JPS6247146U - - Google Patents
Info
- Publication number
- JPS6247146U JPS6247146U JP1985138262U JP13826285U JPS6247146U JP S6247146 U JPS6247146 U JP S6247146U JP 1985138262 U JP1985138262 U JP 1985138262U JP 13826285 U JP13826285 U JP 13826285U JP S6247146 U JPS6247146 U JP S6247146U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- resin
- wire bonding
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 3
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る半導体装置の一実施例に
適用するリードフレームの平面図、第２図は上記
半導体装置の縦断図、第３図は従来の半導体装置
の斜視図である。 １……タブ、２……リード、２ａ……ボンデイ
ング部、２ｂ……半田付部、３……絶縁樹脂部、
４……タイバー、５……枠体、６……リードフレ
ーム、７……ペレツト、８……ボンデイングパツ
ド、９……ワイヤ、１０……樹脂、１１……半田
ブリツジ。
適用するリードフレームの平面図、第２図は上記
半導体装置の縦断図、第３図は従来の半導体装置
の斜視図である。 １……タブ、２……リード、２ａ……ボンデイ
ング部、２ｂ……半田付部、３……絶縁樹脂部、
４……タイバー、５……枠体、６……リードフレ
ーム、７……ペレツト、８……ボンデイングパツ
ド、９……ワイヤ、１０……樹脂、１１……半田
ブリツジ。
Claims (1)
- 【実用新案登録請求の範囲】 (1) ペレツトとリードフレームの各リードのワ
イヤボンデイング部とをワイヤによりボンデイン
グ接続し、かつ該各リードの半田付部及びその近
傍を突出させて全体を樹脂で封止してなる半導体
装置において、前記各リードのワイヤボンデイン
グ部と半田付部との間の部分に絶縁性樹脂を被着
して半田付防止部を形成してなる半導体装置。 (2) 前記半田付防止部は、エポキシ系樹脂を印
刷工法により被着してなる請求の範囲第１項記載
の半導体装置。 (3) 前記半田付防止部は、メラニン系樹脂を印
刷工法により被着してなる請求の範囲第１項記載
の半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985138262U JPS6247146U (ja) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985138262U JPS6247146U (ja) | 1985-09-10 | 1985-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247146U true JPS6247146U (ja) | 1987-03-23 |
Family
ID=31043082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985138262U Pending JPS6247146U (ja) | 1985-09-10 | 1985-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247146U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372662A (ja) * | 1989-05-10 | 1991-03-27 | Hitachi Ltd | 半導体装置 |
-
1985
- 1985-09-10 JP JP1985138262U patent/JPS6247146U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372662A (ja) * | 1989-05-10 | 1991-03-27 | Hitachi Ltd | 半導体装置 |