block 601 is fixed. The control unit 301 determines the cassette size that can be placed on the cassette placement stand 320 from the light-shielded sensor. The cassette placement stand 320 has a hole 1805 that allows the light shielding plate 1801 to move.

By recording the mapping operations and wafer transport movements of the wafer transport robot 310, which change depending on the size of the cassette 200, in the control unit 301 for each size, a system can be created in which the wafer transport robot 310 automatically switches to mapping operations and wafer transport movements that match the size of the cassette 200 by determining the cassette size that can be placed on the cassette placement table 320.

As described above, the storage container installation stand (e.g., cassette placement stand 320) of this embodiment can detachably install a first storage container (e.g., first cassette 200A) that stores wafers 10 of a first size (size) at a first position, or a second storage container (e.g., second cassette 200B) that stores wafers 10 of a second size (size) larger than the first size at a second position, and a first protrusion (e.g., T-bar 501A) on the bottom surface of the first storage container and a second protrusion (e.g., T-bar 501B) on the bottom surface of the second storage container can be detachably installed. and a first movable mechanism 801 that moves the first member in a first direction (e.g., T-bar insertion block movable direction 901) to position the first member at a first position or a second position, the first direction being a direction in which wafers 10 of a first size are stored in a first storage container, or a direction in which wafers 10 of a second size are stored in a second storage container. This allows cassettes of multiple sizes to be placed on a single cassette stand.

The storage container installation stand includes a second movable mechanism 802 that supports the first storage container installed at the first position or the second storage container installed at the second position by moving a second member (e.g., left positioning block 602) in a second direction (e.g., left positioning block movable direction 902), and a third movable mechanism 803 that supports the first storage container installed at the first position or the second storage container installed at the second position by moving a third member (e.g., right positioning block 603) in a third direction (right positioning block movable direction 903).

The storage container installation stand is positioned so that the outer edge of a first size wafer 10 stored in a first storage container installed at a first position and the outer edge of a second size wafer 10 stored in a second storage container installed at a second position are aligned in a first direction.

The storage container installation stand can move the second and third members in conjunction with the movement of the first member. The storage container installation stand can also move the third member in conjunction with the movement of the second member, or can move the second member in conjunction with the movement of the third member.

The shape of the portion of the second and third members that is pressed to support the storage container (e.g., cassette 200) is linear, wavy, or circular.

The first movable mechanism 801 includes a first guide rail (e.g., a central linear guide rail 1001) formed in a first direction on the storage container installation stand, and a first guide block (e.g., a first central linear guide block 1011) provided at the bottom of the first member, and the first guide block of the first member can be moved along the first guide rail to fix the first member at a positioning position of a first position or a second position.

The second direction is a direction that forms a predetermined angle with the first direction on the surface of the storage container installation stand, and the third direction and the second direction are in a linear symmetrical relationship with the first direction. The second movable mechanism 802 is equipped with a second guide rail (e.g., left linear guide rail 1002) formed in the second direction on the storage container installation stand and a second guide block (e.g., left linear guide block 1012) provided at the bottom of the second member, and can move the second guide block of the second member along the second guide rail. The third movable mechanism 803 is equipped with a third guide rail (e.g., right linear guide rail 1003) formed in the third direction on the storage container installation stand and a third guide block (e.g., right linear guide block 1013) provided at the bottom of the third member, and can move the third guide block of the third member along the third guide rail.

The second member and the third member are connected by a second connecting portion (e.g., horizontal connecting plate 1030), and the first member and the second connecting portion are connected by a first connecting mechanism portion (e.g., vertical connecting plate 1020).

The second member and the third member are connected by a second connecting part, and an oblong hole 1110 is provided at the left and right ends of the second connecting part. The second member and the third member are provided with bearings (e.g., threaded bearings 1101), and the bearings can move within the oblong hole in conjunction with the movement of the second member or the third member.

The semiconductor manufacturing apparatus includes a storage container installation stand, and a control unit 301 that determines that the storage container that can be installed on the storage container installation stand is the first storage container, or that the storage container that can be installed on the storage container installation stand is the second storage container, when the first member is moved to a first position for positioning the first storage container, and the optical path 1804A of the first light-emitting sensor 1802A and the first light-receiving sensor 1803A attached to the back surface of the storage container installation stand is blocked by the light-shielding plate 1801 attached to the back surface of the first member, or when the first member is moved to a second position for positioning the second storage container, and the optical path 1804B of the second light-emitting sensor 1802B and the second light-receiving sensor 1803B attached to the back surface of the storage container installation stand is blocked by the light-shielding plate 1801.

The control unit 301 determines the size of the storage container that can be placed on the storage container installation stand, and can automatically switch the wafer transport operation and mapping operation of the wafer transport robot 310 according to the size of the storage container that can be placed on the storage container installation stand.

The cassette stand 320 of this embodiment can easily change the cassette stand by allowing the block for inserting the T-bar and the two blocks for supporting the cassette to be moved to positions that match the size of the cassette. In addition, one cassette stand can accommodate multiple sizes, which has the effect of eliminating the need to manufacture and manage size-changing parts.

10 Wafer 100 Semiconductor inspection equipment (semiconductor manufacturing equipment)
101 Wafer transport unit 102 Wafer processing unit 103 Shutter 200 Cassette 200A First cassette (first storage container)
200B Second cassette (second storage container)
201 wafer guide 202 slot 301 control unit 302 upper port 303 pre-aligner 310 wafer transport robot 311 mapping sensor 312 hand 313 arm 320 cassette placement stand (storage container placement stand)
401 Y-axis 402 X-axis 403 Θ-axis 404 Z-axis 501 T-bar 501A T-bar (first protrusion)
501B T-bar (second protrusion)
502 Cassette protruding portion 601 T-bar insertion block (first member)
602 Left positioning block 603 Right positioning block 701 Wafer protrusion detection range 702, 703, 704 Distance 801 First moving mechanism 802 Second moving mechanism 803 Third moving mechanism 901 T-bar insertion block moving direction (first direction)
902 Left positioning block movable direction (second direction)
903 Right positioning block movable direction (third direction)
1001 Central linear guide rail (first guide rail, first movable mechanism)
1002 Left linear guide rail (second guide rail, second movable mechanism)
1003 Right Linear Guide Rail (Third Guide Rail, Third Movable Mechanism)
1005 screw hole,
1011 First central linear guide block (first guide block, first movable mechanism)
1012 Left linear guide block (second guide block, second movable mechanism)
1013 Right Linear Guide Block (Third Guide Block, Third Movable Mechanism)
1014 Second central linear guide block 1020 Vertical tie plate (first connecting portion)
1030 Horizontal tie plate (second connecting portion)
1101 Threaded bearing 1110 Elliptical hole 1401 Linear guide clamper 1402 Linear guide clamper tightening part 1801 Light shielding plate 1802 Light projecting sensor 1803 Light receiving sensor 1804 Optical path 1805 Hole

Claims (12)

A first storage container for storing wafers of a first size can be detachably installed at a first position, or a second storage container for storing wafers of a second size larger than the first size can be detachably installed at a second position,
a first member having an engagement portion that can be engaged with a first protrusion on a bottom surface of the first storage container and a second protrusion on a bottom surface of the second storage container;
a first movable mechanism that moves the first member in a first direction to position the first member at the first position or the second position;
The first direction is a direction in which wafers of the first size are stored in the first storage container, or a direction in which wafers of the second size are stored in the second storage container. a second movable mechanism that supports the first storage container placed at the first position or the second storage container placed at the second position by moving a second member in a second direction;
The storage container installation stand according to claim 1, further comprising a third movable mechanism that supports the first storage container installed at the first position or the second storage container installed at the second position by moving a third member in a third direction. 2. The storage container installation stand according to claim 1, characterized in that an outer edge of a wafer of the first size stored in the first storage container installed at the first position and an outer edge of a wafer of the second size stored in the second storage container installed at the second position are positioned to be aligned in the first direction. 3. The storage container installation stand according to claim 2, wherein the second member and the third member are moved in conjunction with the movement of the first member. 3. The storage container installation stand according to claim 2, wherein the third member is moved in conjunction with the movement of the second member, or the second member is moved in conjunction with the movement of the third member. 3. The storage container mounting stand according to claim 2, wherein the second member and the third member have portions that are pressed against each other to support the storage container and have a linear, wavy or circular shape. The first movable mechanism includes:
a first guide rail provided on the container installation stand and extending in the first direction;
a first guide block provided on a lower portion of the first member;
2. The storage container installation stand according to claim 1, wherein the first guide block of the first member is moved along the first guide rail to fix the first member at a positioning position of the first position or the second position. the second direction is a direction that forms a predetermined angle with the first direction on a surface of the storage container installation stand, and the third direction and the second direction are in a line-symmetric relationship with respect to the first direction,
The second movable mechanism includes:
a second guide rail formed on the container installation base in the second direction;
a second guide block provided on a lower portion of the second member,
The second guide block of the second member is moved along the second guide rail;
The third movable mechanism includes:
a third guide rail formed on the container installation base in the third direction ;
a third guide block provided on a lower portion of the third member,
3. The storage container installation stand according to claim 2, wherein the third guide block of the third member is movable along the third guide rail. The second member and the third member are connected by a second connecting portion,
The storage container installation stand according to claim 4 , wherein the first member and the second connecting portion are connected to each other via a first connecting portion. The second member and the third member are connected by a second connecting portion,
The second connecting portion has left and right ends each having an oblong hole.
The second member and the third member are provided with bearings,
6. The storage container installation stand according to claim 5, wherein the bearing moves within the oval hole in conjunction with movement of the second member or the third member. A container installation stand according to any one of claims 1 to 10,
When the first member is moved to the first position for positioning the first storage container, optical paths of a first light-projecting sensor and a first light-receiving sensor attached to a rear surface of the storage container installation stand are blocked by a light-shielding plate attached to a rear surface of the first member, or
When the first member is moved to the second position for positioning the second storage container, the light paths of the second light projecting sensor and the second light receiving sensor attached to the rear surface of the storage container installation stand are blocked by the light blocking plate,
A semiconductor manufacturing apparatus comprising: a control unit that determines whether a storage container that can be placed on the storage container setting stand is a first storage container, or whether a storage container that can be placed on the storage container setting stand is a second storage container. The semiconductor manufacturing apparatus according to claim 11, characterized in that the control unit determines a size of a storage container that can be placed on the storage container installation stand, and automatically switches the wafer transport operation and mapping operation of a wafer transport robot in accordance with the size of a storage container that can be placed on the storage container installation stand.

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