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JPS6282751U - - Google Patents

Info

Publication number
JPS6282751U
JPS6282751U JP1985173198U JP17319885U JPS6282751U JP S6282751 U JPS6282751 U JP S6282751U JP 1985173198 U JP1985173198 U JP 1985173198U JP 17319885 U JP17319885 U JP 17319885U JP S6282751 U JPS6282751 U JP S6282751U
Authority
JP
Japan
Prior art keywords
lead
diode
light emitting
chip
glued
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985173198U
Other languages
Japanese (ja)
Other versions
JPH0416464Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985173198U priority Critical patent/JPH0416464Y2/ja
Publication of JPS6282751U publication Critical patent/JPS6282751U/ja
Application granted granted Critical
Publication of JPH0416464Y2 publication Critical patent/JPH0416464Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Protection Of Static Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る発光ダイオードの一実施
例を示す平面図、第２図は同実施例の回路図、第
３図は本考案の他の実施例を示す平面図、第４図
は従来例を示す平面図である。 １１Ａ及び１１Ｂ……リード、１２……保護用
のダイオードチツプ、１３……ＬＥＤチツプ、１
４……導電線、１５……外囲器（透明樹脂）。 FIG. 1 is a plan view showing one embodiment of a light emitting diode according to the present invention, FIG. 2 is a circuit diagram of the same embodiment, FIG. 3 is a plan view showing another embodiment of the present invention, and FIG. FIG. 2 is a plan view showing a conventional example. 11A and 11B...Lead, 12...Protection diode chip, 13...LED chip, 1
4... Conductive wire, 15... Envelope (transparent resin).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方のリードの反射部または他方のリードの先
端に保護用のダイオードチツプを接着し、このダ
イオードチツプの上面またはリードの反射部に発
光ダイオードの一端を接着し、他端を前記他方の
リードまたはダイオードチツプに導電線を介して
接続し、これらの周囲に透明樹脂で外囲器を形成
したことを特徴とする発光ダイオード。 A protective diode chip is glued to the reflective part of one lead or the tip of the other lead, one end of the light emitting diode is glued to the top surface of this diode chip or the reflective part of the lead, and the other end is attached to the other lead or the diode. A light emitting diode characterized in that it is connected to a chip via a conductive wire, and an envelope is formed around these with a transparent resin.
JP1985173198U 1985-11-11 1985-11-11 Expired JPH0416464Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985173198U JPH0416464Y2 (en) 1985-11-11 1985-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985173198U JPH0416464Y2 (en) 1985-11-11 1985-11-11

Publications (2)

Publication Number Publication Date
JPS6282751U true JPS6282751U (en) 1987-05-27
JPH0416464Y2 JPH0416464Y2 (en) 1992-04-13

Family

ID=31110434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985173198U Expired JPH0416464Y2 (en) 1985-11-11 1985-11-11

Country Status (1)

Country Link
JP (1) JPH0416464Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128484A (en) * 1974-03-27 1975-10-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128484A (en) * 1974-03-27 1975-10-09

Also Published As

Publication number Publication date
JPH0416464Y2 (en) 1992-04-13

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