JPS63211614A - Electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more specifically, to leadless electronic components that are surface-mounted on a printed circuit board or the like. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Conventional structure and its problems A conventional leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is constructed as shown in FIG. That is, an anode foil made by roughening aluminum foil and forming a dielectric oxide film by anodization, and a cathode foil made by roughening aluminum foil are wound through a separator and impregnated with a driving electrolyte. capacitor element 1
This capacitor element 1 is housed in a bottomed cylindrical metal case 2, and the open end is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor. The lead wire 4 drawn out from the electrolytic capacitor is mechanically connected to the comb-shaped terminal 6 by a method such as welding, and the entire body except the comb-shaped terminal 6 is coated with a molded resin sheath 6 to create a completed product. It was.

When mounting such chip-type aluminum electrolytic capacitors on a printed circuit board, in order to have soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied, but generally the molded exterior is heated at a temperature of 100'C to 160°C and pressurized at a pressure of 10 to 2/crtl for about 5 minutes. Under harsh conditions, the electrolytic solution used to drive electrolytic capacitors evaporates, resulting in deterioration of characteristics such as a decrease in capacitance and an increase in tanδ.Also, because they are coated with molded resin, they become extremely expensive. There was a problem. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

OBJECTS OF THE INVENTION The object of the present invention is to eliminate such conventional drawbacks, and to provide an inexpensive vertical type leadless electronic component that does not deteriorate in characteristics and has good solderability. It is.

Structure of the Invention In order to achieve this object, the present invention has a structure in which a component element is housed in a case, and the open end of the case is sealed with a sealing member, and a lead connected to the component element. An electronic component main body formed by passing a wire through the sealing member and drawing it out from the same end face, and an electronic component body in which the lead wire is disposed so as to come into contact with the end face sealed by the sealing member of the electronic component 2 main body, and an insulating plate having a through hole passing through the insulating plate, a lead wire passing through the through hole of the insulating plate is bent along the outer surface of the insulating plate, and a tip of the lead wire is attached to the insulating plate. It is made to protrude from the side of the.

With this configuration, when electronic components are mounted on a printed circuit board, the tips of the lead wires protrude from the side of the insulating board, making it easy to visually check whether the electronic component lead wires are soldered. Furthermore, during soldering, since the tip of the lead wire protrudes from the side surface of the insulating plate, it becomes possible to apply solder, improving soldering properties.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 and 3 regarding an aluminum electrolytic capacitor. In addition,
In the figure, parts that are the same as those in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one;
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, lead wires 4 are connected to the anode foil and the cathode foil of the capacitor element 1.
is connected.

The open end of the metal case 2 is sealed by attaching a sealing member 7 consisting of a two-layer structure of an elastic body 71L and an inelastic body 7b and performing a drawing process. The main body of the part is configured. Further, the lead wire 4 connected to the capacitor element 1 passes through the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end face of the electronic component main body sealed by the sealing member, and this insulating plate 8
is provided with a through hole 8a through which the lead wire 4 passes.

Further, a recess 8b connected to the through hole 8a is provided on the outer surface of the insulating plate 8, and the lead wire 4 that has passed through the through hole 8a is inserted into the outer surface of the insulating plate 8 so that it is accommodated in the recess 8b. It is bent along.

In this case, as shown in Figure 3a and b, the round bar lead wire 4
The lead wire may be flattened and bent, or it may be a round bar lead wire.

Furthermore, the tip portion 4a of the lead wire 4 protrudes beyond the side surface of the insulating plate 8.

Effects of the Invention As described above, according to the electronic component of the present invention, the insulating plate is disposed so as to come into contact with the end face of the electronic component body sealed by the sealing member, and the 17-wire of the electronic component body is Since it is bent along the outer surface of the insulating plate to create a leadless type,
The characteristics do not deteriorate due to heat during mold exterior,
Moreover, since it is a vertical type, the installation area on the print/print board is small, and high-density packaging can be achieved.

Moreover, since the tips of the lead wires protrude from the side of the insulating board, it is possible to visually check whether the lead wires have been soldered correctly even after mounting, and the protruding tips can be easily checked. By making it possible to apply solder,
Soldering can improve performance.

[Brief explanation of the drawing]

FIGS. 1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and FIG. Partial cross-sectional view showing one embodiment, FIG. 4a
, b are perspective views showing the shape of a lead according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Capacitor element, 2... Metal case, 4... Lead wire, 4a... Tip part, 7... Sealing member, 8a...through hole, 8b...recess. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (α) (1) Figure 2 Figure 3 (aJ (b)

Claims (2)

[Claims] (1) A component element is housed in a case and the open end of the case is sealed with a sealing member, and a lead wire connected to the component element is passed through the sealing member and drawn out from the same end surface. It is composed of an electronic component main body and an insulating plate provided with a through hole that is disposed so as to come into contact with an end surface of the electronic component main body sealed by the sealing member and through which the lead wire passes, and the insulating plate has a through hole through which the lead wire passes. An electronic component characterized in that a lead wire passing through the hole is bent along the outer surface of the insulating plate, and a tip of the lead wire protrudes from a side surface of the insulating plate. (2) The electronic component according to claim 1, wherein the electronic component main body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.