JPS6348413B2 - - Google Patents
Info
- Publication number
- JPS6348413B2 JPS6348413B2 JP57105952A JP10595282A JPS6348413B2 JP S6348413 B2 JPS6348413 B2 JP S6348413B2 JP 57105952 A JP57105952 A JP 57105952A JP 10595282 A JP10595282 A JP 10595282A JP S6348413 B2 JPS6348413 B2 JP S6348413B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- green
- green sheet
- coil component
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010304 firing Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 239000012671 ceramic insulating material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 claims description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 239000005041 Mylar™ Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 210000001099 axilla Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000012438 extruded product Nutrition 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】
本発明はコイル部品の製造方法に関し、小形で
高信頼性のコイル部品を製造するのに適した方法
を提供しようとするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a coil component, and an object thereof is to provide a method suitable for manufacturing a small and highly reliable coil component.
近年、電子回路の小形化とその信頼性の向上を
目的として、電子部品の高密度実装について各種
の提案がなされている。その一つに、プリント回
路基板に部品を埋込んで回路を小形、平板化させ
るとともに、外付け部品のスペースを広くとれる
ような方法の試みがある。しかしながら、このよ
うな実装方法はまだ十分に実用化されるに至つて
いない。これは、埋込み用チツプ部品として、こ
れに適用した形状、性能のものが十分に得られて
いないためと考えられる。 In recent years, various proposals have been made regarding high-density packaging of electronic components with the aim of downsizing electronic circuits and improving their reliability. One such method is to embed components in a printed circuit board to make the circuit smaller and flatter, and to free up more space for external components. However, such a mounting method has not yet been fully put into practical use. This is thought to be due to the fact that a suitable shape and performance for implantable chip parts has not yet been obtained.
コイル部品を例にとれば、埋込み用のチツプと
して要望される主な条件としては、大きさはプリ
ント回路基板と同等の厚さ（現状の大半のプリン
ト回路基板は1.6mmの厚さである）であり、巾は
プリント回路基板の導体の巾を考慮すると大きく
ても５mm以下であること、形状的には埋込みを考
えた場合、方向性を考慮せずに容易にプリント回
路基板の貫通孔に挿入できる円柱状または円板状
が理想的であり、かつ埋込んだ後、プリント回路
基板の一方の面にその一方の電極が、また他方の
面にその他方の電極がそれぞれ位置するような構
造が望ましいことなどである。 Taking coil components as an example, the main requirements for a chip for embedding are that the size is equivalent to the thickness of a printed circuit board (most current printed circuit boards are 1.6 mm thick). Considering the width of the conductor on the printed circuit board, the width should be at most 5 mm or less, and the shape can be easily inserted into the through hole of the printed circuit board without considering directionality. An insertable cylinder or disk is ideal, and after implantation, one electrode is located on one side of the printed circuit board, and the other electrode is located on the other side of the printed circuit board. is desirable.
このような小形コイル部品の条件を満たすもの
は、現存のチツプ部品では見あたらない。たとえ
ばアルキシヤリード形高周波コイルは埋込みやす
い形状であるが、アキシヤルリードがあり、大き
さもプリント回路基板の厚さより大きく、プリン
ト回路基板の埋込みには適していない。 There are no existing chip components that meet these requirements for small coil components. For example, an axilla lead type high frequency coil has a shape that is easy to embed, but it has axial leads and is larger than the thickness of the printed circuit board, so it is not suitable for embedding in the printed circuit board.
本発明はこれらの欠点を除去し、1.6mm前後の
厚さで直径５mm以内の大きさの、小形、高信頼性
のコイル部品を製造することができる方法を提供
するものである。すなわち、コイル用導電ペース
トを印刷したセラミツク絶縁体材料を含む可撓性
グリーンシートを、このグリーンシートの焼成に
おける収縮率より小さい収縮率を有するセラミツ
ク絶縁体材料のグリーンロツド上に巻回して円柱
状成形体とし、これを通常のセラミツク絶縁体の
焼成条件で焼成し、さらに得られた焼結体の端面
に外部電極を、さらに必要に応じてこの外部電極
にリード線を設けるなどして、コイル部品を得る
ものである。 The present invention eliminates these drawbacks and provides a method capable of manufacturing small, highly reliable coil components having a thickness of approximately 1.6 mm and a diameter of within 5 mm. That is, a flexible green sheet containing a ceramic insulating material printed with a conductive paste for a coil is wound onto a green rod of a ceramic insulating material having a shrinkage rate smaller than the shrinkage rate during firing of this green sheet, and then formed into a cylindrical shape. This is fired under the usual firing conditions for ceramic insulators, and an external electrode is provided on the end face of the obtained sintered body, and if necessary, a lead wire is provided on this external electrode, etc., to produce a coil component. This is what you get.
このようにして得られるコイル部品は、グリー
ンシート相互間、グリーンシートとコイルとの
間、グリーンシートとグリーンロツドとの間の積
層状態がきわめて緊密で、一体化された高密度の
セラミツク焼結体が得られ、層剥離などを生じな
い。その結果、機械的強度、層間絶縁、耐湿特性
にすぐれた小形のコイル部品を得ることができ
る。また、このコイル部品は形状が円柱形または
円板形のものであり、プリント回路基板の貫通孔
に埋込みすることも容易である。また、埋込んだ
後、電極がプリント回路板と同一平板上に配置さ
れ、しかも、中空孔などがないため、そのままプ
リント回路板の導体と導電性接着剤などで容易に
接続することもできる。この際、従来のコイル部
品のようにあらかじめリード端子を形成しておく
必要はなく、プリント回路基板への埋込み後、接
続を兼ねて電極付けすることができるので、製造
工程上の利点が大きい。もちろん、あらかじめ電
極を形成したものであつても本発明の効果を失う
ものではない。 The coil parts obtained in this way have extremely tight stacking conditions between the green sheets, between the green sheets and the coil, and between the green sheets and the green rod, and are made of an integrated high-density ceramic sintered body. obtained, and no delamination occurs. As a result, a small coil component with excellent mechanical strength, interlayer insulation, and moisture resistance properties can be obtained. Further, this coil component has a cylindrical or disk shape, and can be easily embedded in a through hole of a printed circuit board. Further, after embedding, the electrodes are placed on the same flat plate as the printed circuit board, and since there are no hollow holes, they can be easily connected to the conductors of the printed circuit board using a conductive adhesive or the like. At this time, unlike conventional coil components, it is not necessary to form lead terminals in advance, and electrodes can be attached for connection after being embedded in a printed circuit board, which is a great advantage in terms of the manufacturing process. Of course, even if the electrodes are formed in advance, the effects of the present invention will not be lost.
このような本発明の効果の生ずる原因として
は、軸芯であるグリーンロツドよりも、巻回され
たグリーンシートの方が焼成において収縮率が大
きいために生ずるものである。すなわち、焼成時
において、あたかも機械的な圧力を加えるのと同
じような力が巻回されたシートに生じ、これが巻
き締せ作用となつて現れるものである。このよう
な焼成収縮率の差を応用した巻き締めをする方法
は、機械的強度の弱いセラミツクグリーンシート
を巻回して焼成をするコイル部品においてきわめ
て有用な方法である。すなわち、巻き締め操作、
加圧操作などが省略されるだけでなく、焼成にお
いて自ずから生ずる圧力は外部から加える力では
得られない程均一であるため、従来の方法では得
られなかつた高品質の焼成品を得ることができ
る。 The reason for this effect of the present invention is that the wound green sheet has a higher shrinkage rate during firing than the green rod which is the shaft core. That is, during firing, a force similar to applying mechanical pressure is generated on the wound sheet, and this appears as a tightening effect. This winding tightening method that takes advantage of the difference in firing shrinkage rate is an extremely useful method for coil parts in which ceramic green sheets with low mechanical strength are wound and fired. That is, the tightening operation,
Not only does it eliminate pressure operations, but the pressure naturally generated during firing is so uniform that it cannot be obtained with external force, making it possible to obtain high-quality fired products that could not be obtained with conventional methods. .
次に、本発明にかかるコイル部品の製造方法の
一実施例について、図面を用いて説明する。 Next, an embodiment of the method for manufacturing a coil component according to the present invention will be described with reference to the drawings.
セラミツク絶縁体材料よりなるグリーンシート
は公知の方法によつて作られる。公知の材料組成
を有する酸化物系セラミツクの微粉末に、有機バ
インダとしてポリビニルブチラール樹脂を、また
可塑剤としてフタル酸ジｎブチルなどを加えて溶
剤とともにボールミルで均一に混合してスリツプ
を作り、これをナイフコータ、バイプコータ、リ
バースロールコータ、あるいはスクリーン印刷な
どの公知の方法によつて、第１図に示すように表
面に適当な離形処理を施こしたマイラーフイルム
ベース１上に皮膜を形成し、乾燥して所定の厚さ
寸法のグリーンシート２を得る。次いで、このグ
リーンシート２上に、白金、白金−パラジウム、
パラジウム、あるいは銀−パラジウムなどを導電
材料とする導電ペーストを、複数個のパターンを
有する版を用いて印刷し、第２図に示すようなコ
イル３を成形して、グリーンシート４を作製す
る。このコイル３の長さは一つのコイル部品に巻
き込まれるコイルの全長である。次にこのグリー
ンシート４を平坦な台上に置いて後述するグリー
ンロツド５をコイルの長手方向と直角にして適当
な接着剤でグリーンシート４の終縁６に接着す
る。第３図にこれらの関係を示す。そして第４図
に示すように平面板７でグリーンロツド５を上か
ら押えてコイル長手方向に転がし、マイラーフイ
ルムベース１からグリーンシート２を引き剥がし
ながら巻き込みを行ない、最終端を適当な接着剤
で固定して棒状の巻き取り品を得る。次いで第５
図の断面図に示すような破線９の位置において巻
き取り品８を切断して円柱状成形体を得る。これ
をグリーンシートの最適な焼成条件において焼成
を行ない、第６図に示すコイル部品素体１０を得
る。さらに、第７図に示すように、この素体１０
の両端面１１，１２に銀導電性ペーストを塗布
し、焼き付けて外部電極１３，１４とする。必要
に応じて、第８図に示すように外部電極１３，１
４にリード線１５，１６をはんだなどで接続し
て、コイル部品とする。 Green sheets of ceramic insulator material are made by known methods. A slip is made by adding polyvinyl butyral resin as an organic binder and di-n-butyl phthalate as a plasticizer to fine powder of oxide ceramic having a known material composition, and uniformly mixing the mixture with a solvent in a ball mill. A film is formed on a Mylar film base 1 whose surface has been subjected to an appropriate release treatment as shown in FIG. A green sheet 2 having a predetermined thickness is obtained by drying. Next, on this green sheet 2, platinum, platinum-palladium,
A green sheet 4 is produced by printing a conductive paste using a conductive material such as palladium or silver-palladium using a plate having a plurality of patterns, and forming a coil 3 as shown in FIG. 2. The length of this coil 3 is the total length of the coil wound into one coil component. Next, this green sheet 4 is placed on a flat table, and a green rod 5, which will be described later, is glued to the end edge 6 of the green sheet 4 with a suitable adhesive at right angles to the longitudinal direction of the coil. Figure 3 shows these relationships. Then, as shown in Fig. 4, the green rod 5 is pressed from above with the flat plate 7 and rolled in the longitudinal direction of the coil, and the green sheet 2 is rolled up while being peeled off from the Mylar film base 1, and the final end is fixed with an appropriate adhesive. to obtain a rod-shaped rolled product. Then the fifth
The rolled product 8 is cut at the position of the broken line 9 as shown in the cross-sectional view of the figure to obtain a cylindrical molded body. This is fired under optimal firing conditions for green sheets to obtain the coil component body 10 shown in FIG. 6. Furthermore, as shown in FIG.
A silver conductive paste is applied to both end surfaces 11 and 12 of the electrode and baked to form external electrodes 13 and 14. If necessary, as shown in FIG.
Lead wires 15 and 16 are connected to 4 with solder or the like to form a coil component.
第９図は、上記コイル部品素体１０をプリント
回路基板に押込み実装した一例を示す断面図であ
る。１７はプリント回路基板で、円柱形コイル部
品の直径とほぼ同程度の径の貫通孔１８を有す
る。この貫通孔１８に、プリント回路基板１７の
厚みとほぼ同程度の厚みのコイル部品素体１０
を、プリント回路基板１７の両平面とコイル部品
素体１０の両端面が同一平面上になるように挿入
する。次に、コイル部品素体１０の両端面に露出
したコイル３とプリント回路基板１７上の導体１
９，２０とを導電性接着剤２１，２２で電気的に
接続することにより、コイル部品埋込み回路基板
が完成される。これにより導電性接着剤２１，２
２が電極を兼ねる。 FIG. 9 is a sectional view showing an example of the coil component body 10 being pressed and mounted on a printed circuit board. Reference numeral 17 denotes a printed circuit board, which has a through hole 18 having a diameter approximately equal to the diameter of the cylindrical coil component. A coil component element body 10 having a thickness approximately the same as the thickness of the printed circuit board 17 is inserted into the through hole 18.
are inserted so that both flat surfaces of the printed circuit board 17 and both end surfaces of the coil component element body 10 are on the same plane. Next, the coil 3 exposed on both end surfaces of the coil component body 10 and the conductor 1 on the printed circuit board 17 are
9 and 20 are electrically connected using conductive adhesives 21 and 22, a coil component embedded circuit board is completed. As a result, the conductive adhesive 21, 2
2 also serves as an electrode.
本発明におけるグリーンロツドの焼成における
収縮率は、グリーンシートの焼成される最適の焼
成条件で焼成したときにグリーンシートの収縮率
よりも小さいものでなければならない。グリーン
ロツドの焼成における収縮率は、焼成条件が一定
の場合、これを構成するセラミツク粉末の物理
的、化学的性質、有機バインダの特性、これら構
成材料の配合量ならびにグリーンデンシテイなど
によつて決定される。具体的には、グリーンシー
トと同一組成のセラミツクならびに有機バインダ
より構成されることが望ましい。この場合にはグ
リーンシートに使用されるセラミツク材料の粒径
よりも大きい粒径のものを使用するか、グリーン
シートの有機バインダ配合量よりも少ない有機バ
インダ配合量にするか、グリーンロツドを加圧な
どして高密度にするか、あるいはグリーンロツド
をあらかじめ有機バインダの分解温度より低い温
度で熱処理を加えるなどすることによつて実現さ
れる。また、他の方法としては、グリーンロツド
に他成分のセラミツク材料を混合するか、成分比
を変えるなどにより、グリーンシートの収縮率に
対して、グリーンロツドの収縮率を小さくするこ
とができる。すなわち、グリーンシートのセラミ
ツク材料よりも、同一条件の焼成では焼結が若干
遅れるようなセラミツク材料をグリーンロツドに
使用する。 The shrinkage rate of the green rod in the present invention during firing must be smaller than the shrinkage rate of the green sheet when fired under optimal firing conditions for firing the green sheet. The shrinkage rate during firing of Green Rod is determined by the physical and chemical properties of the ceramic powder, the characteristics of the organic binder, the amount of these constituent materials, and the green density under certain firing conditions. Ru. Specifically, it is desirable that the green sheet be made of ceramic and an organic binder having the same composition as the green sheet. In this case, either use a ceramic material with a particle size larger than that of the ceramic material used for the green sheet, or use a smaller amount of organic binder than the amount of organic binder in the green sheet, or pressurize the green rod. This can be achieved by making the green rod denser or by heat-treating the green rod at a temperature lower than the decomposition temperature of the organic binder. In addition, as another method, the shrinkage rate of the green rod can be made smaller than that of the green sheet by mixing other ceramic materials with the green rod or changing the component ratio. That is, a ceramic material is used for the green rod, which sinters slightly more slowly under the same firing conditions than the ceramic material for the green sheet.
グリーンロツドの作製は、上述したものから選
ばれたセラミツク粉末ならびに有機バインダをロ
ール機、らいかい機などで混練をし、この混練物
を加熱加圧などによりノズルから棒状に押出しを
することにより得られる。その断面形状は円形で
ある必要性は特になく、だ円形であつても扁平形
であつても本発明の効果を有するものである。ま
た、グリーンロツドは押出し品ではなく、グリー
ンシートを巻回して棒状にしたものであつてもよ
い。 Green rod is produced by kneading ceramic powder selected from those mentioned above and an organic binder using a roll machine, a sieve machine, etc., and then extruding this kneaded product into a rod shape from a nozzle using heat and pressure. . The cross-sectional shape does not particularly need to be circular, and the effects of the present invention can be achieved even if the cross-sectional shape is oval or flat. Further, the green rod may not be an extruded product but may be a rod-shaped product obtained by winding a green sheet.
以上述べたように、本発明は、セラミツク絶縁
体材料のグリーンシートを、このグリーンシート
の焼成における収緒率より小さい収緒率を有する
グリーンロツドを巻き軸として巻回し、これを焼
成しているので、得られるコイル部品は、焼成時
においてグリーンシートとグリーンロツドの収縮
率の差による巻き締め圧力により、きわめて層間
が稠密で一体化されていて、デラミネーシヨン、
クラツクなどのないものである。そのため、機械
的強度、層間絶縁、耐湿特性にすぐれた小形のコ
イル部品を実現することができる。 As described above, in the present invention, a green sheet of ceramic insulating material is wound around a green rod having a lower yield rate than the yield rate in firing of the green sheet, and this is fired. During firing, the coil parts obtained are extremely dense and integrated between the layers due to the tightening pressure due to the difference in shrinkage rate between the green sheet and the green rod, resulting in delamination,
There are no cracks or the like. Therefore, it is possible to realize a small coil component with excellent mechanical strength, interlayer insulation, and moisture resistance.
第１図〜第８図は本発明にかかるコイル部品の
製造方法の各工程を説明するための図、第９図は
本発明で得られるコイル部品をプリント回路基板
に実装した状態を示す断面図である。
１……マイラーフイルムベース、２……グリー
ンシート、３……コイル、４……コイルを有する
グリーンシート、５……グリーンロツド、６……
グリーンシートの終縁、７……平面板、８……巻
取り品、９……切断位置、１０……コイル部品素
体、１１，１２……端面、１３，１４……外部電
極、１５，１６……リード線、１７……プリント
回路基板、１８……貫通孔、１９，２０……導
体、２１，２２……導電性接着剤。
Figures 1 to 8 are diagrams for explaining each step of the method for manufacturing a coil component according to the present invention, and Figure 9 is a cross-sectional view showing a state in which the coil component obtained by the present invention is mounted on a printed circuit board. It is. DESCRIPTION OF SYMBOLS 1... Mylar film base, 2... Green sheet, 3... Coil, 4... Green sheet having a coil, 5... Green rod, 6...
Terminating edge of green sheet, 7... Plane plate, 8... Rolled product, 9... Cutting position, 10... Coil component element body, 11, 12... End surface, 13, 14... External electrode, 15, 16... Lead wire, 17... Printed circuit board, 18... Through hole, 19, 20... Conductor, 21, 22... Conductive adhesive.
Claims (1)
絶縁体材料を含む可撓性グリーンシートを、この
グリーンシートの焼成における収縮率より小さい
収縮率を有する、セラミツク絶縁体材料を含むグ
リーンロツド上に巻回して円柱状成形体を得、こ
の円柱状成形体を焼成し、得られた焼結体の両端
面に電極を形成することを特徴とするコイル部品
の製造方法。 ２ コイル用導電ペーストの導電材料が白金、パ
ラジウム、白金−パラジウムまたは銀−パラジウ
ムであることを特徴とする特許請求の範囲第１項
記載のコイル部品の製造方法。 ３ セラミツク絶縁体材料が酸化物系セラミツク
であることを特徴とする特許請求の範囲第１項記
載のコイル部品の製造方法。 ４ グリーンロツドがグリーンシートと同一組成
のセラミツク絶縁体材料と有機バインダで構成さ
れていることを特徴とする特許請求の範囲第１項
記載のコイル部品の製造方法。[Claims] 1. A flexible green sheet containing a ceramic insulating material printed with a conductive paste for a coil is placed on a green rod containing a ceramic insulating material having a shrinkage rate smaller than the shrinkage rate during firing of this green sheet. 1. A method for manufacturing a coil component, comprising: winding the coil to obtain a cylindrical molded body, firing the cylindrical molded body, and forming electrodes on both end surfaces of the obtained sintered body. 2. The method for manufacturing a coil component according to claim 1, wherein the conductive material of the conductive paste for coils is platinum, palladium, platinum-palladium, or silver-palladium. 3. The method of manufacturing a coil component according to claim 1, wherein the ceramic insulator material is an oxide ceramic. 4. The method of manufacturing a coil component according to claim 1, wherein the green rod is composed of a ceramic insulating material having the same composition as the green sheet and an organic binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10595282A JPS58222515A (en) | 1982-06-18 | 1982-06-18 | Manufacture of coil parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10595282A JPS58222515A (en) | 1982-06-18 | 1982-06-18 | Manufacture of coil parts |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20340089A Division JPH02161710A (en) | 1989-08-05 | 1989-08-05 | Manufacture of coil parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58222515A JPS58222515A (en) | 1983-12-24 |
| JPS6348413B2 true JPS6348413B2 (en) | 1988-09-29 |
Family
ID=14421161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10595282A Granted JPS58222515A (en) | 1982-06-18 | 1982-06-18 | Manufacture of coil parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58222515A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4881057A (en) * | 1972-02-02 | 1973-10-30 | ||
| JPS5585016A (en) * | 1978-12-21 | 1980-06-26 | Matsushita Electric Ind Co Ltd | Method of fabricating spiral ceramic capacitor |
| JPS5638414B2 (en) * | 1975-05-19 | 1981-09-07 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5638414U (en) * | 1979-08-31 | 1981-04-11 |
-
1982
- 1982-06-18 JP JP10595282A patent/JPS58222515A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4881057A (en) * | 1972-02-02 | 1973-10-30 | ||
| JPS5638414B2 (en) * | 1975-05-19 | 1981-09-07 | ||
| JPS5585016A (en) * | 1978-12-21 | 1980-06-26 | Matsushita Electric Ind Co Ltd | Method of fabricating spiral ceramic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58222515A (en) | 1983-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001076953A (en) | Laminated coil component and manufacture thereof | |
| JP4428852B2 (en) | Multilayer electronic component and manufacturing method thereof | |
| JPH07201570A (en) | Thick film multilayer inductor | |
| JP2002015939A (en) | Multilayered electronic component and its manufacturing method | |
| JP2009158735A (en) | Surface-mounting coil component | |
| JPS6348413B2 (en) | ||
| JPH02161710A (en) | Manufacture of coil parts | |
| JP3236949B2 (en) | Manufacturing method of chip-shaped electronic component substrate | |
| EP0132615A2 (en) | Method of making a matrix print head | |
| JPH10247603A (en) | Magnetic material paste, impedance element using the same and manufacture thereof | |
| JP2850200B2 (en) | Multilayer ceramic electronic components | |
| JPH05135991A (en) | Electronic component for surface mounting | |
| JP2002110451A (en) | Laminated electronic part and its manufacturing method | |
| JPS6129526B2 (en) | ||
| JP5230565B2 (en) | Wiring board | |
| JP3582256B2 (en) | Impedance element and method of manufacturing the same | |
| JP2004207608A (en) | Laminated electronic component and its manufacturing method | |
| JPH09270354A (en) | Manufacture of inductor part | |
| JPS6129529B2 (en) | ||
| JPS6222441B2 (en) | ||
| JP2006278602A (en) | Glass ceramics substrate | |
| JP2989319B2 (en) | Method of forming external electrodes in multilayer ceramic capacitors | |
| JPS6125221Y2 (en) | ||
| JP3948261B2 (en) | Coil parts manufacturing method | |
| JP2001023823A (en) | Laminated chip inductor |