JPS60148105A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to electronic components used in various electronic devices, and more specifically, to so-called Lurie-less electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Construction of a conventional example and its problems A conventional so-called leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is shown in FIG. 1a.

It is configured as shown in b. That is, an anode foil, which is made by roughening aluminum foil and forming a dielectric acid abrasive film by anodizing, and a cathode foil, which is made by roughening aluminum foil, are wound with a separator in between, and a driving electrolyte is applied. When a capacitor element 1 is constructed by impregnating the capacitor element 1 with
In addition, an aluminum electrolytic capacitor is constructed by sealing the open end using an elastic sealing material 3 such as rubber, and a lead wire 4 drawn out from the aluminum electrolytic capacitor is welded to a rubber terminal 6. Electrical by method.

After mechanical connection, a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminal 5, resulting in a completed product.

When mounting such chip-type aluminum electrolytic capacitors on a printed screen board, in order to have soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied, but generally the molded resin exterior is pressurized at a temperature of 10''C to 150''C and a pressure of 1i 10 kg/ctJ for about 6 minutes. Under harsh conditions, the driving electrolyte of an electrolytic capacitor evaporates, causing a decrease in capacitance and
This has resulted in deterioration of characteristics such as an increase in an δ, and since the molded resin exterior 6 is provided, the product is extremely expensive. Furthermore, it is a horizontal type. Second, when mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

Further, in the above configuration, print 11! : When mounting on a board, apply preliminary solder 7 to the connection surface of the comb-shaped terminal 5 to improve soldering as shown in FIG. 2, and apply adhesive 10 to the conductive pattern 9 of the printed board 8 Temporarily fix it with
Solder connection is made by dip soldering, but the height of the preliminary solder 7 is different on the left and right sides, so even when dip soldering is performed, the connection is made at an angle as shown in Figure 3, and one comb-shaped terminal 6 The solder 11 is not sufficiently applied by dipping between the conductive pattern 9 and the conductive pattern 9, resulting in a gap, and there is a risk that the solder splinter may be destroyed by application of an external force.

As described above, the inclination occurs during mounting, and this poses a serious problem in connection strength due to solder connections.

Purpose of the Invention The present invention eliminates the above-mentioned drawbacks of the conventional technology, and provides a vertical type glue-less electronic component that does not deteriorate in characteristics, is inexpensive, and allows for strong and stable solder connections during mounting. It is intended to provide.

Structure of the Invention In order to achieve this object, the present invention provides an electronic component main body in which a component element having a lead wire drawn out from the same end face is enclosed in a case, and the lead wire is passed through the end face from which the lead wire is bowed. An insulating plate having a recess connected to the through hole is arranged on the outer surface of the through hole, and ribbon solder or cream solder is sandwiched in the recess, and the tip of the lead wire that completely passes through the through hole is fitted. , with this configuration, pudding)! This is intended to prevent slanted edges and insufficient solder connections when mounting on a board.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 and 6 regarding an aluminum electrolytic capacitor.

In the figure, 12 is a capacitor element similar to the conventional one, with an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened aluminum foil. It is constructed by winding a cathode aluminum foil with an insulating paper interposed therebetween, and impregnating the wound material with a driving electrolyte. This capacitor element 1
2 is housed in a cylindrical metal case 13 with a bottom. A lead wire 14 is connected to the twisted anode foil and cathode foil of the capacitor element 12.

An elastic body 151L is provided at the open end of the metal case 13.
The open end of the metal case 13 is sealed by attaching a sealing part @15 having a two-layer structure consisting of a metal case 15 and an inelastic body 15b, and drawing the open end of the metal case 13, thereby forming an electronic component main body. Further, the lead wire 14 connected to the capacitor element 12 passes through the sealing member 15 and is drawn out from the same end face. Reference numeral 16 denotes an insulating plate disposed so as to come into contact with the end surface from which the lead wire 14 of the electronic component body is drawn out, and this insulating plate 16 is provided with a through hole 161L through which the lead wire 14 passes.

Further, the through hole 16a is provided on the outer surface of the insulating plate 16.
A recess 161) connected to the recess 16b is provided, and a ribbon or cream solder 17 is inserted or filled into the recess 16b, and the tip 14a of the lead wire 14 that has passed through the through hole 16 is bent at a right angle. is fitted into the recess 16b.

In this case, as shown in FIGS. 6a and 6b, even if the tip 14a of the round bar 11-lead wire 14 is flattened and bent, it remains the lead wire of the round bar. It's okay,
The ribbon solder 17 may be wrapped around the tip 141L of the lead wire 14.

With this configuration, when mounting on a printed circuit board, as shown in FIG. Through this, ribbon solder or cream solder 17 is melted and soldered to the conductive pattern 19, or a dip solder process is performed to make a solder connection. In the case of this dip soldering process, ribbon half day or cream solder 1 day
7 acts as a preliminary solder to improve the solder wetting of the tip 142L of the lead wire 14.

Since the electronic component of the present invention is constructed as described above, the case can be shaped vertically, which is advantageous in increasing the packaging density.Furthermore, the tip of the lead wire to be chip-bonded is coated with ribbon solder or Because cream solder is applied, electronic components do not tilt or wobble when mounted on a printed circuit board, allowing stable mounting, and overall soldering is stable and the soldering strength is also stable. Therefore, even if an external force is applied, the soldered connection part will not be destroyed, and furthermore, the soldering process can be performed efficiently with good wettability during soldering.

In addition, since it is a case exterior, there is no deterioration in characteristics compared to a molded exterior, and it has the advantage of being manufactured at a low cost, so it is of great industrial value.

[Brief explanation of drawings]

Figures 1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, Figures 2 and 3 are front views showing the mounting process of the anti-capacitor on a printed circuit board, and Figure 4 is the present invention. FIG. 6 is a half-sectional front view of the glue-less aluminum electrolytic capacitor as an example of an electronic component, FIG. 6 a and b are perspective views showing an example of the shape of the lead wire, and FIG. FIG. 3 is a front view showing a state in which the capacitor is mounted on a printed circuit board. 12...Capacitor element, 13...Metal case, 14...Lead wire, 142L...
...Tip, 16...Sealing tip, 16...
・Insulating plate, 16a...Through hole, 16b...
...Concave part, 17... Ribbon half day or cream solder. Name of agent: Patent attorney Toshio Nakao and 1 other person
1 (2) (” ' (+1 Figure 2 311!1 IR41!1

Claims (1)

[Claims] A through hole through which the lead wire passes and a recess connected to the through hole are formed on the outer surface of the electronic component main body, in which a component element having a lead wire drawn out from the same end face is enclosed in a case, at the end face from which the lead wire is drawn out. An electronic component in which an insulating plate is arranged, ribbon solder or cream solder is sandwiched between the four parts, and the tip of a lead wire passing through a through hole is fitted.