JPS6163046A - Lead terminal bender of semiconductor device - Google Patents

Abstract

PURPOSE:To improve the productivity by a method wherein, when multiple lead terminals projecting on both sides of a lead frame are bent rectangularly and a semiconductor device is resin-sealed, upper and lower rolls are located on mutually different positions on both sides of supporting members to preliminarily bend the lead terminals at shallow angle and finish-bend them at deep angle. CONSTITUTION:A semiconductor device 4 is sealed on a lead frame using resin 3 and then multiple lead terminals 2 projecting on both sides thereof are bent rectangularly. In order to bend the lead terminals 2, a semiconductor 4 holding terminals 2 still in horizontal state is placed on a bending die 6 on a die plate 5 while a punch plate 7 is oppositely arranged to the bonding die 6 and then the terminals 2 are rectangularly bent downward by upper bending rolls 25 and lower bending rolls 23 at the ends of a pair of arms 21a projecting downward. In such a constitution, the rolls 23 supported by supporting pins 9 may be located downward outer than the rolls 25 supported by supporting pins 24 firstly to perform preliminary bending at shallow angle using the rolls 23 and then deep bending using the rolls 25.

Description

[Detailed description of the invention] [Technical field of invention] This invention is +7 issued on both sides of the semiconductor device.

The present invention relates to a lead terminal bending device for a semiconductor device, which bends a lead terminal downward.

[Prior art]

After the resin-sealed semiconductor device is resin-sealed and molded, lead terminals are formed as shown in FIGS. 1 to 3. As shown in the plan view in Fig. 1, a semiconductor chip (not shown) mounted on a lead frame (1) and wire-bonded is sealed with a resin sealing body (3) formed by synthetic resin molding. There is. (1a) is the connection part in the width direction of the lead frame, (
2) is a large number of lead terminals, the tips of which are connected at a connecting portion (1a), and the middle portions are connected at a connecting portion (1b).

Put the lead frame (1) in this state into a cutting press.
- When the connecting parts (la) and (lb) are separated, the second
Figure (a).

As shown in the plan view and front view in (b), it is separated into individual semiconductor devices (4).

3(a), (t+
) as shown in the front and side views.

A conventional lead terminal bending device of this type is shown in a front view in FIG. (5) is a die plate on the fixed side, and (6) is a bending die fixed to this die plate, which positions the semiconductor device (4) from below and receives the root portion of each lead terminal (2). (7) is a punch plate fixed to a press ram (not shown), which is lowered and raised again. (8) is a support member fixed to the punch plate (7), which rotatably supports the bending roll αO by support pins (9) at the lower ends of both arm portions (8a). αη is a holding plate corresponding to the upper side of the semiconductor device (4), which is held at the lower end of the holding rod (6) and is normally pressed downward by a compression spring (to). The holding plate α° C. is provided with protrusions (lla) on both sides of its lower end to hold down the base portions of each lead terminal (2) in the lowered position.

Lead terminals of semiconductor device @ (4) using the above conventional device (
The bending in 2) was done as follows. The semiconductor device (4) in the state shown in Fig. 2 is bent into a die (6) as shown in Fig. 4.
Put it on top. Activate the press machine, lower the punch plate (7), and first press the protrusions (l) on both sides of the presser plate (6).
la) to hold down the base portions of the numerous lead terminals (2) on both sides and fix the semiconductor device (4). In the subsequent descent to the set lowering position, the bending rolls QO on both sides push down each lead terminal (2) on both sides from above, and each lead terminal (2) is received at both upper ends of the bending die (6). and bent downward. During this bending process, the bending roll αO bends the lead terminal (2) while rotating.

In the conventional device described above, the reaction force that the bending roll αO receives when bending the lead terminal (2) is received by the support pin (9), and the support pin (9)
As a result of contact rotation, the support pin (9) and the inner circumferential portion of the bending roll αO wear out. Therefore, if the wear on both sides progresses and the gap exceeds a predetermined value, the lead terminal (
2) Some non-defective cine products were found to be insufficiently bent. Therefore, the work was interrupted and the bending roll α1 and support pin (9
) had to be replaced, which took a lot of time and stopped the production line, hindering productivity.

[Summary of the invention]

This invention was made in order to eliminate the drawbacks of the above-mentioned conventional device. Upper and lower bending rolls are arranged in both arms of a support member in the bending direction, and the position of the lower bending roll is changed from that of the upper bending roll. The position of the bending rolls is shifted outward in both directions, and as the support member is lowered, the lower bending roll bends the lead terminal of the semiconductor device at a shallow angle, and then the upper roll bends the lead terminal. Finish bending is done at a deep angle, and by sharing the use of rolls between the upper and lower sides, wear on the rolls and support pins is reduced, bending work can be performed continuously for a long time, and productivity is increased. can improve,
It is an object of the present invention to provide a bending device for lead terminals of a semiconductor device.

[Embodiments of the invention]

FIG. 5 is a front view of a lead bending device according to an embodiment of the present invention.
), α→〜(to).

(11a) is the same as the conventional device described above. (Foundation)
is a supporting member fixed to the punch plate (7), and the lower bending roll is connected to the lower end of the arms (21a) on both sides in the bending direction by support pins (9). The upper bending rolls (c) are rotatably supported. The positions of the rolls (C) on both sides of the lower stage are shifted outward in both directions from the positions of the rolls (C) on both sides of the upper stage. These rolls on both sides of the lower tier (
) to bend the lead terminal (2) at a shallow angle, and immediately after this bend the IJ-do terminal (
2) is finished by bending it at a deep predetermined angle.

The one-node terminal (2) of the semiconductor device (4) is bent as follows using the device of the above embodiment. As shown in FIG. 5, the semiconductor device (4) in the state shown in FIG. 2 is placed on the bending die (6).
). Operate the press machine to cut the plate (
7) and lower both protrusions (lla) of the presser plate (b).
) to press the bases of the multiple lead terminals (2) on both sides. As the punch plate (7) continues to descend, the lower bending rolls on both sides roughly bend the lead terminals (2) on both sides at a shallow angle, as shown in FIG.

Furthermore, as the punch plate (7) continues to descend, the upper bending roll (a) of both Ml bends the roughly bent lead terminals (2) on both sides by about 90 degrees as shown in FIG. °
Make the final bend at an angle close to . Next, Nokun.

Chip plate (7) moves to rise.

In this way, the lead terminals (2) of a large number of semiconductor devices (4) are sequentially bent, but the lower roll (to) and the upper roll (c) share the first and second half of the bending. In addition, compared to conventional devices, the support pins (9), (c) and the rolls (to) and (a) have less wear and can be used continuously for a long time.

〔Effect of the invention〕

As described above, according to the present invention, the upper and lower bending rolls are arranged on both arms of the support member, and the lower bending rolls on both sides are positioned relative to the upper bending rolls on both sides. The semiconductor device lead terminals are roughly bent at a shallow angle by the lower roll, and then finished bent at a deep angle by the upper roll. The load on the support pin is reduced.1
, wear is reduced, long-term continuous use is possible, and productivity is greatly improved.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a state in which a semiconductor chip portion is resin-sealed in a lead frame, FIGS. 2(a) and (b) are a plan view and a front view of the semiconductor device separated from the state shown in FIG.
3 is a front view and a side view of a semiconductor device in which the lead terminal of FIG. 2 has been bent, FIG. 4 is a front view of a conventional lead terminal bending device, and FIG. 5 is an embodiment of the present invention. A front view of the lead terminal bending device according to the example, and FIGS. 6 and 7 are front views of main parts showing the bending of the lead terminal by the device of FIG. 5 in the order of operation. 1...Lead frame, 2...Lead terminal, 4...
- Semiconductor device, 5... Die plate, 6... Bending die, 7... Punch plate, 9... Support pin, 21
...Support member, 21a...Arm part, 23...Lower side roll, 24...Support pin, 25...Upper side roll. Note that the same reference numerals in the drawings indicate the same or equivalent parts. show.

Claims (1)

[Claims] A supporting member having bending rolls arranged at the lower ends of both arms is fixed to the lower part of the punch plate, and the semiconductor device is received on the die plate by the bases of the lead terminals extended on both sides, and the punch plate is In this device, the lead terminal is bent downward by the bending rolls on both sides as the bending rolls are lowered, and the bending rolls are arranged at the lower ends of the arms on both sides at upper and lower levels in the bending direction. Prepare,
The positions of the lower rolls on both sides are shifted outward in both directions from the positions of the upper rolls on both sides, and the lead terminals are bent at a shallow angle by the lower rolls, and then bent at a deep angle by the upper rolls. A lead terminal bending device for a semiconductor device, characterized in that it performs final bending at an angle.