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JPS6324857U - - Google Patents

Info

Publication number
JPS6324857U
JPS6324857U JP1986118584U JP11858486U JPS6324857U JP S6324857 U JPS6324857 U JP S6324857U JP 1986118584 U JP1986118584 U JP 1986118584U JP 11858486 U JP11858486 U JP 11858486U JP S6324857 U JPS6324857 U JP S6324857U
Authority
JP
Japan
Prior art keywords
light
emitting
mask plate
display
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986118584U
Other languages
Japanese (ja)
Other versions
JPH0416468Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986118584U priority Critical patent/JPH0416468Y2/ja
Publication of JPS6324857U publication Critical patent/JPS6324857U/ja
Application granted granted Critical
Publication of JPH0416468Y2 publication Critical patent/JPH0416468Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す斜視図、第２
図は第１図の―線拡大断面図、第３図及び第
４図はそれぞれ本考案の他の実施例を示す部分拡
大断面図、第５図は従来例の断面図である。 １……発光部、２……表示体基板、５……発光
素子（ＬＥＤチツプ）、７……透孔、８……マス
ク板、１０，１０ａ，１０ｂ……溝。 Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is an enlarged sectional view taken along the line -- in FIG. 1, FIGS. 3 and 4 are partially enlarged sectional views showing other embodiments of the present invention, and FIG. 5 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Light emitting part, 2... Display body substrate, 5... Light emitting element (LED chip), 7... Through hole, 8... Mask plate, 10, 10a, 10b... Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光素子を配設した表示体基板に、各発光素子
に対応する透孔を形成したマスク板を接合し、各
発光素子を各透孔内に収納して発光部を形成した
発光表示体において、上記マスク板の透孔を除く
表面に溝を形成したこと特徴とする、発光表示体
。 A light-emitting display in which a mask plate in which through-holes corresponding to each light-emitting element are formed is bonded to a display body substrate on which light-emitting elements are arranged, and each light-emitting element is housed in each through-hole to form a light-emitting part, A light emitting display, characterized in that grooves are formed on the surface of the mask plate excluding the through holes.
JP1986118584U 1986-07-31 1986-07-31 Expired JPH0416468Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986118584U JPH0416468Y2 (en) 1986-07-31 1986-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986118584U JPH0416468Y2 (en) 1986-07-31 1986-07-31

Publications (2)

Publication Number Publication Date
JPS6324857U true JPS6324857U (en) 1988-02-18
JPH0416468Y2 JPH0416468Y2 (en) 1992-04-13

Family

ID=31005173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986118584U Expired JPH0416468Y2 (en) 1986-07-31 1986-07-31

Country Status (1)

Country Link
JP (1) JPH0416468Y2 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415037A (en) * 1990-05-08 1992-01-20 Sony Corp Living body monitoring device
JP2004259958A (en) * 2003-02-26 2004-09-16 Kyocera Corp Package for housing light emitting element, and light emitting device
KR100496066B1 (en) * 2002-06-04 2005-06-16 에이피전자 주식회사 A cap to minutely inject sealing into LED board
JP2006120691A (en) * 2004-10-19 2006-05-11 Matsushita Electric Ind Co Ltd Linear light source device
JP2006517738A (en) * 2003-02-07 2006-07-27 松下電器産業株式会社 Metal base substrate for light emitter, light emission source, illumination device and display device
JP2006210624A (en) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp Light-emitting device
JP2007123939A (en) * 2007-01-29 2007-05-17 Kyocera Corp Light emitting device
JP2007142477A (en) * 2007-02-27 2007-06-07 Kyocera Corp Light-emitting device
JP2007142476A (en) * 2007-02-27 2007-06-07 Kyocera Corp Light-emitting device
JP2008182271A (en) * 2003-01-09 2008-08-07 Kyocera Corp Package for housing light emitting device, and light emitting apparatus
JP2008294309A (en) * 2007-05-25 2008-12-04 Showa Denko Kk Light emitting device and display device
JP2012178581A (en) * 2006-03-03 2012-09-13 Lg Innotek Co Ltd Light-emitting diode package
JP2013120840A (en) * 2011-12-07 2013-06-17 Shin Etsu Chem Co Ltd Laminated substrate
WO2014061555A1 (en) * 2012-10-19 2014-04-24 シャープ株式会社 Light-emitting apparatus and structure for attaching light-emitting apparatus to heat sink
JP2014146653A (en) * 2013-01-28 2014-08-14 Dainippon Printing Co Ltd Multifaceted body of lead frame with resin, multifaceted body of optical semiconductor device, lead frame with resin, optical semiconductor device
JP2014235212A (en) * 2013-05-31 2014-12-15 三菱電機株式会社 Graphic display device
JP2014236175A (en) * 2013-06-05 2014-12-15 日亜化学工業株式会社 Light-emitting device
JP2015096875A (en) * 2013-11-15 2015-05-21 三菱電機株式会社 Display device
JP2017187710A (en) * 2016-04-08 2017-10-12 三菱電機株式会社 Display device
JP2017188589A (en) * 2016-04-06 2017-10-12 日亜化学工業株式会社 Light-emitting device
JP2019075552A (en) * 2017-10-12 2019-05-16 ルーメンス カンパニー リミテッド LED module assembly for display

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415037A (en) * 1990-05-08 1992-01-20 Sony Corp Living body monitoring device
KR100496066B1 (en) * 2002-06-04 2005-06-16 에이피전자 주식회사 A cap to minutely inject sealing into LED board
JP4574694B2 (en) * 2003-01-09 2010-11-04 京セラ株式会社 Light emitting element storage package and light emitting device
JP2008182271A (en) * 2003-01-09 2008-08-07 Kyocera Corp Package for housing light emitting device, and light emitting apparatus
JP2006517738A (en) * 2003-02-07 2006-07-27 松下電器産業株式会社 Metal base substrate for light emitter, light emission source, illumination device and display device
JP2004259958A (en) * 2003-02-26 2004-09-16 Kyocera Corp Package for housing light emitting element, and light emitting device
JP2006120691A (en) * 2004-10-19 2006-05-11 Matsushita Electric Ind Co Ltd Linear light source device
JP2006210624A (en) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp Light-emitting device
US8796717B2 (en) 2006-03-03 2014-08-05 Lg Innotek Co., Ltd. Light-emitting diode package and manufacturing method thereof
JP2012178581A (en) * 2006-03-03 2012-09-13 Lg Innotek Co Ltd Light-emitting diode package
JP2007123939A (en) * 2007-01-29 2007-05-17 Kyocera Corp Light emitting device
JP2007142476A (en) * 2007-02-27 2007-06-07 Kyocera Corp Light-emitting device
JP2007142477A (en) * 2007-02-27 2007-06-07 Kyocera Corp Light-emitting device
JP2008294309A (en) * 2007-05-25 2008-12-04 Showa Denko Kk Light emitting device and display device
JP2013120840A (en) * 2011-12-07 2013-06-17 Shin Etsu Chem Co Ltd Laminated substrate
WO2014061555A1 (en) * 2012-10-19 2014-04-24 シャープ株式会社 Light-emitting apparatus and structure for attaching light-emitting apparatus to heat sink
JP2014146653A (en) * 2013-01-28 2014-08-14 Dainippon Printing Co Ltd Multifaceted body of lead frame with resin, multifaceted body of optical semiconductor device, lead frame with resin, optical semiconductor device
JP2014235212A (en) * 2013-05-31 2014-12-15 三菱電機株式会社 Graphic display device
JP2014236175A (en) * 2013-06-05 2014-12-15 日亜化学工業株式会社 Light-emitting device
US10429011B2 (en) 2013-06-05 2019-10-01 Nichia Corporation Method of manufacturing light emitting device
JP2015096875A (en) * 2013-11-15 2015-05-21 三菱電機株式会社 Display device
JP2017188589A (en) * 2016-04-06 2017-10-12 日亜化学工業株式会社 Light-emitting device
US10026718B2 (en) 2016-04-06 2018-07-17 Nichia Corporation Light emitting device
JP2017187710A (en) * 2016-04-08 2017-10-12 三菱電機株式会社 Display device
JP2019075552A (en) * 2017-10-12 2019-05-16 ルーメンス カンパニー リミテッド LED module assembly for display

Also Published As

Publication number Publication date
JPH0416468Y2 (en) 1992-04-13

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