JPS6389210A - Drill - Google Patents
DrillInfo
- Publication number
- JPS6389210A JPS6389210A JP23565386A JP23565386A JPS6389210A JP S6389210 A JPS6389210 A JP S6389210A JP 23565386 A JP23565386 A JP 23565386A JP 23565386 A JP23565386 A JP 23565386A JP S6389210 A JPS6389210 A JP S6389210A
- Authority
- JP
- Japan
- Prior art keywords
- drill
- groove
- grinding
- cutting edge
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 abstract description 3
- 238000005553 drilling Methods 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 101150034459 Parpbp gene Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Drilling Tools (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
この発明は例えば精密加工に使用される小径ドリルの構
造に係り、特に刃先部や溝部の形状や粗さの改良に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to the structure of a small diameter drill used, for example, in precision machining, and particularly relates to improving the shape and roughness of the cutting edge and groove.
(従来の技術)
以下、従来における小径のドリルの構造について第4図
および第5図を参照して説明する。(Prior Art) Hereinafter, the structure of a conventional small-diameter drill will be described with reference to FIGS. 4 and 5.
第4図は従来における直径2a*以下のドリル1の側面
図である。そして、このドリル1にはボール盤等の工作
機械に固定する部分であるシャンク2が一体に設けられ
ている。そして、このシャンク2の一端部には刃部3が
設けられている。FIG. 4 is a side view of a conventional drill 1 having a diameter of 2a* or less. This drill 1 is integrally provided with a shank 2 which is a part that is fixed to a machine tool such as a drilling machine. A blade portion 3 is provided at one end of the shank 2.
さらに、上記刃部3は刃先部4および溝部5等を有して
いる。この刃先部4や溝部5は製造時において最終的に
研削機械によって研削して仕上げられている。Further, the blade portion 3 has a cutting edge portion 4, a groove portion 5, and the like. The cutting edge portion 4 and the groove portion 5 are finally finished by being ground by a grinding machine during manufacturing.
上述のように仕上げられたドリル1は第4図に示される
ように上記溝部5と刃先部4に研削パリ6を有している
。The drill 1 finished as described above has a grinding paris 6 in the groove portion 5 and the cutting edge portion 4, as shown in FIG.
この研削バリ6は0.01#lIm程度のパリであり。This grinding burr 6 is about 0.01 #lIm.
この研削バリ6のあるドリル1によって図示しない被加
工物を加工すると孔あけ初期において孔の内側を引掻く
性質をもち、加工孔の精度を低下させたり、上記ドリル
1の貫通側で被加工物にパリや欠は等が発生することが
あった。ここで、上記被加工物はセラミックの生材、プ
リント基板やプラスチック等である。また、上記ドリル
1によって切出された図示しない切屑の排出溝として形
成されている上記溝部5の仕上げが粗いため切屑が上記
溝部5の表面をスムーズに移動することができず、切屑
のつまりの原因となっていた。When a workpiece (not shown) is machined using the drill 1 with this grinding burr 6, the inside of the hole is scratched at the initial stage of drilling, which may reduce the accuracy of the drilled hole, or the workpiece may be damaged on the penetrating side of the drill 1. Occasionally, problems such as pari or missing may occur. Here, the workpiece is a raw ceramic material, a printed circuit board, a plastic, or the like. Further, since the groove 5, which is formed as a discharge groove for chips (not shown) cut out by the drill 1, has a rough finish, the chips cannot move smoothly on the surface of the groove 5, which prevents the chips from clogging. It was the cause.
そして、従来におけるドリル1の刃先部4は。The cutting edge portion 4 of the conventional drill 1 is as follows.
上述のように研削により仕上げられているのみなので、
その外周端7は第5図に示されるように鋭利なエッヂに
形成されているが、このような形状のドリル1を使用し
ても上述と同様に被加工物にパリや欠けを生じる原因と
なっていた。そこで。As mentioned above, it is only finished by grinding,
The outer circumferential end 7 is formed into a sharp edge as shown in FIG. 5, but even if a drill 1 with such a shape is used, it may cause cracks or chips in the workpiece as described above. It had become. Therefore.
従来よりホーニング砥石によるハンドホーニングで上記
研削パリの除去が行われているが、直径1M以下のドリ
ルでは破損を生じたり、直径2m以上のドリルにおいて
も均一にホーニングできない等の問題点があった。Conventionally, the above-mentioned grinding chips have been removed by hand honing using a honing stone, but there have been problems such as damage in drills with a diameter of 1 m or less, and inability to uniformly hone even in drills with a diameter of 2 m or more.
(発明が解決しようとする間賠点)
上述のように、従来におけるドリルは、その最終仕上げ
に研削加工をするため、刃先部と溝部に研削パリを生じ
ていた。このため、このドリルを使用して加工を行なっ
た被加工物にパリや欠けを生じることがあった。また、
上記溝部の粗さが高いため切屑がスムーズに排出されず
に切屑のつまりを生じてしまうことがあった。さらに、
上記刃先部外周端はその端部が鋭利であるため、被加工
物の貫通時においてその貫通側にパリや欠けを生じやす
いという欠点があった。(Disadvantages to be Solved by the Invention) As described above, conventional drills undergo grinding for the final finish, resulting in grinding chips at the cutting edge and groove. For this reason, cracks or chips may occur in workpieces machined using this drill. Also,
Due to the high roughness of the groove, the chips could not be discharged smoothly, leading to clogging of the chips. moreover,
Since the edge of the outer peripheral edge of the cutting edge is sharp, there is a drawback that when the blade penetrates the workpiece, it is likely to cause burrs or chips on the penetrating side.
この発明は上記事情に着目してなされたもので。This invention was made in view of the above circumstances.
研削加工の後に刃部を研磨仕上げすることにより被加工
物にパリや欠けを生じることのないドリルを提供するこ
とを目的とする。To provide a drill that does not cause cracks or chips on a workpiece by polishing the blade part after grinding.
(問題点を解決するための手段及び作用)この発明は、
刃部における溝部および刃先部を研削加工されているド
リルにおいて、上記研削加工を行なうことによって発生
した研削パリを研磨によって除去するとともに、上記溝
部の切屑流出方向の粗さを3IRRZ以下とし、刃先部
外周端に0.01s程度のRを有するエッヂを設けるこ
とによって、被加工物にパリや欠けを生じることなく孔
あけ可能なドリルを提供することにある。(Means and effects for solving the problem) This invention has the following features:
In a drill in which the groove and cutting edge of the blade are ground, the grinding burrs generated by the above grinding process are removed by polishing, and the roughness of the groove in the chip flow direction is set to 3 IRRZ or less, and the cutting edge is polished. It is an object of the present invention to provide a drill capable of drilling a hole in a workpiece without causing cracks or chips by providing an edge having a radius of about 0.01 s at the outer peripheral end.
(実施例)
以下この発明における一実施例について第1図乃至第3
図を参照して説明するがその基本的構造は第4図および
第5図に示される従来例と同様のため同一部分には同一
符号を付して説明を省略する。(Example) The following is an example of the present invention in Figures 1 to 3.
This will be explained with reference to the drawings, but since its basic structure is the same as the conventional example shown in FIGS. 4 and 5, the same parts are given the same reference numerals and the explanation will be omitted.
第1図に示されるドリルの刃先部付近は、この発明にお
ける研磨をほどこしたドリル8のものである。このドリ
ル8は直径が2m以下の小径ドリルである。The vicinity of the cutting edge of the drill shown in FIG. 1 is that of the polished drill 8 according to the present invention. This drill 8 is a small diameter drill with a diameter of 2 m or less.
このようなドリル8の構造は、従来において最終的に仕
上げられていた研削によって形成される研削パリ6を後
述する研磨方法で除去するとともに、この研磨方法によ
り溝部9の切屑流出方向の表面粗さを3pltR2以下
つまりより平滑にし、刃先部10の外周端11に0.0
1s程度のRを有するエッヂ11aが設けられている。Such a structure of the drill 8 is such that the grinding pad 6 formed by the conventional final finishing process is removed by a polishing method described later, and this polishing method improves the surface roughness of the groove 9 in the chip flow direction. 3pltR2 or less, that is, smoother, and 0.0 on the outer peripheral edge 11 of the cutting edge portion 10
An edge 11a having a radius of about 1 s is provided.
以下、上記研磨方法について第2図および第3図を参照
して説明する。The above polishing method will be explained below with reference to FIGS. 2 and 3.
まず第1の研磨方法である化学研磨について説明すると
、上記ドリル8を図示しないエツチング液中に浸す方法
である。このエツチング液は例えばHNO3の2%液や
ビロリン酸の50%液等が使用される。First, chemical polishing, which is the first polishing method, will be explained. This is a method in which the drill 8 is immersed in an etching solution (not shown). As this etching solution, for example, a 2% solution of HNO3 or a 50% solution of birophosphoric acid is used.
また、第2の研磨方法は電解研磨によるものである。第
2図に示されるように容器12に電離液12aを満たし
、この電離液12aにドリル8の刃部13を浸すととも
に、このドリル8にプラス電極を接続する。さらに、上
記電11112a中にマイナス電極を設け2回路を形成
しこの回路に電荷を与えることにより、電解研磨をする
ものである。Further, the second polishing method is based on electrolytic polishing. As shown in FIG. 2, the container 12 is filled with an ionized liquid 12a, the blade part 13 of the drill 8 is immersed in the ionized liquid 12a, and a positive electrode is connected to the drill 8. Further, a negative electrode is provided in the electrode 11112a to form two circuits, and electrolytic polishing is performed by applying charges to these circuits.
そして、第3の研磨方法は第3図に示される砥粒14を
使用する方法である。The third polishing method is a method using abrasive grains 14 shown in FIG.
この研磨方法は砥粒14が満たされた容器15内に固定
部材16に同定されたドリル8を立て。In this polishing method, a drill 8 identified by a fixing member 16 is set up in a container 15 filled with abrasive grains 14.
つぎに、上記容器15を超音波加振器17の加振部に置
き、上記超音波加振器17を駆動することにより、研磨
する方法である。ここで、上記砥粒14はその研磨剤粒
度を320〜4000ま・での範囲のものを使用する。Next, the container 15 is placed on the vibrating section of the ultrasonic vibrator 17, and the ultrasonic vibrator 17 is driven to perform polishing. Here, the abrasive grains 14 used have an abrasive particle size in the range of 320 to 4000.
上述の各研磨方法のいずれかによって研磨することによ
って、第1図に示されるドリル8を得ることができる。By polishing using any of the polishing methods described above, the drill 8 shown in FIG. 1 can be obtained.
そして、上述のような構造のドリル8を得ることにより
、被加工物におけるパリや欠は等の破損の発生を防止す
ることができるとともに、直径が1jI11以下のドリ
ル8において研磨仕上げをしても上記ドリル8に破損を
生じることなく、研磨することが可能である。ここで上
記被加工物はセラミックスの生材やプリント基板および
プラスチック等である。By obtaining the drill 8 with the above-described structure, it is possible to prevent damage such as cracks and chips in the workpiece, and even when the drill 8 with a diameter of 1jI11 or less is polished and finished. It is possible to polish the drill 8 without damaging it. Here, the above-mentioned workpieces include raw ceramic materials, printed circuit boards, plastics, and the like.
なお、この発明は上記一実施例に限定されるものではな
い1例えば上記一実施例においてドリル8は小径ドリル
であるが、ドリルの直径に関係なくこの発明を実施する
ことができる。また、この発明における研磨方法は上記
第1から第3の研磨方法に限定されず、ドリルの刃部の
最終仕上げを研磨によって行ない、この発明の要旨に沿
う形状のドリルに研磨されるものであればよい。Note that the present invention is not limited to the above embodiment. For example, in the above embodiment, the drill 8 is a small diameter drill, but the present invention can be practiced regardless of the diameter of the drill. Further, the polishing method of the present invention is not limited to the first to third polishing methods described above, and any method in which the final finish of the blade of the drill is performed by polishing and the drill is polished into a shape that meets the gist of the present invention. Bye.
以上説明したように、この発明によれば刃先部や溝部の
研削パリを除去し、刃先部外周端に0.01mm程度の
Rを有するエッヂが設けられているため被加工物にパリ
や欠け、さらに破損等を生じることなく孔あけ加工を行
なえるとともに。As explained above, according to the present invention, grinding burrs on the cutting edge and groove are removed, and an edge with a radius of about 0.01 mm is provided on the outer circumferential edge of the cutting edge, thereby preventing burrs and chips on the workpiece. Furthermore, it is possible to perform hole drilling without causing damage.
溝部の切屑流出方向の粗さが3譚RZ以下と高精度に仕
上げられているため被加工物の切屑がスムーズに排出さ
れ切屑のつまりを防止するドリルを提供することができ
る。Since the roughness of the groove in the chip outflow direction is finished with high precision such that it is 3 RZ or less, it is possible to provide a drill that smoothly discharges chips from the workpiece and prevents clogging of chips.
第1図乃至第3図はこの発明の一実施例であり、第1図
はドリルの刃部先端部を示す側面図。
第2図および第3図はドリルを研磨する各装置の概略的
正面図、第4図および第5図は従来例を示し、第4図は
ドリルの側面図、第5図は第4図におけるドリルの刃先
部付近を示す側面図である。
6、・・・研削パリ、8・・・ドリル、9・・・溝部、
10・・・刃先部、11・・・外周端、11a・・・エ
ッヂ。FIGS. 1 to 3 show one embodiment of the present invention, and FIG. 1 is a side view showing the tip of the drill blade. 2 and 3 are schematic front views of each device for polishing a drill, FIGS. 4 and 5 show a conventional example, FIG. 4 is a side view of the drill, and FIG. 5 is a schematic front view of each device for polishing a drill. FIG. 3 is a side view showing the vicinity of the cutting edge of the drill. 6,...Grinding Paris, 8...Drill, 9...Groove,
10...Blade tip portion, 11...Outer peripheral end, 11a...Edge.
Claims (1)
おいて、上記研削加工時に溝部および刃先部に発生した
研削バリを研磨によつて除去するとともに、上記溝部の
切屑流出方向の粗さを3μmRz以下とし、刃先外周端
に0.01mm程度のRを有するエッヂを設けたことを
特徴とするドリル。In a drill whose groove and cutting edge are formed by grinding, grinding burrs generated in the groove and cutting edge during the grinding process are removed by polishing, and the roughness of the groove in the chip flow direction is set to 3 μmRz or less. A drill characterized in that an edge having a radius of about 0.01 mm is provided at the outer peripheral end of the cutting edge.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23565386A JPS6389210A (en) | 1986-10-03 | 1986-10-03 | Drill |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23565386A JPS6389210A (en) | 1986-10-03 | 1986-10-03 | Drill |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6389210A true JPS6389210A (en) | 1988-04-20 |
Family
ID=16989201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23565386A Pending JPS6389210A (en) | 1986-10-03 | 1986-10-03 | Drill |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6389210A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007245277A (en) * | 2006-03-15 | 2007-09-27 | Mitsubishi Materials Kobe Tools Corp | Formed cutter and manufacturing method for formed cutter |
US7306411B2 (en) | 2002-09-03 | 2007-12-11 | Mitsubishi Materials Corporation | Drill with groove width variation along the drill and double margin with a thinning section at the tip |
JPWO2006046278A1 (en) * | 2004-10-25 | 2008-05-22 | オーエスジー株式会社 | End mill |
US7740426B2 (en) | 2002-10-02 | 2010-06-22 | Osg Corporation | Deep-hole drill having back-tapered web |
-
1986
- 1986-10-03 JP JP23565386A patent/JPS6389210A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7306411B2 (en) | 2002-09-03 | 2007-12-11 | Mitsubishi Materials Corporation | Drill with groove width variation along the drill and double margin with a thinning section at the tip |
US7740426B2 (en) | 2002-10-02 | 2010-06-22 | Osg Corporation | Deep-hole drill having back-tapered web |
DE10331328B4 (en) * | 2002-10-02 | 2021-02-11 | Osg Corp. | Deep hole drill with back sloping back and method for drilling a hole |
JPWO2006046278A1 (en) * | 2004-10-25 | 2008-05-22 | オーエスジー株式会社 | End mill |
JP2007245277A (en) * | 2006-03-15 | 2007-09-27 | Mitsubishi Materials Kobe Tools Corp | Formed cutter and manufacturing method for formed cutter |
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