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JPS62110995U - - Google Patents

Info

Publication number
JPS62110995U
JPS62110995U JP1985202936U JP20293685U JPS62110995U JP S62110995 U JPS62110995 U JP S62110995U JP 1985202936 U JP1985202936 U JP 1985202936U JP 20293685 U JP20293685 U JP 20293685U JP S62110995 U JPS62110995 U JP S62110995U
Authority
JP
Japan
Prior art keywords
light
hole
emitting display
outer frame
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985202936U
Other languages
Japanese (ja)
Other versions
JPH0328467Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985202936U priority Critical patent/JPH0328467Y2/ja
Publication of JPS62110995U publication Critical patent/JPS62110995U/ja
Application granted granted Critical
Publication of JPH0328467Y2 publication Critical patent/JPH0328467Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の発光表示体の一実施例の平
面図、第2図は第1図の―線に沿う拡大断面
図、第3図はその実施例の底面図、第4図は他の
実施例の平面図、第5図は従来の発光表示体の断
面図である。 1……基板、2……外枠、3,3′……仕切枠
、4……透孔部、5……導電パターン、6……導
電パターン、7……LEDチツプ、13……封止
樹脂、41〜44……独立封止部。
FIG. 1 is a plan view of an embodiment of the light emitting display of the present invention, FIG. 2 is an enlarged sectional view taken along the line - in FIG. 1, FIG. 3 is a bottom view of the embodiment, and FIG. FIG. 5, which is a plan view of another embodiment, is a sectional view of a conventional light emitting display. 1...Substrate, 2...Outer frame, 3, 3'...Partition frame, 4...Through hole, 5...Conductive pattern, 6...Conductive pattern, 7...LED chip, 13...Sealing Resin, 41-44...Independent sealing part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に発光体素子が設けられた発光表示体に
おいて、該発光体素子の周囲を囲む外枠により透
孔部が形成され、該透孔部が仕切枠により複数部
分に区分されており、上記外枠、仕切枠の少なく
ともいずれか一方が可撓性合成樹脂により形成さ
れていることを特徴とする発光表示体。
In a light-emitting display in which a light-emitting element is provided on a substrate, a through-hole is formed by an outer frame surrounding the light-emitting element, and the through-hole is divided into a plurality of parts by a partition frame, and the above-mentioned A light-emitting display characterized in that at least one of the outer frame and the partition frame is made of flexible synthetic resin.
JP1985202936U 1985-12-28 1985-12-28 Expired JPH0328467Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985202936U JPH0328467Y2 (en) 1985-12-28 1985-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985202936U JPH0328467Y2 (en) 1985-12-28 1985-12-28

Publications (2)

Publication Number Publication Date
JPS62110995U true JPS62110995U (en) 1987-07-15
JPH0328467Y2 JPH0328467Y2 (en) 1991-06-19

Family

ID=31167786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985202936U Expired JPH0328467Y2 (en) 1985-12-28 1985-12-28

Country Status (1)

Country Link
JP (1) JPH0328467Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278490A (en) * 2005-03-28 2006-10-12 Toshiba Corp Lighting device, imaging apparatus and mobile terminal
JP2007081074A (en) * 2005-09-14 2007-03-29 Rohm Co Ltd Optical communication module
JP2007208041A (en) * 2006-02-02 2007-08-16 Shinko Electric Ind Co Ltd Semiconductor device and method for manufacturing the same
WO2013186977A1 (en) * 2012-06-11 2013-12-19 シャープ株式会社 Light-source device and illumination device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278490A (en) * 2005-03-28 2006-10-12 Toshiba Corp Lighting device, imaging apparatus and mobile terminal
JP2007081074A (en) * 2005-09-14 2007-03-29 Rohm Co Ltd Optical communication module
JP2007208041A (en) * 2006-02-02 2007-08-16 Shinko Electric Ind Co Ltd Semiconductor device and method for manufacturing the same
WO2013186977A1 (en) * 2012-06-11 2013-12-19 シャープ株式会社 Light-source device and illumination device

Also Published As

Publication number Publication date
JPH0328467Y2 (en) 1991-06-19

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