JPS63265418A - Chip-shaped solid-state electrolytic capacitor with fuse and manufacture thereof - Google Patents
Chip-shaped solid-state electrolytic capacitor with fuse and manufacture thereofInfo
- Publication number
- JPS63265418A JPS63265418A JP26082287A JP26082287A JPS63265418A JP S63265418 A JPS63265418 A JP S63265418A JP 26082287 A JP26082287 A JP 26082287A JP 26082287 A JP26082287 A JP 26082287A JP S63265418 A JPS63265418 A JP S63265418A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- external electrode
- lead terminal
- fuse
- anode lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000013013 elastic material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 229920002050 silicone resin Polymers 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000007664 blowing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はヒユーズ付きチップ状固体電解コンデンサおよ
びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-shaped solid electrolytic capacitor with a fuse and a method for manufacturing the same.
従来、この種の固体電解コンデンサは一般的に種々の電
子回路に使用されており、故障率が小さいことが利点と
されているが、一旦故障が発生した場合の故障モードと
しては短絡故障が多いため、大きな短絡電流が流れてコ
ンデンサが発熱し、遂には焼損に至ることがある。この
過度の短絡電流による故障発生の際には、回路構成素子
を保護するため故障モードを短絡から開放にすることが
必要で、一般にヒユーズが用いられている。Conventionally, this type of solid electrolytic capacitor has been generally used in various electronic circuits, and its advantage is that it has a low failure rate, but once a failure occurs, the failure mode is often short-circuit failure. As a result, a large short-circuit current flows and the capacitor generates heat, which may eventually lead to burnout. When a failure occurs due to this excessive short-circuit current, it is necessary to change the failure mode from short-circuit to open circuit in order to protect the circuit components, and fuses are generally used.
第５図、第６図は、それぞれ従来の固体電解コンデンサ
の斜視図および断面図である。陰極ａ３と陽極リード２
からなるコンデンサ素子ｌの陽極リード２に陽極リード
端子４が接続され、陰極層３と陰極リード端子５は絶縁
性接着剤２１を介して接着され、ヒユーズ６をはんだ２
０により橋絡接続させ、さらにヒユーズ６は弾性樹脂７
により被覆され、全体が樹脂９により外装されることに
よりヒユーズ付きチップ状固体電解コンデンサが構成さ
れている。FIG. 5 and FIG. 6 are a perspective view and a sectional view, respectively, of a conventional solid electrolytic capacitor. Cathode a3 and anode lead 2
An anode lead terminal 4 is connected to an anode lead 2 of a capacitor element l, the cathode layer 3 and the cathode lead terminal 5 are bonded via an insulating adhesive 21, and a fuse 6 is connected to a solder 2.
0, and the fuse 6 is made of elastic resin 7.
A chip-shaped solid electrolytic capacitor with a fuse is constructed by covering the whole with resin 9.
上述した従来のヒユーズ付きチップ状固体電解コンデン
サは、陰極層と陰極リード端子がヒユーズにより電気的
に接続されているので、以下のような欠点がある。The conventional fuse-equipped chip solid electrolytic capacitor described above has the following drawbacks because the cathode layer and the cathode lead terminal are electrically connected by the fuse.
（１） ヒユーズとコンデンサ素子が近接しており、
過電流が流れたときにヒユーズが発熱し、この熱によっ
て間接的には陰極層のはんだが溶け、熱膨張して外装樹
脂を破壊し、その破面よりはんだが吹き出して他の配線
回路を短絡させて二次災害を引き起したり、また、直接
的にはコンデンサ素子の焼損を発生させ、さらに回路全
体に甚大な災害を及ぼすことがある。(1) The fuse and capacitor element are close to each other,
When an overcurrent flows, the fuse generates heat, and this heat indirectly melts the solder on the cathode layer, which expands thermally and breaks the exterior resin, causing solder to blow out from the broken surface and short-circuit other wiring circuits. This may cause secondary damage, or directly cause burnout of the capacitor element, and may even cause serious damage to the entire circuit.
（２）ヒユーズの接続に際しては、コンデンサ素子の陰
極層と陰極リード端子間の絶縁のため絶縁性樹脂が用い
られているが、この樹脂が硬化する過程で陰極層と陰極
リード端子が短絡する危険性が諷スＩ？′Ｉで−予めｈ
緬賜すか１士す縄り−ｒ嬬子のルくとも一方の絶縁をと
っておく必要があり、また、陰極層の表面はコンデンサ
素子自体の大きさ、形状が必ずしも一定でないことから
、はんだ付けを自動的に行なうことが困難であることな
ど、工程が煩雑となる。(2) When connecting a fuse, insulating resin is used to insulate between the cathode layer of the capacitor element and the cathode lead terminal, but there is a risk of short circuit between the cathode layer and the cathode lead terminal during the curing process of this resin. Is the sex a joke? 'I-in advance h
It is necessary to insulate at least one side of the capacitor, and since the size and shape of the capacitor element itself are not necessarily constant, the surface of the cathode layer cannot be soldered. The process becomes complicated, as it is difficult to attach automatically.
（３）チップ状固体電解コンデンサは、特に小型大容量
化の要求が強く、収容されるコンデンサ素子を大きくし
て外装樹脂の厚さをできるだけ薄くする必要があるが、
陰極層側にヒユーズを接続するためには、接続部および
ヒユーズ自体のスペースの確保、はんだの吹き出し防止
のための外装樹脂の厚さを厚くする必要があること等の
諸要因により、上記の要求に反し容量の体積効率が小さ
くなる。(3) There is a strong demand for chip-shaped solid electrolytic capacitors to be smaller in size and larger in capacity, so it is necessary to make the capacitor element to be accommodated larger and the thickness of the outer resin to be as thin as possible.
In order to connect a fuse to the cathode layer side, the above requirements are met due to various factors such as securing space for the connection part and the fuse itself, and increasing the thickness of the exterior resin to prevent solder from blowing out. On the other hand, the volumetric efficiency of capacity becomes smaller.
本発明のヒユーズ付きチップ状固体電解コンデンサは、
陰極層と陽極リードからなるコンデンサ素子を含み、陰
極層の陽極リードと反対側の面および上面に陰極リード
端子が導電性接着剤により固着され、陽極°リードには
弾性樹脂により被覆されたヒユーズにより接続部と陽極
外部電極部とが接続されてなる陽極リード端子の前記接
続部が固着され、さらに陽極リード端子の陽極外部電極
部と陰極′リード端子の露出部分を除いて樹脂により絶
縁外装されてなる。The chip-shaped solid electrolytic capacitor with a fuse of the present invention is
It includes a capacitor element consisting of a cathode layer and an anode lead, and the cathode lead terminal is fixed to the surface opposite to the anode lead and the top surface of the cathode layer with a conductive adhesive, and the anode lead is connected to a fuse covered with an elastic resin. The connecting portion of the anode lead terminal in which the connecting portion and the anode external electrode portion are connected is fixed, and the anode external electrode portion of the anode lead terminal and the exposed portion of the cathode lead terminal are insulated and covered with resin. Become.
また、本発明のヒユーズ付きチップ状固体電解コンデン
サの製造方法は、一枚の金属板内に陽極リードの接続部
と陽極外部電極部を形成し、陽極リード端子の前記接続
部と陽極外部電極部をヒユーズにて橋絡接続する工程と
、樹脂外装後に外装樹脂外部にて前記陽極リード端子の
接続部と陽極外部電極部をフレームから切り離す工程を
有する。In addition, the method for manufacturing a chip-shaped solid electrolytic capacitor with a fuse according to the present invention includes forming a connecting portion of an anode lead terminal and an anode external electrode portion in one metal plate, and forming the connecting portion of the anode lead terminal and the anode external electrode portion. and a step of separating the connection portion of the anode lead terminal and the anode external electrode portion from the frame outside the resin packaging after the resin packaging.
さらにまた１本発明の別の製造方法は、一枚の金属板内
に所定間隔ごとにフレームから突出させた陽極リードの
接続部と、陽極外部電極部を設けた陽極リード端子を形
成し、さらに、対向するフレームから所定間隔ごとに突
出させた陰極外部電極部を設けた陰極リード端子を形成
し、陽極リード端子の前記接続部と陽極外部電極部をヒ
ユーズにより橋絡接続する工程と、ヒユーズを絶縁性を
有する弾性体で被覆する工程と、樹脂外装後に外装樹脂
外部にて前記陽極リード端子の接続部と外部電極部を切
り離す工程と、前記陽極外部電極部および陰極外部電極
部をそれぞれフレームから切り離す工程を有する。Still another manufacturing method of the present invention is to form anode lead terminals in which connection portions of the anode leads protruding from the frame at predetermined intervals and anode external electrode portions are provided in one metal plate, and , forming a cathode lead terminal having cathode external electrode parts protruding from opposing frames at predetermined intervals, and bridging and connecting the connecting part of the anode lead terminal and the anode external electrode part with a fuse; a step of covering the anode lead terminal with an elastic body having insulating properties, a step of separating the connection part of the anode lead terminal and the external electrode part outside the outer resin after the resin sheathing, and a step of separating the anode external electrode part and the cathode external electrode part from the frame, respectively. It has a step of separating.
したがって、大きな短絡電流が流れても、ヒユーズがコ
ンデンサ素子の陰極層から離れているので、ヒユーズが
発熱して切断するまでの間にコンデンサ素子からのはん
だの吹き出しや焼損事故は発生せず、また陽極リード端
子の接続部と外部電極部は機械的加工にて製作されてお
り、平坦性や寸法の均一性が良好なため、ヒユーズの接
続は自動機械によって可能であり、さらに、陽極リード
端子側は陰極層側に比べてヒユーズの接続スペースが十
分にあり、チップ形状を大きくしたりコンデンサ素子形
状を小さくしたりする必要もなく、容量の体積効率が向
上する。Therefore, even if a large short-circuit current flows, the fuse is separated from the cathode layer of the capacitor element, so there will be no solder blown out or burnout from the capacitor element until the fuse heats up and breaks. The connection part of the anode lead terminal and the external electrode part are manufactured by mechanical processing and have good flatness and uniformity of dimensions, so the fuse can be connected by an automatic machine. Compared to the cathode layer side, the fuse connection space is sufficient, and there is no need to increase the size of the chip or reduce the size of the capacitor element, improving the volumetric efficiency of the capacitance.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明のヒユーズ付きチップ状固体電解コンデ
ンサの一実施例の内部構造を示す一部断面斜視図、第２
図は第１図の断面図である。FIG. 1 is a partially cross-sectional perspective view showing the internal structure of an embodiment of a chip-type solid electrolytic capacitor with a fuse according to the present invention, and FIG.
The figure is a sectional view of FIG. 1.
陰極層３と陽極リード２からなるコンデンサ素子ｌには
、陰極層３の陽極リード２と反対側の面および上面に、
陰極リード端子５が導電性接着剤８により固着され、陽
極リード２には、弾性（シリコン）樹脂７により被覆さ
れたヒユーズ６により接続部４ａと陽極外部電極部４ｂ
とが接続されてなる陽極リード端子４の接続部４ａが溶
接固着され、さらに、陽極リード端子４の陽極外部電極
部４ｂと陰極リード端子５の露出部分を除き外装樹脂９
により絶縁外装されてヒユーズ付きチップ状固体電解コ
ンデンサ１０が構成されている。A capacitor element 1 consisting of a cathode layer 3 and an anode lead 2 has on the surface of the cathode layer 3 opposite to the anode lead 2 and on the top surface,
A cathode lead terminal 5 is fixed with a conductive adhesive 8, and a fuse 6 covered with an elastic (silicon) resin 7 connects a connecting part 4a and an anode external electrode part 4b to the anode lead 2.
The connecting portion 4a of the anode lead terminal 4, which is connected to
A chip-shaped solid electrolytic capacitor 10 with a fuse is constructed by being insulated and packaged.
次に、このヒユーズ付きチップ状固体電解コンデンサ１
０の製造方法について説明する。第３図は陽極リード端
子４の組立前の形状を示したもので、陽極リード２との
接続部４ａと陽極外部電極部４ｂがフレーム１１により
支持されている。陰極リード端子５の段差部の内側に導
電性接着剤８が塗布され、この塗布部に陰極層３の一方
の面と上面が接着され、陽極リード端子４の接続部４ａ
は陽極リード２に溶着固着され、さらに、接続部４ａと
陽極外部電極部４ｂはヒユーズ６のはんだ付けにより橋
絡接続され、その上をシリコン樹脂７により被覆される
。シリコン樹脂７は弾性および絶縁性を有している。こ
のように形成された組立体は、陽極リード端子４の接続
部４ａおよび陽極外部電極部４ｂと、陰極リード端子５
のそれぞれの露出部を残して外装樹脂９によりトランス
ファモールド手段により絶縁外装された後、接続部４ａ
の露出部のＡ−ＡおよびＣ−Ｃ線と陽極外部電極部４ｂ
の露出部のＢ−Ｂ線よりフレーム１１何が切落され、さ
らに陽極リード端子４の陽極外部電極部４ｂと陰極リー
ド端子５が外装樹脂９の外壁に沿って折曲げられ、ヒユ
ーズ付きチップ状固体電解コンデンサ１０が形成される
０本実施例では外装樹脂９としてエポキシ樹脂を用いた
。Next, this chip solid electrolytic capacitor with fuse 1
The manufacturing method of 0 will be explained. FIG. 3 shows the shape of the anode lead terminal 4 before assembly, in which the connection portion 4a with the anode lead 2 and the anode external electrode portion 4b are supported by the frame 11. A conductive adhesive 8 is applied to the inside of the stepped portion of the cathode lead terminal 5, one surface and the top surface of the cathode layer 3 are adhered to this applied portion, and the connection portion 4a of the anode lead terminal 4 is
is welded and fixed to the anode lead 2, and the connecting portion 4a and the anode external electrode portion 4b are bridge-connected by soldering a fuse 6, and the top thereof is covered with a silicone resin 7. The silicone resin 7 has elasticity and insulation properties. The assembly thus formed includes the connection portion 4a and the anode external electrode portion 4b of the anode lead terminal 4, and the cathode lead terminal 5.
After the connecting portion 4a is covered with insulation by transfer molding means with the covering resin 9, leaving the exposed portions of each of the connecting portions 4a
A-A and C-C lines of the exposed part of the anode external electrode part 4b
The frame 11 is cut off from the exposed part of the B-B line, and the anode external electrode part 4b of the anode lead terminal 4 and the cathode lead terminal 5 are bent along the outer wall of the exterior resin 9 to form a chip with a fuse. In this embodiment, in which the solid electrolytic capacitor 10 is formed, an epoxy resin is used as the exterior resin 9.
次に、このヒユーズ付きチップ状固体電解コンデンサｌ
Ｏの別の製造方法について説明する。Next, this chip-shaped solid electrolytic capacitor l with a fuse is
Another method for producing O will be explained.
第４図（ａ）は陽極リード端子４．陰極リード端子５の
組立前の形状を示したもので、一方の側において陽極リ
ード２との接続部４ａと陽極外部電極部４ｂがフレーム
１１により、対向するもう一方の側において陰極リード
端子５がフレーム１２により支持されている。FIG. 4(a) shows the anode lead terminal 4. This figure shows the shape of the cathode lead terminal 5 before assembly, in which the connection part 4a with the anode lead 2 and the anode external electrode part 4b are connected to the frame 11 on one side, and the cathode lead terminal 5 is connected to the frame 11 on the other side. It is supported by a frame 12.
陽極リード端子４および陰極リード端子５はともに一枚
の金属板のフレーム１１．１２から同一平面内に所定の
間隔をもって突出され１両者のピッチは同じである。Both the anode lead terminal 4 and the cathode lead terminal 5 protrude from the frame 11, 12, which is a single metal plate, in the same plane at a predetermined interval, and have the same pitch.
第４図（ｂ）は陽極リード端子４．陰極リード端子５の
組立後の形状を示したものである。FIG. 4(b) shows the anode lead terminal 4. This figure shows the shape of the cathode lead terminal 5 after assembly.
まず、この陰極リード端子５の段差部の内側に導電性接
着剤８を塗布し、この塗布部に前記陽極リード端子４、
陰極リード端子５と同じピッチ間隔で並べられたコンデ
ンサ素子ｌの陰極層３の一方の側面と上面を接着する０
次に陽極リード端子４の接続部４ａと陽極リード２を溶
接により接続し、さらに前記接続部４ａと陽極外部電極
部４ｂとをヒユーズ６によりはんだ付けあるいはワイヤ
ーポンディング等の手段を用いて橋絡接続し。First, a conductive adhesive 8 is applied to the inside of the stepped portion of the cathode lead terminal 5, and the anode lead terminal 4,
One side surface and the top surface of the cathode layer 3 of the capacitor element l arranged at the same pitch as the cathode lead terminals 5 are bonded.
Next, the connection part 4a of the anode lead terminal 4 and the anode lead 2 are connected by welding, and the connection part 4a and the anode external electrode part 4b are bridged by soldering or wire bonding using a fuse 6. connection.
その上をシリコン樹脂等の絶縁性を有する弾性樹脂７に
より被覆する。最後に陽極リード端子４の接続部４ａ、
陽極外部電極部４ｂの露出部および陰極リード端子５の
露出部である陰極外部電極部５ａを残してトランスファ
モールド等の手段を用いて第１図のように外装樹脂９に
より絶縁外装した後、金属板を陽極リード端子４の接続
部４ａの露出部のＡ−Ａ線、Ｃ−Ｃ線および陽極外部電
極部４ｂの露出部のＢ−Ｂ線から切断して、フレーム１
１側から分離し、さらに陰極リード端子５の露出部であ
る陰極外部電極部５ａのＤ−Ｄ線から同様に切断してフ
レーム１２側から分離し、残った陽極外部電極部４ｂ、
陰極外部電極部５ａを外装樹脂９の外壁に沿って折り曲
げ、ヒユーズ付きチップ状固体電解コンデンサｌＯを形
成する。The top thereof is covered with an elastic resin 7 having insulating properties such as silicone resin. Finally, the connection part 4a of the anode lead terminal 4,
After leaving the exposed part of the anode external electrode part 4b and the cathode external electrode part 5a, which is the exposed part of the cathode lead terminal 5, insulating and sheathing with an exterior resin 9 using means such as transfer molding as shown in FIG. The plate is cut from the A-A line and C-C line of the exposed part of the connection part 4a of the anode lead terminal 4 and the B-B line of the exposed part of the anode external electrode part 4b.
1 side, and then similarly cut from the D-D line of the cathode external electrode part 5a, which is the exposed part of the cathode lead terminal 5, and separated from the frame 12 side, and the remaining anode external electrode part 4b,
The cathode external electrode portion 5a is bent along the outer wall of the exterior resin 9 to form a chip-shaped solid electrolytic capacitor IO with a fuse.
このようにして形成されたヒユーズ付きチップ状固体電
解コンデンサに過電流を流しても、ヒユーズ６と陰極層
３とは近接していないので、ヒユーズ６が発熱してから
溶断に至るまでの間に陰極層３からのはんだの吹出しや
コンデンサ素子ｌの焼損等の事故は発生せず、安全装置
として確実に機能し、二次災害は発生しないことが確認
された。また、陽極リード端子４．陰極リード端子５は
、第３図、第４図（ａ）に示した形状の機械加工等によ
り形成されるので低コストで、しかも平坦性や寸法の均
一性が良く、自動のワイヤボンディング機等を適用して
ヒユーズの自動接続が可能となり、製造工程が大幅に簡
略化された。さらに、陽極リード端子４側は陰極リード
端子５側に比べてヒユーズ６の接続スペースが十分にあ
り、チップ形状を大きくしたり、コンデンサ素子ｌの形
状を小さくしたりする必要がなく、ヒユーズを付けない
チップ状固体電解コンデンサと同等の体 ４積効率を有
する。小型、大容量化の要求に応えうるヒユーズ付チッ
プ状固体電解コンデンサが得られた。Even if an overcurrent is applied to the chip-shaped solid electrolytic capacitor with a fuse formed in this way, since the fuse 6 and the cathode layer 3 are not close to each other, there will be a short period of time between the time when the fuse 6 generates heat and the time when it blows out. No accidents such as solder blowing out from the cathode layer 3 or burnout of the capacitor element 1 occurred, and it was confirmed that the device functioned reliably as a safety device and that no secondary disasters occurred. In addition, anode lead terminal 4. The cathode lead terminal 5 is formed by machining or the like in the shape shown in FIGS. 3 and 4(a), so it is low cost, has good flatness and uniformity of dimensions, and can be used with automatic wire bonding machines, etc. By applying this method, automatic connection of fuses became possible, greatly simplifying the manufacturing process. Furthermore, there is more space on the anode lead terminal 4 side to connect the fuse 6 than on the cathode lead terminal 5 side, so there is no need to increase the size of the chip or reduce the size of the capacitor element l. It has a volumetric efficiency equivalent to that of a solid electrolytic chip capacitor. A chip-shaped solid electrolytic capacitor with a fuse that can meet the demands for smaller size and larger capacity was obtained.
以上説明したように本発明は、陽極リードとの接続部と
外部電極部からなる陽極リード端子と、外装樹脂の内部
で陽極リード端子の接続部と外部電極部を橋絡接続する
ヒュ、−ズを備え、さらに、一枚の金属板から多くの端
子板をまとめて製造することにより、以下のような効果
がある。As explained above, the present invention provides an anode lead terminal consisting of a connection part with an anode lead and an external electrode part, and a fuse that bridges and connects the connection part of the anode lead terminal and the external electrode part inside the exterior resin. Furthermore, the following effects can be achieved by manufacturing many terminal boards from one metal plate at once.
（１）短絡した時でも陰極層からのはんだの吹き出しや
、コンデンサ自身の焼損事故の危険性がない。(1) Even in the event of a short circuit, there is no risk of solder blowing out from the cathode layer or burnout of the capacitor itself.
（２）端子板を高精度で低コストで製造することができ
、接続部と外部電極部のヒユーズによる橋絡接続を自動
装置で簡便に行うことができ、製造工程が大幅に簡略化
される。(2) The terminal board can be manufactured with high precision and at low cost, and the bridging connection between the connection part and the external electrode part using a fuse can be easily performed using automatic equipment, which greatly simplifies the manufacturing process. .
（３）体積効率が高く小型、大容量化が容易である。(3) High volumetric efficiency, small size, and easy increase in capacity.
第１図は本発明のヒユーズ付きチップ状固体電解コンデ
ンサの一実施例の内部構造を示す斜視図、第２図は第１
図の側断面図、第３図は陽極リード端子４の組立前の形
状の一例の正面図、第４図（ａ）はこの固体電解コンデ
ンサ１０の別の製造方法の実施例における陽極リード端
子４および陰極リード端子５の組立前の形状を示し、第
４図（ｂ）はそれらの組立後の形状を示す平面図、第５
図は従来のヒユーズ付きチップ状固体電解コンデンサの
一例の内部構造を示す斜視図、第６図は第５図の側断面
図である。
ｌ・・・コンデンサ素子、２・・・陽極リード、３・・
・陰極層、 ４・・・陽極リード端子。
４ａ・・・接続部、 ４ｂ・・・陽極外部電極部、
５・・・陰極リード端子、５ｂ・・・陰極外部電極部、
６・・・ヒユーズ、
７・・・弾性（シリコン）樹脂、
８・・・導電性接着剤、 ９・・・外装樹脂。
１０・・・ヒユーズ付きチップ状固体電解コンデンサ、
１１．１２・・・フレーム。
２０・・・はんだ、 ２１・・・絶縁性接着剤。
第１図FIG. 1 is a perspective view showing the internal structure of one embodiment of a chip-type solid electrolytic capacitor with a fuse according to the present invention, and FIG.
3 is a front view of an example of the shape of the anode lead terminal 4 before assembly, and FIG. 4(b) is a plan view showing the shape of the cathode lead terminal 5 before assembly, FIG. 4(b) is a plan view showing the shape after assembly, and FIG.
This figure is a perspective view showing the internal structure of an example of a conventional chip-shaped solid electrolytic capacitor with a fuse, and FIG. 6 is a side sectional view of FIG. 5. l... Capacitor element, 2... Anode lead, 3...
- Cathode layer, 4... Anode lead terminal. 4a... Connection part, 4b... Anode external electrode part,
5... Cathode lead terminal, 5b... Cathode external electrode part,
6... Fuse, 7... Elastic (silicon) resin, 8... Conductive adhesive, 9... Exterior resin. 10...Chip solid electrolytic capacitor with fuse, 11.12...Frame. 20...Solder, 21...Insulating adhesive. Figure 1
Claims (1)
、陰極層の陽極リードと反対側の面および上面に陰極リ
ード端子が導電性接着剤により固着され、陽極リードに
は弾性樹脂により被覆されたヒューズにより接続部と陽
極外部電極部とが接続されてなる陽極リード端子の前記
接続部が溶着固着され、さらに陽極リード端子の陽極外
部電極部と陰極リード端子の露出部分を除いて樹脂によ
り絶縁外装されてなるヒューズ付きチップ状固体電解コ
ンデンサ。 ２、陰極層と陽極リードからなるコンデンサ素子を含み
、陰極層の陽極リードと反対側の面および上面に陰極リ
ード端子が導電性接着剤により固着され、陽極リードに
は弾性樹脂により被覆されたヒューズにより接続部と陽
極外部電極部とが接続されてなる陽極リード端子の前記
接続部が固着され、さらに陽極リード端子の陽極外部電
極部と陰極リード端子の露出部分を除いて樹脂により絶
縁外装されてなるヒューズ付きチップ状固体電解コンデ
ンサの製造方法において、 一枚の金属板内に陽極リードの接続部と陽極外部電極部
を形成し、陽極リード端子の前記接続部と陽極外部電極
部をヒューズにて橋絡接続する工程と、樹脂外装後に外
装樹脂外部にて前記陽極リード端子の接続部と陽極外部
電極部をフレームから切り離す工程を有することを特徴
とするヒューズ付きチップ状固体電解コンデンサの製造
方法。 ３、陰極層と陽極リードからなるコンデンサ素子を含み
、陰極層の陽極リードと反対側の面および上面に陰極リ
ード端子が導電性接着剤により固着され、陽極リードに
は弾性樹脂により被覆されたヒューズにより接続部と陽
極外部電極部とが接続されてなる陽極リード端子の前記
接続部が固着され、さらに陽極リード端子の陽極外部電
極部と陰極リード端子の露出部分を除いて樹脂により絶
縁外装されてなるヒューズ付きチップ状固体電解コンデ
ンサの製造方法において、 一枚の金属板内に、所定間隔ごとにフレームから突出さ
せた陽極リードの接続部と陽極外部電極部を設けた陽極
リード端子を形成し、さらに、対向するフレームから所
定間隔ごとに突出させた陰極外部電極部を設けた陰極リ
ード端子を形成し、陽極リード端子の前記接続部と陽極
外部電極部をヒューズにより橋絡接続する工程と、前記
ヒューズを絶縁性を有する弾性体で被覆する工程と、樹
脂外装後に外装樹脂の外部にて前記陽極リード端子の接
続部と陽極外部電極部をフレームから切り離す工程と、
前記陽極外部電極部および陰極外部電極部をそれぞれフ
レームから切り離す工程を有することを特徴とするヒュ
ーズ付きチップ状固体電解コンデンサの製造方法。[Claims] 1. It includes a capacitor element consisting of a cathode layer and an anode lead, a cathode lead terminal is fixed to the surface of the cathode layer opposite to the anode lead and the top surface with a conductive adhesive, and the anode lead has an elastic material. The connecting portion of the anode lead terminal, in which the connecting portion and the anode external electrode portion are connected by a resin-coated fuse, is welded and fixed, and the exposed portions of the anode external electrode portion and the cathode lead terminal of the anode lead terminal are further removed. A chip-shaped solid electrolytic capacitor with a fuse and an insulating exterior made of resin. 2. A fuse that includes a capacitor element consisting of a cathode layer and an anode lead, a cathode lead terminal is fixed to the surface of the cathode layer opposite to the anode lead and the top surface with a conductive adhesive, and the anode lead is covered with an elastic resin. The connecting portion of the anode lead terminal in which the connecting portion and the anode external electrode portion are connected is fixed, and the anode external electrode portion of the anode lead terminal and the exposed portions of the cathode lead terminal are further insulated and coated with resin. In the manufacturing method of a chip-shaped solid electrolytic capacitor with a fuse, a connection part of an anode lead terminal and an anode external electrode part are formed in one metal plate, and the connection part of an anode lead terminal and an anode external electrode part are connected with a fuse. A method for manufacturing a chip-shaped solid electrolytic capacitor with a fuse, comprising a step of making a bridging connection, and a step of separating the connection portion of the anode lead terminal and the anode external electrode portion from the frame outside the resin packaging after the resin packaging. 3. A fuse that includes a capacitor element consisting of a cathode layer and an anode lead, a cathode lead terminal is fixed to the opposite side of the cathode layer from the anode lead and the top surface with a conductive adhesive, and the anode lead is covered with an elastic resin. The connecting portion of the anode lead terminal in which the connecting portion and the anode external electrode portion are connected is fixed, and the anode external electrode portion of the anode lead terminal and the exposed portions of the cathode lead terminal are further insulated and coated with resin. In the manufacturing method of a chip-shaped solid electrolytic capacitor with a fuse, an anode lead terminal is formed in a single metal plate, and an anode lead terminal is provided with an anode lead connection part and an anode external electrode part protruding from a frame at predetermined intervals, Further, a step of forming a cathode lead terminal having cathode external electrode portions protruding from the opposing frames at predetermined intervals, and bridging and connecting the connection portion of the anode lead terminal and the anode external electrode portion with a fuse; a step of covering the fuse with an insulating elastic body; and a step of separating the anode lead terminal connection portion and the anode external electrode portion from the frame outside the outer resin after the resin sheathing;
A method for manufacturing a chip-shaped solid electrolytic capacitor with a fuse, comprising the step of separating the anode external electrode portion and the cathode external electrode portion from the frame, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260822A JPH0626175B2 (en) | 1986-12-17 | 1987-10-16 | Chip-shaped solid electrolytic capacitor with fuse and manufacturing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30251386 | 1986-12-17 | ||
| JP61-302513 | 1986-12-17 | ||
| JP62260822A JPH0626175B2 (en) | 1986-12-17 | 1987-10-16 | Chip-shaped solid electrolytic capacitor with fuse and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63265418A true JPS63265418A (en) | 1988-11-01 |
| JPH0626175B2 JPH0626175B2 (en) | 1994-04-06 |
Family
ID=26544763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62260822A Expired - Fee Related JPH0626175B2 (en) | 1986-12-17 | 1987-10-16 | Chip-shaped solid electrolytic capacitor with fuse and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626175B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5410445A (en) * | 1993-05-12 | 1995-04-25 | Rohm Co., Ltd. | Solid electrolytic capacitor |
| US5608602A (en) * | 1992-04-07 | 1997-03-04 | Rohm Co., Ltd. | Circuit incorporating a solid electrolytic capacitor |
| JP2003168626A (en) * | 2001-11-28 | 2003-06-13 | Samsung Electro Mech Co Ltd | Improved tantalum capacitor with lead frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60257119A (en) * | 1984-05-31 | 1985-12-18 | 松尾電機株式会社 | Condenser with fuse and method of producing same |
| JPS61160923A (en) * | 1985-01-08 | 1986-07-21 | 日本電気株式会社 | Solid electrolytic capacitor with fuse |
-
1987
- 1987-10-16 JP JP62260822A patent/JPH0626175B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60257119A (en) * | 1984-05-31 | 1985-12-18 | 松尾電機株式会社 | Condenser with fuse and method of producing same |
| JPS61160923A (en) * | 1985-01-08 | 1986-07-21 | 日本電気株式会社 | Solid electrolytic capacitor with fuse |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5608602A (en) * | 1992-04-07 | 1997-03-04 | Rohm Co., Ltd. | Circuit incorporating a solid electrolytic capacitor |
| US5410445A (en) * | 1993-05-12 | 1995-04-25 | Rohm Co., Ltd. | Solid electrolytic capacitor |
| JP2003168626A (en) * | 2001-11-28 | 2003-06-13 | Samsung Electro Mech Co Ltd | Improved tantalum capacitor with lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0626175B2 (en) | 1994-04-06 |
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