JPS62110995U - - Google Patents
Info
- Publication number
- JPS62110995U JPS62110995U JP1985202936U JP20293685U JPS62110995U JP S62110995 U JPS62110995 U JP S62110995U JP 1985202936 U JP1985202936 U JP 1985202936U JP 20293685 U JP20293685 U JP 20293685U JP S62110995 U JPS62110995 U JP S62110995U
- Authority
- JP
- Japan
- Prior art keywords
- light
- hole
- emitting display
- outer frame
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Description
第1図は、本考案の発光表示体の一実施例の平
面図、第2図は第1図の―線に沿う拡大断面
図、第3図はその実施例の底面図、第4図は他の
実施例の平面図、第5図は従来の発光表示体の断
面図である。
1……基板、2……外枠、3,3′……仕切枠
、4……透孔部、5……導電パターン、6……導
電パターン、7……LEDチツプ、13……封止
樹脂、41〜44……独立封止部。
FIG. 1 is a plan view of an embodiment of the light emitting display of the present invention, FIG. 2 is an enlarged sectional view taken along the line - in FIG. 1, FIG. 3 is a bottom view of the embodiment, and FIG. FIG. 5, which is a plan view of another embodiment, is a sectional view of a conventional light emitting display. 1...Substrate, 2...Outer frame, 3, 3'...Partition frame, 4...Through hole, 5...Conductive pattern, 6...Conductive pattern, 7...LED chip, 13...Sealing Resin, 41-44...Independent sealing part.
Claims (1)
おいて、該発光体素子の周囲を囲む外枠により透
孔部が形成され、該透孔部が仕切枠により複数部
分に区分されており、上記外枠、仕切枠の少なく
ともいずれか一方が可撓性合成樹脂により形成さ
れていることを特徴とする発光表示体。 In a light-emitting display in which a light-emitting element is provided on a substrate, a through-hole is formed by an outer frame surrounding the light-emitting element, and the through-hole is divided into a plurality of parts by a partition frame, and the above-mentioned A light-emitting display characterized in that at least one of the outer frame and the partition frame is made of flexible synthetic resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985202936U JPH0328467Y2 (en) | 1985-12-28 | 1985-12-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985202936U JPH0328467Y2 (en) | 1985-12-28 | 1985-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62110995U true JPS62110995U (en) | 1987-07-15 |
JPH0328467Y2 JPH0328467Y2 (en) | 1991-06-19 |
Family
ID=31167786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985202936U Expired JPH0328467Y2 (en) | 1985-12-28 | 1985-12-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0328467Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006278490A (en) * | 2005-03-28 | 2006-10-12 | Toshiba Corp | Lighting device, imaging apparatus and mobile terminal |
JP2007081074A (en) * | 2005-09-14 | 2007-03-29 | Rohm Co Ltd | Optical communication module |
JP2007208041A (en) * | 2006-02-02 | 2007-08-16 | Shinko Electric Ind Co Ltd | Semiconductor device and method for manufacturing the same |
WO2013186977A1 (en) * | 2012-06-11 | 2013-12-19 | シャープ株式会社 | Light-source device and illumination device |
-
1985
- 1985-12-28 JP JP1985202936U patent/JPH0328467Y2/ja not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006278490A (en) * | 2005-03-28 | 2006-10-12 | Toshiba Corp | Lighting device, imaging apparatus and mobile terminal |
JP2007081074A (en) * | 2005-09-14 | 2007-03-29 | Rohm Co Ltd | Optical communication module |
JP2007208041A (en) * | 2006-02-02 | 2007-08-16 | Shinko Electric Ind Co Ltd | Semiconductor device and method for manufacturing the same |
WO2013186977A1 (en) * | 2012-06-11 | 2013-12-19 | シャープ株式会社 | Light-source device and illumination device |
Also Published As
Publication number | Publication date |
---|---|
JPH0328467Y2 (en) | 1991-06-19 |
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