JPS63221656A - Semiconductor device - Google Patents

Abstract

PURPOSE:To alleviate a stress to be applied to a connecting section of a vessel body to an external lead terminal by bending the terminal only at the vicinity of a mount to the body and the exterior of the body, connecting it to the body, and reinforcing the connecting section of the terminal. CONSTITUTION:4 terminals 4 made of Ni-plated and Au-plated Kovar on the peripheries are secured with brazing material 3 to a semiconductor vessel body 2 made of a ceramic material. Each terminal 4 is formed with rectangular bent parts 4 at both side faces of the terminal near the brazed parts. The bent part is cut downward perpendicularly to be connected to the body. Thus, the terminal itself becomes easily bendable to absorb a stress to be applied perpendicularly to the terminal, thereby alleviating the stress applied to the connecting section of the terminal to the body.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, particularly a flat type semiconductor device.

[Conventional technology]

Conventionally, in this type of semiconductor device, as shown in FIG.
Generally, the plurality of terminals protrude horizontally from the main body and have a flat plate shape, and there is no single folded portion of the external lead terminal near the container main body. An example of a conventional semiconductor V2C imaginary is shown in FIG. The main body 2 of the semiconductor device is made of a ceramic material, and the surrounding area is plated with Ni and Au.
A terminal 41'1 made of a plated flat cover material is fixed to a brazing material 2'.

[Problem that the invention seeks to solve]

In the above semiconductor device 2, when the force that bends the nine terminals that protrude horizontally from the main body in a direction perpendicular to the surface thereof is exhausted, stress concentrates on the connection between the main body and the terminal, and the connection between the terminal and the main body is The drawback is that the ceramic part tends to peel off, and the ceramic part near the connection part tends to crack.

Also, as the thickness of the terminal increases, the stress absorbed by the bending of the terminal itself decreases, so the above-mentioned problems tend to occur more easily.

[The tth way to solve the problem]

In order to solve the above-mentioned drawbacks, the present invention provides a so-called flat semiconductor container having a plurality of external lead terminals protruding horizontally from the main body, in which the external lead terminals are attached to the container main body near the By bending only the outside of the main body of the device and connecting it to the main body, only the terminal connecting part is reinforced, a part of the bending stress applied to the terminal is absorbed by bending the terminal itself, and the contact part between the main body and the terminal is strengthened. The structure is improved by adding bending stress to the structure.

〔Example〕

Next, the present invention will be specifically described with reference to the drawings.

FIG. 1 is an enlarged perspective view of Embodiment 1 of the present invention.

The four terminals 1 made of Kubar material with N, N, and Au plating applied to the periphery and the semiconductor container body 2 made of ceramic material are fixed with a brazing material 3, and the terminals 1 are attached to each For brazing, long sword-shaped bent portions 4 are provided on both sides of the terminal near the brazing portion, and the bent portions are bent downward at right angles and connected to the main body.

This example has long cedar bends on both sides.

Although we have shown the case of bending downward at right angles, it goes without saying that the same effect can be seen iΔ regardless of the angle of bending, whether it is on both sides or one side, in the cedar-like shape of the oiled part, in the upward or downward direction, or in the bending angle. .

[Example 2] The second case is an enlarged perspective view of Example 2 of the present invention. The four terminals 1 made of a cover material whose periphery is plated with Ni and Au and the semiconductor container body 2 made of a ceramic material are hardened by the brazing material 3, and the above-mentioned) 1
A trapezoidal bent part 4 is formed on one side of the terminal near the brazing part of the terminal, and the bent part 9 is bent upward at a right angle and connected to the main body.

[Implementation @j]

FIG. 3 is an enlarged perspective view of the third embodiment of the invention. Ni plating 2 and Au plating around? The four terminals 1 made of a coated material and the semiconductor container 2 made of a ceramic material are held together by the brazing material 3, and the terminals 1 are
A semi-cylindrical bent part 4 is provided on the terminal picture side near each brazing part, and the bent part is continued to the main body.

[Implementation row 4] FIG. 4 is an enlarged perspective view of Embodiment 4 of the present invention.

Four terminals 1 made of a cover material whose periphery is plated with N, Metsugi, and Au are fixed to a semiconductor container 2 made of a ceramic material through a brazing material 3, and the terminals 1 are
An L-shaped bent part 4 is provided on both sides of the terminal in the vicinity of the brazing part, one above and the other below, and the bent part 4 is connected to the main body.

[Example 5] FIG. 5 is an enlarged perspective view of Embodiment 5 of the present invention.

Four terminals 1 made of a cover material whose peripheries are plated with Ni and L and Au are fixed to a semiconductor container 2 made of a ceramic material with a brazing material 3, and the terminals 1 are
Each brazing section has an oblong bent section 4 on both sides of the terminal near the section.
The bent portion is bent to 180@ and connected to the main body. [Effects of the Invention] As explained above, the present invention is adopted and the bending portion is bent to 180 @ and connected to the main body. Outside the valley of the device
Installation with the container body is done only near the part and outside of the container body.
By bending, connecting to the main body, and reinforcing the terminal connection part, the terminal itself becomes easier to bend, absorbs stress applied to the terminal in the vertical direction, and as a result, the connection part between the terminal and the main body becomes loose. You can get the effect of eliminating stress.

That is, it is possible to eliminate the drawbacks of conventional semiconductor devices in which the connection portions peel off or the ceramic portions crack when stress is applied to the terminals in the vertical direction.

[Brief explanation of drawings]

FIG. 1 is an enlarged perspective view of Embodiment 1 of the present invention.
Figure 2 is an enlarged perspective view of Example 2. Figure 3 shows Example 3
FIG. FIG. 4 is an enlarged perspective view of the fourth embodiment. FIG. 5 is an enlarged perspective view of the fifth embodiment. FIG. 6 shows an example of a conventional semiconductor device. In each figure, 1...External lead terminal, 2...#? Conductor valley device (incorporeal), 3... Brazing metal, 4...
・The terminal bending part is shown. Figure 1

Claims (1)

[Claims] In a so-called flat type semiconductor container having a plurality of external lead terminals protruding horizontally from the semiconductor container main body, the external lead terminals are bent only near the attachment part to the container main body and outside the container main body, and connected to the main body. A semiconductor device characterized in that only the terminal connection portion is reinforced.