JPS61204788A - Portable electronic device - Google Patents
Portable electronic deviceInfo
- Publication number
- JPS61204788A JPS61204788A JP60045977A JP4597785A JPS61204788A JP S61204788 A JPS61204788 A JP S61204788A JP 60045977 A JP60045977 A JP 60045977A JP 4597785 A JP4597785 A JP 4597785A JP S61204788 A JPS61204788 A JP S61204788A
- Authority
- JP
- Japan
- Prior art keywords
- module
- base material
- card
- connecting member
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 47
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 37
- 239000007769 metal material Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- WBHAUHHMPXBZCQ-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound COC1=CC=CC(C)=C1O WBHAUHHMPXBZCQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の背景〕
本発明は、ＩＣモジュールを装着もしくは内蔵した携持
用電子装置に関する。DETAILED DESCRIPTION OF THE INVENTION BACKGROUND OF THE INVENTION The present invention relates to portable electronic devices equipped with or incorporating an IC module.
近年、カード、各種認Ｗｉ票、ドッグタグ、ドアロック
、キーホルダー、ペンダントなどの携帯品中にＩＣモジ
ュールを装着することにより、情報蓄積・情報処理機能
を付与させた物品の開発が種々行なわれている。In recent years, various products have been developed that are equipped with information storage and processing functions by installing IC modules into portable items such as cards, Wi-Fi cards, dog tags, door locks, key chains, and pendants. .
たとえば、カードを例にとって説明すると、従来、マイ
ク・Ｏコンピュータ（ＭＰｔＪ）、メモリなどのＩＣチ
ップを装備したチップカード、メモリカード、マイコン
カードあるいは電子カードと呼ばれるカード（以下、単
にＩＣカードという）の研究が進められている。For example, let's take a card as an example. Conventionally, there are cards called microphone-o-computer (MPtJ), chip cards equipped with IC chips such as memory, memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as IC cards). Research is underway.
このようなＩＣカードは、従来の磁気カードに比べて、
その記憶容量が大きいことから、銀行関係では預金通帳
に代り預貯金の履歴を、そしてクレジット関係では買物
などの取引履歴を記憶させようと考えられている。Compared to conventional magnetic cards, such IC cards have
Because of their large storage capacity, banks are considering using them to store the history of deposits and savings in place of passbooks, and credit cards are considering storing the history of transactions such as shopping.
そして、従来のＩＣカードとしては、プラスチック製カ
ード基材中にＩＣモジュール大の四部を設け、この凹部
にＩＣモジュールを埋設したものが一般的である。また
、カード基材中にＩＣモジュールを埋設する場合、カー
ド基材の屈曲によってＩＣモジュールが脱落しないよう
に、ＩＣモジュールを基材凹部に接着剤で固定する方法
が通常とられている。A conventional IC card is generally one in which four IC module-sized parts are provided in a plastic card base material, and the IC module is embedded in the recesses. Furthermore, when embedding an IC module in a card base material, a method is usually used in which the IC module is fixed in a recessed part of the base material with an adhesive to prevent the IC module from falling off due to bending of the card base material.
一般的な規格に従えば、ＩＣカードは、厚さが約０．８
ｍｆｆＪ後であり、携帯時や使用時の条件からある程度
の屈曲性と柔軟性を備えていなＧノればならない。また
、ＩＣモジュールに内蔵された半導体素子は、数履角で
厚さ０．３〜０．４履のシリコン板からなり、ＭＰＵ１
メモリ等の部品が微細回路網で結線されてＩＣモジュー
ルが構成されている。このようなＩＣモジュールは、屈
曲によるＩＣチップの割れや回路の断線を防止するため
、剛性の高い合成樹脂で電子部品や回路網を封止して形
成されている。According to general standards, the thickness of an IC card is approximately 0.8
It is after MFFJ, and must have a certain degree of bendability and flexibility due to the conditions when carrying and using it. In addition, the semiconductor element built into the IC module is made of a silicon plate with a thickness of 0.3 to 0.4 mm, and the MPU1
Components such as memory are connected through a fine circuit network to form an IC module. Such IC modules are formed by sealing electronic components and circuit networks with a highly rigid synthetic resin in order to prevent IC chips from cracking and circuits from breaking due to bending.
このように、従来のＩＣカードなどの掛持用電子装置は
、屈曲性、柔軟性のある基材中に剛性の高いＩＣモジュ
ールが埋設された構成をとっているため、不可避的に次
のような問題が生ずる。In this way, conventional electronic devices such as IC cards have a structure in which a highly rigid IC module is embedded in a flexible and flexible base material, so the following problems inevitably occur. A problem arises.
（イ） 基材の屈曲の程度によっては、基材とＩＣモジ
ュールとの間の接着部が剥離してＩＣモジュールが床材
から脱落する。(a) Depending on the degree of bending of the base material, the adhesive portion between the base material and the IC module may peel off, causing the IC module to fall off from the flooring material.
（ロ） ＩＣモジュールが基材と強固に接着している
場合、基材の屈曲によって、両者の境界部で折れや割れ
が発生する。(b) When an IC module is firmly adhered to a base material, bending of the base material causes bending or cracking at the boundary between the two.
（ハ） 上記（イ）、（ロ）のような事態が生じない場
合であっても、屈曲による歪みが基材に残留し、平面状
態に復元することが困難な場合がある。(c) Even if the situations (a) and (b) above do not occur, distortion due to bending may remain in the base material and it may be difficult to restore it to a flat state.
（ニ） 基材とＩＣモジュールとを一体化する時に、Ｉ
Ｃモジュールの厚さのばらつぎゃモジュール接着面の凹
凸のため基材面に曲りや凹凸が生じたり、埋設工程時に
生ずる歪によって、基材面に印刷した絵柄等に歪みが発
生し、カードの品質、審美的価値を低下させる。(d) When integrating the base material and the IC module,
C. If the thickness of the module varies, the unevenness of the module adhesive surface will cause bends and unevenness on the base material surface, and distortions that occur during the embedding process will cause distortions in the patterns printed on the base material surface, causing damage to the card. Decreases quality and aesthetic value.
（ホ） ＩＣモジュールの接着強度にばらつきが生じ
やすい。(e) Adhesive strength of IC modules tends to vary.
（へ） 一般に製造工程が複雑になり、製品歩留が不安
定である。(F) Generally, the manufacturing process becomes complicated and the product yield is unstable.
（ト） カード状の薄い基材中にＩＣモジュールを内
蔵させる場合は、モジュール部の電子回路保護のための
封止樹脂も薄くせざるを得す、耐湿性、耐活性ガス性が
通常の電子部品よりも劣り、それゆえ信頼性が必然的に
低下する。(g) When an IC module is built into a thin card-like base material, the sealing resin for protecting the electronic circuits in the module must be made thinner. inferior to the component and therefore necessarily less reliable.
（発明の概要〕
本発明は上述した点に鑑みてなされたものであり、基材
の屈折・屈曲によって生ずる種々の問題が、解消され、
信頼性が大巾に向上した掛持用電子装置を提供すること
を目的とする。(Summary of the Invention) The present invention has been made in view of the above-mentioned points, and various problems caused by bending and bending of the base material are solved,
An object of the present invention is to provide a hanging electronic device with greatly improved reliability.
上記目的を達成するため本発明の掛持用電子装置は、基
材中にＩＣモジュールが内蔵された掛持用電子装置にお
いて、前記基材に貫通形成されたＩＣモジュール取付孔
と、このＩＣモジュール取付孔の表裏両面における各開
口部の縁部周辺を覆い、かつ、基材ならびにＩＣモジュ
ール取付孔に内設されたＩＣモジュールとを表裏両面か
ら挟むようにして配設された２つの補強部材と、上記２
つの補強部材どうしを一体連結する連結部材とからなる
ことを特徴とする。In order to achieve the above object, a hanging electronic device of the present invention includes an IC module mounting hole formed through the base material, and an IC module mounting hole formed through the base material. two reinforcing members disposed to cover the periphery of the edges of each opening on both the front and back sides of the mounting hole, and sandwiching the base material and the IC module installed in the IC module mounting hole from both the front and back sides; 2
and a connecting member that integrally connects two reinforcing members to each other.
以下、本発明を、図面に示す具体例に基づいてさらに詳
細に説明する。Hereinafter, the present invention will be explained in more detail based on specific examples shown in the drawings.
第１図は、第２図に示す本発明の一実施例に係るＩＣカ
ードの平面図にａ３けるＡ−Ａ面の断面図である。第１
図に示すように、本発明に係るＩＣカードは、カード基
材１に貫通形成されたＩＣモジュール取付用孔にＩＣモ
ジュール２が内蔵されてなり、このＩＣモジュール２は
、補強部材３ａと円板状の補強部材３ｂにより挟設され
るとともに、ＩＣモジュール２の側面部は、上記補強部
材３ａと３ｂとを一体連結するリング状の連結部材４に
よって囲繞されている。この例の場合、カードの表側の
面（外部接続端子２ａが形成されている側）に接続端子
を露出させるため、補強部材３ａは、第２図に示すよう
に、刀のつば状の形態である。この補強部材３ａは第３
図に示すような外形を有していてもよい。FIG. 1 is a sectional view taken along line A-A at a3 in the plan view of the IC card according to the embodiment of the present invention shown in FIG. 1st
As shown in the figure, the IC card according to the present invention includes an IC module 2 built into an IC module mounting hole formed through a card base material 1, and this IC module 2 includes a reinforcing member 3a and a circular plate. The side surface of the IC module 2 is surrounded by a ring-shaped connecting member 4 that integrally connects the reinforcing members 3a and 3b. In this example, in order to expose the connection terminals on the front surface of the card (the side on which the external connection terminals 2a are formed), the reinforcing member 3a has a sword-shaped shape as shown in FIG. be. This reinforcing member 3a is the third reinforcing member 3a.
It may have an external shape as shown in the figure.
上記構成において、一般に、基材１と連結部材４ならび
に連結部材４とＩＣモジュール２は接着剤等で固着する
必要は必ずしもないが、カードの製造工程上の必要性か
ら接着剤を使用する場合であっても、従来のＩＣカード
のように、ＩＣモジュール部が内設される部分すべてに
接着剤を適用して固着する必要はなく、基材やモジュー
ルの端部のみ、または補強部材の一部に適用して固着す
れば足りる。ＩＣモジュール２と、これを囲繞する補強
部材３ａ、３ｂならびに連結部材４との間には、ある程
度の遊嵌状態が保持されているので、カード基材の任意
の屈曲に対してＩＣモジュールはほぼ独立した状態で存
在し得ることになる。In the above configuration, it is generally not necessary to bond the base material 1 and the connecting member 4, and the connecting member 4 and the IC module 2 with an adhesive or the like, but if an adhesive is used due to the necessity of the card manufacturing process, However, unlike conventional IC cards, it is not necessary to apply adhesive to all parts where the IC module is installed, but only the edges of the base material or module, or part of the reinforcing member. It is sufficient to apply it to the surface and fix it. A certain degree of loose fitting is maintained between the IC module 2, the reinforcing members 3a and 3b surrounding it, and the connecting member 4, so that the IC module will almost not bend when the card base material is bent. It can exist independently.
このように、本発明に係るＩＣカードは、カード基１Ｉ
１１１とこの基材中に内設されるＩＣモジュール２との
境界部分が、補強部材３ａと３ｂによって表裏両面から
挟持され、かつ、これら補強部材３ａと３ｂは連結部材
４により一体連結されているので、カードを曲げたとき
に生ずる歪みは補強部材３ａ、３ｂによって吸収され、
内設されたＩＣモジュール部への悪影響を効果的に防止
することができる。In this way, the IC card according to the present invention has a card base 1I.
The boundary between 111 and the IC module 2 installed inside this base material is held between the front and back sides by reinforcing members 3a and 3b, and these reinforcing members 3a and 3b are integrally connected by a connecting member 4. Therefore, the distortion that occurs when the card is bent is absorbed by the reinforcing members 3a and 3b.
It is possible to effectively prevent adverse effects on the internally installed IC module section.
上記補強部材３ａ、３ｂならびに連結部材４の材料とし
ては、屈曲による歪みを効果的に吸収し、かつ強度、柔
軟性、加工性が良好であって審美性にも富むものが選ば
れ、たとえば、ｌ”ｅ、 Ｃｕ。Materials for the reinforcing members 3a, 3b and the connecting member 4 are selected from materials that effectively absorb distortion caused by bending, have good strength, flexibility, workability, and are aesthetically pleasing, such as: l”e, Cu.
Ａｌ、Ｎｉ、 Ｔｉ、Ｔａ、ステンレスなどの金属が好
ましく用いられ得る。ＡＩ、ステンレス、Ｔｉ、Ｔａ等
は、電気化学的陽極酸化によって着色することもできる
ので審美上好ましく用いられる。薄さと強度、復元性（
゛柔軟性）の点では、バネ鋼板がすぐれている。また、
ＩＣモジュールの封止（保護）樹脂層が薄い場合、ボン
ディングワイヤが趣旨層上に露出することがあるが、こ
のような場合の電気的絶縁を確保するためには、補強部
材３ｂのＩＣモジュール側の面は絶縁性にしておくこと
が望ましい。上述したように、陽極酸化した金属材料は
この点有利である。ざらに、上記補強部材、連結部材と
しては、ポリエステル、塩化ビニル、ポリエチレン等柔
軟性にすぐれ、かつ引っばり強度の大きな合成樹脂を用
いることもできる。Metals such as Al, Ni, Ti, Ta, and stainless steel can be preferably used. AI, stainless steel, Ti, Ta, etc. can be colored by electrochemical anodic oxidation and are therefore preferably used aesthetically. Thinness, strength, and resilience (
In terms of flexibility, spring steel sheets are superior. Also,
If the sealing (protection) resin layer of the IC module is thin, the bonding wire may be exposed on the target layer, but in order to ensure electrical insulation in such a case, the IC module side of the reinforcing member 3b must be It is desirable that the surface is insulating. As mentioned above, anodized metal materials are advantageous in this respect. In general, as the reinforcing member and the connecting member, synthetic resins having excellent flexibility and high tensile strength, such as polyester, vinyl chloride, and polyethylene, can also be used.
なお、上記部材を金属で構成することにより、静電気に
対する保護機能を付与することもできる。In addition, by configuring the above-mentioned member with metal, it is also possible to provide a protection function against static electricity.
本発明の他の実施例を第４図および第５図に示す。第４
図は、第５図に示す本発明のＩＣカードのＢ−Ｂ線にお
ける断面図である。Another embodiment of the invention is shown in FIGS. 4 and 5. Fourth
The figure is a sectional view taken along the line BB of the IC card of the present invention shown in FIG.
この実施例においては、接続端子２ａ側の補強部材３ａ
はＩＣモジュールの周縁部を部分的に覆うように配設さ
れており、しかもその端部が連結孔５を通じてカード裏
面側の補強部材３ｂに連結されている。In this embodiment, the reinforcing member 3a on the connection terminal 2a side
is disposed so as to partially cover the peripheral edge of the IC module, and its end is connected to the reinforcing member 3b on the back side of the card through the connecting hole 5.
さらに、第６図に示す実施例においては、カード基材１
の表面と補強部材３ａ、３ｂの表面が同一平面となるよ
うに構成されている。Furthermore, in the embodiment shown in FIG.
The surfaces of the reinforcing members 3a and 3b are flush with each other.
次に、第１図に示した本発明に係るＩＣカードの製造方
法について、第７図〜第９図を参照しながら説明する。Next, a method for manufacturing the IC card according to the present invention shown in FIG. 1 will be explained with reference to FIGS. 7 to 9.
まず、カード基材としては、従来のカードに用いられて
いるもの、たとえば、塩化ビニル、ポリエステル樹脂、
ポリカーボネート樹脂、アクリル樹脂、紙、樹脂含浸紙
、プリント基板用材料（フェノール樹脂、エポキシ樹脂
、ガラスエポキシ樹脂等）が広く使用し得る。たとえば
、塩化ビニル樹脂を用いる場合、規格の厚さの樹脂板に
必要に応じて印刷を施こしたのち、所望の位置に、ＩＣ
モジュールに対応したＩＣモジュール取付孔を貫通形成
する。First, the card base materials are those used in conventional cards, such as vinyl chloride, polyester resin,
Polycarbonate resins, acrylic resins, paper, resin-impregnated paper, printed circuit board materials (phenolic resins, epoxy resins, glass epoxy resins, etc.) can be widely used. For example, when using vinyl chloride resin, after printing as necessary on a resin plate of standard thickness, IC
An IC module mounting hole corresponding to the module is formed through the IC module.
ここで、ＩＣモジュールの製造は常法に従って行なわれ
る。たとえば、小型回路基板上にマイクロプロセッサお
よびメモリの２チツプ、または、これら両者を一体化し
た１チツプＩＣを設置し、ワイヤボンディング法（Ａｕ
、ＡＩ等の金属線で接続する方法）やフラットボンディ
ング法（フィルムキャリアを用いて面内に全端子を同時
に接続する方法）で各部品間の電気的接続を行ない、次
いで、絶縁性樹脂によって全体を保護モールドしてＩｃ
モジュールを得る。Here, the IC module is manufactured according to a conventional method. For example, a two-chip microprocessor and memory chip, or a single-chip IC that integrates both, is installed on a small circuit board, and wire bonding (Au
Electrical connections are made between each component using the flat bonding method (a method of connecting all terminals simultaneously within a plane using a film carrier), and then the whole is bonded with an insulating resin. Protective mold and Ic
Get module.
次に、第７図に示すように、補強部材３ａ。Next, as shown in FIG. 7, the reinforcing member 3a.
３ｂおよび連結部材４を各々用意する。端子側に配設す
る補強部材３ａと連結部材４とは、あらかじめ第８図に
示すように接合して一体化しておくと、実際の工程上便
利である。3b and the connecting member 4 are prepared. It is convenient in the actual process if the reinforcing member 3a and the connecting member 4 arranged on the terminal side are joined and integrated in advance as shown in FIG. 8.
次いで、第９図に示すように、カード基材のＩＣモジュ
ール取付孔に上記ＩＣモジュール２、補強部材３ａ、連
結部材４を設置し、さらに補強部材３ｂを連結部材４に
固着する。補強部材３ａ。Next, as shown in FIG. 9, the IC module 2, the reinforcing member 3a, and the connecting member 4 are installed in the IC module mounting hole of the card base material, and the reinforcing member 3b is further fixed to the connecting member 4. Reinforcement member 3a.
３ｂと連結部材４との接合には通常の有機接着剤を用い
ることができるが、上記部材が金属の場合には、ハンダ
付や高周波ウエルグー法により極めて強固な接合が可能
となる。An ordinary organic adhesive can be used to join the connecting member 3b and the connecting member 4, but if the member is made of metal, extremely strong joining can be achieved by soldering or the high frequency welding method.
このような製造形態をとることによって、ＩＣモジュー
ル２ならびにカード基材１は、カード表裏両面から補強
部材３ａ、３ｂにより挟設され、しかも従来のように接
着剤を介して基材とＩＣモジュールとを一体的に固着す
る必要もない。但し、補強部材３ａ、３ｂを、極め’ｃ
ｍ＜比較的弱い材質の材料で構成する場合は、ＩＣモジ
ュールと補強部材とを接着剤層を介して固着することも
できる。By employing this manufacturing method, the IC module 2 and the card base material 1 are sandwiched between the reinforcing members 3a and 3b from both the front and back sides of the card, and the base material and the IC module are connected to each other via an adhesive as in the conventional case. There is no need to fix them together. However, if the reinforcing members 3a and 3b are
When the IC module and the reinforcing member are made of a relatively weak material, the IC module and the reinforcing member may be fixed to each other via an adhesive layer.
上述した例は、本発明の掛持用電子装置がＩＣカードで
ある場合の実施例であるが、本発明は上記カードの様な
平板状の物品のみならず、ＩＣキーやペンなどの棒状の
物品、ペンダント、タイピン、ブローチなどの装身具な
どにも広く適用し得る。The above-mentioned example is an example in which the electronic device for carrying according to the present invention is an IC card, but the present invention is applicable not only to flat articles such as the above-mentioned card, but also to stick-shaped articles such as IC keys and pens. It can also be widely applied to accessories such as articles, pendants, tie pins, and brooches.
第１０図は、本発明の掛持用電子装置がペンダントの場
合の実施例であり、第１１図（ａ）。FIG. 10 shows an embodiment in which the hanging electronic device of the present invention is a pendant, and FIG. 11(a) shows the embodiment.
（ｂ）はタイピンに適用した場合の実施例である。(b) is an example in which the present invention is applied to a tie pin.
（発明の効果）
以上説明したように、本発明の掛持用電子装置は、基材
とＩＣモジュール取付孔に内設されたＩＣモジュールと
を表裏両面から補強部材によって挟設するようにしたの
、で、次のような効果を有している。(Effects of the Invention) As explained above, in the hanging electronic device of the present invention, the base material and the IC module installed inside the IC module mounting hole are sandwiched between the front and back sides by reinforcing members. , and has the following effects.
（イ） 基材を屈曲したときの歪みが補強部材によって
効果的に吸収されるので、ＩＣモジュールの剥離や割れ
、脱落といった問題が解消される。(a) Since the strain caused when the base material is bent is effectively absorbed by the reinforcing member, problems such as peeling, cracking, and falling off of the IC module are resolved.
（ロ） ＩＣモジュールが基材中に遊嵌状態で内蔵さ
れているので、基材の屈曲によって、ＩＣモジュールと
基材との接合部分の折れ、割れの発生もなく、平面状態
への復元性にもすぐれている。(b) Since the IC module is built into the base material in a loosely fitted state, the joint between the IC module and the base material does not break or crack due to bending of the base material, and can be restored to a flat state. It is also excellent.
（ハ） ＩＣモジュールを基材中に内設する際にＩＣ
モジュール厚のばらつきやＩＣモジュール接着面の凹凸
に起因する基材表面のゆがみや凹凸の問題が生じないの
で、物品の審美性、品質の向上を図ることができる。(c) When installing the IC module in the base material,
Since problems of distortion and unevenness of the base material surface due to variations in module thickness and unevenness of the IC module bonding surface do not occur, the aesthetics and quality of the article can be improved.
（ニ） ＩＣモジュールの接着強度のばらつきの問題
が解消される。(d) The problem of variations in adhesive strength of IC modules is solved.
（ホ） 従来のように、基材中に凹部を！ｉＱｔプ接着
剤を介してＩＣモジュールを埋設するといったｉ！雑な
工程が不要となるので、製造工程が簡略化さ・れ、歩留
が向上する。(e) Create a recess in the base material like before! i!, such as embedding an IC module using iQt adhesive Since complicated steps are no longer necessary, the manufacturing process is simplified and the yield is improved.
（ホ） 従来のものよりも耐湿性、耐活性ガス性が向上
し、電気的信頼性も一層すぐれたものとなる。(e) Moisture resistance and active gas resistance are improved compared to conventional products, and electrical reliability is also improved.
第１図、第４図、第６図は各々本発明の一実施例に係る
ＩＣカードの断面図、第２図、第３図、第５図は本発明
の一実施例に係るＩＣカードの平面図であり、第７〜９
図は、本発明の一実施例に係るＩＣカードの！Ｊ造工程
を示す断面図、第１０図、第１１図は本発明の他の実施
例の外観図である。
１・・・基材、２・・・ＩＣモジュール、２ａ・・・接
続端子、３ａ、３ｂ・・・補強部材、４・・・連結部材
、５・・・連結孔。
出願人代理人 猪 股 清
５１ 図
６２ 図
■
？！５３ 図
５４ 図
ら５ 図
■
６６ 囚
６７ 図
３゜
５８ 図
６９ 図
ｂ
６１０ 閉
も１１ 圀1, 4, and 6 are sectional views of an IC card according to an embodiment of the present invention, and FIGS. 2, 3, and 5 are sectional views of an IC card according to an embodiment of the present invention. It is a plan view, and the 7th to 9th
The figure shows an IC card according to an embodiment of the present invention! A sectional view showing the J-building process, and FIGS. 10 and 11 are external views of other embodiments of the present invention. DESCRIPTION OF SYMBOLS 1... Base material, 2... IC module, 2a... Connection terminal, 3a, 3b... Reinforcement member, 4... Connection member, 5... Connection hole. Applicant's agent Kiyoshi Inomata 51 Figure 62 Figure ■ ? ! 53 Figure 54 Figure 5 Figure ■ 66 Prisoner 67 Figure 3゜58 Figure 69 Figure b 610 Shumo 11
Claims (2)
置において、前記基材に貫通形成されたＩＣモジュール
取付孔と、このＩＣモジュール取付孔の表裏両面におけ
る各開口部の縁部周辺を覆いかつ基材ならびにＩＣモジ
ユール取付孔に内設されたＩＣモジユールとを表裏両面
から挟むようにして配設された２つの補強部材と、上記
２つの補強部材どうしを一体連結する連結部材とからな
ることを特徴とする、携持用電子装置。1. In a portable electronic device in which an IC module is built in a base material, the IC module mounting hole formed through the base material and the periphery of each opening on both the front and back surfaces of the IC module mounting hole are covered and It is characterized by consisting of two reinforcing members arranged to sandwich the base material and the IC module installed in the IC module mounting hole from both sides, and a connecting member that integrally connects the two reinforcing members. portable electronic devices.
、特許請求の範囲第１項に記載の携持用電子装置。2. The portable electronic device according to claim 1, wherein the reinforcing member and the connecting member are made of a metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60045977A JPS61204788A (en) | 1985-03-08 | 1985-03-08 | Portable electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60045977A JPS61204788A (en) | 1985-03-08 | 1985-03-08 | Portable electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61204788A true JPS61204788A (en) | 1986-09-10 |
Family
ID=12734262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60045977A Pending JPS61204788A (en) | 1985-03-08 | 1985-03-08 | Portable electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61204788A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262295A (en) * | 1988-08-29 | 1990-03-02 | Matsushita Electric Ind Co Ltd | Information medium, conveying body therefor and reader thereof |
| WO1990008365A1 (en) * | 1989-01-19 | 1990-07-26 | W. & T. Avery Limited | Portable electronic token |
| US5559370A (en) * | 1993-10-08 | 1996-09-24 | Gay Freres Vente Et Exportation S.A. | Electronic label and carriers therefor |
| WO1997048133A1 (en) * | 1996-06-14 | 1997-12-18 | Siemens Aktiengesellschaft | Carrier element for semiconductor chips |
| FR2756954A1 (en) * | 1996-12-05 | 1998-06-12 | Solaic Sa | IC card with local stiffening layer |
| DE10111028A1 (en) * | 2001-03-07 | 2002-09-19 | Infineon Technologies Ag | Smart card module |
| JP2007293561A (en) * | 2006-04-25 | 2007-11-08 | Shoichi Nakamura | Personal authentication accessory |
| EP2187344A1 (en) | 2008-11-17 | 2010-05-19 | Fujitsu Limited | Radio-frequency identification tag |
| JP4580525B2 (en) * | 2000-09-13 | 2010-11-17 | 大日本印刷株式会社 | IC card with reinforcement member |
-
1985
- 1985-03-08 JP JP60045977A patent/JPS61204788A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262295A (en) * | 1988-08-29 | 1990-03-02 | Matsushita Electric Ind Co Ltd | Information medium, conveying body therefor and reader thereof |
| WO1990008365A1 (en) * | 1989-01-19 | 1990-07-26 | W. & T. Avery Limited | Portable electronic token |
| US5559370A (en) * | 1993-10-08 | 1996-09-24 | Gay Freres Vente Et Exportation S.A. | Electronic label and carriers therefor |
| WO1997048133A1 (en) * | 1996-06-14 | 1997-12-18 | Siemens Aktiengesellschaft | Carrier element for semiconductor chips |
| FR2756954A1 (en) * | 1996-12-05 | 1998-06-12 | Solaic Sa | IC card with local stiffening layer |
| JP4580525B2 (en) * | 2000-09-13 | 2010-11-17 | 大日本印刷株式会社 | IC card with reinforcement member |
| DE10111028A1 (en) * | 2001-03-07 | 2002-09-19 | Infineon Technologies Ag | Smart card module |
| JP2007293561A (en) * | 2006-04-25 | 2007-11-08 | Shoichi Nakamura | Personal authentication accessory |
| EP2187344A1 (en) | 2008-11-17 | 2010-05-19 | Fujitsu Limited | Radio-frequency identification tag |
| US8002195B2 (en) | 2008-11-17 | 2011-08-23 | Fujitsu Limited | Radio-frequency identification tag |
| US8286888B2 (en) | 2008-11-17 | 2012-10-16 | Fujitsu Limited | Radio-frequency identification tag |
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