JPH0521902Y2 - - Google Patents
Info
- Publication number
- JPH0521902Y2 JPH0521902Y2 JP1987191429U JP19142987U JPH0521902Y2 JP H0521902 Y2 JPH0521902 Y2 JP H0521902Y2 JP 1987191429 U JP1987191429 U JP 1987191429U JP 19142987 U JP19142987 U JP 19142987U JP H0521902 Y2 JPH0521902 Y2 JP H0521902Y2
- Authority
- JP
- Japan
- Prior art keywords
- flat pack
- pack component
- frame
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はフラツトパツク部品をプリント基板に
実装するための構造に関し、特にフラツトパツク
部品のリード線の断線防止を図つた実装構造に関
する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a structure for mounting flat pack components on a printed circuit board, and more particularly to a mounting structure for preventing disconnection of lead wires of flat pack components.
従来、この種の実装構造は、第４図に平面図、
第５図にそのCC線に沿う断面図を示すように、
フラツトパツク部品１１のリード線１１ａをプリ
ント基板１２の配線部に半田付けし、この半田付
けによつてフラツトパツク部品１１をプリント基
板２に保持させた構成となつている。この場合、
フラツトパツク部品１１とプリント基板１２との
接触面に接着剤を塗布し、この接着力により保持
を補助する実装構造がとられることもある。
Conventionally, this type of mounting structure is shown in a plan view in FIG.
As shown in Figure 5, a cross-sectional view along the line CC,
The lead wire 11a of the flat pack component 11 is soldered to the wiring portion of the printed circuit board 12, and the flat pack component 11 is held on the printed circuit board 2 by this soldering. in this case,
A mounting structure may be adopted in which an adhesive is applied to the contact surface between the flat pack component 11 and the printed circuit board 12, and the adhesive force assists the holding.
上述した従来のフラツトパツク部品の実装構造
は、リード線１１ａをプリント基板１２に半田付
けしただけでは、振動等によりプリント基板１２
が変形された際にリード線に応力が集中し、リー
ド線が断線されることがある。場合によつては、
フラツトパツク部品がプリント基板から脱落され
ることもある。
In the conventional flat pack component mounting structure described above, if the lead wire 11a is simply soldered to the printed circuit board 12, the printed circuit board 12 may be damaged due to vibration or the like.
When the lead wire is deformed, stress concentrates on the lead wire, which may cause the lead wire to break. In some cases,
Flat pack components may also fall off the printed circuit board.
また、接着剤により保持を補助する実装構造で
は、このようなリード線の断線が防止できても、
フラツトパツク部品１１を交換する際に接着剤を
剥離し、かつ改めて接着剤を塗布する等の作業が
要求され、部品交換が困難になるという問題があ
る。 In addition, even if such lead wire breakage can be prevented with a mounting structure that uses adhesive to assist in holding,
When replacing the flat pack component 11, operations such as peeling off the adhesive and reapplying the adhesive are required, making it difficult to replace the component.
本考案は、リード線の断線を防止する一方で部
品を容易に交換することを可能としたフラツトパ
ツク部品の実装構造を提供することを目的として
いる。 An object of the present invention is to provide a flat pack component mounting structure that prevents breakage of lead wires and allows components to be easily replaced.
本考案のフラツトパツク部品の実装構造は、フ
ラツトパツク部品のリード線をプリント基板に半
田付けするとともに、このフラツトパツク部品の
上面に接触される枠状をした補強枠をその隅部に
おいて前記プリント基板に固定し、この補強枠で
フラツトパツク部品をプリント基板に押圧保持し
た構成としている。また、補強枠は、フラツトパ
ツク部品のパツケージ本体の縦横寸法よりも小さ
い寸法の枠部と、この枠部の四隅に一体形成した
固定部と、前記枠部の内縁に沿つて形成したフイ
ンとで構成されており、更に固定部は枠部よりも
フラツトパツク部品のパツケージ本体の厚さに略
等しい寸法で下面方向に突出された構成とする。
In the mounting structure of the flat pack component of the present invention, the lead wire of the flat pack component is soldered to the printed circuit board, and a frame-shaped reinforcing frame that contacts the top surface of the flat pack component is fixed to the printed circuit board at its corner. The reinforcing frame holds the flat pack component against the printed circuit board. Further, the reinforcing frame is composed of a frame portion having dimensions smaller than the vertical and horizontal dimensions of the package main body of the flat pack component, fixing portions integrally formed at the four corners of this frame portion, and fins formed along the inner edge of the frame portion. Further, the fixing portion is configured to protrude downward from the frame portion by a dimension approximately equal to the thickness of the package body of the flat pack component.
次に、本考案を図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本考案の一実施例の平面図であり、そ
のAA線及びBB線に沿う断面図を第２図及び第
３図に示している。 FIG. 1 is a plan view of an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views taken along lines AA and BB.
フラツトパツク部品１は周辺に多数本のリード
線１ａが突出形成され、プリント基板２上に配設
された上で各リード線１ａをプリント基板２の導
体膜からなる配線部（図示せず）に半田付けして
いる。このフラツトパツク部品１の上側には補強
枠３を被せ、この補強枠３の四隅部をねじ４、ナ
ツト５、平座金６、ばね座金７からなる締結手段
でプリント基板２に固定している。 The flat pack component 1 has a number of protruding lead wires 1a formed around the periphery, and is arranged on a printed circuit board 2, and each lead wire 1a is soldered to a wiring part (not shown) made of a conductive film of the printed circuit board 2. It is attached. A reinforcing frame 3 is placed over the flat pack component 1, and the four corners of the reinforcing frame 3 are fixed to the printed circuit board 2 by fastening means consisting of screws 4, nuts 5, flat washers 6, and spring washers 7.
前記補強枠３は、前記フラツトパツク部品１の
縦横寸法よりも一回り小さい正方形の枠部３ａ
と、この枠部３ａの四隅に一体形成した固定部３
ｂと、前記枠部３ａの内縁に沿つて断面Ｌ字状に
形成したフイン３ｃとで構成される。そして、前
記固定部３ｂに設けた透孔を通して前記締結手段
により固定を行ない、このとき枠部３ａはフラツ
トパツク部品１の上面に接触して、フラツトパツ
ク部品１をプリント基板２に押圧保持させてい
る。 The reinforcing frame 3 has a square frame portion 3a that is one size smaller than the vertical and horizontal dimensions of the flat pack component 1.
and fixing parts 3 integrally formed at the four corners of this frame part 3a.
b, and a fin 3c having an L-shaped cross section along the inner edge of the frame portion 3a. Then, the fixing is performed by the fastening means through the through hole provided in the fixing part 3b, and at this time, the frame part 3a comes into contact with the upper surface of the flat pack component 1, and the flat pack component 1 is pressed and held against the printed circuit board 2.
この構成によれば、フラツトパツク部品１はリ
ード線１ａが半田付けによりプリント基板２に取
着されるのはもとより、補強枠３によつてプリン
ト基板２に押圧されていることにより、プリント
基板２が振動等の外力によつて変形した場合に、
応力は補強枠３とフラツトパツク部品１との接触
部に均等に作用し、リード線１ａに応力が集中し
て断線されることが防止できる。 According to this configuration, in the flat pack component 1, the lead wire 1a is not only attached to the printed circuit board 2 by soldering, but also pressed against the printed circuit board 2 by the reinforcing frame 3, so that the printed circuit board 2 is When deformed by external force such as vibration,
The stress acts evenly on the contact portion between the reinforcing frame 3 and the flat pack component 1, and it is possible to prevent the stress from concentrating on the lead wire 1a and causing it to break.
なお、この実施例では枠部３ａの一部を断面凹
状に削成することにより、その内縁に沿つてフイ
ン３ｃを形成しているので、補強枠３の重量が軽
減できるとともに曲げに対する強度（断面係数）
も向上でき、更にフイン３ｃによりフラツトパツ
ク部品１から発生される熱を放熱できる効果もあ
る。 In this embodiment, a part of the frame 3a is cut into a concave cross section to form the fins 3c along the inner edge of the frame 3a, so that the weight of the reinforcing frame 3 can be reduced and the strength against bending (cross section) can be reduced. coefficient)
Furthermore, the fins 3c have the effect of dissipating the heat generated from the flat pack component 1.
以上説明したように本考案は、リード線をプリ
ント基板に半田付けするとともに、フラツトパツ
ク部品の上面に接触される枠状をした補強枠をそ
の隅部においてプリント基板に固定し、この補強
枠でフラツトパツク部品をプリント基板に押圧保
持しているので、リード線への応力集中を防止し
てリード線の断線を防止できる。また、補強枠に
フインを一体に設けることにより、フラツトパツ
ク部品の有効な放熱を行うことができる効果もあ
る。
As explained above, in the present invention, the lead wires are soldered to the printed circuit board, and at the same time, a frame-shaped reinforcing frame that contacts the top surface of the flat pack component is fixed to the printed circuit board at its corner. Since the parts are pressed and held against the printed circuit board, stress concentration on the lead wires can be prevented, and breakage of the lead wires can be prevented. Further, by providing the fins integrally with the reinforcing frame, there is an effect that heat can be effectively dissipated from the flat pack components.
第１図は本考案のフラツトパツク部品の実装構
造の平面図、第２図は第１図のAA線に沿う断面
図、第３図は第１図のBB線に沿う断面図、第４
図は従来構造の平面図、第５図は第４図のCC線
に沿う断面図である。
１，１１……フラツトパツク部品、１ａ，１１
ａ……リード線、２，１２……プリント基板、３
……補強枠、３ａ……枠部、３ｂ……固定部、３
ｃ……フイン、４……ねじ、５……ナツト、６…
…平座金、７……ばね座金。
Fig. 1 is a plan view of the mounting structure of the flat pack component of the present invention, Fig. 2 is a sectional view taken along line AA in Fig. 1, Fig. 3 is a sectional view taken along line BB in Fig. 1, and Fig. 4 is a sectional view taken along line AA in Fig. 1.
The figure is a plan view of the conventional structure, and FIG. 5 is a sectional view taken along line CC in FIG. 4. 1, 11... Flat pack parts, 1a, 11
a... Lead wire, 2, 12... Printed circuit board, 3
...Reinforcement frame, 3a...Frame part, 3b...Fixed part, 3
c... Finn, 4... Neji, 5... Natsu, 6...
...Flat washer, 7...Spring washer.
Claims (1)
に半田付けするとともに、このフラツトパツク部
品のパツケージ本体の上面に接触される枠状をし
た補強枠をその隅部において前記プリント基板に
固定し、この補強枠でフラツトパツク部品をプリ
ント基板に押圧保持してなり、前記補強枠は、前
記フラツトパツク部品のパツケージ本体の縦横寸
法よりも小さい寸法の枠部と、この枠部の四隅に
一体形成した固定部と、前記枠部の内縁に沿つて
形成したフインとで構成され、前記固定部は前記
枠部よりも前記フラツトパツク部品のパツケージ
本体の厚さに略等しい寸法で下面方向に突出され
てなることを特徴とするフラツトパツク部品の実
装構造。 The lead wires of the flat pack component are soldered to the printed circuit board, and a frame-shaped reinforcing frame that contacts the top surface of the package body of the flat pack component is fixed to the printed circuit board at its corner. The reinforcing frame includes a frame portion having dimensions smaller than the vertical and horizontal dimensions of the package body of the flat pack component, fixing portions integrally formed at the four corners of the frame portion, and the reinforcing frame. fins formed along an inner edge of the flat pack component, the fixing part protruding downward from the frame part by a dimension substantially equal to the thickness of the package body of the flat pack component. Implementation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987191429U JPH0521902Y2 (en) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987191429U JPH0521902Y2 (en) | 1987-12-18 | 1987-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195778U JPH0195778U (en) | 1989-06-26 |
| JPH0521902Y2 true JPH0521902Y2 (en) | 1993-06-04 |
Family
ID=31482341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987191429U Expired - Lifetime JPH0521902Y2 (en) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521902Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63181396A (en) * | 1987-01-23 | 1988-07-26 | 株式会社東芝 | Method of mounting semiconductor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889943U (en) * | 1981-12-14 | 1983-06-17 | 株式会社精工舎 | Mounting structure for IC, etc. |
| JPS59180434U (en) * | 1983-05-20 | 1984-12-01 | パイオニア株式会社 | Flat package IC socket |
| JPS6420693A (en) * | 1987-07-15 | 1989-01-24 | Fujitsu General Ltd | Ic mounting device |
-
1987
- 1987-12-18 JP JP1987191429U patent/JPH0521902Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63181396A (en) * | 1987-01-23 | 1988-07-26 | 株式会社東芝 | Method of mounting semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0195778U (en) | 1989-06-26 |
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