JPS63304060A - Thermoplastic polymer composition having excellent antistaticity - Google Patents
Thermoplastic polymer composition having excellent antistaticityInfo
- Publication number
- JPS63304060A JPS63304060A JP13952887A JP13952887A JPS63304060A JP S63304060 A JPS63304060 A JP S63304060A JP 13952887 A JP13952887 A JP 13952887A JP 13952887 A JP13952887 A JP 13952887A JP S63304060 A JPS63304060 A JP S63304060A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- vinyl acetate
- parts
- acetate copolymer
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title abstract description 14
- 229920001169 thermoplastic Polymers 0.000 title abstract 4
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 41
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 41
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 25
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 22
- 150000003839 salts Chemical class 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 230000007935 neutral effect Effects 0.000 claims abstract description 15
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 14
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 12
- 238000007127 saponification reaction Methods 0.000 claims abstract description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000005977 Ethylene Substances 0.000 claims abstract description 9
- 150000001732 carboxylic acid derivatives Chemical group 0.000 claims abstract description 9
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical group CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000003368 amide group Chemical group 0.000 claims abstract description 5
- 229920006122 polyamide resin Polymers 0.000 claims description 26
- 239000011342 resin composition Substances 0.000 claims description 24
- 229920005992 thermoplastic resin Polymers 0.000 claims description 23
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Chemical group 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 abstract description 11
- 229920000642 polymer Polymers 0.000 abstract description 10
- 239000004952 Polyamide Substances 0.000 abstract description 9
- 229920002647 polyamide Polymers 0.000 abstract description 9
- 229920000515 polycarbonate Polymers 0.000 abstract description 4
- 239000004417 polycarbonate Substances 0.000 abstract description 4
- 238000013329 compounding Methods 0.000 abstract description 3
- 125000000896 monocarboxylic acid group Chemical group 0.000 abstract 1
- -1 polyethylene terephthalate Polymers 0.000 description 33
- 239000002253 acid Substances 0.000 description 28
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 24
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 230000000694 effects Effects 0.000 description 16
- 239000000047 product Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 238000005406 washing Methods 0.000 description 14
- 238000000465 moulding Methods 0.000 description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- 239000008188 pellet Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 9
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- 239000002216 antistatic agent Substances 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 5
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 5
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 229920006351 engineering plastic Polymers 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 150000002763 monocarboxylic acids Chemical class 0.000 description 3
- 238000005453 pelletization Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920006380 polyphenylene oxide Polymers 0.000 description 3
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- QCOGKXLOEWLIDC-UHFFFAOYSA-N N-methylbutylamine Chemical compound CCCCNC QCOGKXLOEWLIDC-UHFFFAOYSA-N 0.000 description 2
- XTUVJUMINZSXGF-UHFFFAOYSA-N N-methylcyclohexylamine Chemical compound CNC1CCCCC1 XTUVJUMINZSXGF-UHFFFAOYSA-N 0.000 description 2
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- 230000003292 diminished effect Effects 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 229910003002 lithium salt Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- IWTMSCUHCJHPPR-ACCUITESSA-N (E)-hexadec-2-enedioic acid Chemical compound OC(=O)CCCCCCCCCCCC\C=C\C(O)=O IWTMSCUHCJHPPR-ACCUITESSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 description 1
- JPZYXGPCHFZBHO-UHFFFAOYSA-N 1-aminopentadecane Chemical compound CCCCCCCCCCCCCCCN JPZYXGPCHFZBHO-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- REHQLKUNRPCYEW-UHFFFAOYSA-N 1-methylcyclohexane-1-carboxylic acid Chemical compound OC(=O)C1(C)CCCCC1 REHQLKUNRPCYEW-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- RMMFUALOIIVORL-UHFFFAOYSA-N 2,3-Undecanedione Chemical compound CCCCCCCCC(=O)C(C)=O RMMFUALOIIVORL-UHFFFAOYSA-N 0.000 description 1
- CGMMPMYKMDITEA-UHFFFAOYSA-N 2-ethylbenzoic acid Chemical compound CCC1=CC=CC=C1C(O)=O CGMMPMYKMDITEA-UHFFFAOYSA-N 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- NWYDEWXSKCTWMJ-UHFFFAOYSA-N 2-methylcyclohexane-1,1-diamine Chemical compound CC1CCCCC1(N)N NWYDEWXSKCTWMJ-UHFFFAOYSA-N 0.000 description 1
- WLJVXDMOQOGPHL-PPJXEINESA-N 2-phenylacetic acid Chemical compound O[14C](=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-PPJXEINESA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
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- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
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- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- JJOJFIHJIRWASH-UHFFFAOYSA-N Eicosanedioic acid Natural products OC(=O)CCCCCCCCCCCCCCCCCCC(O)=O JJOJFIHJIRWASH-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- WJYIASZWHGOTOU-UHFFFAOYSA-N Heptylamine Chemical compound CCCCCCCN WJYIASZWHGOTOU-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004727 Noryl Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- SBLKVIQSIHEQOF-UPHRSURJSA-N Octadec-9-ene-1,18-dioic-acid Chemical compound OC(=O)CCCCCCC\C=C/CCCCCCCC(O)=O SBLKVIQSIHEQOF-UPHRSURJSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
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- 239000005643 Pelargonic acid Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
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- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
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- 230000002378 acidificating effect Effects 0.000 description 1
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- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- QZHBYNSSDLTCRG-WUUYCOTASA-N brimonidine tartrate Chemical compound [H+].[H+].[O-]C(=O)[C@@H](O)[C@H](O)C([O-])=O.C1=CC2=NC=CN=C2C(Br)=C1NC1=NCCN1 QZHBYNSSDLTCRG-WUUYCOTASA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical class C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910001622 calcium bromide Inorganic materials 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
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- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 1
- VZRUGPJUVWRHKM-UHFFFAOYSA-N dibutylhexamethylenediamine Chemical compound CCCCNCCCCCCNCCCC VZRUGPJUVWRHKM-UHFFFAOYSA-N 0.000 description 1
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- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- FPIQZBQZKBKLEI-UHFFFAOYSA-N ethyl 1-[[2-chloroethyl(nitroso)carbamoyl]amino]cyclohexane-1-carboxylate Chemical compound ClCCN(N=O)C(=O)NC1(C(=O)OCC)CCCCC1 FPIQZBQZKBKLEI-UHFFFAOYSA-N 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
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- 238000012812 general test Methods 0.000 description 1
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- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
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- 239000004310 lactic acid Substances 0.000 description 1
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- 159000000002 lithium salts Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- 229910001623 magnesium bromide Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
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- 229910017604 nitric acid Inorganic materials 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 229960002446 octanoic acid Drugs 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
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- 239000004014 plasticizer Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、帯電防止性の良好な熱可塑性樹脂組成物、殊
にエンジニアリングプラスチックスとして有用な熱可塑
性樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermoplastic resin composition having good antistatic properties, particularly to a thermoplastic resin composition useful as engineering plastics.
従来の技術
ポリカーボネート、ポリエチレンテレフタレート、ポリ
ブチレンテレフタレート、変性ポリフェニレンオキサイ
ドなどは、機械器具部品、電気・電子機器部品等のエン
ジニアリングプラスチックスとして汎用されている。BACKGROUND OF THE INVENTION Polycarbonate, polyethylene terephthalate, polybutylene terephthalate, modified polyphenylene oxide, and the like are widely used as engineering plastics for mechanical appliance parts, electric/electronic equipment parts, and the like.
これらの用途に用いる成形用樹脂は帯電防止性が要求さ
れることが多く、そのため次に述べるような帯電防止剤
または帯電防止性樹脂を配合することが行われている。Molding resins used in these applications are often required to have antistatic properties, and therefore antistatic agents or antistatic resins as described below are often added.
(暉 ノニオンまたはアニオン界面活性剤を配合する方
法、
■ 帯電防止性を有しかつ溶融成形が可能な樹脂である
エチレン−酢酸ビニル共重合体ケン化物を配合する方法
、
(j) ノニオンまたはアニオン界面活性剤とエチレ
ン−酢酸ビニル共重合体ケン化物とを併用して配合する
方法。(1) A method of blending a nonionic or anionic surfactant, (2) A method of blending a saponified ethylene-vinyl acetate copolymer, which is a resin that has antistatic properties and can be melt-molded, (j) A nonionic or anionic interface A method of blending an activator and a saponified ethylene-vinyl acetate copolymer together.
L記■は古くから行われている方法である。Lki ■ is a method that has been used for a long time.
丑記■に関する文献としては、たとえば特公昭46−5
223号公報がある。Documents related to Oxki■ include, for example,
There is a publication No. 223.
上記(φに関する文献としては、特開昭51−5684
7号公報、特開昭56−14543号公報、特開昭57
−202338号公報などがある。The above (documents related to φ include Japanese Patent Application Laid-Open No. 51-5684
Publication No. 7, JP-A-56-14543, JP-A-57
-202338 publication etc.
帯電防止剤または帯電防止性樹脂を配合することにより
帯電防止を図る方法のほかに、成形物を得た後、該成形
物の表面に帯電防止剤を塗布する方法もある。In addition to the method of preventing static electricity by blending an antistatic agent or antistatic resin, there is also a method of applying an antistatic agent to the surface of the molded product after obtaining the molded product.
なお本発明とは別目的に関するものであるが、特開昭6
1−281147号公報には、エチレン−酢酸ビニル共
重合体ケン化物にリチウム塩化合物を配合してピンホー
ル、クラック、局所的偏肉のない単層または多層の成形
物、殊に延伸成形物を得る技術が示されている。Although it is related to a purpose different from the present invention,
1-281147 discloses that a lithium salt compound is blended with a saponified ethylene-vinyl acetate copolymer to produce a single-layer or multilayer molded product, especially a stretched molded product, without pinholes, cracks, or local thickness deviations. The technique to obtain it is shown.
そのほか本発明に関係する文献として、特開昭82−2
2840号公報には、末端カルボキシル基−COOHの
数N1と末端カルボン酸アミド基−CONRR’ (た
だしRは炭素数1〜22の炭化水素基、Roは水素原子
または炭素数1〜22の炭化水素基)の数N2との比が
100・N2/ (N1+N2)≧5
を満足するポリアミド系樹脂とエチレン−酢酸ビニル共
重合体ケン化物とを重量比で98/2〜2798の割合
で配合した樹脂組成物につき開示がある。Other documents related to the present invention include JP-A-82-2
Publication No. 2840 describes the number N1 of terminal carboxyl groups -COOH and the terminal carboxylic acid amide group -CONRR' (where R is a hydrocarbon group having 1 to 22 carbon atoms, and Ro is a hydrogen atom or a hydrocarbon group having 1 to 22 carbon atoms). A resin in which a polyamide resin whose ratio to the number N2 of groups (groups) satisfies 100・N2/(N1+N2)≧5 and a saponified ethylene-vinyl acetate copolymer are blended in a weight ratio of 98/2 to 2798. There is a disclosure regarding the composition.
発明が解決しようとする問題点
エンジニアリングプラスチックスの帯電防止を図る上述
の従来の方法は、以下に述べるようにそれぞれ問題点が
ある。Problems to be Solved by the Invention The above-mentioned conventional methods for preventing static electricity on engineering plastics each have their own problems as described below.
すなわち、アニオン界面活性剤を配合する上記■の方法
は、成形温度における界面活性剤の熱安定性が不足する
こと、経時的に帯電防止効果が低下していくこと1表面
にマイグレーション(浸出)した界面活性剤によりこの
成形物と接触する部材を汚染するおそれがあることなど
の問題点がある。In other words, the above method (2) of blending an anionic surfactant has two problems: the thermal stability of the surfactant at the molding temperature is insufficient, and the antistatic effect decreases over time.1. There are problems such as the possibility that the surfactant may contaminate members that come into contact with the molded article.
エチレン−酢酸ビニル共重合体ケン化物を配合する上記
■の方法は、界面活性剤を配合した場合のようなマイグ
レーションのおそれはないが、低湿条件下では帯電防止
性が不足するという問題点がある。Method (2) above, in which a saponified ethylene-vinyl acetate copolymer is blended, does not pose the risk of migration as would be the case when a surfactant is blended, but there is a problem in that antistatic properties are insufficient under low humidity conditions. .
界面活性剤とエチレン−酢酸ビニル共重合体ケン化物と
を併用する上記■の方法も、本質的には上記■または■
の方法と変わらない。The method (2) above, which uses a surfactant and a saponified ethylene-vinyl acetate copolymer, is also essentially the same as (1) or (2) above.
It's no different from the method.
成形物の表面に帯電防止剤を塗布する方法は、摩擦、払
拭により短期間に帯電防止効果が損なわれる上、成形時
の帯電は全く防止できないという問題点がある。The method of applying an antistatic agent to the surface of a molded article has the problem that the antistatic effect is lost in a short period of time due to friction and wiping, and that charging during molding cannot be prevented at all.
本発明は、このような状況に鑑み、低湿条件下でも帯電
防止効果を奏しかつその帯電防止効果が持続する熱可塑
性樹脂組成物を見出すべくなされたものである。In view of this situation, the present invention was made to find a thermoplastic resin composition that exhibits an antistatic effect and maintains the antistatic effect even under low humidity conditions.
問題点を解決するための手段
本発明は、
「疎水性熱可塑性樹脂(A)およびエチレン含量が20
〜60モル%、酢酸ビニル部分のケン化度が95モル%
以上であり、かつ灰分含量が20ppm以下で、アルカ
リ金属含量が5 ppm以下の低灰分・低アルカリ金属
のエチレン−酢酸ビニル共重合体ケン化物(B)を必須
成分とし、末端カルボキシル基−COOHの数N1と末
端カルボン酸アミド基−CONRR’ (ただしRは
炭素数1〜22の炭化水素基、Roは水素原子または炭
素数1〜22の炭化水素基)の数N2との比が100I
N2/ (1十N2)≧5
を満足する末端封鎖ポリアミド系樹脂(C)を任意成分
とする樹脂組成物(X)100重量部に、吸湿性の中性
金属塩(y) o、t〜5重量部を配合してなる帯電
防止性の良好な熱可塑性樹脂組成物、」
をその要旨とするものである。Means for Solving the Problems The present invention is based on a hydrophobic thermoplastic resin (A) and an ethylene content of 20%.
~60 mol%, degree of saponification of vinyl acetate moiety is 95 mol%
In addition, the essential component is a saponified ethylene-vinyl acetate copolymer (B) with a low ash content and a low alkali metal, which has an ash content of 20 ppm or less and an alkali metal content of 5 ppm or less, and has a terminal carboxyl group -COOH. The ratio of the number N1 to the number N2 of the terminal carboxylic acid amide group -CONRR' (where R is a hydrocarbon group having 1 to 22 carbon atoms, and Ro is a hydrogen atom or a hydrocarbon group having 1 to 22 carbon atoms) is 100I
A hygroscopic neutral metal salt (y) o, t~ is added to 100 parts by weight of a resin composition (X) optionally containing an end-blocked polyamide resin (C) satisfying N2/(10N2)≧5. 5 parts by weight of a thermoplastic resin composition with good antistatic properties.''
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明の熱可塑性樹脂組成物は、樹脂組成物(X)と吸
湿性の中性金属塩(Y)とからなる。The thermoplastic resin composition of the present invention consists of a resin composition (X) and a hygroscopic neutral metal salt (Y).
−樹脂組成物(X)−
樹脂組成物(X)は、疎水性熱可塑性樹脂(A)および
低灰分・低アルカリ金属のエチレン−酢酸ビニル共重合
体ケン化物(B)を必須成分とし、末端封鎖ポリアミド
系樹脂(C)を任意成分とする。- Resin composition (X) - The resin composition (X) contains a hydrophobic thermoplastic resin (A) and a saponified ethylene-vinyl acetate copolymer of low ash and low alkali metal (B) as essential components, and A capped polyamide resin (C) is an optional component.
ロ − A疎水性熱可塑性
樹脂(A)としては、ポリカーボネート、ポリエチレン
テレフタレート、ポリブチレンテレフタレート、ポリエ
ステルカーボネート、変性ポリフェニレンオキサイド、
AB l!1脂、AS樹脂、ポリプロピレンなどが例示
される。B-A hydrophobic thermoplastic resin (A) includes polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyester carbonate, modified polyphenylene oxide,
AB l! 1 resin, AS resin, polypropylene, etc.
低灰分・低アルカリ金属のエチレン−酢酸ビニル共重合
体ケン化物(B)としては、エチレン含量が20〜60
モル%、酢酸、ビニル部分のケン化度が95モル%以上
の組成を有するものが用いられる。エチレン含量が20
モル%未満では上記疎水性熱可塑性樹脂(A)との相溶
性が低下し、一方60モル%を越えると帯電防止性の改
良効果が不足する。酢酸ビニル部分のケン化度が95モ
ル%未満では、成形時の熱安定性が不足する。The saponified ethylene-vinyl acetate copolymer (B) with low ash and low alkali metal has an ethylene content of 20 to 60
A composition having a saponification degree of 95 mol % or more of acetic acid and vinyl moieties is used. Ethylene content is 20
If it is less than 60 mol %, the compatibility with the hydrophobic thermoplastic resin (A) will decrease, while if it exceeds 60 mol %, the effect of improving antistatic properties will be insufficient. If the degree of saponification of the vinyl acetate portion is less than 95 mol%, thermal stability during molding will be insufficient.
上記共重合体ケン化物は、エチレン以外のα−オレフィ
ン、不飽和カルボン酸系化合物、不飽和ニトリル、不飽
和アミド、不飽和スルホン酸系化合物などのコモノマー
を少量含有していてもよい。The saponified copolymer may contain a small amount of a comonomer such as an α-olefin other than ethylene, an unsaturated carboxylic acid compound, an unsaturated nitrile, an unsaturated amide, or an unsaturated sulfonic acid compound.
一般にエチレン−酢酸ビニル共重合体ケン化物は、エチ
レン−酢酸ビニル共重合体をアルカリ触媒でケン化する
ことにより製造される。ところが、使用する工業用水や
試薬中には金属塩が不純物として含まれており、またケ
ン化触媒(アルカリ金属水酸化物)は反応後もアルカリ
金属の酢酸塩として残存する。そのため、これらの不純
物やアルカリ金属酢酸塩は、ケン化液から析出した樹1
階中に含まれることになる。Generally, a saponified ethylene-vinyl acetate copolymer is produced by saponifying an ethylene-vinyl acetate copolymer with an alkali catalyst. However, the industrial water and reagents used contain metal salts as impurities, and the saponification catalyst (alkali metal hydroxide) remains as an acetate of the alkali metal even after the reaction. Therefore, these impurities and alkali metal acetates are removed from the wood 1 precipitated from the saponification solution.
It will be included in the floor.
本発明に適するエチレン−酢酸ビニル共重合体ケン化物
(B)は、このような不純物やアルカリ金属酢酸塩を一
定限度以下にまで低減したものを用いることが必須とな
る。It is essential to use a saponified ethylene-vinyl acetate copolymer (B) suitable for the present invention in which such impurities and alkali metal acetate are reduced to below a certain limit.
上述の灰分とは、乾燥したエチレン−酢酸ビニル共重合
体ケン化物を白金蒸発皿にとり、電熱器とガスバーナー
を用いて炭化後、400℃の電気炉に入れ、700℃ま
で昇温し、さらに700℃で3時間にわたって完全に灰
化後、電気炉より取り出し、5分間放冷後、デシケータ
−中で25分間放置し、灰分を活量して求めたものを言
うものとする。The above-mentioned ash refers to the dry saponified ethylene-vinyl acetate copolymer taken in a platinum evaporating dish, carbonized using an electric heater and gas burner, placed in an electric furnace at 400°C, heated to 700°C, and then heated to 700°C. After being completely incinerated at 700°C for 3 hours, it is taken out from the electric furnace, left to cool for 5 minutes, and then left in a desiccator for 25 minutes to determine the activity of the ash content.
上述のアルカリ金属は、灰分測定の場合と同一の方法で
エチレン−酢酸ビニル共重合体ケン化物を灰化後、灰分
を塩酸酸性水溶液に加温下に溶解した溶液について原子
吸光法によって定量される。The above-mentioned alkali metals are determined by atomic absorption spectrometry using a solution in which the saponified ethylene-vinyl acetate copolymer is incinerated in the same manner as in the case of ash measurement, and the ash is dissolved in an acidic aqueous solution of hydrochloric acid under heating. .
そして本発明の目的に適するエチレン−酢酸ビニル共重
合体ケン化物(B)は、上記で定義される灰分含量は2
0 ppm以下、好ましくは10ppm以下であること
が必要であり、灰分含量が20ppmを越えると、得ら
れる成形物の機械的強度の低下および表面外観の悪化が
著しくなる。灰分は上記許容範囲の中でできるだけ少な
い方が好ましいが、工業的見地からは精製に限界がある
ので、その下限はi ppm程度となる。The saponified ethylene-vinyl acetate copolymer (B) suitable for the purpose of the present invention has an ash content of 2 as defined above.
It is necessary that the ash content be 0 ppm or less, preferably 10 ppm or less; if the ash content exceeds 20 ppm, the resulting molded product will have a significant decrease in mechanical strength and deterioration in surface appearance. It is preferable for the ash content to be as low as possible within the above-mentioned allowable range, but from an industrial standpoint there is a limit to refining, so the lower limit is about i ppm.
エチレン−酢酸ビニル共重合体ケン化物(B)は、灰分
が上記許容範囲にあるだけでなく、アルカリ金属含量が
5 ppm以下、好ましくは3 ppm以下であること
が必要である。アルカリ金属含量が5 ppmを越える
と、前記と同様に得られる成形物の機械的強度の低下お
よび表面外観の悪化が著しくなる。アルカリ金属含量は
上記許容範囲の中でできるだけ少ない方が好ましいが、
工業的見地からは精製に限界があるので、その下限は0
.5ppm程度となる。The saponified ethylene-vinyl acetate copolymer (B) not only needs to have an ash content within the above-mentioned allowable range, but also needs to have an alkali metal content of 5 ppm or less, preferably 3 ppm or less. If the alkali metal content exceeds 5 ppm, the mechanical strength of the molded product obtained will decrease significantly and the surface appearance will deteriorate in the same manner as described above. It is preferable that the alkali metal content be as low as possible within the above allowable range,
From an industrial standpoint, there is a limit to refining, so the lower limit is 0.
.. It will be about 5 ppm.
結局、本発明におけるエチレン−酢酸ビニル共重合体ケ
ン化物(B)は、先に述べた共重合組成を有すると共に
、灰分含量が20 ppm以下で、アルカリ金属含量が
5PP鵬以下であることが要求されるのである。Ultimately, the saponified ethylene-vinyl acetate copolymer (B) in the present invention is required to have the above-mentioned copolymer composition, have an ash content of 20 ppm or less, and an alkali metal content of 5 PP or less. It will be done.
上述の低灰分番低アルカリ金属含量のエチレン−酢酸ビ
ニル共重合体ケン化物(B)は、エチレン−酢酸ビニル
共重合体をケン化して製造されるエチレン−酢酸ビニル
共重合体ケン化物の粉末、粒子、ペレットを酸、特に弱
酸の水溶液で十分に洗浄し、灰分やアルカリ金属の原因
となる塩類を除去後、さらに望ましくは水洗によって樹
脂に付着した酸を除去し、乾燥することによって得られ
る。The saponified ethylene-vinyl acetate copolymer (B) with a low ash number and low alkali metal content described above is a saponified ethylene-vinyl acetate copolymer powder produced by saponifying an ethylene-vinyl acetate copolymer, It is obtained by thoroughly washing the particles or pellets with an aqueous solution of an acid, particularly a weak acid, to remove salts that cause ash and alkali metals, and more preferably washing with water to remove the acid attached to the resin, and drying.
弱酸としては、酢酸、プロピオン酸、グリコール酸、乳
酸、アジピン酸、アゼライン酸、ゲルタール酸、コハク
酸、安息香酸、イソフタル酸、テレフタル酸などが使用
される0通常、25℃におけるpKaが3.5以上のも
のが有用である。Examples of weak acids used include acetic acid, propionic acid, glycolic acid, lactic acid, adipic acid, azelaic acid, geltaric acid, succinic acid, benzoic acid, isophthalic acid, and terephthalic acid. Usually, pKa at 25°C is 3.5. The above are useful.
また、上記弱酸による処理を行った後、水洗の前または
後に、稀薄な強酸、たとえばシュウ酸、マレイン酸など
25℃におけるpKaが2.5以下の有機酸やリン酸、
硫酸、硝酸、塩酸などの水溶液でさらに処理することが
望ましい、これによりアルカリ金属の除去が一段と効率
的になされる。In addition, after performing the treatment with the above-mentioned weak acid, before or after washing with water, dilute strong acids such as oxalic acid, maleic acid, and other organic acids with a pKa of 2.5 or less at 25°C, phosphoric acid, etc.
It is desirable to further treat with an aqueous solution such as sulfuric acid, nitric acid, hydrochloric acid, etc., which makes the alkali metal removal more efficient.
−−ポリアミド、 C
末端封鎖ポリアミド系樹脂(C)としては、末端カルボ
キシル基−COOHの数N1と末端カルボン酸アミド基
−CONRR’ (ただしRは炭素数1〜22の炭化
水素基、R″は水素原子または炭素数1〜22の炭化水
素基)の数N2との比が100・N2/ (N1+N2
)≧5
を満足するもの、すなわち、3員環以上のラクタム、ε
−アミノ酸、または二塩基酸とジアミン等の重合または
共重合によって得られるポリアミドの末端カルボキシル
基をN−置換アミド変性したものが用いられる。モノ置
換アミド変性(R’が水素原子)が実用的であるが、ジ
置換アミド変性であっても差支えない。--Polyamide, C The terminal-blocked polyamide resin (C) has the number N1 of terminal carboxyl groups -COOH and the terminal carboxylic acid amide group -CONRR' (where R is a hydrocarbon group having 1 to 22 carbon atoms, R'' is The ratio of hydrogen atoms or hydrocarbon groups having 1 to 22 carbon atoms to the number N2 is 100・N2/ (N1+N2
)≧5, that is, lactams with three or more membered rings, ε
- A polyamide obtained by polymerization or copolymerization of an amino acid or a dibasic acid with a diamine, etc., whose terminal carboxyl group is modified with an N-substituted amide is used. Mono-substituted amide modification (R' is a hydrogen atom) is practical, but di-substituted amide modification may also be used.
上記ポリアミド系樹脂(C)は、ポリアミド原料を、
■ 炭素数1〜22のモノアミン、または■ 炭素数1
〜22のモノアミンと炭素数2〜23のモノカルボン酸
、
の存在下に重縮合させることにより得られる。The above-mentioned polyamide resin (C) is prepared by combining a polyamide raw material with ■ a monoamine having 1 to 22 carbon atoms, or ■ a carbon number 1
It can be obtained by polycondensation in the presence of ~22 monoamines and monocarboxylic acids having 2 to 23 carbon atoms.
ポリアミド原料としては、ラクタム類(ε−カプロラク
タム、エナントラクタム、カプリルラクタム、ラウリル
ラクタム、α−ピロリドン、α−ピペリドン等)、ω−
アミノ酸類(6−アミノカプロン酸、7−アミノノナン
酸、9−アミノノナン酸、11−アミノウンデカン酸等
)、二塩基酸類(アジピン酸、グルタル酸、ピメリン酸
、スペリン酸、アゼライン酸、セバシン酸、ウンデカン
ジオン酸、ドデカジオン酸、ヘキサデカジオン酸、ヘキ
サデセンジオン酸、エイコサンジオン酸、エイコサジエ
ンジオン酸、ジグリコール酸、2.2.4−トリメチル
アジピン酸、キシリレンジカルボン酸、1.4−シクロ
ヘキサンジカルボン酸、テレフタル酸、イソフタル酸等
)、ジアミン類(ヘキサメチレンジアミン、テトラメチ
レンジアミン、ノナメチレンジアミン、ウンデカメチレ
ンジアミン、ドデカメチレンジアミン、2゜2.4−ま
たは2,4.4−1リメチルへキサメチレンジアミン、
ビス−(4、4’−アミノシクロヘキシル)メタン、メ
タキシリレンジアミン等)があげられる。Polyamide raw materials include lactams (ε-caprolactam, enanthractam, capryllactam, lauryllactam, α-pyrrolidone, α-piperidone, etc.), ω-
Amino acids (6-aminocaproic acid, 7-aminononanoic acid, 9-aminononanoic acid, 11-aminoundecanoic acid, etc.), dibasic acids (adipic acid, glutaric acid, pimelic acid, speric acid, azelaic acid, sebacic acid, undecanedione) Acid, dodecadionic acid, hexadecadionic acid, hexadecenedioic acid, eicosanedionic acid, eicosadienedionic acid, diglycolic acid, 2.2.4-trimethyladipic acid, xylylenedicarboxylic acid, 1.4-cyclohexanedicarboxylic acid acid, terephthalic acid, isophthalic acid, etc.), diamines (hexamethylene diamine, tetramethylene diamine, nonamethylene diamine, undecamethylene diamine, dodecamethylene diamine, 2゜2.4- or 2,4.4-1 remethyl) xamethylene diamine,
bis-(4,4'-aminocyclohexyl)methane, metaxylylene diamine, etc.).
炭素数1〜22のモノアミンとしては、脂肪族モノアミ
ン(メチルアミン、エチルアミン、プロピルアミン、ブ
チルアミン、ペンチルアミン、ヘキシルアミン、ヘプチ
ルアミン、オクチルアミン、2−エチルヘキシルアミン
、ノニルアミン、デシルアミン、ウンデシルアミン、ド
デシルアミン、トリデシルアミン、テトラデシルアミン
、べンタデシルアミン、ヘキサデシルアミン、オクタデ
シルアミン、オクタデシルンアミン、エイコシルアミン
、トコジルアミン等)、脂環式モノアミン(シクロヘキ
シルアミン、メチルシクロヘキシルアミン等)、芳香族
モノアミン(ベンジルアミン、β−フェニルエチルアミ
ン等)、対称第二アミン(N 、 N−ジメチルアミン
、N、N−ジエチルアミン、N、N−ジプロピルアミン
、N、N−ジブチルアミン、N、N−ジエチルアミン、
N、N−ジオクチルアミン、N、N−ジデシルアミン等
)、混成第二アミン(N−メチル−N−エチルアミン、
N−メチル−N−ブチルアミン、N−メチル−N−オク
タデシルアミン、N−エチル−N−ヘキサデシルアミン
、N−エチル−N−オクタデシルアミン、N−プロピル
−N−ヘキサデシルアミン、N−メチル−N−シクロヘ
キシルアミン、N−メチル−N−ベンジルアミン等)が
あげられる。Examples of monoamines having 1 to 22 carbon atoms include aliphatic monoamines (methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, heptylamine, octylamine, 2-ethylhexylamine, nonylamine, decylamine, undecylamine, dodecyl amines, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, octadecylamine, octadecylamine, eicosylamine, tocodylamine, etc.), alicyclic monoamines (cyclohexylamine, methylcyclohexylamine, etc.), aromatic monoamines ( benzylamine, β-phenylethylamine, etc.), symmetrical secondary amines (N,N-dimethylamine, N,N-diethylamine, N,N-dipropylamine, N,N-dibutylamine, N,N-diethylamine,
N,N-dioctylamine, N,N-didecylamine, etc.), mixed secondary amines (N-methyl-N-ethylamine,
N-Methyl-N-butylamine, N-methyl-N-octadecylamine, N-ethyl-N-hexadecylamine, N-ethyl-N-octadecylamine, N-propyl-N-hexadecylamine, N-methyl- N-cyclohexylamine, N-methyl-N-benzylamine, etc.).
炭素数2〜23のモノカルボン酸としては、脂肪族モノ
カルボン酸(酢酸、プロピオン酸、酪酸、吉草酸、カプ
ロン酸、エナントS、カプリル酸、カプリン酸、ペラル
ゴン酸、ウンデカン酸、ラウリル酸、トリデカン酸、ミ
リスチン酸、ミリストレイン酸、パルミチン酸、ステア
リン酸、オレイン酸、リノール酸、アラキン酸、ベヘン
酸等)、脂環式モノカルボン酸(シクロヘキサンカルボ
ン酸、メチルシクロヘキサンカルボン酸等)、芳香族モ
ノカルボン酸(安息香酸、トルイル酸、エチル安息香酸
、フェニル酢酸等)があげられる。Examples of monocarboxylic acids having 2 to 23 carbon atoms include aliphatic monocarboxylic acids (acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthate S, caprylic acid, capric acid, pelargonic acid, undecanoic acid, lauric acid, tridecane) acids, myristic acid, myristoleic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, arachidic acid, behenic acid, etc.), alicyclic monocarboxylic acids (cyclohexanecarboxylic acid, methylcyclohexanecarboxylic acid, etc.), aromatic monocarboxylic acids Examples include carboxylic acids (benzoic acid, toluic acid, ethylbenzoic acid, phenylacetic acid, etc.).
また必要に応じ、上記モノアミンまたはモノアミンとモ
ノカルボン酸のほかに、脂肪族ジアミン(エチレンジア
ミン、トリメチレンジアミン、テトラメチレンジアミン
、ペンタメチレンジアミン、ヘキサメチレンジアミン、
ヘプタメチレンジアミン、オクタメチレンジアミン、ノ
ナメチレンジアミン、デカメチレンジアミン、ウンデカ
メチレンジアミン、ドデカメチレンジアミン、トリデカ
メチレンジアミン、ヘキサデカメチレンジアミン、オク
タデカメチレンジアミン、2,2.4−または2,4.
4−)ジブチルへキサメチレンジアミン等)、脂環式ジ
アミン(シクロヘキサンジアミン、メチルシクロヘキサ
ンジアミン、ビス−(4、4’−アミノシクロヘキシル
)メタン等)、芳香族ジアミン(キシリレンジアミン等
)、脂肪族ジカルボン酸(マロン酸、コハク酸、グルタ
ル酸、アジピン酸、ピメリン酸、スペリン酸、アゼライ
ン酸、セバシン酸、ウンデカンジオン酸、ドデカンジオ
ン酸、トリデカジオン酸、テトラデカジオン酸、ヘキサ
デカジオン酸、オクタデカジオン酸、オクタデセンジオ
ン酸、エイコサンジオン酸、エイコセンジオン酸、トコ
サンジオン酸、2,2.4−)ジブチルアジピン酸等)
、脂環式ジカルボン酸(1,4−シクロヘキサンジカル
ボン酸等)、芳香族ジカルボン酸(テレフタル酸、イソ
フタル酸、フタル酸、キシリレンジカルボン酸等)など
のジアミン類やジカルボン酸類を共存させることができ
る。In addition to the above monoamines or monoamines and monocarboxylic acids, aliphatic diamines (ethylene diamine, trimethylene diamine, tetramethylene diamine, pentamethylene diamine, hexamethylene diamine,
Heptamethylene diamine, octamethylene diamine, nonamethylene diamine, decamethylene diamine, undecamethylene diamine, dodecamethylene diamine, tridecamethylene diamine, hexadecamethylene diamine, octadecamethylene diamine, 2,2.4- or 2,4 ..
4-) dibutylhexamethylenediamine, etc.), alicyclic diamines (cyclohexanediamine, methylcyclohexanediamine, bis-(4,4'-aminocyclohexyl)methane, etc.), aromatic diamines (xylylenediamine, etc.), aliphatic diamines Dicarboxylic acids (malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, speric acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecadionic acid, tetradecadionic acid, hexadecadioic acid, octadeca dionic acid, octadecenedioic acid, eicosandioic acid, eicocenedioic acid, tocosandioic acid, 2,2.4-)dibutyladipic acid, etc.)
Diamines and dicarboxylic acids such as , alicyclic dicarboxylic acids (1,4-cyclohexanedicarboxylic acid, etc.), aromatic dicarboxylic acids (terephthalic acid, isophthalic acid, phthalic acid, xylylene dicarboxylic acid, etc.) can coexist. .
ポリアミド系樹脂(C)を製造する反応は、前記のポリ
アミド原料を用いて常法に従って反応を開始すればよい
、上記カルボン酸およびアミンは、反応開始時から減圧
下の反応をはじめるまでの任意の段階で添加することが
できる。カルボン酸とアミンとは、同時に加えても、別
々に加えてもよい。The reaction for producing the polyamide resin (C) can be started using the polyamide raw material according to a conventional method. Can be added in stages. The carboxylic acid and amine may be added simultaneously or separately.
カルボン酸およびアミンの使用量は、そのカルボキシル
基およびアミノ基の量として、ポリアミド原料1モル(
繰返し単位を構成するモノマーまたはモノマーユニット
1モル)に対してそれぞれ2〜20meq1モル、好ま
しくは3〜19meq1モルである(アミノ基の当量は
、カルボン酸1当量と1=1で反応してアミド結合を形
成するアミノ基の量を1当量とする)。The amount of carboxylic acid and amine used is 1 mole of polyamide raw material (as the amount of carboxyl group and amino group).
1 mol of 2 to 20 meq, preferably 1 mol of 3 to 19 meq, per 1 mol of monomer or monomer unit constituting the repeating unit (the equivalent of the amino group is 1=1 when reacting with 1 equivalent of carboxylic acid to form an amide bond) (The amount of amino groups forming this is defined as 1 equivalent).
この使用量が余りに少ないと本発明の目的に適するポリ
アミド系樹脂を製造することができず、一方多すぎると
ポリアミド系樹脂の物性に悪影響を及ぼすようになる。If the amount used is too small, it will not be possible to produce a polyamide resin suitable for the purpose of the present invention, while if it is too large, the physical properties of the polyamide resin will be adversely affected.
反応圧力は、反応終期を400 Torr以下、好まし
くは300 Torr以下で行うのがよい0反応終期の
圧力が高いと、希望する相対粘度のものが得られない。The reaction pressure is preferably 400 Torr or less, preferably 300 Torr or less at the end of the reaction. If the pressure at the end of the reaction is high, the desired relative viscosity cannot be obtained.
減圧反応の時間は0.5時間以上とすることが望ましく
、通常は1〜2時間とする。The time for the reduced pressure reaction is desirably 0.5 hours or more, and usually 1 to 2 hours.
ポリアミド系樹脂(C)が末端に有する一〇〇NRR’
基におけるRまたはR′で示される炭化水素基としては
、脂肪族炭化水素基(メチル基、エチル基、プロピル基
、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オ
クチル基、2−エチルヘキシル基、ノニル基、デシル基
、ウンデシル基、ドデシル基、トリデシル基、テトラデ
シル基、テトラデシル基、ペンタデシル基、ヘキサデシ
ル基、ヘプタデシル基、オクタデシル基、オクタデシル
基、エイコシル基、トコシル基等)、脂環式炭化水素基
(シクロヘキシル基、メチルシクロヘキシル基、シクロ
ヘキシルメチル基等)、芳香族炭化水素基(フェニル基
、トルイル基、ベンジル基、β−フェニルエチル基等)
があげられる。100 NRR' that the polyamide resin (C) has at the end
The hydrocarbon group represented by R or R' in the group includes aliphatic hydrocarbon groups (methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, 2-ethylhexyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, octadecyl group, eicosyl group, tocosyl group), alicyclic hydrocarbon group (cyclohexyl group, methylcyclohexyl group, cyclohexylmethyl group, etc.), aromatic hydrocarbon group (phenyl group, tolyl group, benzyl group, β-phenylethyl group, etc.)
can be given.
ポリアミド系樹脂の末端−〇〇〇H基の−CONRR’
基への変換割合は、ポリアミド系樹脂の製造時にアミン
またはアミンとカルボン酸を存在させることによってa
mllHされるが、−COOH基の5モル以上、特に1
0モル%以上が−CONRR°基に変換されていること
が好ましく、かつ、変換されていない一〇〇〇H基の量
は50 geq/g・ポリマー以下、特に40 geq
/g・ポリマー以下であることが好ましい、この変換の
程度が小さいと所期の効果が期待できなくなる。−力変
換の程度を大きくすることは物性の点からは不都合はな
いが、製造が困難となるので、変性されない末端カルボ
キシル基の量が1JLeq/g・ポリマーとなる程度に
止めるのが得策である。-CONRR' of terminal -〇〇H group of polyamide resin
The conversion rate to groups can be determined by the presence of an amine or an amine and a carboxylic acid during the production of polyamide resin.
mllH, but more than 5 moles of -COOH group, especially 1
It is preferable that 0 mol% or more is converted to -CONRR° groups, and the amount of unconverted 1000H groups is 50 geq/g polymer or less, especially 40 geq
/g·polymer or less is preferable; if the degree of this conversion is small, the desired effect cannot be expected. - Increasing the degree of force conversion is not disadvantageous in terms of physical properties, but it makes manufacturing difficult, so it is best to limit the amount of unmodified terminal carboxyl groups to 1 JLeq/g of polymer. .
上記−〇〇NRR’基のRおよびR゛で示される炭化水
素基は、ポリアミド系樹脂(C)を塩酸を用いて加水分
解後、ガスクロマトグラフィーにより測定できる。−C
OOH基は、ポリアミド系樹脂(C)をベンジルアルコ
ールに溶解し、0、IN苛性ソーダで滴定することによ
り測定できる。The hydrocarbon groups represented by R and R in the -00NRR' group can be measured by gas chromatography after hydrolyzing the polyamide resin (C) using hydrochloric acid. -C
OOH groups can be measured by dissolving the polyamide resin (C) in benzyl alcohol and titrating the solution with 0, IN caustic soda.
ポリアミド系樹脂(C)の末端基としては、上記の一〇
〇NRR’基のほかに、ポリアミド原料に由来する一〇
〇〇H基および−MHz基がある。In addition to the above-mentioned 100NRR' group, the terminal groups of the polyamide resin (C) include 1000H group and -MHz group derived from the polyamide raw material.
末端アミノ基については変性されていても変性されてい
なくても差支えないが、流動性および溶融安定性がよい
ことから、上記の炭化水素基で変性されていることが好
ましい。The terminal amino group may or may not be modified, but it is preferably modified with the above-mentioned hydrocarbon group because of good fluidity and melt stability.
−NHλ基はポリアミド系樹脂(C)をフェノールに溶
解し、0.05N塩酸で滴定することにより測定できる
。-NHλ group can be measured by dissolving the polyamide resin (C) in phenol and titrating with 0.05N hydrochloric acid.
ポリアミド系樹脂(C)の相対粘度[ηrellは、J
IS K E1810に従って、98%硫酸中濃度1%
、温度25℃で測定した値で2〜6、好ましくは2〜5
である。相対粘度が低すぎるとストランド化し、チップ
化することが困難となり、製造上不都合となる。−吉相
対粘度が高すぎると成形性が悪くなる。The relative viscosity of the polyamide resin (C) [ηrell is J
Concentration 1% in 98% sulfuric acid according to IS K E1810
, 2 to 6, preferably 2 to 5, measured at a temperature of 25°C
It is. If the relative viscosity is too low, it will be difficult to form into strands and chips, which will be inconvenient in manufacturing. - If the relative viscosity is too high, moldability will be poor.
重重」L皮士1と1音
樹脂組成物(X)中に占める各樹脂成分の割合は、疎水
性熱可塑性樹脂(A)99〜80重量%、低灰分番低ア
ルカリ金属のエチレン−酢酸ビニル共重合体ケン化物(
B)1〜20重量%および末端封鎖ポリアミド系樹脂(
C)0〜10重量%とすることが望ましい。The proportion of each resin component in the resin composition (X) is 99 to 80% by weight of the hydrophobic thermoplastic resin (A), low ash number, low alkali metal ethylene-vinyl acetate. Saponified copolymer (
B) 1 to 20% by weight and end-blocked polyamide resin (
C) Desirably 0 to 10% by weight.
ケン化物(B)の割合がこの範囲よりも少ないと、成形
物表面が粗面化し、該ケン化物(B)の配合による帯電
性防止効果および吸湿性の中性金属塩(Y)の樹脂層内
部への保持効果が認め難く、一方該ケン化物(B)の割
合がこの範囲よりも多くなると、疎水性熱可塑性樹脂(
A)を主成分とする本来の目的が減殺される上、ロング
ラン成形時の成形性が低下するようになる。If the proportion of the saponified substance (B) is less than this range, the surface of the molded product will become rough, and the antistatic effect due to the blending of the saponified substance (B) and the resin layer of the hygroscopic neutral metal salt (Y) will be reduced. It is difficult to recognize the retention effect inside the hydrophobic thermoplastic resin (
The original purpose of having A) as the main component is diminished, and the moldability during long-run molding is reduced.
ポリアミド系樹脂(C)は必ずしも用いなくてもよいが
、エチレン−酢酸ビニル共重合体ケン化物(B)の使用
量が上記範囲の中で比較的多い場合に併用すると、ケン
化物(B)の配合によるロングラン成形性の低下が効果
的に防止できる場合がある。ポリアミド系樹脂(C)を
併用する場合、その配合割合は、上記のように多くとも
10重量%とし、エチレン−酢酸ビニル共重合体ケン化
物(B)に対する割合では、等量以下、特に10〜50
重量%とするのが通常である。ポリアミド系樹脂(C)
を10重量%を越えて配合することは、疎水性熱可塑性
樹脂(A)を主成分とする本来の目的が減殺される上、
帯電防止効果の点で不利に作用する。Polyamide resin (C) does not necessarily need to be used, but if used in combination when the amount of saponified ethylene-vinyl acetate copolymer (B) is relatively large within the above range, the saponified product (B) will increase. Deterioration in long run formability due to compounding may be effectively prevented in some cases. When the polyamide resin (C) is used in combination, the blending ratio is at most 10% by weight as mentioned above, and the ratio to the saponified ethylene-vinyl acetate copolymer (B) is equal to or less, especially 10 to 10% by weight. 50
It is usually expressed as % by weight. Polyamide resin (C)
If more than 10% by weight is blended, the original purpose of having the hydrophobic thermoplastic resin (A) as the main component will be diminished, and
This has a disadvantageous effect in terms of antistatic effect.
一吸湿性の中性金属塩(Y)−
吸湿性の中性金属塩(Y)としては、塩化リチウム、臭
化リチウム、ヨウ化リチウム、硝酸リチウム等のリチウ
ム塩;塩化カルシウム、臭化カルシウム、硝酸カルシウ
ム等のカルシウム塩;塩化マグネシウム、臭化マグネシ
ウム等のマグネシウム塩;などがあげられる。Monohygroscopic neutral metal salt (Y) - As the hygroscopic neutral metal salt (Y), lithium salts such as lithium chloride, lithium bromide, lithium iodide, lithium nitrate; calcium chloride, calcium bromide, Examples include calcium salts such as calcium nitrate; magnesium salts such as magnesium chloride and magnesium bromide; and the like.
上述の樹脂組成物(X)100重量部に対する吸湿性の
中性金属塩(Y)の配合量は、0.1〜5重量部、好ま
しくは0.2〜3重量部の範囲から選ばれ、その割合が
0.1重量部未満では帯電防止効果が不足し、一方その
割合が5重量%を越えると成形物の物性低下を招くよう
になる。The amount of the hygroscopic neutral metal salt (Y) based on 100 parts by weight of the above-mentioned resin composition (X) is selected from the range of 0.1 to 5 parts by weight, preferably 0.2 to 3 parts by weight, If the proportion is less than 0.1 part by weight, the antistatic effect will be insufficient, while if the proportion exceeds 5% by weight, the physical properties of the molded product will deteriorate.
−溶融成形−
上述の樹脂組成物(X)および吸湿性の中性金属塩(Y
)からなる本発明の組成物には、必要に応じ、可塑剤(
多価アルコールなど)、安定剤、架橋性物質(エポキシ
化合物、多価金属塩、無機または有機の多塩基酸または
その塩など)、フィラー、染顔料、補強材(ガラス繊維
、炭素繊維など)、滑剤、発泡剤など公知の添加剤を配
合することができる。他の熱可塑性樹脂を配合すること
もできる。また、本発明の趣旨を損なわない範囲であれ
ば、従来用いられている他の帯電防止剤を少量併用する
こともできる。- Melt molding - The above resin composition (X) and the hygroscopic neutral metal salt (Y
) may optionally contain a plasticizer (
(polyhydric alcohol, etc.), stabilizers, crosslinking substances (epoxy compounds, polyvalent metal salts, inorganic or organic polybasic acids or their salts, etc.), fillers, dyes and pigments, reinforcing materials (glass fiber, carbon fiber, etc.), Known additives such as lubricants and foaming agents can be blended. Other thermoplastic resins can also be blended. In addition, a small amount of other conventionally used antistatic agents can be used in combination without impairing the spirit of the present invention.
溶融成形法としては、射出成形法のほか、押出成形法(
ペレット化のための押出成形、押出コートを含む)、ブ
ロー成形法なども採用できる。Melt molding methods include injection molding and extrusion molding (
Extrusion molding for pelletization (including extrusion coating), blow molding, etc. can also be adopted.
溶融成形温度は各樹脂の種類によっても異なるが、射出
成形法の場合は、主成分の疎水性熱可塑性樹脂(A)の
成形温度を採用することになる。Although the melt molding temperature varies depending on the type of each resin, in the case of injection molding, the molding temperature of the main component hydrophobic thermoplastic resin (A) is adopted.
押出成形法を採用する場合は、本発明の樹脂組成物を他
の熱可塑性樹脂と共押出成形することもできる。When extrusion molding is employed, the resin composition of the present invention can also be coextruded with other thermoplastic resins.
本発明の樹脂組成物から得られる成形物は、機械器具部
品、電気・電子機器部品、自動車拳船舶・航空機部品、
光学・時計部品をはじめ種々の用途に有用である。Molded products obtained from the resin composition of the present invention include mechanical appliance parts, electric/electronic equipment parts, automobile parts, ship/aircraft parts,
It is useful for a variety of applications including optical and watch parts.
作 用
本発明において、疎水性熱可塑性樹脂(A)は樹脂組成
物(X)の主成分を構成する。Function In the present invention, the hydrophobic thermoplastic resin (A) constitutes the main component of the resin composition (X).
低灰分・低アルカリ金属含量のエチレン−酢酸ビニル共
重合体ケン化物(B)および吸湿性の中性金属塩(Y)
は、両者共に上記疎水性熱可塑性樹脂(A)単独の場合
の帯電性を防止する作用を示す、この場合、ケン化物(
B)は中性金属塩(Y)の成形物表面からの脱離を阻止
する役割も果たすので、成形物の帯電防止効果は長期に
わたり持続することになる。Saponified ethylene-vinyl acetate copolymer with low ash and low alkali metal content (B) and hygroscopic neutral metal salt (Y)
In this case, the saponified material (
Since B) also plays the role of preventing the neutral metal salt (Y) from detaching from the surface of the molded product, the antistatic effect of the molded product will last for a long time.
末端封鎖ポリアミド系樹脂(C)は、上記疎水性熱可塑
性樹脂(A)に低灰分・低アルカリ金属含量のエチレン
−酢酸ビニル共重合体ケン化物(B)を配合したときの
ロングラン成形性を確保する役割を果たす。The end-capped polyamide resin (C) ensures long-run moldability when the hydrophobic thermoplastic resin (A) is blended with a saponified ethylene-vinyl acetate copolymer (B) having a low ash content and low alkali metal content. play a role.
実施例
次に実施例をあげて本発明の熱可塑性樹脂組成物をさら
に説明する。以下「部」、1%」とあるのは、特に断わ
りのない限り、重量基準で表わしたものである。EXAMPLES Next, the thermoplastic resin composition of the present invention will be further explained with reference to Examples. Hereinafter, "part" and "1%" are expressed on a weight basis unless otherwise specified.
[使用樹脂]
樹脂組成物(X)を構成する樹脂として、次の樹脂を準
備した。[Resin used] The following resin was prepared as a resin constituting the resin composition (X).
0#I A
(A−1)ポリブチレンテレフタレート(三菱化成工業
株式会社製「ノバドゥール501“0J)(A−2)ポ
リエチレンテレフタレート(日本二二ペット株式会社製
rRT533J )
(A−3)ポリカーボネート(三菱化成工業株式会社製
rツバレックス7025AJ、融点250℃)
(A−4)変性ポリフェニレンオキサイド(エンジニア
リング プラスチック株式会社製「ノリル731J)
(A−5)ABS樹脂(三菱モンサント化成株式会社製
r タフ レ−/ ’) スT F X −610]
)(A−8)ポリプロピレン(三菱化成工業株式会社製
「ツバチック−P4100YJ)
(B−1)
エチレン含量40モル%のエチレン−酢酸ビニル共重合
体の40%メタノール溶液1000部を耐圧反応器に仕
込み、攪拌しながら110℃に加熱した。続いて、水酸
化ナトリウムの6%メタノール溶液40部およびメタノ
ール2500部を連続的に仕込むと共に、副生ずる酢酸
メチルおよび余分のメタノールを系から留出させながら
2.5時間ケン化反応を行い、酢酸ビニル部分のケン化
度99.0%のエチレン−酢酸ビニル共重合体ケン化物
を得た。0#I A (A-1) Polybutylene terephthalate (manufactured by Mitsubishi Chemical Industries, Ltd. "NOVADUR 501" 0J) (A-2) Polyethylene terephthalate (manufactured by Nihon Nini Pet Co., Ltd. rRT533J) (A-3) Polycarbonate (manufactured by Mitsubishi Chemical Corporation, rRT533J) (Tubalex 7025AJ, manufactured by Kasei Kogyo Co., Ltd., melting point 250°C) (A-4) Modified polyphenylene oxide (Noryl 731J, manufactured by Engineering Plastics Co., Ltd.) (A-5) ABS resin (Tuffley, manufactured by Mitsubishi Monsanto Chemical Co., Ltd.) / ') S T F X -610]
) (A-8) Polypropylene (Tubatic-P4100YJ manufactured by Mitsubishi Chemical Industries, Ltd.) (B-1) 1000 parts of a 40% methanol solution of ethylene-vinyl acetate copolymer with an ethylene content of 40 mol% was charged into a pressure-resistant reactor. , and heated to 110° C. with stirring.Next, 40 parts of a 6% methanol solution of sodium hydroxide and 2,500 parts of methanol were continuously charged, and while methyl acetate as a by-product and excess methanol were distilled out of the system, The saponification reaction was carried out for .5 hours to obtain a saponified ethylene-vinyl acetate copolymer with a degree of saponification of the vinyl acetate portion of 99.0%.
ケン化終了液に30%含水メタノールを450部仕込み
ながら余分のメタノールを留出させ、樹脂分濃度39%
の水/メタノール(組成比3/7)溶液となした。While adding 450 parts of 30% water-containing methanol to the saponified liquid, excess methanol was distilled off, resulting in a resin concentration of 39%.
A water/methanol (composition ratio 3/7) solution was prepared.
液温を50℃にした前記のエチレン−酢酸ビニル共重合
体ケン化物の水/メタノール混合液を孔径4層層のノズ
ルより 1.5Jl /hrの速度にて5℃に維持され
た水/メタノール(混合比9/1)a固液槽(巾100
+*會、長さ4000mm、深さ100mm)にストラ
ンド状に押出した。凝固終了後、凝固液槽の端部に付設
された引取りローラー(線速2m/脂in)を経て、ス
トランド状物をカッツタ−で切断し、直径4mm、長さ
4■の白色、多孔質のペレットを得た。The water/methanol mixture of the saponified ethylene-vinyl acetate copolymer at a liquid temperature of 50°C was passed through a nozzle with a four-layer pore size at a rate of 1.5 Jl/hr to water/methanol maintained at 5°C. (Mixing ratio 9/1) a solid-liquid tank (width 100
It was extruded into a strand shape with a length of 4000 mm and a depth of 100 mm. After coagulation, the strand-like material is cut with a cutter through a take-up roller (linear speed 2 m/in) attached to the end of the coagulation liquid tank, and a white, porous material with a diameter of 4 mm and a length of 4 mm is cut. pellets were obtained.
このエチレン−酢酸ビニル共重合体ケン化物ペレットの
灰分含量は7400ppm、ナトリウム金属含量は48
00 ppmであった。The ash content of this saponified ethylene-vinyl acetate copolymer pellet is 7,400 ppm, and the sodium metal content is 48
00 ppm.
次に該ペレット100部を0.3%酢酸水溶液300部
に浸漬し、30℃で1時間攪拌するという洗浄操作(弱
酸洗浄)を2回繰返した。ついで、スラリーをろ別した
後、得られたペレットを再度水300部と混合してスラ
リー化し、30°Cで1時間攪拌するという洗浄操作(
水洗)を3回繰返した。Next, a washing operation (weak acid washing) in which 100 parts of the pellets were immersed in 300 parts of a 0.3% acetic acid aqueous solution and stirred at 30° C. for 1 hour was repeated twice. Next, after filtering the slurry, the obtained pellets were mixed with 300 parts of water again to form a slurry, and the washing operation was performed by stirring at 30°C for 1 hour (
Washing with water) was repeated three times.
上記洗浄操作後のエチレン−酢酸ビニル共重合体ケン化
物ペレットの灰分は6pp+i、ナトリウム金属含量は
2.79p膳であった。The ash content of the saponified ethylene-vinyl acetate copolymer pellets after the above washing operation was 6 pp+i, and the sodium metal content was 2.79 ppm.
このエチレン−酢酸ビニル共重合体ケン化物を(B−1
)とする。This saponified ethylene-vinyl acetate copolymer (B-1
).
(B −2)
また上記水洗に先立ち1弱酸洗浄後のペレットをさらに
0.003%リン酸水溶液230部に浸漬して30℃で
1時間攪拌するという洗浄操作(強酸洗浄)を1回行い
、ついで(B−1)製造の場合と同様の水洗操作を3回
繰返した。(B-2) In addition, prior to the above water washing, a washing operation (strong acid washing) was performed once in which the pellets after the weak acid washing were further immersed in 230 parts of a 0.003% phosphoric acid aqueous solution and stirred at 30 ° C. for 1 hour. Then, the same water washing operation as in the case of production (B-1) was repeated three times.
得られたエチレン−酢酸ビニル共重合体ケン化物ペレッ
トの灰分は10pp腸、ナトリウム金属含量は 1.4
pp■であった。The ash content of the obtained saponified ethylene-vinyl acetate copolymer pellets was 10 pp, and the sodium metal content was 1.4.
It was pp■.
このエチレン−酢酸ビニル共1重合体ケン化物を(B−
2)とする。This ethylene-vinyl acetate monopolymer saponified product (B-
2).
(B −3)
比較のため、灰分30 ppm 、ナトリウム金属含量
は10ppmのエチレン−酢酸ビニル共重合体ケン化物
ペレットを上記(B−1)の製造方法に準じて(ただし
洗浄回数を減じて)製造した。(B-3) For comparison, saponified ethylene-vinyl acetate copolymer pellets with an ash content of 30 ppm and a sodium metal content of 10 ppm were prepared according to the manufacturing method of (B-1) above (however, the number of washings was reduced). Manufactured.
このエチレン−酢酸ビニル共重合体ケン化物を(B−3
)とする。This saponified ethylene-vinyl acetate copolymer (B-3
).
なお、灰分およびナトリウム金属の定量は以下に従った
。In addition, the ash content and sodium metal were determined in accordance with the following.
〈灰分〉
乾燥した試料約80gを精秤し、そのうちの約10gを
恒量化した白金蒸発皿に入れ、電熱器で炭化した。炭化
後、さらに試料約10gずつを追加し、同様の操作を繰
返した。最後にガスバーナーで加熱し、煙が出なくなる
まで焼いた。<Ash content> Approximately 80 g of the dried sample was accurately weighed, and approximately 10 g of it was placed in a platinum evaporation dish with constant weight, and carbonized with an electric heater. After carbonization, approximately 10 g of each sample was added and the same operation was repeated. Finally, I heated it with a gas burner and baked it until there was no smoke.
約400℃の電気炉内に前記の白金蒸発皿を入れ、磁性
ルツボ蓋で大半を覆い、700℃まで徐々に昇温した。The platinum evaporation dish was placed in an electric furnace at about 400°C, most of it covered with a magnetic crucible lid, and the temperature was gradually raised to 700°C.
700℃に3時間保持して完全に灰化させた後、電気炉
から取出し、5分間放冷後、デシケータ−中で25分間
放置し、灰分を精秤した。After being held at 700°C for 3 hours to completely incinerate, it was taken out from the electric furnace, allowed to cool for 5 minutes, and then left in a desiccator for 25 minutes, and the ash content was accurately weighed.
〈ナトリウム金属〉
乾燥した試料約10gを精秤して白金ルツボに入れ、上
記と同一の方法で灰化した。白金ルッポに特級塩酸21
および純水3mlを入れ、電熱器で加熱して溶解した。<Sodium metal> Approximately 10 g of the dried sample was accurately weighed, placed in a platinum crucible, and incinerated in the same manner as above. Special grade hydrochloric acid 21 for Platinum Luppo
Then, 3 ml of pure water was added and heated with an electric heater to dissolve.
上記溶液を50m1メスフラスコに純水で流し込み、ざ
らに標線まで純水を追加して原子吸光分析用の試料とし
た。The above solution was poured into a 50 ml volumetric flask with pure water, and pure water was added roughly up to the marked line to prepare a sample for atomic absorption spectrometry.
別途調製した標準液(ナトリウム金属tpp腸、塩酸的
0.5N)を対照液として原子吸光度の測定を行い、吸
光度の比率からナトリウム金属の量を定量した。測定条
件は次の通りである。Atomic absorbance was measured using a separately prepared standard solution (sodium metal TPP, 0.5N hydrochloric acid) as a control solution, and the amount of sodium metal was determined from the absorbance ratio. The measurement conditions are as follows.
装 置:日立180−30形原子吸光/炎光分光光度
計
波 長 : 589.0 nm
フレーム:アセチレン−空気
−去 ポリアミド、 C
(C−1)
200文のオートクレーブに叱−カプロラクタム6Qk
g、水1.2kg、オクタデシルアミン3.33meq
/so Iおよびステアリン酸3.39seq/mol
を仕込み、窒素雰囲気にして密閉して250℃に昇温し
、攪拌下2時間加圧下に反応を行った後、徐々に放圧し
て200 Torrまで減圧し、2時間減圧下に反応を
行った。Equipment: Hitachi Model 180-30 Atomic Absorption/Flame Spectrophotometer Wavelength: 589.0 nm Flame: Acetylene-air-vacuum polyamide, C (C-1) 200-liter autoclave-caprolactam 6Qk
g, water 1.2kg, octadecylamine 3.33meq
/so I and stearic acid 3.39 seq/mol
The reactor was sealed in a nitrogen atmosphere, heated to 250°C, and reacted under pressure with stirring for 2 hours.Then, the pressure was gradually released to 200 Torr, and the reaction was carried out under reduced pressure for 2 hours. .
次に窒素を導入して常圧に復圧後、攪拌を止めてストラ
ンドとして抜き出してチップ化し、清水を用いて未反応
上ツマ−を抽出除去して乾燥した。Next, after nitrogen was introduced and the pressure was restored to normal pressure, stirring was stopped and strands were taken out and made into chips. Unreacted upper particles were extracted and removed using clean water and dried.
得られたポリアミド系樹脂(C−1)の特性値は次の通
りであった。The characteristic values of the obtained polyamide resin (C-1) were as follows.
末端カルボキシル基:20ILeq/8@ポリマー末端
アミノ基: 21 geq/g・ポリマー10
0・82/ (Nl+N2) : 60相対粘度[η
rell : 2.89(C−2)
オクタデシルアミンの仕込み量を8.81腸eq/鵬O
1とし、ステアリン酸3.3θ■eq/朧o1に代えて
アジピン酸を8.81meq/molを用いたほかは(
C−1)製造の場合と同様にして下記の特性値を有する
ポリアミド系樹脂(C−2)を得た。Terminal carboxyl group: 20 ILeq/8 @ polymer terminal amino group: 21 geq/g, polymer 10
0.82/ (Nl+N2): 60 relative viscosity [η
rell: 2.89 (C-2) The amount of octadecylamine charged was 8.81 eq/PengO.
1, except that 8.81 meq/mol of adipic acid was used instead of stearic acid 3.3θ■eq/Oboro 1 (
A polyamide resin (C-2) having the following characteristic values was obtained in the same manner as in the case of C-1) production.
末端カルボキシル基: 20ILeq/g・ポリマー
末端アミノ基: 21 棒eq/g・ポリマー
100・N2/ (N1+N2) : 80相対粘度
[77rell : 2.50(C−3)
オクタデシルアミンの仕込み量を8.78薦eq/脂0
1とし、ステアリン酸の仕込みを省略し、また重合反応
終期の圧力を180Torrとした(C−1)製造の場
合と同様にして下記の特性値を有するポリアミド系樹脂
(C−3)を得た。Terminal carboxyl group: 20 ILeq/g Polymer terminal amino group: 21 Rod eq/g Polymer 100 N2/ (N1+N2): 80 Relative viscosity [77rell: 2.50 (C-3) The amount of octadecylamine charged was 8. 78 recommended eq/fat 0
1, the charging of stearic acid was omitted, and the pressure at the end of the polymerization reaction was 180 Torr.A polyamide resin (C-3) having the following characteristic values was obtained in the same manner as in the production of (C-1). .
末端カルボキシル基: 9JLeq/g・ポリマー
末端アミ7基: 68peq/g・ポリマー1
00・N2/ (N1+N2) : 87相対粘度[η
rell : 2.40[配合組成]
樹脂組成物(X)を構成する樹脂成分(A)、(B)お
よび(C)は、ペレットまたはチップを使用し、タンブ
ラ−を用いて下記の割合で予備混合した。その際、塩化
リチウム(Y−1) 1.0部を水 1.0部に溶解し
た状態で添加後、100℃で5時間乾燥した。ただし、
実施例7、比較例14、実施例8、比較例17、実施例
9および比較例20については、塩化リチウム(Y−1
) 2.0部を水2.0部に溶解した状態で添加後、1
00℃で5時間乾燥した。Terminal carboxyl group: 9 JLeq/g, polymer terminal amine 7 groups: 68 peq/g, polymer 1
00・N2/ (N1+N2): 87 Relative viscosity [η
rell: 2.40 [Composition] The resin components (A), (B) and (C) constituting the resin composition (X) are prepared in advance in the following ratio using a tumbler using pellets or chips. Mixed. At that time, 1.0 part of lithium chloride (Y-1) dissolved in 1.0 part of water was added, and then dried at 100°C for 5 hours. however,
For Example 7, Comparative Example 14, Example 8, Comparative Example 17, Example 9, and Comparative Example 20, lithium chloride (Y-1
) After adding 2.0 parts dissolved in 2.0 parts of water, 1
It was dried at 00°C for 5 hours.
(A−1)を用いるもの
実施例I A−1:90部、B−1:10部、C−1
: 2部実施例2 A−1:90部、B−2:10
部、C−2:2部実施例3 A−1:90部、B−2
:10部、C−3:2部比較例I A−1:100部
(ただしく Y−1)無配合)
比較例2 A−1:100部
比較例3 A−1:90部、B−1:10部(ただし
くY−1)無配合)
比較例4 A−1:130部、B−3:10部、C−
1: 2部比較例5 A−1rtoo部、
C−1: 2部実施例4 A−1:135部
、B−2:5部比較例6 A−1:95部、B−3:
5部(ただしくY−1)無配合)
(A−2)を用いるもの
実施例5 A−2:9部部、B−2:10部、C−1
: 3部比較例7 A−2:100部
(ただしくY−1)無配合)
比較例8 A−2:100部
比較例9 A−2:90部、B−2:10部(ただし
く Y−1)無配合)
(A−3)を用いるもの
実施例6 A−3:90部、B−2:10部、C−2
:2部比較例10 A−3:100部
(ただしくY−1)無配合)
比較例11 A−3:100部
比較例12 A−3:90部、B−2:10部(ただ
しくY−1)無配合)
(A−0を用いるもの
実施例7 A−4:90部、B−2:10部比較例1
3 A−4:100部
(ただしくY−1)l配合)
比較例14 A−4:100部
比較例15 A−4:90部、B−2:10部(ただ
しくY−1)無配合)
(A−5)を用いるもの
実施例8 A−5:98部、B−2:4部比較例18
A−5:100部
(ただしくY−1)無配合)
比較例17 A−5:100部
比較例18 A−5:9部部、B−2+4部(ただし
くy−t)無配合)
(A−6)を用いるもの
実施例9 A−8:9Et部、B−2:4部比較例1
9 A−8:100部
(ただしくY−1)無配合)
比較例2OA−8:100部
比較例21 A−8:98部、B−2: 4部(た
だしくy−t)無配合)
また、実施例2の処方において、塩化リチウム(Y−1
) 1.0部に代えて次の吸湿性の中性金属塩(Y)0
.5部を用いた。Using (A-1) Example I A-1: 90 parts, B-1: 10 parts, C-1
: 2 parts Example 2 A-1: 90 parts, B-2: 10
Part, C-2: 2 parts Example 3 A-1: 90 parts, B-2
: 10 parts, C-3: 2 parts Comparative Example I A-1: 100 parts (without Y-1) Comparative Example 2 A-1: 100 parts Comparative Example 3 A-1: 90 parts, B-1 Comparative Example 4 A-1: 130 parts, B-3: 10 parts, C-
1: 2 parts Comparative Example 5 A-1rtoo part,
C-1: 2 parts Example 4 A-1: 135 parts, B-2: 5 parts Comparative example 6 A-1: 95 parts, B-3:
Example 5 using (A-2) A-2: 9 parts, B-2: 10 parts, C-1
: 3 parts Comparative Example 7 A-2: 100 parts (without Y-1) Comparative Example 8 A-2: 100 parts Comparative Example 9 A-2: 90 parts, B-2: 10 parts (without Y-1) 1) Non-blended) (A-3) Example 6 A-3: 90 parts, B-2: 10 parts, C-2
: 2 parts Comparative Example 10 A-3: 100 parts (without Y-1) Comparative Example 11 A-3: 100 parts Comparative Example 12 A-3: 90 parts, B-2: 10 parts (without Y-1) 1) No formulation) (Using A-0 Example 7 A-4: 90 parts, B-2: 10 parts Comparative Example 1
3 A-4: 100 parts (with Y-1) Comparative Example 14 A-4: 100 parts Comparative Example 15 A-4: 90 parts, B-2: 10 parts (without Y-1) Using (A-5) Example 8 A-5: 98 parts, B-2: 4 parts Comparative Example 18
Comparative Example 17 A-5: 100 parts Comparative Example 18 A-5: 9 parts, B-2+4 parts (Y-t) not added) (A -6) Example 9 A-8: 9 Et parts, B-2: 4 parts Comparative Example 1
9 A-8: 100 parts (just Y-1 not added) Comparative Example 2 OA-8: 100 parts Comparative Example 21 A-8: 98 parts, B-2: 4 parts (just Y-t not added) , in the formulation of Example 2, lithium chloride (Y-1
) In place of 1.0 part, add the following hygroscopic neutral metal salt (Y)0
.. 5 parts were used.
実施例1O塩化カルシウム(Y −2)実施例11
硝酸リチウム(Y −3)実施例12 硝酸カルシウ
ム(Y −4)[溶融成形条件]
〈ペレット化〉
上記配合の樹脂組成物につき、ダルメージ付スクリュー
(スクリュー径40m層)を装備した一軸押出成形機を
用い、下記の押出温度で押出成形を行うと共に、ペレタ
イザーによりペレット化した。Example 1O Calcium chloride (Y-2) Example 11
Lithium nitrate (Y-3) Example 12 Calcium nitrate (Y-4) [Melt molding conditions] <Pelletization> For the resin composition of the above formulation, a uniaxial extrusion molding machine equipped with a screw with dullage (screw diameter 40 m layer) Extrusion molding was carried out using the following extrusion temperature using a pelletizer, and pelletization was performed using a pelletizer.
(A−1)を用いた場合 240℃
(A−2)を用いた場合 270℃
(A−3)を用いた場合 290℃
(A−4)を用いた場合 280℃
(A−5)を用いた場合 230℃
(A−8)を用いた場合 230℃
〈射出成形〉
上記で得たペレットを用いて、5オンス級インラインス
クリュータイプ射出成形機により下記の温度条件で射出
成形を行い、厚さ3.2mm、直径100■層の円板状
のサンプル片を得た。射出圧力は9 (1’−1200
kg/・・2、射出時間は8秒、金型温度は50℃、冷
却時間は20秒に設定した。When using (A-1) When using 240℃ (A-2) When using 270℃ (A-3) When using 290℃ (A-4) When using 280℃ (A-5) When using 230℃ (A-8) When using 230℃ <Injection molding> Using the pellets obtained above, injection molding was performed using a 5-ounce class in-line screw type injection molding machine under the following temperature conditions. A disk-shaped sample piece with a length of 3.2 mm and a diameter of 100 square layers was obtained. The injection pressure is 9 (1'-1200
kg/...2, injection time was set to 8 seconds, mold temperature was set to 50° C., and cooling time was set to 20 seconds.
(A−1)を用いた場合 220/ 240/ 240
℃(A−2)を用いた場合 250/ 270/ 27
0℃(A−3)を用いた場合 280/ 290/ 2
90℃(A−4)を用いた場合 280/ 290/
290℃(A−5)を用いた場合 220/ 240/
240℃(A−6)を用いた場合 220/ 240
/ 240℃(数値は、左から順に、シリンダー後部温
度(C1)/シリンダー前部温度(C2) /ノズル温
度)[試験・判定項目]
(項目l)射出成形品の表面抵抗
4時間連続射出成形後のサンプル片の外観を観察すると
共に、そのサンプル片の成形後20℃、65%RHの条
件に1日放置後および2週間放置後の表面抵抗を測定し
た。When using (A-1) 220/ 240/ 240
When using °C (A-2) 250/ 270/ 27
When using 0℃ (A-3) 280/290/2
When using 90℃ (A-4) 280/ 290/
When using 290℃ (A-5) 220/ 240/
When using 240℃ (A-6) 220/240
/ 240℃ (The numerical values are, from left to right, cylinder rear temperature (C1) / cylinder front temperature (C2) / nozzle temperature) [Test/judgment items] (Item l) Surface resistance of injection molded product 4 hours continuous injection molding The appearance of the sample piece after molding was observed, and the surface resistance of the sample piece was measured after being left at 20° C. and 65% RH for one day and two weeks after molding.
表面抵抗の測定は、JIS規格、熱硬化性プラスチック
一般試験法の中の表面抵抗試験法に準拠した。The surface resistance was measured in accordance with the surface resistance test method in the JIS standard, general test methods for thermosetting plastics.
[結果]
結果を第1表に示す、なお、表中の外観判定は次の基準
による。[Results] The results are shown in Table 1. The appearance judgment in the table is based on the following criteria.
0:良好 Δ:分解による樹脂の黄変が認められる。0: Good Δ: Yellowing of the resin due to decomposition is observed.
×:表面にざらつきが認められる。×: Roughness is observed on the surface.
第 1 表
実施例13
低灰分・低アルカリ金属含量のエチレン−酢酸ビニル共
重合体ケン化物(B)として、灰分8ppm 、ナトリ
ウム金属含量2.9ppm、エチレン含量30モル%、
酢酸ビニル部分のケン化度39.0%のエチレン−酢酸
ビニル共重合体ケン化物(B−4)を用いたほかは実施
例1に準じて実験を行った。ただし、(A−4) /
(B−4) / (Y−1)の配合割合は95部75部
71.0部とした。Table 1 Example 13 As saponified ethylene-vinyl acetate copolymer (B) with low ash and low alkali metal content, ash content is 8 ppm, sodium metal content is 2.9 ppm, ethylene content is 30 mol%,
An experiment was carried out according to Example 1 except that a saponified ethylene-vinyl acetate copolymer (B-4) having a degree of saponification of the vinyl acetate portion of 39.0% was used. However, (A-4) /
The blending ratio of (B-4)/(Y-1) was 95 parts, 75 parts, and 71.0 parts.
外観判定はOであり、表面抵抗は1日放置後−r: 2
.oxto”n、2 週間数1j tte テ1 、O
X toI3fL−t’ アラた。The appearance judgment is O, and the surface resistance is -r: 2 after being left for one day.
.. oxto"n, 2 weeks number 1j tte te 1, O
X toI3fL-t' Arata.
発明の効果
本発明の熱可塑性樹脂組成物を用いて溶融成形して得ら
れた成形物は、すぐれた帯電防止性を示し、その帯電防
止効果は低湿時においても発揮される。しかも、吸湿性
の中性金属塩(Y)を配合しているにもかかわらずそれ
が成形物表面からほとんど脱離しないので、長期にわた
って帯電防止効果が持続する。Effects of the Invention A molded article obtained by melt molding using the thermoplastic resin composition of the present invention exhibits excellent antistatic properties, and the antistatic effect is exhibited even at low humidity. Moreover, even though the hygroscopic neutral metal salt (Y) is blended, it is hardly detached from the surface of the molded product, so the antistatic effect is maintained for a long period of time.
加えて、帯電防止性樹脂またti帯電防止剤としての低
灰分−低アルカリ金属含量のエチレン−酢酸ビニル共重
合体ケン化物(B)および吸湿性の中性金属塩(Y)の
配合によっても、ロングラン成形性は確保されると共に
、得られる成形物の外観も損なわれない。In addition, by blending a saponified ethylene-vinyl acetate copolymer (B) with a low ash content and a low alkali metal content as an antistatic resin or a Ti antistatic agent and a hygroscopic neutral metal salt (Y), Long-run moldability is ensured, and the appearance of the resulting molded product is not impaired.
Claims (1)
0〜60モル%、酢酸ビニル部分のケン化度が95モル
%以上であり、かつ灰分含量が20ppm以下で、アル
カリ金属含量が5ppm以下の低灰分・低アルカリ金属
のエチレン−酢酸ビニル共重合体ケン化物(B)を必須
成分とし、末端カルボキシル基−COOHの数Nlと末
端カルボン酸アミド基−CONRR′(ただしRは炭素
数1〜22の炭化水素基、R′は水素原子または炭素数
1〜22の炭化水素基)の数N2との比が100・N2
/(N1+N2)≧5 を満足する末端封鎖ポリアミド系樹脂(C)を任意成分
とする樹脂組成物(X)100重量部に、吸湿性の中性
金属塩(Y)0.1〜5重量部を配合してなる帯電防止
性の良好な熱可塑性樹脂組成物。 2、樹脂組成物(X)が、疎水性熱可塑性樹脂(A)9
9〜80重量%、低灰分・低アルカリ金属のエチレン−
酢酸ビニル共重合体ケン化物(B)1〜20重量%およ
び末端封鎖ポリアミド系樹脂(C)0〜10重量%から
なることを特徴とする特許請求の範囲第1項記載の熱可
塑性樹脂組成物。[Claims] 1. Hydrophobic thermoplastic resin (A) and ethylene content is 2.
A low ash/low alkali metal ethylene-vinyl acetate copolymer with a saponification degree of 0 to 60 mol%, a saponification degree of the vinyl acetate portion of 95 mol% or more, an ash content of 20 ppm or less, and an alkali metal content of 5 ppm or less. The saponified product (B) is an essential component, the number Nl of terminal carboxyl groups -COOH and the terminal carboxylic acid amide group -CONRR' (where R is a hydrocarbon group having 1 to 22 carbon atoms, R' is a hydrogen atom or a carbon number 1) ~22 hydrocarbon groups) to the number N2 is 100・N2
/(N1+N2)≧5 0.1 to 5 parts by weight of a hygroscopic neutral metal salt (Y) to 100 parts by weight of a resin composition (X) containing as an optional component an end-blocked polyamide resin (C) satisfying the following. A thermoplastic resin composition with good antistatic properties. 2. The resin composition (X) is a hydrophobic thermoplastic resin (A) 9
9-80% by weight, low ash, low alkali metal ethylene
Thermoplastic resin composition according to claim 1, characterized in that it consists of 1 to 20% by weight of saponified vinyl acetate copolymer (B) and 0 to 10% by weight of end-blocked polyamide resin (C). .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13952887A JPS63304060A (en) | 1987-06-03 | 1987-06-03 | Thermoplastic polymer composition having excellent antistaticity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13952887A JPS63304060A (en) | 1987-06-03 | 1987-06-03 | Thermoplastic polymer composition having excellent antistaticity |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63304060A true JPS63304060A (en) | 1988-12-12 |
Family
ID=15247384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13952887A Pending JPS63304060A (en) | 1987-06-03 | 1987-06-03 | Thermoplastic polymer composition having excellent antistaticity |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63304060A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03188158A (en) * | 1989-10-20 | 1991-08-16 | General Electric Co <Ge> | Antistatic polyphenylene ether resin composition and method for imparting antistatic property |
WO2017047806A1 (en) * | 2015-09-18 | 2017-03-23 | 株式会社クラレ | Resin composition, production method therefor, and multilayer structure |
US10611894B2 (en) * | 2015-04-07 | 2020-04-07 | Mitsubishi Chemical Corporation | Resin composition and multilayer structure using same, and method of improving long-run stability |
-
1987
- 1987-06-03 JP JP13952887A patent/JPS63304060A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03188158A (en) * | 1989-10-20 | 1991-08-16 | General Electric Co <Ge> | Antistatic polyphenylene ether resin composition and method for imparting antistatic property |
US10611894B2 (en) * | 2015-04-07 | 2020-04-07 | Mitsubishi Chemical Corporation | Resin composition and multilayer structure using same, and method of improving long-run stability |
WO2017047806A1 (en) * | 2015-09-18 | 2017-03-23 | 株式会社クラレ | Resin composition, production method therefor, and multilayer structure |
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