JPS62192693U - - Google Patents
Info
- Publication number
- JPS62192693U JPS62192693U JP8035786U JP8035786U JPS62192693U JP S62192693 U JPS62192693 U JP S62192693U JP 8035786 U JP8035786 U JP 8035786U JP 8035786 U JP8035786 U JP 8035786U JP S62192693 U JPS62192693 U JP S62192693U
- Authority
- JP
- Japan
- Prior art keywords
- metal foils
- electronic component
- circuit board
- printed circuit
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Description
第1図、第2図は本考案の一実施例を示す図、
第3図は金属箔の斜視図を示す図、第4図は従来
の電子部品放熱構造を示す図である。
図中、1はIC、2は放熱板、3はプリント基
板、4は筐体、5,6は金属箔、7はスルーホー
ルである。
FIGS. 1 and 2 are diagrams showing an embodiment of the present invention,
FIG. 3 is a perspective view of the metal foil, and FIG. 4 is a diagram showing a conventional electronic component heat dissipation structure. In the figure, 1 is an IC, 2 is a heat sink, 3 is a printed circuit board, 4 is a housing, 5 and 6 are metal foils, and 7 is a through hole.
Claims (1)
面に金属箔を形成し、該夫々の金属箔を接続する
とともに、一方の金属箔上に前記電子部品を実装
し、他方の金属箔を筐体に接触させてなることを
特徴とする電子部品の放熱構造。 Metal foils are formed on the front and back surfaces of the electronic component mounting area on the printed circuit board, the respective metal foils are connected, and the electronic component is mounted on one of the metal foils, and the other metal foil is brought into contact with the casing. A heat dissipation structure for electronic components that is characterized by
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8035786U JPS62192693U (en) | 1986-05-27 | 1986-05-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8035786U JPS62192693U (en) | 1986-05-27 | 1986-05-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62192693U true JPS62192693U (en) | 1987-12-08 |
Family
ID=30931090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8035786U Pending JPS62192693U (en) | 1986-05-27 | 1986-05-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62192693U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5739596A (en) * | 1980-08-21 | 1982-03-04 | Tokyo Shibaura Electric Co | Printed cirucit board |
JPS5726895B2 (en) * | 1976-10-01 | 1982-06-07 |
-
1986
- 1986-05-27 JP JP8035786U patent/JPS62192693U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5726895B2 (en) * | 1976-10-01 | 1982-06-07 | ||
JPS5739596A (en) * | 1980-08-21 | 1982-03-04 | Tokyo Shibaura Electric Co | Printed cirucit board |
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