JPH0227759U - - Google Patents
Info
- Publication number
- JPH0227759U JPH0227759U JP10598588U JP10598588U JPH0227759U JP H0227759 U JPH0227759 U JP H0227759U JP 10598588 U JP10598588 U JP 10598588U JP 10598588 U JP10598588 U JP 10598588U JP H0227759 U JPH0227759 U JP H0227759U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin layer
- circuit board
- printed circuit
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は本考案に係るプリント基板を示す斜視
図、第２図はその断面図、第３図は従来のプリン
ト基板を示す斜視図、第４図はその断面図である
。
１……プリント基板、１ａ……放熱用金属板、
１ｂ……樹脂層、３……電子部品、１１……第一
の銅箔、１３……スルーホール。
FIG. 1 is a perspective view of a printed circuit board according to the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is a perspective view of a conventional printed circuit board, and FIG. 4 is a sectional view thereof. 1...Printed circuit board, 1a...metal plate for heat dissipation,
1b...Resin layer, 3...Electronic component, 11...First copper foil, 13...Through hole.
Claims (1)
電子部品が前記樹脂層に密接された状態で搭載さ
れるプリント基板において、前記電子部品と対応
する樹脂層の電子部品搭載面に電子部品と対接さ
れる伝熱用銅箔を設け、この伝熱用銅箔をスルー
ホールを介して前記放熱用金属板に接続したこと
を特徴とするプリント基板。 It has a heat dissipation metal plate whose surface is covered with a resin layer,
In a printed circuit board on which an electronic component is mounted in close contact with the resin layer, a copper foil for heat transfer is provided on the electronic component mounting surface of the resin layer corresponding to the electronic component, and is in contact with the electronic component. A printed circuit board, characterized in that a thermal copper foil is connected to the heat dissipation metal plate via a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598588U JPH0227759U (en) | 1988-08-12 | 1988-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598588U JPH0227759U (en) | 1988-08-12 | 1988-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227759U true JPH0227759U (en) | 1990-02-22 |
Family
ID=31339091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10598588U Pending JPH0227759U (en) | 1988-08-12 | 1988-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227759U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679174U (en) * | 1993-04-09 | 1994-11-04 | 東洋電機製造株式会社 | Inverter printed wiring board |
-
1988
- 1988-08-12 JP JP10598588U patent/JPH0227759U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679174U (en) * | 1993-04-09 | 1994-11-04 | 東洋電機製造株式会社 | Inverter printed wiring board |
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