JPS62172164U - - Google Patents
Info
- Publication number
- JPS62172164U JPS62172164U JP1986060267U JP6026786U JPS62172164U JP S62172164 U JPS62172164 U JP S62172164U JP 1986060267 U JP1986060267 U JP 1986060267U JP 6026786 U JP6026786 U JP 6026786U JP S62172164 U JPS62172164 U JP S62172164U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- light emitting
- emitting diode
- resistor
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図ａ，ｂはこの考案の一実施例の構造を示
す説明図、第２図ａ，ｂはこの考案の他の実施例
の構造を示す説明図、第３図ａは従来のＬＥＤの
構造の一例を示す説明図、第３図ｂは第３図ａに
おける素子間の接続を示す回路図である。
１……ステム、２……外部リード、３……ＬＥ
Ｄチツプ、５……リード線、６……透明樹脂ドー
ム、７……厚膜印刷抵抗、８……厚膜チツプ抵抗
、９……外部リード２の電極。なお各図中同一符
号は同一または相当する部分を示す。
Figures 1a and b are explanatory diagrams showing the structure of one embodiment of this invention, Figures 2a and b are explanatory diagrams showing the structure of another embodiment of this invention, and Figure 3a is an explanatory diagram of the structure of a conventional LED. FIG. 3b is an explanatory diagram showing an example of the structure, and FIG. 3b is a circuit diagram showing connections between elements in FIG. 3a. 1... Stem, 2... External lead, 3... LE
D chip, 5... Lead wire, 6... Transparent resin dome, 7... Thick film printed resistor, 8... Thick film chip resistor, 9... Electrode of external lead 2. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
素子に厚膜印刷抵抗あるいは厚膜チツプ抵抗を用
い、該厚膜印刷抵抗あるいは厚膜チツプ抵抗を発
光ダイオードチツプとともにステムあるいはリー
ドフレーム基板にマウントして本体部に組み込む
とともに発光ダイオードチツプが透明樹脂ドーム
の中心部にくるように構成した発光ダイオード。 A thick film printed resistor or thick film chip resistor is used as an element that limits the current flowing to the light emitting diode chip, and the thick film printed resistor or thick film chip resistor is mounted together with the light emitting diode chip on a stem or lead frame substrate and attached to the main body. A light emitting diode is constructed so that the light emitting diode chip is placed in the center of a transparent resin dome.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986060267U JPS62172164U (en) | 1986-04-23 | 1986-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986060267U JPS62172164U (en) | 1986-04-23 | 1986-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62172164U true JPS62172164U (en) | 1987-10-31 |
Family
ID=30892530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986060267U Pending JPS62172164U (en) | 1986-04-23 | 1986-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62172164U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9231023B2 (en) | 2009-11-13 | 2016-01-05 | Sharp Kabushiki Kaisha | Light-emitting device having a plurality of concentric light transmitting areas |
| US9966367B2 (en) | 2010-01-22 | 2018-05-08 | Sharp Kabushiki Kaisha | Light emitting device |
-
1986
- 1986-04-23 JP JP1986060267U patent/JPS62172164U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9231023B2 (en) | 2009-11-13 | 2016-01-05 | Sharp Kabushiki Kaisha | Light-emitting device having a plurality of concentric light transmitting areas |
| US9966367B2 (en) | 2010-01-22 | 2018-05-08 | Sharp Kabushiki Kaisha | Light emitting device |