JPS62268693A - Ic card and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card with a built-in IC module and a manufacturing method thereof.

[Conventional technology]

In recent years, microcomputers (hereinafter referred to as MPUs),
Research is underway on cards called chip cards, memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as IC cards) that are equipped with IC chips such as memory.

This type of IC card is 1.Compared to conventional magnetic cards,
Because of its large storage capacity, banks are considering using it to store the history of deposits and savings in place of passbooks, while credit cards are considering storing the history of transactions such as shopping.

Such 10 cards are usually manufactured by mounting an IC module, which has an IC chip, a circuit board, etc. embedded in the base, on a plastic card base material. Terminals are arranged on the terminals, and the entire surface thereof is exposed to the surface of the card base material.

[Problem that the invention seeks to solve]

However, in this configuration, almost the entire surface of the IC module is exposed on the card surface, which poses a problem in terms of aesthetics.It is desirable to embed the IC module in the card and expose only the terminals with the minimum required area. It was rare.

The present invention has been made in view of such needs, and aims to provide a beautiful IC card that has a simple structure, is easily manufactured, and has only terminals exposed on the card surface, and a method for manufacturing the same.

[Means for Solving the Problems] The IC card of the present invention, which has been made to achieve the above object, includes a core having a through hole into which an IC module is fitted;
An IC module fitted into the through hole of the core, a back oversheet bonded to the back side of the core, and an opening that exposes a terminal area on the front surface of the IC module, although the area is smaller than the IC module. a surface oversheet bonded to the core surface; and an IC module covering oversheet bonded to the IC module surface within the opening and having terminal holes exposing each terminal. It is something.

Moreover, the method of the present invention for manufacturing the above-mentioned IC card is as follows.

The IC module is fitted into the through hole of the core, which has a through hole into which the IC module is fitted, and an oversheet is placed on the back side of the core. A heat deformable IC having terminal holes exposing each terminal of the IC module, in which a surface oversheet having an opening exposing a terminal area of the IC module is stacked and a terminal hole exposing each terminal of the IC module is provided in the opening of the surface oversheet.
The module is characterized in that an exposed oversheet covering the module is placed and the whole is heat-bonded and integrated.

〔Example〕

The present invention will be described in detail below with reference to two embodiments shown in the drawings.

FIG. 3 is a perspective view showing an IC card according to an embodiment of the present invention. This IC card 1 contains an IC module 2, and only its terminals 3 are exposed on the surface. Although eight terminals are shown in one drawing, the number of terminals is not limited to eight and can be increased or decreased as appropriate.

FIG. 4 is an exploded perspective view showing each member constituting the IC card 1 described above. This IC card 1 includes an IC module 2 and a through hole 4A- into which the IC module 2 is fitted.
It has a core 4 with a t-6i diameter, a back oversheet 5 attached to the back surface of the core 4, and an opening 6A that exposes a terminal area on the front surface of the IC module 2, although the area is smaller than that of the IC module 2. , a surface oversheet 6 that is pasted on the surface of the core 4, and a size that is arranged within this opening 6A, and each terminal 3 of the IC module 2.
An IC module covering oversheet 7 is provided with terminal holes 7A exposing the IC module.

1 and 2 are a sectional view and a top view of the IC module portion of the IC card 1 shown in FIG. 3. FIG. The core 4 has the same thickness as the IC module 2, and its through hole 4A
The IC module 2 is fixed in a predetermined position by fitting the IC module 2 into the holder and joining the oversheets 5 and 6 to the front and back surfaces of the holder. Further, the IC module covering oversheet 7 is bonded to the surface of the IC module 2 with only the terminals 3 exposed through the terminal holes 7A, and covers the IC module 2. In this way, an IC card 1 with only the terminals 3 exposed is constructed.

Any known IC module 2 can be used here, and one example is shown in FIG.

The IC module 2 includes an IC module base material JiJ21 made of a glass epoxy film (a film obtained by impregnating glass cloth with an epoxy resin and curing it).

Terminals 3 formed on the surface by plating or the like, an insulating circuit pattern layer 22 having circuit patterns 22A and 22B on one side, and a sealing frame that acts as a sealing frame when molding the IC module. layer 23 and an IC chip 24 such as an MPU or memory attached to the back surface of the base layer 21
and adhesive N25 for joining each layer.

Molding resin 26, through hole 271 connecting terminal 3 and circuit pattern 22I3, circuit pattern 22A, 22
Through hole connecting B 28. It consists of four bodies 29 etc. that connect the IC chip 24 and the circuit pattern 22B.

Here, the area 1 position of the terminal 3 is +sot! determined for the IC card. The size of one terminal 3 is usually set to be about 2 mm x 1.7 ms, which is determined taking into consideration the single standard.

The core 4 has the function of maintaining the shape of the card and protecting the IC module, so it can be used to carry the card,
The impact that is applied to the card when it is used or dropped,
It is made of a material that has mechanical strength that can withstand twisting, bending, etc., and can withstand heat processing during processing. This core 4
Specific materials include various plastics such as vinyl chloride, polyester, polycarbonate acrylic resin, polyamide, polyvinylidene chloride, and vinyl chloride copolymer.

In particular, milky white vinyl chloride is preferred from the viewpoint of cost, workability, appearance, and ease of embossing after being made into a card. The thickness of the core 4 is the same as that of the IC module 2 as described above.
The thickness is the same as that of ill! Normally, it is about 0.6w. The oversheets 5 and 6 are attached to both sides of the core 4 to fix and hold the IC module 2 and prevent the IC module 2 from popping out when the card is bent. shock applied to.

A material that has mechanical strength that can withstand twisting, bending, etc., and can withstand processing during processing.For example, vinyl chloride.

Polyester, polycarbonate, acrylic resin.

Plastics such as polyamide, polyvinylidene chloride, and vinyl chloride copolymers are used, and milky white vinyl chloride is particularly suitable. The thicker the oversheet 5.6 is, the greater the effect of holding the IC module 2 is.

It is not desirable if the entire card becomes thick. Therefore, it is appropriately selected in consideration of the overall thickness of the card and the IC module holding effect, and is usually about 0.1 mm. The smaller the opening 6A formed in the surface overseat, the greater the effect of holding the IC module 2.
is selected to be as small as possible to expose it.

The oversheet 7 to be pasted on the surface of the IC module 2 is provided with the terminal holes 7A that expose the terminals 3 as described above, but the smaller the terminal holes 7A, the smaller the appearance of the card. .7■ Crow) is selected as small as possible. The material constituting the oversheet 7 is selected to prevent the aforementioned small terminal holes 7A from being thermally deformed and crushed during the heat bonding described later.

Heat deformable plastics are used, such as polyester, polycarbonate, polyamide, polyethylene,
Polypropylene, fluorine-containing resin, etc. are used.

The thickness of the oversheet 7 is selected so that when molded into a card, the top surface of the Auburn Toro and the top surface of the oversheet 7 are on the same plane.

Next, a method of manufacturing the above IC card 1 will be explained.

First, a core 4 having a through hole 4A formed therein for fitting the IC module 2 in a predetermined position is prepared. In addition, a front oversheet 6 and a back oversheet 5 are prepared which have undergone necessary printing and have openings 6A at required positions. Furthermore, an IC module covering oversheet 7 is prepared to be placed inside the opening 6A. Note that the core 4, the front oversheet 6, and the back oversheet 5 are all set to the final shape shown in FIG. 4 (it is not necessary).

Next, fit the Ic module into the through hole 4A of the core 4, and overlay the back oversheet 5 on the back side of the core 4.
A surface Auburn Toro is placed on the front surface, and an IC module covering oversheet 7 is further placed in the opening 6A of the five-surface oversheet 6 so as to overlap the surface of the IC module 2. Note that, before superimposing each member, an adhesive is applied to the bonding surface of each part, if necessary. Thereafter, the whole is heat-bonded and integrated using a press, and punched into a predetermined card size. As a result, the IC
module, core 4. It is built into the card base material consisting of Open-) 5, 6, 7, etc.

An IC card ■ with only the terminals exposed is completed. In addition.

A magnetic recording layer is formed on the oversheet 5.6, if necessary.

In the above embodiment, as shown in enlarged form in FIGS. 1 and 5, the IC module 2 used is one in which terminals 3 simply formed by plating or the like are provided on the surface of a flat base layer 21. Therefore, the thickness of the terminal 3 is extremely thin, for example, 30μ.
Since the oversheet 7 attached to the surface of the IC module 2 has a thickness of about 0.1 mm, a recessed portion due to the opening lower A is formed at the portion of the five terminals 3. In order to eliminate these four parts, as shown in Figure 6.

The IC module 2 may have a structure in which the terminals protrude so that the upper surface of the terminals 3 is substantially flush with the upper surface of the oversheet 7. Further, in the above embodiment, a small-area terminal is used as the terminal 3, and is configured to fit into the terminal hole 7A of the oversheet 7.

Instead, a wide terminal extending over almost the entire surface of the IC module 2 may be used, and an oversheet 7 having a small terminal hole 7A may be placed thereon to expose only a portion of the terminal.

FIG. 7 shows another embodiment of the invention. In this embodiment, an IC module 2 having a collar portion 2a is used. This flange portion 2a can be formed by widening the sealing frame layer 23 in FIG. In addition, in FIG. 7, the core 4 includes a first core 4a that penetrates a portion of the IC module 2 that does not have a flange portion, and a flange portion 2a.
It is composed of a laminate including a second core 4b that penetrates through the second core 4b. In this embodiment, when the collar 2a of the IC module 2 is caught on the first core 4a, the IC module
is more reliably prevented from falling off from the card base material. Note that the flange portion 2a is not limited to being formed on the side opposite to the terminal 3 as in the illustrated embodiment, but may be formed on the terminal side or in the middle. Alternatively, the two-circuit pattern layer 22 may be extended laterally.

FIG. 8 shows yet another embodiment. In this embodiment as well, an IC module 2 having a flange portion 2a is used, and a laminate of a first core 4a and a second core 4b is used as the core 4. Furthermore, in this embodiment, a reinforcing sort material 9 having a larger area than the IC module 2 is provided between the IC module 2 and the back oversheet 5. This reinforcing sheet material 9 provides mechanical strength and flexibility to the IC card, and even when the IC card is bent, it will not break at the boundary between the card base material (core 4 and oversheet 5.6) and the IC module 2. 2. A flexible material with high shear strength and resilience when bent, or a material that can be used to connect the card base material and the rigid IC module when the IC card is bent. It is made of a material with sufficient pushability to absorb the shear stress concentrated at the boundary and diffuse the force. The reinforcing sheet material 9 may be (1) a mesh-like knitted fabric made of various fibers such as synthetic fibers, natural fibers, inorganic fibers, metal fibers, etc., or a porous material made by punching holes in various plastic films or metal fibers; (ii) A nonwoven fabric obtained by arranging various fibers in a thin cotton-like or cloak-like manner using an appropriate method and bonding the fibers together using the bonding force of an adhesive or the like.

(iii) Continuum sheet made of plastinokuntu, metal foil, etc. (iv) Various rubbers or thermoplastic elastomers), (v) Rubber adhesive layer, (vi) Menu-shaped sheet, nonwoven fabric, continuum sheet described above , rubber, etc. as a base sheet, and at least one side thereof is coated with a rubber adhesive, a pressure-sensitive adhesive, a track-visible resin adhesive, a composite adhesive such as polyvinyl formal phenolic, or a thermosetting resin such as epoxo resin. An adhesive or a pressure-sensitive adhesive sheet provided with a layer of a synthetic resin adhesive is used. Although the size and shape of the reinforcing sheet to be laid are arbitrary, it is formed so that at least the peripheral edge of the boundary between the card base and the IC module is substantially covered. The IC card has this structure.

The reinforcing sheet can more reliably prevent the IC module from falling off.

〔Effect of the invention〕

As is clear from the above description, the IC card of the present invention has an IC module fitted into the through hole of the core, a back oversheet bonded to the back side, and an IC card on the front side.
Since a surface oversheet with an opening area smaller than that of the module is bonded, Ic with 9 double-sided oversheets
The module can be fixed at a predetermined position on the core, and an IC module covering oversheet having terminal holes that expose the terminals is bonded to the top surface of the IC module, so the IC module surface can be covered with the oversheet. It has the effect of improving the appearance.

Further, in the IC card manufacturing method of the present invention, the IC module is fitted into the through hole of the core, a back oversheet and a front oversheet are stacked on the back two surfaces of the core, and further, in the opening of the front oversort, I has track deformation resistance with terminal holes that expose each terminal of the IC module.
The C module is placed on a covered auburn track and the whole is heat-bonded and integrated. By this method, the above-mentioned IC cart can be manufactured, and moreover, the core and It is possible to simultaneously perform bonding between the oversheets and between the IC module and the oversheet, and the manufacturing process is simple.

[Brief explanation of drawings]

FIG. 1 is a sectional view of the main parts of an IC card according to an embodiment of the present invention, FIG. 2 is a top view thereof, and FIG. 3 is an I of an embodiment of the present invention.
Figure 4 is an exploded perspective view of each part of the IC card; Figure 5 is the IC module used in the IC card; Figures 6, 7, and 8 are respectively FIG. 7 is a sectional view of a main part showing another embodiment of the present invention. 1-1c cart 2- IC module 3-terminal
4-core

Claims (2)

[Claims] (1) A core with a through hole into which an IC module is fitted, an IC module fitted into the through hole of this core,
a back oversheet bonded to the back surface of the core; a front oversheet bonded to the core surface and having an opening that exposes a terminal area on the front surface of the IC module, although the area is smaller than the IC module; , an IC card having an IC module covering oversheet bonded to the IC module surface within the opening and having terminal holes exposing each terminal. (2) Fit the IC module into the through hole of the core, which has a through hole into which the IC module is fitted, overlay an oversheet on the back side of the core, and place the IC module on the surface, although the area is smaller than the IC module. A heat deformation-resistant IC module covering oversheet comprising a surface oversheet having an opening that exposes a terminal area on the surface of the module, and a terminal hole exposing each terminal of the IC module in the opening of the surface oversheet. A method of manufacturing an IC card, characterized by arranging the IC cards and heat-bonding the whole to integrate them.