JPH0551165B2 - - Google Patents
Info
- Publication number
- JPH0551165B2 JPH0551165B2 JP11675186A JP11675186A JPH0551165B2 JP H0551165 B2 JPH0551165 B2 JP H0551165B2 JP 11675186 A JP11675186 A JP 11675186A JP 11675186 A JP11675186 A JP 11675186A JP H0551165 B2 JPH0551165 B2 JP H0551165B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- exterior resin
- anode terminal
- capacitor element
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 239000007787 solid Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はヒユーズ付きチツプ型コンデンサに関
し、特にヒユーズを外装樹脂に内蔵させた構造に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type capacitor with a fuse, and particularly to a structure in which a fuse is built into an exterior resin.
一般に固体電解コンデンサは、種々の電子回路
に使用されており、故障率は小さいが、万一故障
が起きた場合の故障モードは短絡故障が多く、大
きな短絡電流が流れるとコンデンサ素子が発熱し
焼損に至ることもある。この温度の短絡電流によ
る故障発生の際には、回路構成素子を保護するた
め故障モードを短絡(シヨート)から開放(オー
プン)にすることが必要で、一般的にはヒユーズ
を用いる手段が知られている。
Solid electrolytic capacitors are generally used in various electronic circuits, and have a low failure rate, but in the event of a failure, the failure mode is often short-circuit failure, and when a large short-circuit current flows, the capacitor element heats up and burns out. It may even lead to. In the event of a failure due to short-circuit current at this temperature, it is necessary to change the failure mode from short-circuit to open in order to protect the circuit components, and the commonly known method is to use a fuse. ing.
従来技術としては、第5図の斜視図および第6
図の側面の断面図に示すように、外部陰極端子1
5と陰極層25の間に絶縁物30を介挿させて絶
縁し、ヒユーズ35をはんだにて外部陰極端子1
5と陰極層25の間に矯絡接続させ、外装樹脂4
0で絶縁外装し、この壁面に沿つて折曲げさせた
構造がある。 As prior art, the perspective view of FIG. 5 and the perspective view of FIG.
As shown in the side cross-sectional view of the figure, the external cathode terminal 1
An insulator 30 is inserted between 5 and the cathode layer 25 for insulation, and a fuse 35 is connected to the external cathode terminal 1 by soldering.
5 and the cathode layer 25, and the exterior resin 4
There is a structure that has an insulated exterior and is bent along this wall surface.
上述した従来のヒユーズ付きチツプ型固体電解
コンデンサは、陰極層側にヒユーズを接続させて
いるので、以下のような欠点がある。
The conventional fuse-equipped chip type solid electrolytic capacitor described above has the following drawbacks because the fuse is connected to the cathode layer side.
(1) ヒユーズとコンデンサ素子が近接しているの
で、過電流が流れたときにヒユーズが溶断し、
この溶断熱により間接的に陰極層のはんだが溶
け、熱膨張し、外装樹脂を破壊して吹き出すこ
とによつて、他の配線回路を短絡させて二次災
害を引き起したり、また直接的にはコンデンサ
素子の焼損を発生させ、さらに甚大な災害を起
すことがある。(1) Since the fuse and capacitor element are close to each other, the fuse will blow when an overcurrent flows.
This thermal insulation indirectly melts the solder on the cathode layer, causing thermal expansion, breaking the exterior resin and blowing it out, which can short-circuit other wiring circuits and cause secondary disasters, or directly. This may cause burnout of the capacitor element, resulting in even more serious disaster.
(2) ヒユーズの接続に際しては、コンデンサ素子
の陰極層と陰極端子との絶縁を樹脂でとつてい
るので、樹脂の硬化時に短絡する危険性があ
り、予め陰極層または
陰極端子の絶縁をとつておく必要がある。ま
た、陰極層の表面はコンデンサ素子自体の大き
さのバラツキも含めて形状的に一定でなく、自
動ではんだ付けを行う場合は非常に条件設定が
難しくなるなど、工程が煩雑になる。(2) When connecting a fuse, since the cathode layer of the capacitor element and the cathode terminal are insulated with resin, there is a risk of a short circuit when the resin hardens, so please insulate the cathode layer or cathode terminal in advance. It is necessary to keep it. Furthermore, the surface of the cathode layer is not uniform in shape, including variations in the size of the capacitor element itself, and when soldering is performed automatically, it becomes extremely difficult to set conditions, making the process complicated.
(3) チツプ型固体電解コンデンサは特に小型大容
量化の要求が強く、収容するコンデンサ素子を
大きくし、外装樹脂の肉厚をできるだけ薄くす
る必要がある。しかし、陰極層にヒユーズを接
続するには、接続およびヒユーズ自体のスペー
スの確保とはんだの吹き出し防止のために外装
樹脂を厚くしなければならず、このために容量
の体積効率が小さくなる。(3) There is a strong demand for chip-type solid electrolytic capacitors to be smaller in size and larger in capacity, so it is necessary to increase the size of the capacitor element to be accommodated and to make the outer resin wall thickness as thin as possible. However, in order to connect a fuse to the cathode layer, the exterior resin must be made thick to ensure space for the connection and the fuse itself and to prevent solder from blowing out, which reduces the volumetric efficiency of the capacitance.
上述した従来のヒユーズ付きチツプ型固体電解
コンデンサは、陰極側に外部陰極端子と陰極層の
間に絶縁物を介挿入させて絶縁し、ヒユーズを接
続した構造に対し、本発明は、コンデンサ素子の
陽極線と接続する山型状陽極端子と突出する外部
陽極端子とが外装樹脂の内部にて陽極側に矯絡接
続するヒユーズを有し、且つ山型状陽極端子は隅
を面取りした外装樹脂の壁面で切離したという独
創的な内容を有する。
The conventional chip-type solid electrolytic capacitor with a fuse described above has a structure in which an insulator is inserted between the external cathode terminal and the cathode layer on the cathode side to insulate the cathode layer, and a fuse is connected. The chevron-shaped anode terminal that connects to the anode wire and the protruding external anode terminal have a fuse that connects to the anode side inside the exterior resin, and the chevron-shaped anode terminal has a corner of the exterior resin with chamfered corners. It has an original content in that it is separated by a wall.
本発明の目的は、かかる従来欠点を排除し、電
気的特性の信頼度が高く、体積効率の高いヒユー
ズ付き固体電解コンデンサを提供するものであ
る。
An object of the present invention is to eliminate such conventional drawbacks and provide a solid electrolytic capacitor with a fuse that has highly reliable electrical characteristics and high volumetric efficiency.
本発明によれば、コンデンサ素子を挟んで対向
する陽極および陰極端子の引き出し部が外装樹脂
の壁面に沿つて折曲げされたチツプ型固体電解コ
ンデンサにおいて、コンデンサ素子の陽極線と接
続する山型陽極端子と前記外装樹脂から引き出さ
れる外部陽極端子とが前記外装樹脂の内部にて橋
絡接続するヒユーズを有し、前記山型状陽極端子
の切断面は隅を面取りした外装樹脂の壁面に露出
していることを特徴とするヒユーズ付きチツプ型
固体電解コンデンサがえられる。 According to the present invention, in a chip-type solid electrolytic capacitor in which the lead-out portions of the anode and cathode terminals facing each other with the capacitor element in between are bent along the wall surface of the exterior resin, the chevron-shaped anode is connected to the anode wire of the capacitor element. The terminal and the external anode terminal drawn out from the exterior resin have a fuse for bridging connection inside the exterior resin, and the cut surface of the chevron-shaped anode terminal is exposed on a wall surface of the exterior resin with chamfered corners. A chip-type solid electrolytic capacitor with a fuse is obtained.
次に、本発明について図面を参照して説明す
る。
Next, the present invention will be explained with reference to the drawings.
第1図は本発明の第1の実施例の内部構造を表
わす斜視図であり、第2図は第1図の側面の断面
図、第3図は第1図の正面の断面図である。 1 is a perspective view showing the internal structure of a first embodiment of the present invention, FIG. 2 is a side sectional view of FIG. 1, and FIG. 3 is a front sectional view of FIG. 1.
先ず、ニツケルや、鉄(58%)−ニツケル(42
%)合金(いわゆる42合金)などの薄い金属条を
用意し、プレス等の成型手段により第3図に示す
ように山型状陽極端子3および外部陽極端子4並
びに段差部を有する陰極端子5が連結されたリー
ドフレーム6を形成する。 First, nickel, iron (58%) - nickel (42
%) alloy (so-called 42 alloy) is prepared, and as shown in FIG. A connected lead frame 6 is formed.
次に、タンタルなどの弁作用金属の陽極体を陽
極酸化し、その上に二酸化マンガン層、カーボン
層、銀ペースト層を順次被着させ、最外最に陰極
部を有す固体電解コンデンサ素子(以後コンデン
サ素子と略称)1を形成する。このコンデンサ素
子1に植立状に接続された陽極線2を山型状陽極
端子3の一部に溶接等の手段により接続する。一
方、段差部を有する陰極端子5にあらかじめ一定
量塗布しておいた導電性接着剤7にコンデンサ素
子1を接着させ乾燥固着させる。その後、山型状
陽極端子3と外部陽極端子4の間にヒユーズ8を
はんだ付け、あるいはワイヤーボンデイングなど
により矯絡させてヒユーズ8の両端を固着し、さ
らにシリコン樹脂等の弾性樹脂9でヒユーズ8を
覆うように被着する。その後にトランスフアーモ
ールド等の手段によりエポキシ樹脂などの外装樹
脂10で絶縁外装し、外装樹脂10の陽極側の二
隅の面取り部10a,10bより突出している山
型状陽極端子3の矯絡部を外装樹脂10の面取り
部10a,10bの壁面で切り離し、さらに外部
陽極端子4および陰極端子5をリードフレーム6
より切り離して、外装樹脂10の壁面に沿つて折
り曲げ形成し、本発明のヒユーズ付きチツプ型固
体電解コンデンサを形成する。 Next, an anode body made of a valve metal such as tantalum is anodized, and a manganese dioxide layer, a carbon layer, and a silver paste layer are sequentially deposited on the anode body, and a solid electrolytic capacitor element ( A capacitor element (hereinafter abbreviated as a capacitor element) 1 is formed. The anode wire 2 connected to the capacitor element 1 in a raised manner is connected to a part of the chevron-shaped anode terminal 3 by means such as welding. On the other hand, the capacitor element 1 is adhered to the conductive adhesive 7 which has been previously applied in a certain amount to the cathode terminal 5 having the stepped portion, and is dried and fixed. Thereafter, a fuse 8 is soldered between the chevron-shaped anode terminal 3 and the external anode terminal 4, or wire bonding or the like is used to connect the fuse 8 to secure both ends of the fuse 8. to cover it. Thereafter, it is insulated and exteriorized with an exterior resin 10 such as epoxy resin by means of transfer molding, etc., and the concentric portion of the chevron-shaped anode terminal 3 protrudes from the chamfered portions 10a and 10b at the two corners on the anode side of the exterior resin 10. are separated by the walls of the chamfered portions 10a and 10b of the exterior resin 10, and then the external anode terminal 4 and the cathode terminal 5 are connected to the lead frame 6.
It is then separated and bent along the wall surface of the exterior resin 10 to form the chip-type solid electrolytic capacitor with fuse of the present invention.
この完成品に過電流を流した際には、ヒユーズ
がコンデンサ素子の陰極層に近接していないの
で、ヒユーズが発熱し切断に至るまでの間にはん
だの吹き出しや、焼損等の事故は発生せず、安全
装置として確実に機能し、二次災害等は発生しな
い。また、陽極端子側は陰極層と比較して平坦性
や寸法の均一性が良いので、ヒユーズの接続が容
易であり、自動のワイヤーボンデイング機等の適
用が十分に可能であるために、工程の簡略化がで
きる。 When an overcurrent is applied to this finished product, since the fuse is not close to the cathode layer of the capacitor element, accidents such as solder blowout and burnout will not occur until the fuse heats up and is cut. It functions reliably as a safety device, and no secondary disasters occur. In addition, the anode terminal side has better flatness and dimensional uniformity than the cathode layer, so it is easy to connect the fuse, and it is fully possible to apply an automatic wire bonding machine, etc., so the process can be improved. Can be simplified.
並びに、陽極端子側は陰極側に比べてヒユーズ
の接続スペースが十分にあり、チツプ形状を大き
くしたり、コンデンサ素子形状を小さくすること
もなく、容量の体積効率はヒユーズを付けないチ
ツプ型固体電解コンデンサと同等のものが得られ
る。さらに、外装樹脂の隅が面取りした個所で陽
極端子を切り離しするので、陽極端子が多少突出
して切断されても、回路基板等へ自動装着する自
動装着機でのセンタリングが確実にできるので回
路基板等への装着位置精度向上および装着確率が
高いヒユーズ付きチツプ型固体電解コンデンサが
得られる。 In addition, the anode terminal side has more space for connecting the fuse than the cathode side, so there is no need to increase the size of the chip or reduce the size of the capacitor element, and the volumetric efficiency of the capacitance is higher than that of a chip-type solid electrolyte without a fuse. You can get something equivalent to a capacitor. Furthermore, since the anode terminal is separated at the chamfered corners of the exterior resin, even if the anode terminal protrudes slightly and is cut, it can be reliably centered on the automatic mounting machine that automatically mounts it onto the circuit board, etc. A chip-type solid electrolytic capacitor with a fuse can be obtained with improved mounting position accuracy and high mounting probability.
第4図は、本発明の第2の実施例を示す正面の
断面図である。
FIG. 4 is a front sectional view showing a second embodiment of the invention.
第2の実施例では第1の実施例で記載した山型
状陽極端子3の一端部をカツトした形状のL型状
陽極端子11を形成し、且つ、外装樹脂10の内
部で外部陽極端子の一端を延長したL型状外部陽
極端子12を形成し、第1の実施例の如く外装樹
脂10の面取り部10aの壁面で切離したもので
ある。 In the second embodiment, an L-shaped anode terminal 11 is formed by cutting off one end of the chevron-shaped anode terminal 3 described in the first embodiment, and an external anode terminal is formed inside the exterior resin 10. An L-shaped external anode terminal 12 is formed with one end extended, and is separated at the wall surface of the chamfered portion 10a of the exterior resin 10 as in the first embodiment.
以上説明したように本発明によれば次の効果が
ある。
As explained above, the present invention has the following effects.
(1) はんだ吹き出しや焼損事故の危険性がなく、
(2) ヒユーズの接合工程が簡便であり、
(3) 小型大容量化の容易な、
(4) 自動装着機に適合し、装着確率の高いヒユー
ズ付きチツプ型固体電解コンデンサが得られ
る。(1) There is no risk of solder blow-out or burnout accidents, (2) The fuse joining process is simple, (3) It is easy to make it smaller and larger in capacity, and (4) It is compatible with automatic placement machines and has a low attachment probability. A chip-type solid electrolytic capacitor with a high fuse can be obtained.
第1図は本発明の第1の実施例の内部構造を表
わす斜視図。第2図は第1図の側面の断面図を示
し、第3図は第1図の正面の断面図、第4図は本
発明の第2の実施例を示す正面の断面図、第5図
は従来のヒユーズ付きチツプ型固体電解コンデン
サの内部構造を示す斜視図、第6図は第5図の側
面の断面図である。
1……コンデンサ素子、2……陽極線、3……
山型状陽極端子、4,20……外部陽極端子、
5,15……陰極端子、6……リードフレーム、
7……導電性接着剤、8,35……ヒユーズ、9
……弾性樹脂、10,40……外装樹脂、10
a,10b……面取り部、11……L型状陽極端
子、12……L型状外部陽極端子、25……陰極
層、30……絶縁物。
FIG. 1 is a perspective view showing the internal structure of a first embodiment of the present invention. 2 shows a side sectional view of FIG. 1, FIG. 3 shows a front sectional view of FIG. 1, FIG. 4 shows a front sectional view of a second embodiment of the present invention, and FIG. 6 is a perspective view showing the internal structure of a conventional chip-type solid electrolytic capacitor with a fuse, and FIG. 6 is a side sectional view of FIG. 5. 1... Capacitor element, 2... Anode wire, 3...
chevron-shaped anode terminal, 4, 20...external anode terminal,
5, 15...Cathode terminal, 6...Lead frame,
7... Conductive adhesive, 8, 35... Fuse, 9
...Elastic resin, 10,40 ...Exterior resin, 10
a, 10b... Chamfered portion, 11... L-shaped anode terminal, 12... L-shaped external anode terminal, 25... Cathode layer, 30... Insulator.
Claims (1)
陰極端子の引き出し部が外装樹脂の壁面に沿つて
折曲げされたチツプ型固体電解コンデンサにおい
て、コンデンサ素子の陽極線と接続する山型陽極
端子と前記外装樹脂から引き出される外部陽極端
子とが前記外装樹脂の内部にて橋絡接続するヒユ
ーズを有し、前記山型状陽極端子の切断面は隅を
面取りした外装樹脂の壁面に露出していることを
特徴とするヒユーズ付きチツプ型固体電解コンデ
ンサ。1. In a chip-type solid electrolytic capacitor in which the lead-out portions of the anode and cathode terminals facing each other across the capacitor element are bent along the wall surface of the exterior resin, the angle-shaped anode terminal connected to the anode wire of the capacitor element and the exterior resin An external anode terminal pulled out from the exterior resin has a fuse for bridging connection inside the exterior resin, and a cut surface of the chevron-shaped anode terminal is exposed on a wall surface of the exterior resin with chamfered corners. A chip-type solid electrolytic capacitor with a fuse.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11675186A JPS62272516A (en) | 1986-05-20 | 1986-05-20 | Chip type solid electrolytic capacitor with fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11675186A JPS62272516A (en) | 1986-05-20 | 1986-05-20 | Chip type solid electrolytic capacitor with fuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62272516A JPS62272516A (en) | 1987-11-26 |
JPH0551165B2 true JPH0551165B2 (en) | 1993-07-30 |
Family
ID=14694858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11675186A Granted JPS62272516A (en) | 1986-05-20 | 1986-05-20 | Chip type solid electrolytic capacitor with fuse |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62272516A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0246715A (en) * | 1988-08-09 | 1990-02-16 | Nichikon Sprague Kk | Manufacture of solid electrolytic capacitor |
JP2535489B2 (en) * | 1992-04-07 | 1996-09-18 | ローム株式会社 | Solid electrolytic capacitor |
US7532457B2 (en) * | 2007-01-15 | 2009-05-12 | Avx Corporation | Fused electrolytic capacitor assembly |
-
1986
- 1986-05-20 JP JP11675186A patent/JPS62272516A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62272516A (en) | 1987-11-26 |
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